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1 ? fn6166.5 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2005-2007. all rights reserved. all other trademarks mentioned are the property of their respective owners. isl29001 light-to-digital sensor the isl29001 is an integrated ambient light sensor with adc and i 2 c interface. with a spec tral sensitivity curve matched to that of the human eye, the isl29001 provides 15-bit effective resolution while rejecting 50hz and 60hz flicker caused by artificial light sources. in normal operation, the isl29001 consumes less than 300a of supply current. a software power-down mode controlled via the i 2 c interface disables all but the i 2 c interface. a power-down pin is also provided, which reduces power consumption to less than 1a. the isl29001 includes an internal oscillator, which provides 100ms automatic integration periods, or can be externally timed by i 2 c commands. both the internal timing and the illuminance resolution can be adjusted with an external resistor. designed to operate on supplies from 2.5v to 3.3v, the isl29001 is specified for opera tion over the -40c to +85c ambient temperature range. it is packaged in a clear 6 ld odfn package. pinout isl29001 (6 ld odfn) top view features ? human eye response ? temperature compensated ? ir rejection ? 15-bit effective resolution ? adjustable resolution: 3 counts to 15 counts per lux ? simple output code, dire ctly proportional to lux ? 0.3lux to10,000lux range ? 50hz/60hz rejection ?i 2 c interface ? 2.5v to 3.3v supply ? 6 ld odfn (2.1mmx2mm) ? pb-free plus anneal available (rohs compliant) applications ? ambient light sensing ? ambient backlight control ? temperature control systems ? contrast control ? camera light meters ? lighting controls ?hvac block diagram ordering information part number (note) tape & reel package (pb-free) pkg. dwg. # ISL29001IROZ - 6 ld odfn l6.2x2.1 ISL29001IROZ-t7 7? 6 ld odfn l6.2x2.1 note: intersil pb-free products em ploy special pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free products are msl classified at pb-f ree peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. 1 2 3 6 5 4 vdd gnd rext sda scl pd thermal pad vdd rext gnd pd sda scl command register integrating adc data register i 2 c photodiode 1 photodiode 2 mux 3 2 4 5 6 1 fosc iref counter 2 16 data sheet february 8, 2007
2 fn6166.5 february 8, 2007 absolute maxi mum ratings (t a = +25c) maximum supply voltage between v dd and gnd . . . . . . . . . . 3.6v i 2 c bus pin voltage (scl, sda) . . . . . . . . . . . . . . . . . -0.2v to 5.5v i 2 c bus pin current (scl, sda) . . . . . . . . . . . . . . . . . . . . . . <10ma r ext pin voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2v to 3.6v operating temperature . . . . . . . . . . . . . . . . . . . . . . .-45c to +85c maximum die temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125c storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-45c to +100c esd voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kv caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. important note: all parameters having min/max specifications are guaranteed. typical values are for information purposes only. u nless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a electrical specifications v dd = 3v, t a = +25c, r ext = 100k , internally controlled integration timing (note 1), unless otherwise specified. parameter description condition min typ max unit v dd power supply range 2.25 3.63 v i dd supply current 0.28 0.33 ma i dd1 supply current software disabled 0.09 0.10 ma i dd2 supply current pd = 3v 0.5 a fupd internal update time mode 1 and mode 2 (note 2) 85 105 126 ms f osc internal oscillator frequency 312 khz fi 2 ci 2 c clock rate (note 3) 1 400 khz data0 adc code ev = 0lux 1 counts data1 adc code full scale adc count value 32768 counts data2 adc code ev = 300lux, fluorescent light, mode 1 (note 4) 738 983 1254 counts data3 adc code ev = 300lux, fluorescent light, mode 2 (note 4) 98 counts v ref voltage of r ext pin 0.487 0.51 0.533 v v tl scl and sda threshold lo (note 5) 1.05 v v th scl and sda threshold hi (note 5) 1.95 v i sda sda current sinking capability 3 5 ma i pd pd pin leakage current pd = v dd 0.1 a t on enable time pd = hi to lo 2 s t off disable time pd = lo to hi 50 ns notes: 1. see principle of operation 2. there are three modes of the adc?s operations. in mode 1, the adc integrates the current of the photodiode which is sensitive to visible and infrared light. in mode 2, the adc integrates the current of the photodiode which is sens itive only to infrared light. 3. minimum i 2 c clock rate is guaranteed by design. 4. fluorescent light is substi tuted by an led at production. 5. the voltage threshold levels of the sda and scl pins are vdd dependent: v tl = 0.35*v dd . v th = 0.65*v dd . isl29001
3 fn6166.5 february 8, 2007 pin descriptions pin number pin name description 1 vdd positive supply. connect this pi n to a clean 2.5v to 3.3v supply. 2 gnd ground pin. the thermal pad is connected to the gnd pin. 3 rext external resistor pin is for the adc refe rence current, the integration time adjustment in internal timing mode, and lux range/resolution adjustment. 100k 1% tolerance resistor recommended. 4 pd power-down pin. this pin is active-high. a pplying a logic ?high? to this pin will put the device into power down mode. 5scli 2 c serial clock the i 2 c bus lines can be pulled above v dd , 5.5v max. 6sdai 2 c serial data typical performance curves r ext = 100k figure 1. supply current vs supply voltage fig ure 2. output code for 0lux vs supply voltage figure 3. output code vs supply voltage fig ure 4. oscillator frequency vs supply voltage 2.0 2.3 2.6 2.9 3.2 3.5 3.8 320 306 292 278 264 250 supply current (ma) supply voltage (v) t a = +27c command = 00h 5000lux 200lux 2.0 2.3 2.6 2.9 3.2 3.5 3.8 10 8 6 4 2 0 output code (counts) supply voltage (v) t a = +27c command = 00h 0lux 2.0 2.3 2.6 2.9 3.2 3.5 3.8 1.015 1.010 1.005 1.000 0.995 0.990 output code ratio (% from 3v) supply voltage (v) 5000lux 200lux t a = +27c command = 00h 2.0 2.3 2.6 2.9 3.2 3.5 3.8 320.0 319.5 319.0 318.5 318.0 oscillator frequency (khz) supply voltage (v) t a = +27c isl29001
4 fn6166.5 february 8, 2007 figure 5. supply current vs temperature figure 6. output code for 0lux vs temperature figure 7. output code vs temperature fig ure 8. oscillator frequency vs temperature figure 9. spectral response figure 10. radiation pattern typical performance curves r ext = 100k (continued) -60 -20 20 60 100 315 305 295 285 275 265 supply current (a) temperature (c) v dd = 3v command = 00h 5000lux 200lux -60 -20 20 60 100 10 8 6 4 2 0 output code (counts) temperature (c) v dd = 3v command = 00h 0lux -60 -20 20 60 100 1.080 1.048 1.016 0.984 0.952 0.920 output code ratio (% from +25c) 5000lux 200lux v dd = 3v command = 00h temperature (c) -60 -20 20 60 100 330 329 328 327 326 325 oscillator frequency (khz) temperature (c) v dd = 3v 0 20 40 60 80 100 300 400 500 600 700 800 900 1000 1100 wavelength (nm) normalized response (%) k = 7.5 n = 1.85 human visibility cie standard d1 normalized n(d1-kd2) normalized d2 normalized radiation pattern luminosity angle relative sensitivity 90o 80o 70o 60o 50o 40o 30o 20o 10o 0o 90o 80o 70o 60o 50o 40o 30o 20o 10o 0.20.4 0.60.81.0 isl29001
5 fn6166.5 february 8, 2007 principles of operation photodiodes and adc the isl29001 contains two photodiodes. one of the photodiodes is sensitive to visible and infrared light (diode 1) while the other diode (diode 2) is used for temperature compensation (leakage current cancellation) and ir rejection. the isl29001 also cont ains an on-chip integrating analog-to-digital converter (adc) to convert photodiode currents into digital data. the adc has three operating modes with two timing controls. (please consult table 1 for a complete list of modes.) in the first operating mode, the adc only integrates diode 1's current, and the digital output format is 16-bit unsigned-magnitude. in second operating mode, the adc's operation is the same, except diode 2's current is integrated. in the third operating mode, the adc integrates diode 2's current first, then diode 1's current. the total integration time is doubled, and the digital output is the difference of the two photodiode currents (diode 1?s current - diode 2?s current). in this mode, the digital output format is 16-bit 2's-complement . any of the three operating modes can be used with either of the two timing controls (either internally or externally controlled integration timing). the interface to the adc is implemented using the standard i 2 c interface. i 2 c interface the isl29001 contains a single 8-bit command register that can be written via the i 2 c interface. the command register defines the operation of the device, which does not change until the command register is overwritten. the isl29001 contains four 8-bit data registers that can be read via the i 2 c interface. the first two data registers contain the adc's latest digital output, while the second two registers contain the number of clock cycles in the previous integration period. the isl29001?s i 2 c address is hardwired internally as 1000100. figure 11a shows a write timing diagram sample. figure 11b shows a sample two-byte read. the i 2 c bus master always drives the scl (clock) line, wh ile either the master or the slave can drive the sda (data) line. every i 2 c transaction begins with the master asserting a start condition (sda falling while scl remains high). the following byte is driven by the master, and includes the slave address and read/write bit. the receiving device is responsible for pulling sda low during the acknowledgement period. any writes to the isl29001 overwrite the command register, changing the device?s mode. any reads from the isl29001 return two or four bytes of sensor data and counter value, depending upon the operating m ode. neither the command register nor the data registers have internal addresses, and none of the registers can be individually addressed. every i 2 c transaction ends with th e master asserting a stop condition (sda rising while scl remains high). i 2 c transaction flow to write, the master sends slave address 44(hex) plus the write bit. then master sends the adc command to the device which defines its operation. as soon as the isl29001 receives the adc command, it will execut e and then store the readings in the register after the analog-to -digital conversion is complete. while the isl29001 is executing the command and also after the execution, the i 2 c bus is available for transactions other than the isl29001. after comma nd execution, sensor data readings are stored in the registers. note that if a read is received before the execution is finished, the data retrieved is previous data sensor reading. typical integration/conversion time is 100ms (for rext = 100k and internal timing mode). it is recommended that a read is s ent 120ms later because the f osc variation is 20%. the operation of the device does not change until the command register is overwritten. hence, when the master sends a slave address 44(hex) and a write bit, the isl29001 will repeat the same command from the previous write transaction. to read, master sends slave address 44(hex) plus the read bit. then isl29001 will hold the sda line to send data to master. note that the master need not send an address register to access the data. as soon as the isl29001 receives the read bit. it will send 4 bytes. th e 1st byte is the lsb of the sensor reading. the 2nd byte is the msb of the sensor reading. the 3rd byte is lsb of the counter reading. the 4th byte is the msb of the counter reading. if internal timing mode is selected, only the 1st and 2n d data byte are necessary; the master can assert a stop after the 2nd data byte is received. for more information about the i 2 c standard, please consult the philips ? i 2 c specification documents. command register the command register is used to define the adc's operations. table 1 shows the primary comm ands used to control the adc. note that there are two classes of operating commands: three for internal timing, and three fo r external (arbitrary) timing. when using any of the three in ternal timing commands, the device self-times each conversion, which is nominally 100ms (with r ext = 100k ). when using any of the three external timing commands, each command received by the device ends one conversion and begins another. the integration time of the device is thus the time between one i 2 c external timing command and the next. the integration time can be between 1ms and 100ms. the external timing commands can be used to synchronize the adc?s integrating time to a pwm dimming frequency in a backlight system in order to eliminate noise. isl29001
6 fn6166.5 february 8, 2007 table 1. command registers and functions command function 8ch adc is powered-down. 0ch adc is reset. 00h adc converts diode 1?s current (i diode1 ) into unsigned-magnitude 16-bit data. the integration is internally timed at 100ms per integration. 04h adc converts diode 2?s current (i diode2 ) into unsigned-magnitude 16-bit data. the integration is internally timed at 100ms per integration. 08h adc converts i diode1 -i diode2 into 2?s-complement 16-bit data. the total integration is internally timed at 200ms per integration. 30h adc converts diode 1?s current (i diode1 ) into unsigned-magnitude 16-bit data. the in tegration is externally timed; each 30h command sent to the device ends one integration period and begins another. 34h adc converts diode 2?s current (i diode1 ) into unsigned-magnitude 16-bit data. the in tegration is externally timed; each 34h command sent to the device ends one integration period and begins another. 38h adc converts i diode1 -i diode2 into 2?s-complement 16-bit data. the integr ation is externally timed; each 38h command sent to the device ends one integration period and begins another. 1xxx_xxxxb i 2 c communication test. the value written to t he command register can be read back via the i 2 c bus. figure 11a. i 2 c write timing diagram sample figure 11b. i 2 c read timing diagram sample figure 11. start w a a6 a5 a4 a3 a2 a1 a0 w a r7 r6r5r4r3r2r1r0 a a 15 3 stop sda driven by master power down cmd 8c(hex) sda driven by master device address 44(hex) i 2 c data a i 2 c sda out i 2 c clk in i 2 c sda in 2 4 67891234 56789 a a6 a5 a4 a3 a2 a1 a0 r a a a a d7 d6 d5 d4 d3 d2 d1 d0 a d7 d6 d5 d4 d3 d2 d1 d0 a msb of sensor reading stop lsb of sensor reading sda driven by master sda driven by isl29001 sda driven by isl29001 i 2 c data i 2 c sda out i 2 c clk in i 2 c sda in start device address 44(hex) r/w aa 15 3 2 4 67891234567891234 56789 isl29001
7 fn6166.5 february 8, 2007 data registers the isl29001 contains four 8-bit data registers. these registers cannot be specifically addressed, as is conventional with other i 2 c peripherals; instead, performing a read operation on the device always returns all available registers in ascending order. see table 2 for a description of each register. the first two 8-bit data registers contain the most recent sensor reading. the meaning of the specific value stored in these data registers depends on the command written via the i 2 c interface; see table 1 for information on the various commands. the first byte read over the i 2 c interface is the least-significant byte; the second is the most significant. this byte ordering is often called ?little-endian? ordering. the third and fourth 8-bit data registers contain the integration counter value corresponding to the most recent sensor reading. the isl29001 includes a free-running oscillator, each cycle of which increments a 16-bit counter. at the end of each integration peri od, the value of this counter is made available in these two 8-bit registers. like the sensor reading, the integrati on counter value is read across the i 2 c bus in little-endian order. note that the integration counter value is only available when using one of the thr ee externally-timed operating modes; when using internally-timed modes, the device will nak after the two-byte sensor reading has been read. internal timing when using one of the three internal timing modes, each integration period of the isl29001 is timed by 32,768 clock cycles of an internal oscillator. the nominal frequency of the internal oscillator is 327.6khz, which provides 100ms internally-timed integration periods. the oscillator frequency is dependent upon an external resistor, r ext , and can be adjusted by selecting a different resistor value. the resolution and maximum range of the device are also affected by changes in r ext ; see below. the oscillator frequency can be calculated with the following equation: accordingly, the integration time, t int , is also a function of r ext. the full scale range in lux, fsr, is also scaled by r ext. r ext is nominally 100k , and provides 100ms internal timing and a 1 to 10,000lux range for diode 1. doubling this resistor value to 200k halves the internal oscillator frequency, providing 200ms internal timing. in addition, the maximum lux range of diode 1 is also halved, from 10,000lux to 5,000lux, and the resolution is doubled, from 3.3 counts per lux to 6.6 counts per lux. the acceptable range of this resistor is 50k (providing 50ms internal timing, 20,000lux maximum reading, ~1.6 counts per lux) to 500k (500ms internal timing, 2,000lux maximum reading, ~16 counts per lux). when using one of the three internal timing modes, the isl29001?s resolution is determined by the ratio of the max lux range to 32,768, the number of clock cycles per integration. the following equations describe the light intensity as a function of the sensor readi ng, and as a function of the external resistor. where e is the measured light in tensity, data1 is the sensor reading, and r ext is external resistor value. external timing when using one of the three external timing modes, each integration period of the isl29001 is determined by the time which passes between consecutive external timing commands received over the i 2 c bus. the user starts the integration by sending an external command and stops the integration by sending anot her external command. the integration time, t int , therefore is determined by the following equation: where: i i2c is the number of i 2 c clock cycles to obtain the t int. f i2c is the i 2 c operating frequency table 2. data registers address contents 00h least-significant byte of mo st recent sensor reading. 01h most-significant byte of most recent sensor reading. 02h least-significant byte of integration counter value corresponding to most recent sensor reading. 03h most-significant byte of integration counter value corresponding to most recent sensor reading. f osc 327.6khz 100k r ext ------------------ ? = (eq. 1) t int 100ms r ext 100k ------------------ ? = (eq. 2) table 3. r ext resistor selection guide r ext (k ) integration time (ms) lux range (lux) resolution, counts/lux 50 (min) 50 20,000 1.6 100 recommended 100 10,000 3 200 200 5,000 6 500 (max) 500 2,000 16 fsr 10000lux 100k r ext ------------------ ? = (eq. 3) e lux () fsr 32768 ---------------- = data1 ? (eq. 4) elux () 1 32768 ---------------- = 10 000lux , r ext 100k ? () --------------------------------------- data1 ?? t int i i2c f i2c ---------- = (eq. 5) isl29001
8 fn6166.5 february 8, 2007 the internal oscillator, f osc , operates identically in both the internal and external timing modes, with the same dependence on r ext . however, when using one of the three external timing modes, the number of clock cycles per integration is no longer fixed at 32,768, but varies with the chosen integration time, and is limited to 65,536. in order to avoid erroneous lux readings the integration must be short enough not to allow an overflow in the counter register. where: t int = user defined integration time f osc = 327.6khz*100k /r ext . isl29001?s internal oscillator. not to be confused with the i 2 c?s frequency. r ext = user defined external resistor to adjust f osc . 100k recommended. the number of clock cycles in the previous in tegration period is provided in the third and f ourth bytes of data read across the i 2 c bus. this two-byte value is called the integration counter value. when using one of the three external timing modes, the isl29001?s resolution varies with the integration time. the resolution is determined by the ratio of the max lux range to the number of clock cycles per integration. the following equations describe the light intensity as a function of sensor reading, in tegration counter value, and integration time: where e is the measured light in tensity, data1 is the sensor reading, data2 is the integrat ion counter value, t is the integration time, and r ext is external resistor value. noise rejection and integration time in general, integrating type adc?s have an excellent noise- rejection characteristics for periodic noise sources whose frequency is an integer multiple of the integration time. for instance, a 60hz ac unwanted signal?s sum from 0ms to n*16.66ms (n = 1,2...n i ) is zero. similarly, setting the isl29001?s integration time to an integer multiple of periodic noise signal greatly improves th e light sensor output signal in the presence of noise. the integration time, t int , of the isl29002 is set by an external resistor r ext . see equation 3. design example 1 using the isl29001, determine a suitable integration time, t int , that will ignore the presence of both 60hz and 50hz noise. accordingly, specify the r ext value. given that the i 2 c clock is at f i2c = 10khz. solution 1 - using internal timing t int = n(1/60hz) = m(1/50hz). in order to achieve both 60hz and 50hz ac rejection, the integration time needs to be adjusted to coincide with an int eger multiple of the ac noise cycle times. n/m = 60hz/50hz = 6/5. the firs t instance of integer values at which t int rejects both 60hz and 50hz is when m = 5, and n = 6. t int = 6(1/60hz) = 5(1/50hz) = 100ms from equation 3: r ext = t int * (100k /100ms) = 100k . by populating rext = 100k , the isl29001 defaults to 100ms integration time and will reject the presence of both 60hz and 50hz power line signals. solution 2 - using external timing from solution 1, the desired in tegration time is 100ms. note that the r ext resistor does not determine the integration time when using external timing mode. instead, the integration and the 16-bit counter starts when an external timing mode command is sent and end when another external timing mode is sent . in other words, the time between two external timing mode command is the integration time. the programmer determines how many clock cycles to wait between two external timing commands. i i2c = f i2c * t int , where i i2c = number of i 2 c cycles i i2c = 10khz * 100ms i i2c = 1,000 i 2 c clock cycles. an external timing command 1,000 cycles after another exte rnal timing command rejects both 60hz and 50hz ac noise signals. ir rejection any filament type light source has a high presence of infrared component invisible to the human eye. a white fluorescent lamp, on the other hand has a low ir content. as a result, output sensitivity may vary depending on the light source. maximum attenuation of ir can be achieved by properly scaling the readings of diode1 and diode2. the user obtains data reading from sensor diode 1, d 1 , which is sensitive to visible and ir, then reading from sensor diode 2, d 2 which is mostly sensitive from ir. t he graph on figure 9 shows the effective spectral response after applying equation 8 of the isl29001 from 400nm to 1000nm. the equation below describes the method of cancelling ir in internal timing mode. where: data = lux amount in number of counts less ir presence d 1 = data reading of diode 1 d 2 = data reading of diode 2 t int 65,536 f osc ----------------- - < (eq. 6) e lux () 10 000lux , r ext 100k ? () --------------------------------------- data1 data2 ----------------- ? = (eq. 7) d 3 nd 1 kd 2 ? () = (eq. 8) isl29001
9 fn6166.5 february 8, 2007 n = 1.85. this is a fudge factor to scale back the sensitivity up to ensure equation 4 is valid. k = 7.5. this is a scaling factor for the ir sensitive diode 2. flat window lens design a window lens will surely limit the viewing angle of the isl29001. the window lens sh ould be placed directly on top of the isl29001. the thickness of the lens should be kept at minimum to minimize loss of power due to reflection and also to minimize loss of loss due to absorption of energy in the plastic material. a thickn ess of t = 1mm is recommended for a window lens design. the bigger the diameter of the window lens the wider the viewing angle is of the isl29001. table 4 shows the recommended dimensions of the optical window to ensure both 35 and 45 viewing angle. these dimensions are based on a window lens thickness of 1.0mm and a refractive index of 1.59. window with light guide design if a smaller window is desired while maintaining a wide effective viewing angle of the isl29001, a cylindrical piece of transparent plastic is needed to trap the light and then focus and guide the light on to the isl29001. hence the name light guide or also known as light pipe. the pipe should be placed directly on top of the isl29001 with a distance of d1 = 0.5mm to achieve peak performanc e. the light pipe should have minimum of 1.5mm in diameter to ensure that whole area of the sensor will be exposed. see figure 13. d lens ? t d1 d total ? = viewing angle window lens isl29001 figure 12. flat window lens table 4. recommended dimensions for a flat window design d total d1 d lens @ 35 viewing angle d lens @ 45 viewing angle 1.5 0.50 2.25 3.75 2.0 1.00 3.00 4.75 2.5 1.50 3.75 5.75 3.0 2.00 4.30 6.75 3.5 2.50 5.00 7.75 t = 1 thickness of lens d1 distance between isl29001 and inner edge of lens d lens diameter of lens d total distance constraint between the isl29001 and lens outer edge * all dimensions are in mm. d lens t l d lens light pipe isl29001 d 2 d 2 > 1.5mm figure 13. window with light guide/pipe isl29001
10 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6166.5 february 8, 2007 typical circuit a typical application circuit is shown in figure 14. suggested pcb footprint footprint pads should be a nominal 1-to-1 correspondence with package pads. the large, exposed central die-mounting paddle in the center of the pa ckage requires neither thermal nor electrical connection to the pcb, and such connection should be avoided. layout considerations the isl29001 is relatively insensitive to layout. like other i 2 c devices, it is intended to provide excellent performance even in significantly noisy environments. there are only a few considerations that w ill ensure best performance. route the supply and i 2 c traces as far as possible from all sources of noise. use two power-supply decoupling capacitors, 4.7f and 0.1f, placed close to the device. soldering considerations convection heating is recommended for reflow soldering; direct-infrared heating is not recommended. the isl29001?s plastic odfn package does not require a custom reflow soldering profile, and is qualified to +260c. a standard reflow soldering profile with a +260c maximum is recommended. special handling odfn6 is rated as jedec moisture level 4. standard jedec level 4 procedure should be followed: 72hr floor life at less than +30c 60% rh. when baking the device, the temperature required is +110c or less due to special molding compound. figure 14. typical circuit isl29002 vdd vss rext pd sda scl + 4.7f 0.1f 100k microcontroller sda scl 2.5v to 3.3v isl29001 isl29001
11 fn6166.5 february 8, 2007 isl29001 package outline drawing l6.2x2.1 6 lead optical dual flat no-lead plastic package (odfn) rev 0, 9/06 located within the zone indicated. the pin #1 indentifier may be unless otherwise specified, tolerance : decimal 0.05 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but must be between 0.15mm and 0.30mm from the terminal tip. dimension b applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amse y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: (4x) 0.10 index area pin 1 a 2.10 b 2.00 c seating plane base plane 0.08 0.10 see detail "x" c c 0 . 00 min. detail "x" 0 . 05 max. 0 . 2 ref c 5 side view typical recommended land pattern ( 6x 0 . 30 ) ( 6x 0 . 55 ) 6 top view (0 . 65) (1 . 95) (0 . 65) (1 . 35) bottom view 6x 0 . 35 0 . 05 b 0.10 ma c 1 1 . 35 1 . 30 ref index area pin 1 6 0.65 0 . 65 max 0.75 6x 0 . 30 0 . 05

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