HLMP-U802-N0000 t-1? (5 mm) led lamp data sheet description this yellow green led is designed in industry standard t-1? package with untinted and non-diused optics. it is ideal for the use as indicators. application status indicator features high luminous intensity output low power consumption popular t-1? package high eciency versatile mounting on pcb or panel notes: 1. all dimensions are in millimeter / inches. 2. dimension tolerances are 0.25 mm unless otherwise specied. 3. lead spacing is measured at where the leads emerge from the package. 4. epoxy meniscus is 1.0 mm maximum below the body. 1.00 0.039 0.70 0.028 5.00 0.197 max. 8.70 0.343 see note 4 anode 0.5 0.020 typ. 22.0 0.87 min. 1.0 0.04 min. 2.54 0.100 typ. 5.9 0.232 ? package dimensions
2 selection guide part number color package description HLMP-U802-N0000 alingap yellow green untinted, non-diused part numbering system mechanical option 00: bulk color bin options 0: full color bin distribution maximum iv bin options 0: open (no maximum limit) minimum iv bin options n: minimum bin n hlmp C u802 C x x x xx absolute maximum rating at t a = 25 c parameter HLMP-U802-N0000 unit dc forward current [1] 30 ma peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma reverse voltage (i r = 100 a) 5 v power dissipation 72 mw operating temperature range -40 to +85 c storage temperature range -40 to +85 c notes: 1. derate linearly as shown in figure 4. electrical / optical characteristics at t a = 25 c parameter symbol min. typ. max. units test conditions luminous ecacy iv 417.0 800.0 mcd i f = 20 ma, note 1 viewing angle 2 ? 25 deg note 2 spectral half width 13 nm i f = 20 ma forward voltage v f 2.1 2.4 v i f = 20 ma peak wavelength p 572.5 nm i f = 20 ma dominant wavelength d 564.5 572.0 576.5 nm i f = 20 ma, note 3 reverse voltage v r 5v i r = 100 a notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. 2. 2 ? is the o-axis angle where the luminous intensity is ? the on axis intensity. 3. the dominant wavelength, d is derived from the cie 1931 chromaticity diagram and represents the perceived color of the device.
3 ambient temperature (c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 480 580 680 780 wavelength - nm relative intensity 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 5 10 15 20 25 30 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 5 10 15 20 25 30 35 0 20406080100 max forward current - ma 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity figure 1. relative intensity vs. wavelength figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward curr ent figure 4. maximum forward current vs. ambient temperature figure 5. radiation pattern
4 precautions: lead forming: assembly method: this product is not meant for auto- insertion. the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. during lead forming, the leads should be bent at a point at least 3mm from the base of the lens. do not use the base of the lead frame as a fulcrum during forming. lead forming must be done before soldering at normal temperature. it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering conditions: care must be taken during pcb assembly and soldering process to prevent damage to led component. the closest led is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without stando. recommended soldering conditions: wave soldering pre-heat temperature 105c max. preheat time 60 sec max peak temperature 260c max. dwell time 5 sec max. wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. customer is advised to periodically check on the soldering prole to ensure the soldering prole used is always conforming to recommended soldering condition. if necessary, use xture to hold the led component in proper orientation with respect to the pcb during soldering process. proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c, before handling. special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. recommended pc board plated through-hole sizes for led component leads: led component lead size diagonal plated through hole diameter 0.50 x 0.50 mm (0.020 x 0.020 inch) 0.718 mm (0.029 inch) 1.050 to 1.150 mm (0.042 to 0.046 inch) note: refer to application note an1027 for more information on soldering led component. intensity bin limits bin id intensity (mcd) at 20 ma min. max. n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 tolerance for each bin limit is 15% color bin limits bin id dominant wavelength (nm) at 20 ma min. max. 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 tolerance for each bin limit is 1 nm
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. av02-2673en - october 8, 2010 disclaimer: avagos products and software are not specically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. example of wave soldering temperature prole for th led figure 6. recommended wave soldering prole. recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 60 sec max time (sec) 260c max 105c max temperature (c)
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