dfm1200exs12 - a000 fast recovery diode module replaces ds5851 - 1.2 ds5851 - 2 august 2011 (ln 28651 ) 1 / 7 www.dynexsemi.com features ? low reverse recovery charge ? high switching speed ? low forward volt drop ? isolated cu base with al 2 o 3 substrates ? triple diodes can be paralleled for 3600a r ating ? lead free c onstruction applications ? chopper diodes ? boost and buck converters ? free - whe el circuits ? snubber circuits ? resonant converters ? induction heating ? multi - level switch inverters the df m 12 00e xs12 - a000 is a triple 12 00v, fast recovery diode (frd) module. designed for low power loss, the module is suitable for a variety of high voltage a pplications in motor drives and power conversion. fast switching times and low reverse recovery losses allow high frequency operation, making the device suitable for the latest drive designs employing pwm and high frequency switching. the module incorpor ates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety . ordering information order as: df m 12 00e xs12 - a000 note: when ordering, please us e the complete part number key parameters v rrm 1200 v v f (typ) 1.9 v i f (max) 12 00 a i fm (max) 24 00 a external connection required for a single 36 00a diode fig. 1 circuit configuration outline type code: e (see fig. 7 for f urther information) fig. 2 package 4 (a3) 5 (k3) 8 (a1) 6 (a2) 7 (k2) 9 (k1)
df m 1200exs12 - a000 2 /7 www.dynexsemi.com absolute maximum ratings C per arm stresses above those listed under absolute maximum ratings may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may include potentiall y hazardous rupture of the package. appropriate safety precautions should always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25c unless stated otherwise symbol parameter test conditions max. units v rrm re peti tive peak reverse voltage t j = 125c 1200 v i f forward current dc, t case = 75 c , t j = 125c 12 00 a i fm max. forward current t case = 110 c , t p = 1ms 24 00 a i 2 t i 2 t value fuse current rating v r = 0, t p = 10ms, t j = 125c 400 ka 2 s p max max. transisto r power dissipation t case = 25c, t j = 125 c 7520 w v isol isolation voltage C per module commoned terminals to base plate. ac rms, 1 min, 50hz 2500 v thermal and mechanical ratings internal insulation material: al 2 o 3 baseplate material: cu creepag e distance: 33 mm clearance: 2 0 mm cti (comparative tracking index): >600 symbol parameter test conditions min typ. max units r th(j - c) thermal resistance (per arm ) continuous dissipation C th(c - h) thermal resistance C j junction temperature - - 125 c t stg storage temperature range - 40 - 125 c screw torque mounting C C
df m 1200exs12 - a000 3 / 7 www.dynexsemi.com stati c electrical characteristics C per arm t case = 25 c unless stated otherwise. symbol parameter test conditions min typ max units i rm peak reverse current v r = 12 00v, t j = 125c 30 ma v f forward voltage i f = 12 00a 1.9 2.2 v i f = 12 00a, t j = 125c 2.1 2.4 v l m i nductance 20 nh static electrical characteristics t case = 25c unless stated otherwise. symbol parameter test conditions min typ max units l m module inductance (externally connected in parallel) 15 nh dynamic electrical cha racteristics C per arm t case = 25c unless stated otherwise symbol parameter test conditions min typ. max units q rr reverse recovery charge i f = 12 00a v r = 6 00v di f /dt = 9 0 00a/ s 200 c i rr peak r everse recovery current 800 a e rec reverse recovery energy 80 mj t case = 125c unless stated otherwise symbol parameter test conditions min typ. max units q rr reverse recovery charge i f = 12 00a v r = 6 00v di f /dt = 84 00a/s 300 c i rr peak r everse recovery current 920 a e rec reverse recovery energy 140 mj
df m 1200exs12 - a000 4 /7 w ww.dynexsemi.com fig. 3 diode typical forward characteristics fig. 4 transient thermal impedance fig. 5 dc current rating vs case temperature fig. 6 rbsoa
df m 1200exs12 - a000 5 / 7 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated otherwise. do not scale. nominal weight: 22 50g module outline type code: e fig. 7 module outline drawing screwing depth max. 16 screwing depth max. 8 6 x m8 3 x m4 dim....esm....... dim....ecm....... dfm....exm....... 7 external connection external connection 5(c) 7(c) 4(e) 6(e) 9(c) 8(e) external connection external connection 3(c) 2(g) 1(e) 7(c) 9(c) 6(e) 8(e) 5(c) 4(e) external connection external connection 3(c) 2(g) 1(e) 5(c) 7(c) 4(e) 6(e) 9(c) 8(e) 8 x 7 ? 57 0.1 171 0.15 190 0.5 20 0.1 40 0.2 124 0.1 140 0.5 79.4 0.2 41.25 0.2 20.25 0.2 61.5 0.3 61.5 0.3 13 0.2 5 0.2 38 0.5 5.2 0.2 40 0.2 28 0.5
df m 1200exs12 - a000 6 /7 w ww.dynexsemi.com important information: this publication is provided for information only and not for resale. the products and information in this publication are intended for use by appropriately trained technical personnel. due to the diversity o f product applications, the information contained herein is provided as a general guide only and does not constitute any guarantee of suitability for use in a specific application . the user must evaluate the suitability of the product and the completeness of the product data for the application. the user is responsible for product selection and ensuring all safety and any warning requirements are met. should additional product information be needed please contact customer service. although we have endea voured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. the information is provided without any warranty or guarantee of any kind. this publication is an uncontrolled document and is subject to change without notice. when referring to it please ensure that it is the most up to date version and has not been superseded. the products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage t o property. the user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. the products must not be touched when operating because there is a danger of electrocution or seve re burning. always use protective safety equipment such as appropriate shields for the product and wear safety glasses. even when disconnected any electric charge remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. use outside the product ratings is likely to cause permanent damage to the product. in extreme conditions, as wit h all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. appropriate application design and safety precautions should always be followed to protect persons and pr operty. product status & product ordering: we annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet fully appr oved for production. the annotations are as follows: - target information: this is t he most tentative form of information and represents a very preliminary specification. no actual design work on the product has been started. preliminary information: the product design is complete and final characterisation for vo lume production is in progress. the datasheet represents the product as it is now understood but details may change. no annotation: the product has been approved for production and unless otherwise notified by dynex any product ordered will be supplied to the current vers ion of the data sheet prevailing at the time of our order acknowledgement. all products and materials are sold and services provided subject to dynexs conditions of sale, which are available on request. any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. headquarters operations customer service dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom dynex semiconductor ltd doddi ngton road, lincoln, lincolnshire, ln6 3lf, united kingdom fax: +44(0)1522 500550 fax: +44(0)1522 500020 tel: +44(0)1522 500500 tel: +44(0)1522 502753 / 502901 web: http://www.dynexsemi.com email: power_solutions@dynexsemi.com ? dynex semiconductor ltd. 2005. technical documentation C not for resale.
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