pb rohs e2sga18-14.31818m e2s g a 18 -14.31818m series rohs compliant (pb-free) resistance welded hc-49/up smd crystal frequency tolerance/stability 15ppm at 25c, 30ppm over 0c to +70c mode of operation at-cut fundamental nominal frequency 14.31818mhz load capacitance 18pf parallel resonant electrical specifications nominal frequency 14.31818mhz frequency tolerance/stability 15ppm at 25c, 30ppm over 0c to +70c aging at 25c 5ppm/year maximum load capacitance 18pf parallel resonant shunt capacitance (c0) 7pf maximum equivalent series resistance 70 ohms maximum mode of operation at-cut fundamental drive level 1mwatt maximum storage temperature range -40c to +125c insulation resistance 500 megaohms minimum at 100vdc environmental & mechanical specifications fine leak test mil-std-883, method 1014 condition a gross leak test mil-std-883, method 1014 condition c lead termination sn 2m - 6m mechanical shock mil-std-202, method 213 condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007 condition a mechanical dimensions (all dimensions in millimeters) line marking 1 e14.318m e=ecliptek designator m=mhz www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 1 of 4 4.50 max 13.30 max 4.85 max 4.88 0.20 0.50 min (x2) 11.60 max 0.80 0.30 (x2) no te: coplanar ity 0.360 max
e2sga18-14.31818m 4.0 2.0 (x2) 5.5 (x2) www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 2 of 4 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x2) all dimensions in millimeters
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e2sga18-14.31818m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 3 of 4
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods e2sga18-14.31818m low temperature infrared/convection 245c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 2 times / 230c maximum 1 time time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev f 8/12/2010 | page 4 of 4
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