1/4 rev. a structure silicon monolithic integrated circuit product name over voltage protection cont roller with internal fet model name BD6044GUL block diagram see figure 1 package dimensions see figure 2 features overvoltage protection up to 36v internal low ron (125m ? ) fet over voltage lockout (ovlo) under voltage lockout(uvlo) internal 2msec startup delay over current protect thermal shut down small package: vcsp50l1(1.6mm x 1.6mm, height=0.55mm) this product is not especially designed to be protected from radioactivity. absolute maximum ratings (ta=25 ) contents symbol rating unit conditions input supply voltage 1 vmax1 -0.3 36 v in1, in2, in3, in4 input supply voltage 2 vmax2 -0.3 7 v other power dissipation pd 725 mw operating temperature range topr -35 +85 storage temperature range tstr -55 +150 1 when using more than at ta=25 , it is reduced 5.8 mw per 1 . rohm specification board 50mm 58mm mounting. recommended operating range (ta=-35 +85 ) parameter symbol range unit usage input voltage range v in 2.2 34 v this product is not especially designed to be protected from radioactivity.
2/4 rev. a electrical characteristics (unless otherwise noted, ta = 25 ? c, in=5v) parameter symbol rating unit conditions min. typ. max. electrical input voltage range vin - - 34 v supply quiescent curre nt 1 icc1 - 45 90 ? a in=5v, en=l supply quiescent current 2 icc2 - 60 120 ? a in=5v, en=h under voltage lockout uvlo 2.53 2.65 2.77 v in=decreasing under voltage lockout hysteresis uvloh 50 100 150 mv in=increasing over voltage lockout ovlo 6.2 6.4 6.6 v in=increasing over voltage lockout hysteresis ovloh 50 100 150 mv in=decreasing current limit ilm 1.2 2 3 a vin vs. vout res. ron - 125 150 m ? flgb output low voltage flgbvo - - 400 mv sink=1ma flgb leakage current flgbleak - - 1 ? a en input voltage (h) enh 1.45 - - v en input voltage (l) enl - - 0.5 v en input current enc 12 25 50 ? a ? en=1.5v timings (flgb pull up resistance 100k ) start up delay ton - 2 4 msec output turn off time toff - 2 10 ? sec alert delay tovp - 1.5 10 ? sec * this product is not especially design ed to be protected from radioactivity.
3/4 rev. a block diagram pin number/pin name figure1. block diagram pin descriptions pin name function a2, a3 b2, b3 in1, 2, 3, 4 input voltage pin. a 1 ? f low esr capacitor, or larger must be connected between this pin and gnd a1, b1 out1, 2 output voltage pin c1 flgb active-low open drain output to signal if the adapter voltage is correct c3 gnd ground pin c2 en enable input drive en high to turn off out (hi-z output) package dimensions (vcsp50l1) figure2. package use-related cautions pin number pin name a2 in1 a3 in2 b2 in3 b3 in4 a1 out1 b1 out2 c3 gnd c1 flgb c2 en 6044 lot no.
4/4 rev. a (1) absolute maximum ratings if applied voltage (vdd, vin), operating temp erature range (topr), or other absolute maximum ratings are exceeded, there is a r isk of damage. since it is not possible to identify short, open, or other damage modes, if special modes in wh ich absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures. (2) recommended operating range this is the range within which it is possible to obtain roughl y the expected characteristics. for electrical characteristics, it is those that are guaranteed under the conditions for each parame ter. even when these are within the recommended operating range, voltage and te mperature characteristics are indicated. (3) reverse connection of power supply connector there is a risk of damaging the lsi by reverse connection of the power supply connector. for protection from reverse connectio n, take measures such as externally placing a diode between the power supply and the power supply pin of the lsi. (4) power supply lines in the design of the board pattern, make pow er supply and gnd line wiring low impedance. when doing so, although the digital power supply and analog power supply are the same potential, separate the digital power sup ply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due to the common impedance of the wir ing patterns. similarly take pattern design into account for gnd lines as well. furthermore, for all power supply pins of the lsi, in conjunc tion with inserting capacitors between power supply and gnd pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitan ce loss occurring at low temperatures is not a problem for various characteristics of the capacitors used. (5) gnd voltage make the potential of a gnd pin such that it will be the lowest po tential even if operating below that. in addition, confirm t hat there are no pins for which the potential becomes less than a gnd by actually including transition phenomena. (6) shorts between pins and misinstallation when installing in the set board, pay adequate attention to orientation and placement discrepancies of the lsi. if it is insta lled erroneously, there is a risk of lsi damage. there also is a risk of damage if it is shorted by a foreign substance getting between pins or between a p in and a power supply or gnd. (7) operation in strong magnetic fields be careful when using the lsi in a strong magnetic field, since it may malfunction. (8) inspection in set board when inspecting the lsi in the set board, si nce there is a risk of stress to the lsi when capacitors are connected to low imped ance lsi pins, be sure to discharge for each process. moreover, when getting it on and of f of a jig in the inspection process, always connect it after t urning off the power supply, perform the inspection, and remove it after turning off the power supply. furthermore, as countermeasures against static elect ricity, use grounding in the assembly process and take appropriate care in transport and storage. (9) input pins parasitic elements inevitably are formed on an lsi structure due to potential relati onships. because parasitic elements operat e, they give rise to interference with circuit operation and may be the cause of malfunc tions as well as damage. accordingly, take care not to appl y a lower voltage than gnd to an input pin or use the lsi in other ways such that para sitic elements operate. moreover, do not apply a voltage to an input pin when the power supply voltage is not being applied to the lsi. furthermore, when the power supply vo ltage is being applied, make each input p in a voltage less than the power supply voltage as well as within the guaranteed values of electrical characteristics. (10) ground wiring pattern when there is a small signal gnd and a large current gnd, it is r ecommended that you separate the large current gnd pattern and small signal gnd pattern and provide single point grounding at the reference point of the set so that voltage variation due to resistance components of the pattern wiring and large currents do not cause the small signa l gnd voltage to change. take care that the gnd wiring pattern of externally attach ed components also does not cha nge. (11) externally at tached capacitors when using ceramic capacitors fo r externally attached capacitors , determine constants upon taking into account a lowering of th e rated capacitance due to dc bias and capacitance change due to factors such as temperature. (12) thermal shutdown circuit (tsd) when the junction temperature r eaches the defined value, the thermal shutdown ci rcuit operates and turns a switch off. the the rmal shutdown circuit, which is aimed at isolating the ls i from thermal runaway as much as possible, is not aimed at the protection or guaran tee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual st ates of use.
r0039 a www.rohm.com ? 2009 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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