pb rohs euaa33-23.333m eu a a 33 -23.333m series rohs compliant (pb-free) resistance welded hc-49/u crystal frequency tolerance/stability 50ppm at 25c, 100ppm over 0c to +70c mode of operation at-cut fundamental nominal frequency 23.333mhz load capacitance 33pf parallel resonant electrical specifications nominal frequency 23.333mhz frequency tolerance/stability 50ppm at 25c, 100ppm over 0c to +70c aging at 25c 5ppm/year maximum load capacitance 33pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 25 ohms maximum mode of operation at-cut fundamental drive level 2mwatts maximum storage temperature range -40c to +125c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c lead integrity mil-std-883, method 2004 lead termination sn 2m - 6m mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a mechanical dimensions (all dimensions in millimeters) line marking 1 ecliptek 2 e23.333m e=configuration designator 3 xx xx=ecliptek manufacturing code www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 1 of 3 12.70 min 13.58 max 4.88 0.20 dia 0.457 0.051(x2) 4.70 max 11.18 max
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods euaa33-23.333m high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 2 of 3
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods euaa33-23.333m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 3 of 3
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