2.0 mm x 2.5 mm ceramic package smd oscillator, ttl / hc-mos ism95 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/09_a specifications subject to change withou t notice page 1 0.6 recommended pad layout pin connection 1 enable 2 gnd 3 output 4 vcc dimension units: mm 2.5 2.0 product features: applications: low jitter, non-pll based output fibre channel cmos/ttl compatible logic levels server & storage compatible with leadfree processing sonet /sdh 802.11 / wifi t1/e1, t3/e3 system clock frequency 1.000 mhz to 60.000 mhz output level hc-mos ttl ?0? = 0.1 vcc max., ?1? = 0.9 vcc min. ?0? = 0.4 vdc max., ?1? = 2.4 vdc min. duty cycle specify 50% 10% or 5% see table in part number guide rise / fall time 5 ns max. @ vcc = +3.3 vdc, 10 ns max. @ vcc = +5 vdc *** output load fo < 50 mhz = 10 ttl, fo > 50 mhz = 5 lsttl see table in part number guide frequency stability see frequency stability table (includes room temperature tolerance and stability over operating temperature) start-up time 10 ms max. enable / disable time 100 ns max. n.c. or 70% vdd = enable. 30% vdd = disable. supply voltage see input voltage table, tolerance 5 % current 25 ma max. *** operating see operating temperature table in part number guide storage -55 c to +125 c jitter: rms(1sigma) 1 mhz-60 mhz 5 ps rms (1 sigma) max. accumulated jitter (20k adjacent periods) max integrated 1 mhz-60 mhz 1.5 ps rms (1 sigma -12khz to 20mhz) max total jitter 1 mhz-60 mhz 50 ps p-p (100k adjacent periods) note: a 0.01 f bypass capacitor is recommended between vcc (p in 4) and gnd (pin 2) to minimize power supply noise. * not available at all frequencies. ** not available for all temperature ranges. *** frequency, supply, and load related p arameters. part number guide sample part number: ism95 - 3251bh - 20.000 package input voltage operating temperature symmetry (duty cycle) output stability (in ppm) enable / disable frequency i sm95 - 5 = 5.0 v 1 = 0 c to +70 c 5 = 45 / 55 max. 1 = 10ttl / 15 pf hc-mos **a = 25 h = enable - 20.000 mhz 3 = 3.3 v 8 = -10 c to +60 c 6 = 40 / 60 max. 6 = 30 pf b = 50 o = n/c 7 = 3.0 v 6 = -10 c to +70 c 5 = 50 pf hc-mos (<40 mhz) c = 100 2 = 2.7 v 3 = -20 c to +70 c 6 = 2.5 v 4 = -30 c to +75 c 1 = 1.8 v* 2 = -40 c to +85 c
2.0 mm x 2.5 mm ceramic package smd oscillator, ttl / hc-mos ism95 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 06/09_a specifications subject to change withou t notice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: ilsi and date code (yww) line 2: frequency quantity per reel 1000 a 8 +/-.3 b 4 +/-.2 c 3.5 +/-.2 d 9 +/-1 or 12 +/-.3 e 60 / 80 f 180
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