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1. general description the 74aup2g240 provides the dual inverting buffer/line driver with 3-state output. the 3-state output is controlled by the output enable input (noe ). a high level at pin noe causes the output to assume a high-impedance off-state. schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire v cc range from 0.8 v to 3.6 v. this device ensures a very low static and dynamic power consumption across the entire v cc range from 0.8 v to 3.6 v. this device is fully specified for pa rtial power-down applications using i off . the i off circuitry disables the output, preventin g the damaging backflow current through the device when it is powered down. this device has the input-disable feature, which allows floating input signals. the inputs are disabled when the output enable input noe is high. 2. features and benefits ? wide supply voltage range from 0.8 v to 3.6 v ? high noise immunity ? complies with jedec standards: ? jesd8-12 (0.8 v to 1.3 v) ? jesd8-11 (0.9 v to 1.65 v) ? jesd8-7 (1.2 v to 1.95 v) ? jesd8-5 (1.8 v to 2.7 v) ? jesd8-b (2.7 v to 3.6 v) ? esd protection: ? hbm jesd22-a114f class 3a exceeds 5000 v ? mm jesd22-a115-a exceeds 200 v ? cdm jesd22-c101e exceeds 1000 v ? low static power consumption; i cc = 0.9 a (maximum) ? latch-up performance exceeds 100 ma per jesd78 class ii ? inputs accept voltages up to 3.6 v ? low-noise overshoot and undershoot < 10 % of v cc ? input-disable feature allows floating input conditions ? i off circuitry provides partial power-down mode operation ? multiple package options ? specified from ? 40 cto+85 c and ? 40 cto+125 c 74aup2g240 low-power dual inverting buf fer/line driver; 3-state rev. 5 ? 13 september 2010 product data sheet
74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 2 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 3. ordering information 4. marking [1] the pin 1 indicator is located on the lower left corner of the device, below the marking code. table 1. ordering information type number package temperature range name description version 74aup2g240dc ? 40 c to +125 c vssop8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765-1 74aup2g240gt ? 40 c to +125 c xson8 plastic extremely thin sm all outline package; no leads; 8 terminals; body 1 1.95 0.5 mm sot833-1 74aup2g240gf ? 40 c to +125 c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1 0.5 mm sot1089 74aup2g240gd ? 40 c to +125 c xson8u plastic extremely thin sm all outline package; no leads; 8 terminals; utlp based; body 3 2 0.5 mm sot996-2 74aup2g240gm ? 40 c to +125 c xqfn8u plastic extremely thin quad flat package; no leads; 8 terminals; utlp based; body 1.6 1.6 0.5 mm sot902-1 74aup2g240gn ? 40 c to +125 c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.2 1.0 0.35 mm sot1116 74AUP2G240GS ? 40 c to +125 c xson8 extremely thin small outline package; no leads; 8 terminals; body 1.35 1.0 0.35 mm sot1203 table 2. marking codes type number marking code [1] 74aup2g240dc p40 74aup2g240gt p40 74aup2g240gf p2 74aup2g240gd p40 74aup2g240gm p40 74aup2g240gn p2 74AUP2G240GS p2 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 3 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 5. functional diagram 6. pinning information 6.1 pinning fig 1. logic symbol fig 2. iec logic symbol 001aah782 1a 2y 1y 1oe 2a 2oe en en 001aah783 fig 3. pin configuration sot765-1 fig 4. pin configuration sot833-1, sot1089, sot1116 and sot1203 74aup2g240 1oe v cc 1a 2oe 2y 1y gnd 2a 001aaf407 1 2 3 4 6 5 8 7 74aup2g240 1y 2oe v cc 2a 2y 1a 1oe gnd 001aaf408 36 27 18 45 transparent top view 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 4 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 6.2 pin description 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. fig 5. pin configuration sot996-2 f ig 6. pin configuration sot902-1 001aaj919 74aup2g240 transparent top view 8 7 6 5 1 2 3 4 1oe 1a 2y gnd v cc 2oe 1y 2a 001aaf40 9 1a 1y 1oe v cc 2y 2oe gnd 2a transparent top view 3 6 4 1 5 8 7 2 terminal 1 index area 74aup2g240 table 3. pin description symbol pin description sot765-1, sot8 33-1, sot1089, sot996-2, sot1116 and sot1203 sot902-1 1oe , 2oe 1, 7 7, 1 output enable input (active low) 1a, 2a 2, 5 6, 3 data input gnd 4 4 ground (0 v) 1y, 2y 6, 3 2, 5 data output v cc 8 8 supply voltage table 4. function table [1] input output noe na ny llh lhl hxz 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 5 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 8. limiting values [1] the minimum input and output voltage ratings may be exceed ed if the input and output current ratings are observed. [2] for vssop8 packages: above 110 c the value of p tot derates linearly with 8.0 mw/k. for xson8, xson8u and xqfn8u packages: above 118 c the value of p tot derates linearly with 7.8 mw/k. 9. recommended operating conditions 10. static characteristics table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +4.6 v i ik input clamping current v i <0v ? 50 - ma v i input voltage [1] ? 0.5 +4.6 v i ok output clamping current v o <0v ? 50 - ma v o output voltage active mode and power-down mode [1] ? 0.5 +4.6 v i o output current v o =0 vtov cc - 20 ma i cc supply current - 50 ma i gnd ground current ? 50 - ma t stg storage temperature ? 65 +150 c p tot total power dissipation t amb = ? 40 c to +125 c [2] -250mw table 6. operating conditions symbol parameter conditions min max unit v cc supply voltage 0.8 3.6 v v i input voltage 0 3.6 v v o output voltage active mode 0 v cc v power-down mode; v cc =0v 0 3.6 v t amb ambient temperature ? 40 +125 c t/ v input transition rise and fall rate v cc = 0.8 v to 3.6 v 0 200 ns/v table 7. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = 25 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 6 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.75 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.11 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.32 - - v i o = ? 2.3 ma; v cc = 2.3 v 2.05 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.9 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.72 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.6 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.31 v i o = 1.9 ma; v cc = 1.65 v - - 0.31 v i o = 2.3 ma; v cc = 2.3 v - - 0.31 v i o = 3.1 ma; v cc = 2.3 v - - 0.44 v i o = 2.7 ma; v cc = 3.0 v - - 0.31 v i o = 4.0 ma; v cc = 3.0 v - - 0.44 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.1 a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.1 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.2 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.2 a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --0.5 a i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --40 a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] --110 a disabled inputs; v i = gnd to 3.6 v; noe =v cc ; v cc = 0.8 v to 3.6 v --1 a c i input capacitance v cc = 0 v to 3.6 v; v i = gnd or v cc -0.6-pf c o output capacitance output enabled; v o = gnd; v cc = 0 v - 1.7 - pf output disabled; v cc = 0 v to 3.6 v; v o = gnd or v cc -1.5-pf t amb = ? 40 c to +85 c v ih high-level input voltage v cc = 0.8 v 0.70 v cc -- v v cc = 0.9 v to 1.95 v 0.65 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 7 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state v il low-level input voltage v cc = 0.8 v - - 0.30 v cc v v cc = 0.9 v to 1.95 v - - 0.35 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.1 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.7 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 1.03 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.30 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.97 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.85 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.67 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.55 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.1 v i o = 1.1 ma; v cc = 1.1 v - - 0.3 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.37 v i o = 1.9 ma; v cc = 1.65 v - - 0.35 v i o = 2.3 ma; v cc = 2.3 v - - 0.33 v i o = 3.1 ma; v cc = 2.3 v - - 0.45 v i o = 2.7 ma; v cc = 3.0 v - - 0.33 v i o = 4.0 ma; v cc = 3.0 v - - 0.45 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.5 a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.5 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.5 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.6 a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --0.9 a i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --50 a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] - - 120 a disabled inputs; v i = gnd to 3.6 v; noe =v cc ; v cc = 0.8 v to 3.6 v --1 a t amb = ? 40 c to +125 c v ih high-level input voltage v cc = 0.8 v 0.75 v cc -- v v cc = 0.9 v to 1.95 v 0.70 v cc -- v v cc = 2.3 v to 2.7 v 1.6 - - v v cc = 3.0 v to 3.6 v 2.0 - - v table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 8 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state [1] one input at v cc ? 0.6 v, other input at v cc or gnd. v il low-level input voltage v cc = 0.8 v - - 0.25 v cc v v cc = 0.9 v to 1.95 v - - 0.30 v cc v v cc = 2.3 v to 2.7 v - - 0.7 v v cc = 3.0 v to 3.6 v - - 0.9 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 0.8 v to 3.6 v v cc ? 0.11 - - v i o = ? 1.1 ma; v cc = 1.1 v 0.6 v cc -- v i o = ? 1.7 ma; v cc = 1.4 v 0.93 - - v i o = ? 1.9 ma; v cc = 1.65 v 1.17 - - v i o = ? 2.3 ma; v cc = 2.3 v 1.77 - - v i o = ? 3.1 ma; v cc = 2.3 v 1.67 - - v i o = ? 2.7 ma; v cc = 3.0 v 2.40 - - v i o = ? 4.0 ma; v cc = 3.0 v 2.30 - - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 0.8 v to 3.6 v - - 0.11 v i o = 1.1 ma; v cc = 1.1 v - - 0.33 v cc v i o = 1.7 ma; v cc = 1.4 v - - 0.41 v i o = 1.9 ma; v cc = 1.65 v - - 0.39 v i o = 2.3 ma; v cc = 2.3 v - - 0.36 v i o = 3.1 ma; v cc = 2.3 v - - 0.50 v i o = 2.7 ma; v cc = 3.0 v - - 0.36 v i o = 4.0 ma; v cc = 3.0 v - - 0.50 v i i input leakage current v i = gnd to 3.6 v; v cc = 0 v to 3.6 v - - 0.75 a i oz off-state output current v i = v ih or v il ; v o = 0 v to 3.6 v; v cc = 0 v to 3.6 v -- 0.75 a i off power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v - - 0.75 a i off additional power-off leakage current v i or v o = 0 v to 3.6 v; v cc = 0 v to 0.2 v -- 0.75 a i cc supply current v i = gnd or v cc ; i o =0a; v cc = 0.8 v to 3.6 v --1.4 a i cc additional supply current data input; v i = v cc ? 0.6 v; i o =0a; v cc =3.3v [1] --75 a noe input; v i = v cc ? 0.6 v; i o = 0 a; v cc =3.3v [1] - - 180 a disabled inputs; v i = gnd to 3.6 v; noe =v cc ; v cc = 0.8 v to 3.6 v --1 a table 7. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 9 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 11. dynamic characteristics table 8. dynamic characteristics voltages are referenced to gnd (ground = 0 v; for test circuit see figure 9 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) c l = 5 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 22.3 - - - - ns v cc = 1.1 v to 1.3 v 3.0 5.8 12.6 2.8 14.1 15.5 ns v cc = 1.4 v to 1.6 v 2.3 4.0 7.3 2.1 8.5 9.4 ns v cc = 1.65 v to 1.95 v 2.0 3.2 5.5 1.9 6.7 7.4 ns v cc = 2.3 v to 2.7 v 1.8 2.6 4.1 1.5 4.8 5.3 ns v cc = 3.0 v to 3.6 v 1.4 2.3 3.6 1.3 4.1 4.6 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 70.2 - - - - ns v cc = 1.1 v to 1.3 v 3.1 6.4 14.3 2.8 15.9 17.5 ns v cc = 1.4 v to 1.6 v 2.5 4.4 8.1 2.2 9.5 10.5 ns v cc = 1.65 v to 1.95 v 2.1 3.6 6.2 1.9 7.4 8.2 ns v cc = 2.3 v to 2.7 v 1.8 2.8 4.6 1.7 5.4 6.0 ns v cc = 3.0 v to 3.6 v 1.7 2.5 4.0 1.7 4.7 5.3 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 14.8 - - - - ns v cc = 1.1 v to 1.3 v 2.0 4.3 7.4 2.3 8.3 9.2 ns v cc = 1.4 v to 1.6 v 1.6 3.2 5.2 1.7 5.9 6.5 ns v cc = 1.65 v to 1.95 v 1.5 3.0 4.8 1.5 5.5 6.1 ns v cc = 2.3 v to 2.7 v 1.1 2.2 3.5 1.4 4.0 4.5 ns v cc = 3.0 v to 3.6 v 1.3 2.5 3.9 1.4 4.5 5.0 ns 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 10 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state c l = 10 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 25.7 - - - - ns v cc = 1.1 v to 1.3 v 3.5 6.6 14.5 3.2 16.3 18.0 ns v cc = 1.4 v to 1.6 v 2.2 4.6 8.4 2.0 9.9 10.9 ns v cc = 1.65 v to 1.95 v 2.0 3.8 6.4 1.8 7.7 8.6 ns v cc = 2.3 v to 2.7 v 1.8 3.1 4.8 1.7 5.7 6.4 ns v cc = 3.0 v to 3.6 v 1.7 2.8 4.3 1.7 5.0 5.5 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 74.0 - - - - ns v cc = 1.1 v to 1.3 v 3.6 7.4 16.3 3.2 18.2 20.1 ns v cc = 1.4 v to 1.6 v 2.3 5.1 9.2 2.1 10.9 12.0 ns v cc = 1.65 v to 1.95 v 2.0 4.1 7.1 1.8 8.5 9.4 ns v cc = 2.3 v to 2.7 v 1.8 3.4 5.4 1.7 6.4 7.1 ns v cc = 3.0 v to 3.6 v 1.8 3.1 4.8 1.7 5.7 6.3 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 33.7 - - - - ns v cc = 1.1 v to 1.3 v 3.4 5.4 9.0 3.2 10.0 11.0 ns v cc = 1.4 v to 1.6 v 2.1 4.1 6.3 2.1 7.1 7.9 ns v cc = 1.65 v to 1.95 v 2.3 4.2 6.3 1.8 7.1 7.9 ns v cc = 2.3 v to 2.7 v 1.6 3.0 4.6 1.7 5.2 5.7 ns v cc = 3.0 v to 3.6 v 2.1 3.8 5.7 1.7 6.4 7.1 ns c l = 15 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 29.0 - - - - ns v cc = 1.1 v to 1.3 v 3.9 7.4 16.3 3.6 18.4 20.2 ns v cc = 1.4 v to 1.6 v 3.0 5.1 9.4 2.5 11.1 12.3 ns v cc = 1.65 v to 1.95 v 2.2 4.2 7.2 2.1 8.7 9.6 ns v cc = 2.3 v to 2.7 v 2.0 3.5 5.4 1.9 6.5 7.2 ns v cc = 3.0 v to 3.6 v 2.0 3.3 4.9 1.9 5.7 6.4 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 77.8 - - - - ns v cc = 1.1 v to 1.3 v 4.0 8.2 18.2 3.6 20.4 22.5 ns v cc = 1.4 v to 1.6 v 3.0 5.6 10.3 2.5 12.2 13.4 ns v cc = 1.65 v to 1.95 v 2.3 4.6 7.9 2.1 9.5 10.5 ns v cc = 2.3 v to 2.7 v 2.1 3.9 6.0 2.0 7.2 7.9 ns v cc = 3.0 v to 3.6 v 2.1 3.6 5.5 1.9 6.4 7.1 ns table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v; for test circuit see figure 9 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 11 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 62.5 - - - - ns v cc = 1.1 v to 1.3 v 4.3 6.6 10.4 3.6 11.6 12.8 ns v cc = 1.4 v to 1.6 v 3.0 5.0 7.4 2.5 8.4 9.3 ns v cc = 1.65 v to 1.95 v 3.0 5.3 7.8 2.1 8.7 9.7 ns v cc = 2.3 v to 2.7 v 2.1 3.8 5.7 2.0 6.4 7.1 ns v cc = 3.0 v to 3.6 v 2.9 5.0 7.4 1.9 8.3 9.1 ns c l = 30 pf t pd propagation delay na to ny; see figure 7 [2] v cc = 0.8 v - 39.1 - - - - ns v cc = 1.1 v to 1.3 v 5.0 9.7 21.6 4.6 24.3 26.8 ns v cc = 1.4 v to 1.6 v 4.0 6.7 12.3 3.0 14.6 16.1 ns v cc = 1.65 v to 1.95 v 2 .9 5.5 9.5 2.7 11.5 12.6 ns v cc = 2.3 v to 2.7 v 2.7 4.6 7.1 2.5 8.6 9.5 ns v cc = 3.0 v to 3.6 v 2.6 4.3 6.4 2.5 7.7 8.5 ns t en enable time noe to ny; see figure 8 [3] v cc = 0.8 v - 89.4 - - - - ns v cc = 1.1 v to 1.3 v 5.2 10.6 23.8 4.6 26.7 29.5 ns v cc = 1.4 v to 1.6 v 4.0 7.3 13.2 3.0 15.7 17.4 ns v cc = 1.65 v to 1.95 v 3.0 6.0 10.2 2.7 12.3 13.6 ns v cc = 2.3 v to 2.7 v 2.8 5.0 7.8 2.6 9.3 10.3 ns v cc = 3.0 v to 3.6 v 2.8 4.8 7.1 2.6 8.4 9.3 ns t dis disable time noe to ny; see figure 8 [4] v cc = 0.8 v - 68.9 - - - - ns v cc = 1.1 v to 1.3 v 6.0 9.3 15.0 4.6 16.5 18.2 ns v cc = 1.4 v to 1.6 v 4.4 7.7 11.0 3.0 12.2 13.4 ns v cc = 1.65 v to 1.95 v 5.1 8.8 12.4 2.7 13.7 15.1 ns v cc = 2.3 v to 2.7 v 3.6 6.2 9.0 2.6 10.0 11.0 ns v cc = 3.0 v to 3.6 v 5.2 8.8 12.7 2.6 14.0 15.4 ns table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v; for test circuit see figure 9 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 12 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state [1] all typical values are measured at nominal v cc . [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzh and t pzl . [4] t dis is the same as t phz and t plz . [5] c pd is used to determine the dynamic power dissipation (p d in w). p d =c pd v cc 2 f i n+ (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; (c l v cc 2 f o ) = sum of the outputs. 12. waveforms c l = 5 pf, 10 pf, 15 pf and 30 pf c pd power dissipation capacitance f = 1 mhz; v i = gnd to v cc [5] v cc = 0.8 v - 2.7 - - - - pf v cc = 1.1 v to 1.3 v - 2.9 - - - - pf v cc = 1.4 v to 1.6 v - 3.0 - - - - pf v cc = 1.65 v to 1.95 v - 3.2 - - - - pf v cc = 2.3 v to 2.7 v - 3.7 - - - - pf v cc = 3.0 v to 3.6 v - 4.2 - - - - pf table 8. dynamic characteristics ?continued voltages are referenced to gnd (ground = 0 v; for test circuit see figure 9 . symbol parameter conditions 25 c ? 40 c to +125 c unit min typ [1] max min max (85 c) max (125 c) measurement points are given in table 9 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 7. the data input (na) to output (ny) propagation delays mna96 0 t plh t phl v m v m v m v m ny output na input v i gnd v oh v ol table 9. measurement points supply voltage output input v cc v m v m v i t r = t f 0.8 v to 3.6 v 0.5 v cc 0.5 v cc v cc 3.0 ns 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 13 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state measurement points are given in table 10 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 8. 3-state enable and disable times mna96 1 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high noe input v ol v oh v cc v i v m gnd gnd t pzl t pzh v m v m table 10. measurement points supply voltage input output v cc v m v m v x v y 0.8 v to 1.6 v 0.5 v cc 0.5 v cc v ol + 0.1 v v oh ? 0.1 v 1.65 v to 2.7 v 0.5 v cc 0.5 v cc v ol + 0.15 v v oh ? 0.15 v 3.0 v to 3.6 v 0.5 v cc 0.5 v cc v ol + 0.3 v v oh ? 0.3 v 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 14 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state [1] for measuring enable and disable times r l = 5 k , for measuring propagation delays, setup and hold times and pulse width r l = 1 m . test data is given in table 11 . definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 9. test circuit for measuring switching times 001aac52 1 dut r t v i v o v ext v cc r l 5 k c l g table 11. test data supply voltage load v ext v cc c l r l [1] t plh , t phl t pzh , t phz t pzl , t plz 0.8 v to 3.6 v 5 pf, 10 pf, 15 pf and 30 pf 5 k or 1 m open gnd 2 v cc 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 15 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 13. package outline fig 10. package outline sot765-1 (vssop8) unit a 1 a max. a 2 a 3 b p l h e l p wy v ce d (1) e (2) z (1) references outline version european projection issue date iec jedec jeita mm 0.15 0.00 0.85 0.60 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.1 8 0 0.13 0.1 0.2 0.4 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.40 0.15 q 0.21 0.19 sot765-1 mo-187 02-06-07 w m b p d z e 0.12 14 8 5 a 2 a 1 q l p (a 3 ) detail x a l h e e c v m a x a y 2.5 5 mm 0 scale vssop8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm sot765- 1 1 pin 1 index 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 16 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 11. package outline sot833-1 (xson8) terminal 1 index area references outline version european projection issue date iec jedec jeita sot833-1 - - - mo-252 - - - sot833- 1 07-11-14 07-12-07 dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm d e e 1 e a 1 b l l 1 e 1 e 1 0 1 2 mm scale notes 1. including plating thickness. 2. can be visible in some manufacturing processes. unit mm 0.25 0.17 2.0 1.9 0.35 0.27 a 1 max b e 1.05 0.95 d ee 1 l 0.40 0.32 l 1 0.5 0.6 a (1) max 0.5 0.04 1 8 2 7 3 6 4 5 8 (2) 4 (2) a 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 17 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 12. package outline sot1089 (xson8) references outline version european projection issue date iec jedec jeita sot1089 mo-252 sot1089_po 10-04-09 10-04-12 unit mm max nom min 0.5 0.04 1.40 1.35 1.30 1.05 1.00 0.95 0.55 0.35 0.35 0.30 0.27 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. x son8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm sot108 9 a 1 bl 1 0.40 0.35 0.32 0.20 0.15 0.12 deee 1 l 0 0.5 1 mm scale terminal 1 index area e d detail x a a 1 l l 1 b e 1 e terminal 1 index area 1 4 8 5 (4 ) (2) (8 ) (2) x 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 18 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 13. package outline sot996-2 (xson8u) references outline version european projection issue date iec jedec jeita sot996-2 - - - - - - sot996- 2 07-12-18 07-12-21 unit a max mm 0.5 0.05 0.00 0.35 0.15 3.1 2.9 0.5 1.5 0.5 0.3 0.6 0.4 0.1 0.05 a 1 dimensions (mm are the original dimensions) x son8u: plastic extremely thin small outline package; no leads; 8 terminals; utlp based; body 3 x 2 x 0.5 mm 0 1 2 mm scale b d 2.1 1.9 e e e 1 l l 1 0.15 0.05 l 2 v w 0.05 y y 1 0.1 c y c y 1 x b 14 85 e 1 e a c b v m c w m l 2 l 1 l terminal 1 index area b a d e detail x a a 1 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 19 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 14. package outline sot902-1 (xqfn8u) references outline version european projection issue date iec jedec jeita sot902-1 mo-255 - - - - - - sot902- 1 05-11-25 07-11-14 unit a max mm 0.5 a 1 0.25 0.15 0.05 0.00 1.65 1.55 0.35 0.25 0.15 0.05 dimensions (mm are the original dimensions) x qfn8u: plastic extremely thin quad flat package; no leads; 8 terminals; utlp based; body 1.6 x 1.6 x 0.5 mm b dl e 1 1.65 1.55 e e l 1 v 0.1 0.55 0.5 w 0.05 y 0.05 0.05 y 1 0 1 2 mm scale x c y c y 1 terminal 1 index area terminal 1 index area b a d e detail x a a 1 b 8 7 6 5 e 1 e 1 e e a c b ? v m c ? w m 4 1 2 3 l l 1 metal area not for soldering 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 20 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 15. package outline sot1116 (xson8) references outline version european projection issue date iec jedec jeita sot1116 sot1116_po 10-04-02 10-04-07 unit mm max nom min 0.35 0.04 1.25 1.20 1.15 1.05 1.00 0.95 0.55 0.3 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. x son8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1.0 x 0.35 mm sot111 6 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area e d (4 ) (2) (8 ) (2) a 1 a e 1 e 1 e 1 e l l 1 b 4 3 2 1 5 6 7 8 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 21 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state fig 16. package outline sot1203 (xson8) references outline version european projection issue date iec jedec jeita sot1203 sot1203_po 10-04-02 10-04-06 unit mm max nom min 0.35 0.04 1.40 1.35 1.30 1.05 1.00 0.95 0.55 0.35 0.40 0.35 0.32 a (1) dimensions note 1. including plating thickness. 2. visible depending upon used manufacturing technology. x son8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.0 x 0.35 mm sot120 3 a 1 b 0.20 0.15 0.12 deee 1 l 0.35 0.30 0.27 l 1 0 0.5 1 mm scale terminal 1 index area e d (4 ) (2) (8 ) (2) a a 1 e l l 1 b e 1 e 1 e 1 1 8 2 7 3 6 4 5 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 22 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 14. abbreviations 15. revision history table 12. abbreviations acronym description cdm charged device model dut device under test esd electrostatic discharge hbm human body model mm machine model table 13. revision history document id release date data sheet status change notice supersedes 74aup2g240 v.5 20100913 product data sheet - 74aup2g240 v.4 modifications: ? added type number 74aup2g240gf (sot1089/xson8 package). ? added type number 74aup2g24 0gn (sot1116/xson8 package). ? added type number 74aup2g24 0gs (sot1203/xson8 package). 74aup2g240 v.4 20090630 product data sheet - 74aup2g240 v.3 74aup2g240 v.3 20090407 product data sheet - 74aup2g240 v.2 74aup2g240 v.2 20080222 product data sheet - 74aup2g240 v.1 74aup2g240 v.1 20061006 product data sheet - - 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 23 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use in automotive applications ? this nxp semiconductors product has been qua lified for use in automotive applications. the product is not desi gned, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be ex pected to result in personal injury, death or severe property or environmental dam age. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. 74aup2g240 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 13 september 2010 24 of 25 nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors 74aup2g240 low-power dual inverting buffer/line driver; 3-state ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 13 september 2010 document identifier: 74aup2g240 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 23 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 23 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24 17 contact information. . . . . . . . . . . . . . . . . . . . . 24 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 |
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