page 1 2004.11.17 recommended applications car audio, electric household appliances, oa/fa, pc/peripheral equipment, other general applications ? outer dimension 3.2 x 1.6 x 1.1mm ( l x w x h ) ? flat lenz type ? total output power : 2mw typ. (i f =20ma) ? reverse mount type ? no lead package ? lead?free soldering compatible peak wavelength 950nm product features die materials gaas 150 deg. features package 3216 reverse mount type, water clear epoxy rank grouping parameter soldering methods esd reflow soldering, ttw (through the wave) soldering and manual soldering please refer to soldering conditions about soldering. 2kv (hbm) sorted by radiant inte nsity per rank taping half intensity angle assembly method auto pick & place machine (auto mounter) taping and reel 3,000pcs per reel in a 8mm width tape. (standard) reel diameter: 180mm AN1111R surface mount ired/reverse mount type
page 2 2004.11.17 AN1111R surface mount ired/reverse mount type absolute maximum ratings item symbol unit power dissipation pd mw forward current i f ma pulse forward current t 1 i fr m ma ? i f ma/ ? ? i frm ma/ ? reverse voltage v r v operating temperature t opr ? storage temperature t stg ? t 1 ifrm measurement condition : pulse width ? 100 s, duty ? 1/100 electro-optical characteristics conditions typ. 1.22 max. 1.4 reverse current v r =5v i r max. 10 a min. 0.2 typ. 0.28 total output power i f =20ma po typ. 2 mw peak wavelength i f =20ma p typ. 950 nm spectral half-width i f =20ma ? typ. 45 nm half intensity angle i f =20ma 2 1/2 typ. 150 deg. min. - typ. 0.5 response time i f =20ma tr/tf typ. 700 ns derating (ta=25 ? or higher) item symbol characteristics 0.67 4 5 -30 ? +85 -40 ? +100 absolute maximum ratings 75 50 300 v mw/sr unit forward voltage i f =20ma v f mhz cut-off frequency i f =20ma dc 5ma, -3db from 0.1mhz radiant intensity i f =20ma i e fc (ta=25 ) (ta=25 )
min. max. a0.24.0 b 0.28 0.56 c4.00.8 i e mw/sr i f = 20ma condition rank page 3 t please contact our sales staff concerning rank designation. 2004.11.17 AN1111R (ta=25 ) surface mount ired/reverse mount type radiant intensity rank
page 4 2004.11.17 AN1111R technical data spatial distribution example condition : ta = 25 ? spectral distribution relative intensity vs. wavelength condition : ta = 25 ? , i f = 50ma wavelength [nm] relative intensity forward voltage vs. forward current condition : ta = 25 ? forward voltage : v f (v) forward current i f (ma) duty ratio vs. pulse forward current condition : ta = 25 ? , tw ? 100 s duty ratio pulse forward current i frm (a) surface mount ired/reverse mount type
page 5 2004.11.17 AN1111R technical data ambient temperature vs. pulse forward current condition : tw ? 100 s, duty ? 1/100 ambient temperature : ta( ? ) ambient temperature vs. forward current ambient temperature : ta( ? ) forward current : i f (ma) ambient temperature vs. forward voltage condition : i f = 50ma ambient temperature : ta ( ? ) pulse forward current i frm (ma) forward voltage v f (v) surface mount ired/reverse mount type pulse forward voltage vs. pulse forward current condition : ta=25 ? , tw ? 100 s, duty ? 1/100 pulse forward voltage : v fm (v) pulse forward current i frm (ma)
page 6 2004.11.17 AN1111R technical data forward current vs. relative total power condition : - - pulse, tw ? 100 s, duty ? 1/100, ta = 25 ? forward current : i f (ma) ambient temperature vs. peak wavelength condition : i f = 50ma ambient temperature : ta( ? ) peak wavelength p(nm) relative total power ambient temperature vs. relative total power condition : i f = 50ma ambient temperature : ta ( ? ) relative total power surface mount ired/reverse mount type
page 7 AN1111R surface mount ired/reverse mount type package dimensions recommended soldering pattern (unit: mm) taping specification (unit: mm) (unit: mm) quantity: 3,000pcs/ reel (standard) weight: (6.60)mg 2004.11.17
2004.11.17 AN1111R page 8 surface mount ired/reverse mount type reflow soldering conditions pre-heating solder bath temp. dipping time 120 ?? 150 ? 60 s ? 120 s 1) the dip soldering process shall be 2 times maximum. 2) the product shall be cooled to normal temperature before the second dipping process. manual soldering conditions iron tip temp. soldering time and frequency 265 ? 5 s (max.) (max.) (max.) (max.) 3 s 1 time 350 ? (max.) (max.) (max.) (30 w max.) ttw (through the wave) soldering conditions 1) the above profile temperature gives the ma ximum temperature of the led resin surface. please set the temperature so as to avoid exceeding this range. 2) total times of reflow soldering pr ocess shall be no more than 2 times. when the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature afte r the first reflow) in order to prevent the led from absorbing moisture. 3) temperature fluctuation to the led during the pre-heating process shall be minimized.
2004.11.17 AN1111R page 9 surface mount ired/reverse mount type reliability testing result reliability testing result applicable standard duration failure room temp. operating life eiaj ed- 4701/100(101) 1,000 h 0/25 (pretreatment) individual standard (reflow soldering) pre-heating 150 120s operating heating 240 5s (pretreatment) individual standard (reflow soldering) pre-heating 180 120s operating heating 260 5s temperature cycling eiaj ed- 4701/100(105) 5 cycles 0/25 wet high temp. storage life eiaj ed- 4701/100(103) 1,000 h 0/25 high temp. storage life eiaj ed- 4701/200(201) 1,000 h 0/25 low temp. storage life eiaj ed- 4701/200(202) 1,000 h 0/25 vibration, variable frequency eiaj ed- 4701/400(403) 2 h 0/10 98.1m/s 2 (10g), 100 2khz sweep for 20min., xyz each direction testing conditions ta = 25 , i f = maxium rated current minimum rated storage temperature(30min) normal temperature(15min) maximum rated storage temperature(30min) normal temperature(15min) ta = 60 2 , rh = 90 5% resistance to soldering heat eiaj ed- 4701/300(301) ta = maximum rated storage temperature ta = minimum rated storage temperature 0/25 0/25 - - failure criteria items symbols conditions failure criteria radiant intensity i e i f value of each product radiant intensity testing min. value initial value x 0.5 forward voltage v f i f value of each product forward voltage testing max. value spec. max. value x 1.2 reverse current i r v r = maximum rated reverse voltage v testing max. value R spec. max. value x 2.5 cosmetic appearance - - no notable, decoloration, deformation and cracking
special notice to customer s using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specific ations, characteristics and technical data described in the data sheets are subject to change without prior no tice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sh eets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we ar e not responsible for any damage which may occur if these specifications are exceeded. 4) the products described in the data sheets are made to be used in stan dard electronic applications such as office automation appliances, commu nication devices, audio visual, home appliances, and measuring instruments. 5) if the products in the data sheets are to be used for purposes other than the above which requires high level reliability and safety where failure and or malfunction of the product may cause deat h or other serious effects on the human body such as airplane, space activity, transportation, medical, nuclear), please contact our sales personnel. 6) in order to export the products or technologies de scribed in this data sheet which are under the ?foreign exchange and foreign trade control law,? it is necessary to first obtain an export permit from the japanese government. 7) no part of this data sheet m ay be reprinted or reproduced without prior written permission from stanley electric co., ltd. 8) the most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com AN1111R page 10 surface mount ired/reverse mount type 2004.11.17
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