pb rohs eps13d2c1hd-33.333m eps13d2 c 1 h d -33.333m series rohs compliant (pb-free) 3.3v 4 pad 5mm x 7mm ceramic smd lvcmos programmable spread spectrum oscillator frequency stability 100ppm maximum over operating temperature of -20c to +70c duty cycle 50 10% nominal frequency 33.333mhz spread spectrum 1.00% center spread output control function tri-state electrical specifications nominal frequency 33.333mhz frequency stability 100ppm maximum over operating temperature of -20c to +70c (inclusive of all conditions: frequency stability over the operating temperature range, supply voltage change, output load change, first year aging at 25c, shock, and vibration.) aging at 25c 5ppm first year maximum supply voltage 3.3vdc 0.3vdc maximum supply voltage -0.5vdc to +7.0vdc input current 30ma maximum (unloaded; vdd=3.3vdc) output voltage logic high (voh) vdd-0.4vdc minimum (ioh=-8ma) output voltage logic low (vol) 0.4vdc maximum (iol=+8ma) rise/fall time 2.7nsec maximum (measured at 20% to 80% of waveform) duty cycle 50 10% (measured at 50% of waveform) load drive capability 15pf maximum output logic type cmos output control function tri-state (high impedance internal pull down resistor of 100kohms typical on pad 3, internal pull up resistor of 100kohms typical on pad 1) tri-state input voltage (vih and vil) 70% of vdd minimum or no connection to enable output, 30% of vdd maximum to disable output tri-state output disable time 350nsec maximum tri-state output enable time 350nsec maximum disable current 20ma maximum (unloaded; pad 1=ground; vdd=3.3vdc) spread spectrum 1.00% center spread modulation frequency 30khz minimum, 31.5khz typical, 33khz maximum period jitter 400psec maximum (cycle to cycle; spread spectrum-on; vdd=3.3vdc) start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev b 8/12/2010 | page 1 of 5
eps13d2c1hd-33.333m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state 2 case/ground 3 output 4 supply voltage line marking 1 ecliptek 2 33.333m 3 sxxyzz s=configuration designator xx=ecliptek manufacturing code y=last digit of the year zz=week of the year 3.1 1.6 2.0 (x4) 2.0 (x4) www.ecliptek.com | specification subject to change without notice | rev b 8/12/2010 | page 2 of 5 1.60 0.20 5.00 0.15 7.00 0.15 marking orient a tion 3.68 0.15 1.4 0.1 1.4 0.2 2.20 0.15 5.08 0.15 1 2 3 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
eps13d2c1hd-33.333m www.ecliptek.com | specification subject to change without notice | rev b 8/12/2010 | page 3 of 5 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% of w a v ef or m 50% of w a v ef or m 20% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output t r i-state or p o w er do wn ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eps13d2c1hd-33.333m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev b 8/12/2010 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eps13d2c1hd-33.333m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev b 8/12/2010 | page 5 of 5
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