21 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series sp1001 general purpose esd protection - sp1001 series description zener diodes fabricated in a proprietary silicon avalanche technology protect each i/o pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (esd). these robust diodes can safely absorb repetitive esd strikes above the maximum level speci?ed in the iec 61000-4-2 international standard ( level 4, 8kv contact discharge) without performance degradation. their very low loading capacitance also makes them ideal for protecting high- speed signal pins. pinout functional block diagram features t - p x d b q b d j u b o d f p g q ' (typ) per i/o t & 4 % q s p u f d u j p o p g ? l 7 contact discharge, 30kv air discharge, ( level 4, iec61000-4-2) t & ' 5 q s p u f d u j p o
iec61000-4-4, 40a (5/50ns) t - p x m f b l b h f d v s s f o u p g 0.5a (max) at 5v t 4 n b m m q b d l b h f t b w f t board space t - j h i u o j o h 1 s p u f d u j p o
iec61000-4-5, 2a (8/20s) applications t $ p n q v u f s 1 f s j q i f s b m t t . p c j m f 1 i p o f t t % j h j u b m $ b n f s b t t % f t l u p q t / p u f c p p l t t - $ % 1 % 1 5 7 t t 4 f u 5 p q # p y f t t % 7 % 1 m b z f s t t . 1 1 . 1 1 3 4 5 sp1001-02 (sc70-3) (sc70- 5 ) (sc70-6) 1 3 2 sp1001-04 1 3 5 4 6 sp1001-0 5 2 2 1 3 4 5 1 3 5 4 6 2 2 sp1001-02 (sot 55 3) 4 5 2 nc nc sp1001-04 (sot 55 3) sp1001-0 5 (sot 5 63) sp1001-02 sp1001-02 2 3 1 2 13 4 2 5 2 13 sp1001-0 5 sp1001-04 4 5 4 6 5 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green application example shield ground sp 1001-04jtg (sc70-5) sp 1001-04xtg (sot553) outside world input lcd module controller d1 d2 d3 d4 signal ground sp1001 series - 8pf 15kv unidirectional tvs array
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 22 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series general purpose esd protection - sp1001 series absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2 a t op operating temperature -40 to 85 c t stor storage temperature -60 to 150 c caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speci?cation is not implied. electrical characteristics (t op = 25c) parameter symbol test conditions min typ max units forward voltage drop v f i f =10ma 0.7 0.9 1.2 v reverse voltage drop v r i r =1ma 7.0 7.8 8.5 v reverse standoff voltage v rwm i r 1a 5.5 v reverse leakage current i leak v r =5v 0.5 a clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 8.0 11.0 v i pp =2a, t p =8/20s, fwd 9.7 13.0 v dynamic resistance r dyn (v c2 - v c1 ) / (i pp2 - i pp1 ) 1.7 esd withstand voltage 1,2 v esd iec61000-4-2 (contact) 15 kv iec61000-4-2 (air) 30 kv diode capacitance 1 c d reverse bias=0v 12 pf reverse bias=2.5v 8 pf reverse bias=5v 7 pf notes: 1 parameter is guaranteed by device characterization 2 a minimum of 1,000 esd pulses are applied at 1s intervals between the anode and common cathode of each diode thermal information parameter rating units storage temperature range -65 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 10s) 260 c capacitance vs. reverse bias 0 2 4 6 8 10 12 14 dc bias (v) capacitance (pf) 00. 5 11. 5 22. 5 33. 5 44. 555 . 5 6 design consideration because of the fast rise-time of the esd transient, placement of esd devices is a key design consideration. to achieve optimal esd suppression, the devices should be placed on the circuit board as close to the source of the esd transient as possible. install the esd suppressors directly behind the connector so that they are the ?rst board-level circuit component encountered by the esd transient. they are connected from signal/data line to ground.
23 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series sp1001 general purpose esd protection - sp1001 series time temperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat prehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zon e t l to t p re?ow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max re?ow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 250 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters part numbering system ordering information part number package marking min. order qty. SP1001-02JTG sc70-3 a x 2 3000 sp1001-02xtg sot553 a x 2 5000 sp1001-04jtg sc70-5 a x 4 3000 sp1001-04xtg sot553 a x 4 5000 sp1001-05jtg sc70-6 a x 5 3000 sp1001-05xtg sot563 a x 5 5000 part marking system sp 1001 -02 j t g series number of channels 02 = 2 channel 04 = 4 channel 0 5 = 5 channel package j = sc70-3, - 5 or -6, 3000 qty x = sot 55 3 or sot 5 63, 5 000 qty t= tape & reel g= green silicon protection array (spa tm ) family of tvs diode arrays product characteristics lead plating matte tin (sc70-x) pre-plated frame (sot5x3) lead material copper alloy lead coplanarity 0.0004 inches (0.102mm) subsitute material silicon body material molded epoxy flammability ul94-v-0 notes : 1. all dimensions are in millimeters 2. dimensions include solder plating. 3. dimensions are exclusive of mold ?ash & metal burr. 4. all speci?cations comply to jedec spec mo-203 issue a 5. blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. package surface matte ?nish vdi 11-13. a xx a x x product series a = sp1001 series assembly site (varies) number of channels (varies)
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 24 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series general purpose esd protection - sp1001 series package dimensions sc70 b 3 e he 2 1 e e d a2 a a1 c l package sc70-3 pins 3 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.66 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 package sc70-6 pins 6 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 d a2 a a1 c l e he 2 1 3 6 5 4 b b b d a2 a a1 c l e he 2 1 3 6 5 not used 4 e e b package sc70-5 pins 5 jedec mo-203 issue a millimeters inches min max min max a 0.80 1.10 0.031 0.043 a1 0.00 0.10 0.000 0.004 a2 0.70 1.00 0.028 0.039 b 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 d 1.85 2.25 0.073 0.089 e 1.15 1.35 0.045 0.053 e 0.65 bsc 0.026 bsc he 2.00 2.40 0.079 0.094 l 0.26 0.46 0.010 0.018 sc70-5 solder pad layout sc70-6 solder pad layout sc70-3 solder pad layout
25 ?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series sp1001 general purpose esd protection - sp1001 series package dimensions sot5 package sot 553 pins 5 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1.10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 5 (not used) c he l a d 6 4 2 3 e e b package sot 563 pins 6 millimeters inches min max min max a 0.50 0.60 0.020 0.024 b 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 d 1.50 1.70 0.059 0.067 e 1.10 1.30 0.043 0.051 e 0.50 bsc 0.020 bsc l 0.10 0.30 0.004 0.012 he 1.50 1.70 0.059 0.067 c he l a d 6 4 2 3 e e b 5 embossed carrier tape & reel speci?cation sc70-3 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.30 2.50 0.090 0.098 a1 1.00 ref 0.039 ref b0 2.30 2.50 0.090 0.098 b1 1.90 ref 0.074 k0 1.10 1.30 0.043 0.051 k1 0.60 ref 0.023 ref t 0.27 max 0.010 dimensions sot 553 solder pad layout sot 563 solder pad layout
?2011 littelfuse, inc. speci?cations are subject to change without notice. please refer to www.littelfuse.com/spa for current information. 26 tvs diode arrays (spa ? family of products) revision: april 14, 2011 sp1001 series general purpose esd protection - sp1001 series embossed carrier tape & reel speci?cation sc70-5 and sc70-6 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 1.00 1.25 0.039 0.049 p0 3.90 4.10 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 2.14 2.34 0.084 0.092 b0 2.24 2.44 0.088 0.096 k0 1.12 1.32 0.044 0.052 t 0.27 max 0.010 max dimensions embossed carrier tape & reel speci?cation sot553 and sot563 millimetres inches min max min max e 1.65 1.85 0.065 0.073 f 3.45 3.55 0.135 0.139 p2 1.95 2.05 0.077 0.081 d 1.40 1.60 0.055 0.063 d1 0.45 0.55 0.017 0.021 p0 3.90 4.1 0.154 0.161 10p0 40.0 +/- 0.20 1.574 +/- 0.008 w 7.70 8.10 0.303 0.318 p 3.90 4.10 0.153 0.161 a0 1.73 1.83 0.068 0.072 b0 1.73 1.83 0.068 0.072 k0 0.64 0.74 0.025 0.029 t 0.22 max .009 max dimensions
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