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BD555BKFV product structure silicon monolithic integrated circuit this product is not designed protection against rad ioactive rays . 1/10 tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 tsz22111 ? ?? ? 14 ? ?? ? 001 www.rohm.com datasheet BD555BKFV ac/dc controller ic for mains dimmable led lighting BD555BKFV general description the BD555BKFV controller ac/dc controller ic can be used in a wide range of dimmable led lighting driver applications. the main target application is dimmab le retro-fit led lighting, replacing existing incandesc ent light bulbs, halogen spot lights, cfl tubes etc. features fixed frequency dc/dc controller (selectable) peak current or average current control (pcc/acc) dynamic load current controller (dlcc) logarithmic compensation of detected dimming level dimmer detector function anti-flash function when dimmer is off pwm and analog dimming control supported over current protection (ocp) thermal shutdown protection (tsd) under voltage lock out (uvlo) applications retro-fit dimmable led lighting (e27, e14, gu10, t8 etc.). wide range of triac and transistor dimmers supported by dlcc function. custom led lighting with pwm or voltage controlled dimming. key specifications input voltage range............................... .........16~39v regulated supply voltage.......................... .......11.5v fixed dc/dc operating frequency.........40~400khz detectable phase-cut range........................ 45~135 typical current consumption....................... ......1ma under voltage lock out detection.................. ...9.0v operating temperature range.................-40~+1 10c package w(typ.) x d(typ.) x h(max.) ssop-b14 5.00mm x 6.40mm x 1.15mm typical application circuits figure 1 . typical application circuit for non-isolated dimmable buck topology
2/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 pin configuration figure 2. pin configuration figure 3. equivalent circuit pin description pin pin name function 1 bldr driver for dynamic load current controller (d lcc) transistor 2 wbld internal strong load current input (connecte d to internal open drain nmos) 3 isys *1 sense voltage input for dlcc on/off function 4 gnd ground terminal 5 dim detected dimming level reference voltage 6 det input for detecting phase-cut angle 7 ref *2 pin for external resistor to set led current (averag e current control mode) 8 osc *2 pin for external resistor to set dc/dc operating fr equency 9 fb *3 average current feedback input or pcc mode selectio n (v fb <1.5v) 10 isns sense voltage for peak current regulation & ov er current protection (ocp) 11 pgnd *4 ground terminal for internal bldr and sw driver st ages 12 sw driver output for gate of external dc/dc swit ching mosfet 13 vddh regulated supply voltage 14 sup input supply voltage *1 between isys and gnd are internal anti-parallel surge diodes *2 connect only resistive load according to applica tion instructions *3 fb terminal is pre-charged to 4v during start- up in order to have smooth start of the led current regulation. never connect this pin directly to gnd . *4 between gnd and pgnd are internal anti-parallel diodes
3/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 block diagram description of blocks startup sequence: when an ac input voltage is applied, the rectified mains voltage (vhv) is buffered by capacitor c2 and starts supplying the BD555BKFV via start-up resistor r 6. the vddh capacitor c5 will be charged by the inte rnal regulator until the system uvlo condition is released, after which a pwm signal from terminal sw can start driving the external nmos when the anti-flash detector is released. anti-flash detector: some dimmers require a small leakage current to pow er an internal electronic control circuit or an ind icator led. in order to prevent a false start when the vhv buffer cap was accidentally charged by this leakage current, the detection level voltage on the dim terminal needs to rise abo ve 400mv, before the sw terminal starts switching, lighting up the leds. dc/dc buck converter: when the sw signal is high, it turns on the mn2 mo sfet, building up a current in coil l1 via the led string. during the off period of mn2, the current f lows via fly-back diode d4. capacitor c4 stabilizes the led voltage to reduce the led current ripple. the led current is regulated by controlling the led forward voltage. auxiliary supply voltage: the alternating current in the primary side of ind uctor l1 is coupled n p :n s to the secondary side, creating a voltage alternating between v vhv (mn2=on) and (v led + v th,d4 )* n s /n p (mn2=off). this last voltage is passed on to capacitor c3 via diode d5. this creates an auxiliar y supply which improves efficiency by reducing the resistive power loss in the start-up resistor r6. led average current control (acc) mode: the BD555BKFV features two feedback mechanisms by aver age current control (acc) or peak current control (pcc). in acc mode, the high-side sensing resistor r7 is used in the led cur rent mirror (typically 1:500), creating an led feedback current in transist or q1. this current flows to the fb terminal and cre ating a reference voltage (for led current regulation) across resistor r12 at the ref terminal. figure 4. block diagram of BD555BKFV functions
4/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 led peak current control (pcc) mode: alternatively, in pcc mode (v fb <1.5v), the duty-cycle of the sw signal is determin ed by the peak current through resistor r10. the isns terminal senses the voltage across resistor r10. wh en this voltage reaches the reference voltage, the sw signal will b e pulled low. during startup and in acc mode, this f unction is used as over current protection to limit the current through ind uctor l1. in both acc and pcc mode, the ref voltage wi ll be adjusted to the detected phase-cut in case a dimmer is connected. phase-cut detection: via resistive divider r4/r5 at the det terminal, the rising and falling edge of the phase-cut are detec ted, generating an internal pwm signal. via an internal resistor and external capacitor c1, this pwm signal is averaged into a dimming reference voltage at the dim terminal. an in ternal conversion function creates a logarithmicall y corrected voltage at the ref terminal. this allows achieving a natural led l ight intensity curve as perceived by the human eye, when turning the dimmer knob. dimmer stability: based on the phase-cut detection at the det termina l, the dlcc dynamically adjusts the total load curr ent for stable operation of leading edge triac dimmers . for trailing edge dimmers, the dlcc load curren t pulls down the dimmer output voltage, in order to detect the falling edge . in case the vhv current exceeds the minimum load cu rrent requirement, the dlcc load current can disabled completely. this all ows to achieve high efficiency without dimmers. dimmer detector: when a dimmer is not present, the dlcc will be swi tched off.
5/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 absolute maximum ratings parameter symbol maximum rating unit supply voltage (sup terminal) v sup 40 v internal supply regulator voltage (vddh terminal) v vddh 15.5 v sw output current i sw 600 *1 ma bldr output current i bldr 60 *1 ma wlbd, isns terminal voltage v wbld , v isns 15.5 v wbld input current (strong load current) i sbld 300 *2 ma dim, det, osc, ref, fb terminal voltage v dim , v det , v osc , v ref , v fb 4.5 v fb input current (v fb =4.5v) i fb 4.0 ma isys, pgnd terminal voltage v isys , v pgnd +/- 0.5 v operating frequency f operating 400 khz maximum power dissipation p d 0.87 *4 w operating ambient temperature range t a -40 +110 c storage temperature range t storage -55 +150 c maximum junction temperature t junction,max +150 c *1 i sw pulse current duration <100ns@ f operating *2 i bldr pulse current duration <1us@ f mains never exceed 0.8*pd *3 i wbld pulse current duration <300us@ f mains *4 ssop-b14 package thermal resistance r ja =143c/w, mounted on a two-layer pcb of 70x70x1.6mm 3 recommended operating range (ta= -40 ~ +110c) parameter symbol range unit supply voltage vsup 16 ~ 39 v electrical characteristics parameter symbol limits unit comments min. typ. max. internal supply regulator* 1 startup current i sup,start - 0.4 0.8 ma in uvlo condition supply current on i sup,ns - 0.8 1.0 ma no switching. supply current on 1 i sup,on1 - 1.0 1.3 ma no load on sw/bldr, f sw =40khz. supply current on 2 i sup,on2 - 2 2.4 ma no load on sw/bldr, f sw =400khz. vddh internal regulator voltage v vddh 10.0 11.5 15.0 v vddh load current i vddh < 10ma uvlo release voltage v uvlo,rl 9.20 10.0 10.8 v vddh rising uvlo trigger voltage v uvlo,tr v uvlo,tr - v uvlo,hys v vddh falling uvlo hysteresis v uvlo,hys 0.75 1.00 1.25 v switching regulator minimum frequency f sw_min 32 40 48 khz f sw = 9.010 6 /r11 (khz) 20% , for frequency range 40khz to 400khz. maximum frequency f sw_max 320 400 480 khz sw maximum duty cycle max 70 75 80 % sw minimum on-time t on,min - 80 140 ns determines minimum duty-cycle
6/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 parameter symbol limits unit comments min. typ. max. sw slew rate t sw,slew - 50 100 ns v sw = 111v at 1nf load (rising/falling) sw driver on resistance (pmos) r sw,p - 15 40 ? v sw =0v, i sw =-10ma sw driver off resistance (nmos) r sw,n - 15 40 ? v sw = vddh, i sw =10ma duty cycle, fb=3.5v 20 2 20 38 % acc mode duty cycle, fb=2.9v 60 36 60 80 % fb mode selection threshold v fb,mode 1.4 1.6 1.9 v pcc (v fb <1.4v), acc (v fb >1.9v) isns trigger voltage (ocp) v ocp 1.08 1.20 1.36 v inductor current limiter in acc mode isns blanking time (ocp) t ocp,blank 90 140 180 ns used in pcc & acc mode dimmer phase-cut detector det phase cut voltage (rising) v det,r 215 260 300 mv monitored at output bridge rectifier det phase cut voltage (falling) v det,f 75 110 190 mv det phase cut hysteresis v det,hys 75 130 180 mv dim voltage (no dimming) v dim1 2.85 3.0 3.15 v phase-cut = 135 dim voltage (max dimming) v dim2 0.95 1.0 1.05 v phase-cut = 45 ref voltage (no dimming) acc v ref,a1 1.85 2.0 2.15 v acc mode (v fb >1.9), 2k ? < r ref < 10k ? ref voltage (max dimming) acc v ref,a2 75 100 135 mv isns voltage (no dimming) pcc v isns,p1 1.12 1.24 1.36 v pcc mode (v fb < 1.5v). v isns peak current threshold, r ref =2k ? isns voltage (max dimming) pcc v isns,p2 200 260 316 mv dynamic load current controller bldr driver slew rate t bldr,slew - 1 5 s v sw = 111v at 1nf load (rising/falling) bldr driver on resistance r bldr,p - 100 300 ? v bldr =0v, i bldr =-10ma bldr driver off resistance r bldr,n - 100 300 ? v bldr = vddh, i bldr =10ma strong load current i sbld,sat 200 250 - ma strong load current on (v isys <100mv, v dim <3.4v, v vddh =11.5v, v wbld- v isys =8v) strong load internal nmos r on r on,sbld - 10 300 ? strong load current on (v isys <100mv, v dim <3.4v, v vddh =11.5v, v wbld- v isys =8v) strong load current off delay t sb,off 180 250 320 s after phase-cut rising edge dimmer detector trigger voltage v dim,tr 3.3 3.5 3.7 v dlcc load current off dimmer detector release voltage v dim,rl v dim,tr -v dim,hys v dlcc load current on dimmer detector hysteresis v dim,hys 50 100 170 mv isys load current off voltage v isys,off -260 -200 -160 mv dlcc load current off isys load current on voltage v isys,on v isys,off +v isys,hys mv dlcc load current on isys current sense hysteresis v isys,hys 75 100 140 mv anti-flash detector threshold v dim,start 360 400 440 mv dc/dc starts switching (v dim >400mv) *1 the supply regulator has a thermal shutdown func tion that triggers at about 175c, having a hystere sis of about 20c. this protects against a too high junction-temperature (e.g. due to short currents of vddh, sw or bldr to (p)gnd on the pcb or excessi ve ambient temperatures).
7/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 application examples the BD555BKFV is typically used as a controller ic i n retro-fit dimmable led lighting systems. the exter nal component selection is fully dependent on the type of led driver. for more information about this, plea se refer to the BD555BKFV application note. the example circuit belo w shows a dimmable non-isolated buck converter. a non-isolated topology is suitable for relatively lo w led power (e.g. v led =100v and i led =40ma) applications in which the led heatsink is electrically isolated by a non-condu ctive led lamp casing. figure 5 . final application circuit for non-isolated dimmabl e acc led driver notes of board layout there are a few considerations for designing a smal l-sized pcb that fits inside a led lamp casing. speci al attention needs to be given to component placement for optima l grounding and minimum distances of high-voltage w iring. 1) ocp sense resistor r ocp and snubber resistor rs need to be connected as cl ose as possible to the minus terminal of the vhv buffer capacitor. 2) the drain terminal of switching nmos mn2 should b e close to the inductor l1p and fly-back diode d4. 3) the gnd and pgnd terminals need to be connected d irectly on the pcb. 4) for mains-isolated designs (not described in thi s document), the isolated pcb terminals need to be s eparated from the 'hot' side electronics. selection of components externally connected please refer to the BD555BKFV application note for more information about selecting the external components . power dissipation the power dissipation of the BD555BKFV is mainly depen dent on the fixed dc/dc operating frequency and the applied load at the sw and bldr terminals. this power consumption s hould be less than 80% of the allowable package pow er dissipation.
8/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 operational notes 1) absolute maximum ratings when the ic is operated outside of the given absolu te maximum ratings, internal devices of the ic can break down and resulting failure modes may be impossible to identify. in case any special operating mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safe ty measures including the use of fuses or overvoltage clamping devices, etc. 2) special caution on terminal connections a. never connect the fb terminal directly to gnd. t o enable pcc mode, the fb terminal is best pulled down by a resistor (>10k) to gnd. b. always protect the isys terminal with a reverse dio de to gnd in case of using ground current sensing in a dimmable led driver application. for additional operation stability, a capacitor >1uf is added between gnd and isys terminals. c. never connect a capacitive load to the ref and osc terminals. only resistive loads can be connected to these terminals. d. always short gnd and pgnd terminals on the applic ation pcb. special care needs to be taken to keep the gnd terminal free from noise. none of the ic terminals except isys should have a negative potential. e. no external voltage should be applied to the ic terminals when the supply voltage on the sup termina l is absent. 3) erroneous mounting and terminal short circuit if the ic is mounted incorrectly or in case of a sh ort circuit between supply line, ground and other t erminals, the ic may malfunction or break down. 4) thermal shut down when the ic junction temperature exceeds about 175 c, the tsd function disables internal circuits of th e ic and pulls down the internal supply voltage vddh. the sw terminal will cease switching which stops the dc/dc operation of the application. this safety mea sure also reduces potential physical damage as a re sult of overheating in case of a short circuit between vddh, sw, bldr and gnd terminals. in the thermal design of the application (pcb), the maximum ambient operating temperature and ssop-b14 maximum power dissipation (pd) need to be considered to avoid unwa nted triggering of the tsd function. 5) operation in electromagnetic fields the functionality of this ic is not guaranteed in t he presence of (strong) electromagnetic fields. 6) external buffer capacitors the capacitor value derating of vs. voltage and tem perature and lifetime degradation need to be taken into account in order to ensure proper operation of the ic. status of this document the english version of this document is formal speci fication. versions in other languages are for refer ence only. in case of a difference between this english document and a tran slated version, this formal english version takes p riority.
9/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 ordering information b d 5 5 5 b k f v - e 2 part no. package fv: ssop14 packaging and forming specification e2: embossed tape and reel none: tray, tube physical dimension tape and reel information marking diagram (top view) (unit : mm) ssop-b14 8 7 14 1 0.10 6.4 0.3 4.4 0.2 5.0 0.2 0.22 0.1 1.15 0.1 0.65 0.15 0.1 0.3min. 0.1 * order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 ( ) direction of feed reel 1pin 1pin mark ssop-b14 555bk product name. lot no.
10/10 datasheet BD555BKFV tsz02201-0w1w0c300010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 03.aug.2012 rev.001 www.rohm.com tsz22111 ? ?? ? 15 ? ?? ? 001 revision history date revision changes 03.aug.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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