View TZA1049TH_5733356.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

d a t a sh eet product speci?cation 2004 mar 09 integrated circuits tza1049 4-channel btl driver for cd/dvd drives
2004 mar 09 2 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 contents 1 features 2 applications 3 general description 4 ordering information 5 block diagram 6 pinning 7 functional data 7.1 general notes 8 limiting values 9 characteristics 10 test and application information 11 package outline 12 soldering 12.1 introduction to soldering surface mount packages 12.2 reflow soldering 12.3 wave soldering 12.4 manual soldering 12.5 suitability of surface mount ic packages for wave and reflow soldering methods 13 data sheet status 14 definitions 15 disclaimers
2004 mar 09 3 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 1 features two bridge-tied load (btl) driver channels for sled and spindle motors and actuators pulse width modulation (pwm) input integral thermal shut-down circuit integral mute control two regulated reference voltage outputs for other chips in system; 3.3 v and 1.8 v respectively hsop28 package. 2 applications btl driver for cd and dvd players. 3 general description the tza1049 is a four-channel btl driver ic for driving motors and actuators in cd and dvd players. two reference voltage outputs are also available for peripheral ics such as servo and pick-up head drivers. the spindle motor control inputs to the ic can be either differential or single-ended. 4 ordering information type number package name description version TZA1049TH hsop28 plastic, heatsink small outline package; 28 leads sop007
2004 mar 09 4 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 5 block diagram mce478 1 v cc 7 v cc v cc 11 gnd v cc 2 x1 32.3 k w 32.3 k w 32.3 k w 24 k w 24 k w 24 k w 24 k w 24 k w 32.3 k w 32.3 k w x1 x1 x1 x1 x1 x0.5 x0.5 radoutn 3 focoutp 8 9 10 5 focoutn 6 radoutp sloutp sloutn 12 13 motoutp motoutn 14 4 28 22 18 27 26 21 20 19 24 23 17 16 15 25 gnd vout3.3 slin vfbin3.3 vout1.8 mute radin focin vbiasin gnd motbias vbiasout motin1 motin2 vfbin1.8 3.3 v generator mute tza1049 1.8 v generator fig.1 block diagram.
2004 mar 09 5 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 6 pinning symbol pin description v cc 1 supply voltage radoutn 2 radial coil driver negative output focoutp 3 focus coil driver positive output gnd 4 ground focoutn 5 focus coil driver negative output radoutp 6 radial coil driver positive output v cc 7 supply voltage v cc 8 supply voltage sloutp 9 sled motor driver positive output sloutn 10 sled motor driver negative output gnd 11 ground motoutp 12 spindle motor driver positive output motoutn 13 spindle motor driver negative output v cc 14 supply voltage motin2 15 spindle motor driver input 2 motin1 16 spindle motor driver input 1 motbias 17 spindle motor bias input vbiasout 18 1.65 v bias voltage output gnd 19 ground vbiasin 20 bias voltage input slin 21 sled motor driver input focin 22 focus coil driver input radin 23 radial coil driver input mute 24 mute control input vfbin1.8 25 1.8 v generator/regulator feedback voltage input vout1.8 26 1.8 v generator/regulator output vfbin3.3 27 3.3 v generator/regulator feedback voltage input vout3.3 28 3.3 v generator/regulator output
2004 mar 09 6 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 7 functional description 7.1 general notes 1. the integral thermal shut-down circuit mutes the output current when the chip temperature reaches 175 c (typical). the hysteresis is set to 25 c (typical), so the circuit will restart when the chip temperature falls to 150 c (typical). 2. mute mode is activated when the voltage at pin mute is below 0.5 v, and deactivated when the voltage at pin mute is above 1.2 v. in mute mode, both positive and negative output terminals will be at high-impedance state. however, the 3.3 v and 1.8 v outputs are not affected. 3. it is recommended that a 220 m f decoupling capacitor is connected between pins v cc and pin gnd and physically located as close as possible to these supply pins. 4. the positive outputs of the focus, radial and sled driver channels are in phase with their respective input signals. the positive output of the spindle driver channel is in phase with the input signal on pin motin1. 5. the values of the resistors connected to each input channel must be equal to, or larger than, 4.7 k w to ensure that the gain of each input stage is less than, or equal to 1. 6. the gnd pins are internally connected to heat dissipation fins within the package. you must ensure that these pins are connected to an external ground. 7. the 1.65 v bias voltage output from pin vbiasout is derived from the internal 3.3 v generator/regulator, and will be affected by any variation in the 3.3 v generator/regulator voltage. TZA1049TH v cc vout3.3 radoutn vfbin3.3 focoutp vout1.8 gnd vfbin1.8 focoutn mute radoutp radin v cc focin v cc slin sloutp vbiasin sloutn gnd gnd vbiasout motoutp motbias motoutn motin1 v cc motin2 mce479 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 15 18 17 20 19 22 21 24 23 26 25 28 27 fig.2 pin configuration.
2004 mar 09 7 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 8 limiting values in accordance with the absolute maximum rating system (iec 60134). 9 characteristics t amb =25 c; v cc =9v; r l =8 w ; unless otherwise speci?ed. symbol parameter min. max. unit v cc supply voltage - 13.5 v p power dissipation - 1.7 w t oper operating temperature - 40 +85 c t stg storage temperature - 55 +150 c symbol parameter conditions min. typ. max. unit b bandwidth 20 25 100 khz v cc power supply 6 9 13 v psrr power supply rejection ratio at v cc =5v 30 38 - db i q quiescent current unloaded - 20.3 36 ma i stb standby current mute mode active; unloaded - 2.1 10 ma v mute(l) low level voltage on pin mute; mute mode active 0 - 0.8 v v mute(h) high level voltage on pin mute; mute mode inactive 2 - 5v radial coil driver v oo(rad) output offset voltage - 20 50 mv i con(rad) maximum constant current r l =8 w 250 300 - ma i p(max)(rad) maximum peak current r l =8 w 250 430 - ma g rad gain v cc =9v; v i = 700 mv (p-p); r ext = 4.7 k w ; note 1 678db focus coil driver v oo(foc) output offset voltage - 20 50 mv i con(foc) maximum constant current r l =8 w 250 300 - ma i p(max)(foc) maximum peak current r l =8 w 370 430 - ma g foc gain v cc =9v; v i = 700 mv (p-p); r ext = 4.7 k w ; note 1 678db sled motor driver v oo(sle) output offset voltage - 20 50 mv i con(sle) maximum constant current r l =8 w 200 300 - ma i p(sle) maximum peak current r l =8 w 370 430 - ma g sle gain v cc =9v; v i = 700 mv (p-p); r ext = 4.7 k w ; note 1 678v/v
2004 mar 09 8 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 note 1. for gain measurements, only the channel being tested is active, the others are inactive; see fig.4. spindle motor driver v oo(spin) output offset voltage - 10 50 mv i con(spin) maximum constant current r l =4 w 400 430 - ma i p(spin) maximum peak current r l =4 w 560 600 - ma g spin gain v cc =9v; v i = 700 mv (p-p); r ext = 4.7 k w ; note 1 1 1.12 1.26 v/v 3.3 v generator v fb(3.3) feedback voltage 3.1 3.3 3.5 v i o(3.3) output current 3 4.4 5 ma 1.8 v generator v fb(1.8) feedback voltage 1.7 1.8 1.9 v i o(1.8) output current 3 4.2 5 ma symbol parameter conditions min. typ. max. unit
2004 mar 09 9 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 10 test and application information handbook, halfpage 0 3 2 1 0 50 100 p (w) 200 150 t amb (?c) mce472 fig.3 power dissipation as a function of ambient temperature. 70 70 1.6 mm glass epoxy board. at temperatures above t amb =25 c, power dissipation is de-rated at 13.6 mw/ c.
2004 mar 09 10 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 mce480 8 w 8 w 1 v cc 7 v cc v cc 11 gnd v cc 2 x1 32.3 k w 32.3 k w 32.3 k w 24 k w 24 k w 24 k w 24 k w 24 k w 4.7 k w 4.7 k w 4.7 k w 4.7 k w 4.7 k w 32.3 k w 32.3 k w x1 x1 x1 x1 x1 x0.5 x0.5 12 v 12 v radoutn 220 m f 12 v 3 focoutp 8 9 10 5 focoutn 6 radoutp sloutp sloutn 12 13 motoutp motoutn 14 4 28 22 18 27 26 21 20 19 24 23 17 16 15 vs 25 q1 q2 3.3 v 1.8 v 47 m f 47 m f gnd vout3.3 slin vfbin3.3 vout1.8 mute radin focin vbiasin gnd motbias vbiasout motin1 motin2 vfbin1.8 3.3 v generator mute tza1049 1.8 v generator 8 w 8 w fig.4 gain test configuration.
2004 mar 09 11 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 handbook, full pagewidth mce481 mute forward microcontroller reverse radial coil servo/coil driver spindle motor1 spindle motor2 focus coil sled coil m m 12 v 1 2 3 4 5 6 focus coil 12 v radial coil 7 8 12 v 12 v 9 sled motor m spindle motor loading motor 10 11 12 13 28 q1 q2 3.3 v 1.8 v 47 m f 220 m f 47 m f 27 26 25 24 23 22 21 20 19 18 17 16 15 14 tza1049 fig.5 spindle motor differential control application.
2004 mar 09 12 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 handbook, full pagewidth mce482 mute forward microcontroller reverse radial coil servo/coil driver spindle motor1 focus coil sled coil m m 12 v 1 2 3 4 5 6 focus coil 12 v radial coil 7 8 12 v 12 v 9 sled motor m spindle motor loading motor 10 11 12 13 28 q1 q2 3.3 v 1.8 v 47 m f 220 m f 47 m f 27 26 25 24 23 22 21 20 19 18 17 16 15 14 tza1049 fig.6 spindle motor single-ended application.
2004 mar 09 13 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 11 package outline unit a max. a 1 a 2 max bb 1 cel references outline version european projection issue date iec jedec jeita mm 2.31 0.20 0.05 2.2 5.25 5.05 0.45 0.30 0.30 0.23 7.75 7.49 0.8 1.1 y 0.089 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions are not included. sop007 03-07-28 d (1) e (1) 18.67 18.41 h e 10.02 9.62 l p 1.0 0.4 b 1 detail x a a 1 a 2 y l p l c b hsop28: plastic, heatsink small outline package; 28 leads sop007 0 5 10 mm scale x d 28 15 114 e e h e
2004 mar 09 14 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 12 soldering 12.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. 12.2 re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson-t and ssop-t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 12.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 12.4 manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2004 mar 09 15 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 12.5 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 4. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 6. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on flex foil. however, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. the appropriate soldering profile can be provided on request. 9. hot bar or manual soldering is suitable for pmfp packages. package (1) soldering method wave reflow (2) bga, htsson..t (3) , lbga, lfbga, sqfp, ssop..t (3) , tfbga, uson, vfbga not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable (4) suitable plcc (5) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (5)(6) suitable ssop, tssop, vso, vssop not recommended (7) suitable cwqccn..l (8) , pmfp (9) , wqccn..l (8) not suitable not suitable
2004 mar 09 16 philips semiconductors product speci?cation 4-channel btl driver for cd/dvd drives tza1049 13 data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). 14 definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 15 disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2004 sca76 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r32/01/pp 17 date of release: 2004 mar 09 document order number: 9397 750 11573

▲Up To Search▲

Price & Availability of TZA1049TH

	To Download TZA1049TH Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .