pb lead-free parts round type led lamps a 07 - dec. doc. no : qw0905- rev. : date : - 2006 LDBK3833 ligitek electronics co.,ltd. property of ligitek only LDBK3833 data sheet
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LDBK3833page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 1.5max 5.6 5.0 8.7 7.7 2.54typ 1.0min 25.0min 0.5 typ + - 50% 75% 100% -60 -30 25% 0 25% 50%75%100% 0 60 30
* static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. part no.LDBK3833 2/5 page ligitek electronics co.,ltd. property of ligitek only unit ma a mw ma ratings dbk symbol 100 50 120 i fp ir pd i f 30 v 150 esd tstg t opr -30 ~ +100 -20 ~ +80 typ. max.min. luminous intensity @ ma(mcd) 20 viewing angle 2 1/2 (deg) dominant d spectral halfwidth nm wave length nm color lens emitted forward voltage @20ma(v) typ. water clear blue 470303.54.0 12 5000 2700 parameter power dissipation forward current storage temperature material part no ingan/gan LDBK3833 peak forward current duty 1/10@10khz reverse current @5v electrostatic discharge( * ) operating temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 )
fig.5 relative intensity vs. wavelength typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 1.03.04.0 0 1 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 450 0.0 400500550 0.5 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 20 ambient temperature( ) ambient temperature( ) 0 -20 -40 0.8 0 -40-20 100 80 60 40 20 0.0 60100 80 40 fig.4 relative intensity vs. temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 fig.3 forward voltage vs. temperature 1.2 3.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a f o r w a r d c u r r e n t ( m a ) forward current(ma) forward voltage(v) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 fig.2 relative intensity vs. forward current fig.1 forward current vs. forward voltage 2.5 3.0 1 10 100 1000 dbk chip part no. LDBK3833 page3/5
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 LDBK3833 part no.
part no. LDBK3833 5/5 page ligitek electronics co.,ltd. property of ligitek only reference standard description the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test item high temperature storage test operating life test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature high humidity test low temperature storage test solder resistance test thermal shock test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reliability test: this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1
|
