features data sheet no. BSDB-5000-1B mechanical specification 50 amp silicon bridge rectifiers e49 maximum ratings & electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. single phase, half wave, 60hz, resistive or inductive load. for capacitive loads, derate current by 20%. typical thermal resistance, junction to case minimum insulation breakdown voltage (circuit to case) r q jc c/w maximum average dc reverse current at rated dc blocking voltage i rm m a @ t = 25 c a o @ t = 125 c a o 1 50 2500 1.10 junction temperature range t j -55 to +150 storage temperature range t stg c -55 to +150 3.01 50sdb 0.125 nom 0.750 19.0 n/a n/a n/a n/a n/an/a 0.200 typ 1.27 typ 3.175 nom 5.08 typ 28.4 28.7 1.12 1.13 10.3 0.405 0.050 typ 15.9 0.625 millimeters inches min min max max sym bl bw ld ll lm lo ls average forward rectified current @ t = 75 c c o parameter (test conditions) maximum dc blocking voltage maximum peak recurrent reverse voltage maximum rms voltage series number i o v rms v rrm v rm symbol sdb sdb ratings units volts sdb sdb sdb sdb sdb 50 100 200 400 1000 35 70 140 280 700 50 peak forward surge current. single 60hz half-sine wave superimposed on rated load (jedec method). t = 125 c j o forward voltage (per diode) at 25 amps dc volts volts amps v fm i fsm 600 1.10 600 800 50 100 200 400 1000 600 800 420 560 5000 5001 5002 5004 5006 5008 5010 max. typ. 1.02 ul recognized - file #e124962 tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp. gardena, ca 90248 u.s.a 18020 hobart blvd., unit b v iso built-in stress relief mechanism for superior reliability and performance integrally molded heat sink provides very low thermal resistance for maximum heat transfer space saving in-line design for printed circuit board applications void free vacuum die soldering for maximum mechanical strength and heat dissipation (solder voids: typical < 2%, max. < 10% of die area) mechanical data max. mounting torque = 20 in-lb. case: terminals: round silver plated copper pins or fast-on terminals soldering: per mil-std 202 method 208 guaranteed polarity: marked on side of case mounting position: any. through hole for #10 screw. weight: case: molded epoxy with integral heat sink epoxy carries a u/l flammability rating of 94v-0 0.55 ounces (16.0 grams) rohs compliant series: sdb5000 - sdb5010 heat sink bl bl ll lm ls ls ls bw + - ac ld lo bottom view + _ sdb5006 r u { top view 612 diotec hole for#10 screw (nom. hole dia.=0.208")
rating & characteristic curves for series sdb5000 - sdb5010 data sheet no. bsdb-5000-2b tel.: (310) 767-1052 fax: (310) 767-7958 diotec electronics corp. gardena, ca 90248 u.s.a 18020 hobart blvd., unit b number of cycles at 60 hz 50 amp silicon bridge rectifiers 3.01 50sdb figure 2. maximum non-repetitive surge current e50 figure 3. typical forward characteristic per diode instantaneous forward voltage (volts) instantaneous forward current (amperes) peak forward surge current (amperes) 1 10 100 400 500 600 700200 300100 instantaneous reverse current, i (milcroamperes) figure 4. typical reverse characteristics percent of rated peak reverse voltage t = 125 c j o .01 0.1 1.0 10 100 120 140 20 40 0 60 80 t = 125 c j o t = 25 c j o 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10 100 1000 t = 25 c j o pulse width = 300 s 1% duty cycle m 30 10 0 20 40 50 60 25 75 125 150 175 figure 1. forward current derating curve case temperature, c o average forward current, io (amperes) 60hz resistive or inductive loads bridge mounted on9" x 4" x 5" thick (22.9cm x 10.2cm x 12.9cm) finned al. plate
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