(a) (c) (b) (e) (d) 1. part no. expression : 2. conf igurat ion & di me ns ions : 3. mate ri als : (a) body : ferrite (b) termination : ag/ni/sn a 4. ge ne ral sp ecif ication : b) operating temp. : -40c to +125c ( including self-temperature. rise ) a) storage temp. : -40c to +125c pg. 1 unit:m/m c a d b b ag(100%) ni(100%)-1.5u m(min.) sn(100%)-3.0u m(min.) (f) (g) superworld electronics (s) pte ltd ferrite chip bead (b) dimension code (c) material code (a) series code (e) r : reel (f) current code : c = 300ma (g) 10 : rohs copnpliant (d) impedance code : 121=120 ? 0.500.10 bd 1.000.10 ac 0.500.10 0.250.10 superworld electronics (s) pte ltd z 1 g c 1 2 1 - r c - 1 0 10.11.2011 z1g series note : specifications subject to change without notice. please check our website for latest information.
pg. 2 superworld electronics (s) pte ltd superworld electronics (s) pte ltd ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information. 5. electrical characteristics : 1000 25% 1800 25% 220 25% 60025% impedance ( ? ) 120 25% 100mhz z1gc121-rc-10 z1gc102-rb-10 z1gc182-rb-10 z1gc221-rb-10 Z1GC601-RC-10 part number 0402 0402 0402 0402 0402 size eia 1.25 2.20 1.00 0.85 max. 0.70 dc resistance ( ? ) 200040% 270040% 90040% 140040% 50040% 1ghz max. ( ma ) rated current 300 250 200 250 300
6. impedance vs. frequency curves : pg. 3 superworld electronics (s) pte ltd superworld electronics (s) pte ltd ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information. 1 10 100 1000 frequency(mhz) 0 20 0 40 0 60 0 80 0 impedance(ohm) ghb1005cf-121t03 z r x z1 gc 121-r c -1 0 1 10 100 1000 freq uency(mhz) 0 500 1000 1500 impedan ce(o hm) ghb1005cf-221t02 z r x z1gc221-rb -10 1 10 1 00 1000 freque ncy (mhz) 0 400 800 12 00 16 00 20 00 i mpe dan ce( ohm) ghb1005hf-601t03 z r x Z1GC601-RC-10 1 10 100 1000 frequency(mhz) 0 600 1200 1800 2400 impedance(ohm) ghb1005hf-102t02 z r x z1gc102-rb-10 1 10 100 1000 frequency(mhz) 0 1000 2000 3000 4000 5000 impedance(ohm) ghb1005hf-182t02 z r x z1gc182-rb-10
pg. 4 7. re li abil it y & te st condition : superworld electronics (s) pte ltd superworld electronics (s) pte ltd bending 40(1.575) not be damaged by the forces applied on the the terminal electrode & the dielectric must fl ex ture s trength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) s ol der a c hi p on a tes t s ubs trate, bend the substrate by 2mm (0.079in) and return. test condition performance not be damaged by the forces applied on the the terminal electrode & the dielectric must more than 95% of the terminal electr ode refer to standard electrical characteristics list 100.5 seconds 60 seconds termi nal s trength solderability right conditions. w should be covered with solder. 60 seconds preheating 245c 150c 41.0 seconds cooling dipping natural solder heat resistance temperature rise test electrical characteristics test rated current impedance (z) preheating 260c 150c dipping cooling natural for z series : solder : sn-cu0.5 flux for lead free: rol0 d i p ti me : 41sec. preheat : 150c, 60sec. s ol der temperature : 2455c 2. temperature measured by digital surface thermometer. flux for lead free: rol0 d i p ti me : 100.5sec. preheat : 150c, 60sec. solder : sn-cu0.5 s ol der temperature : 2605c 1. applied the allowed dc current. a gi l ent4291 a gi l ent e4991 appearance: no significant abnormality. impedance change: within 30%. item 1.0 5 6 7 1.0 1.5 2 3 4 0.6 0.5 1.0 > 30 size force (kfg) time (sec) rated current < 1a t 20c max rated current 1a t 40c max R dc power supply over rated current requirements, there will be some risk q factor a gi l ent4287 dc resistance a gi l ent 4338 a gi l ent16192 10.2 w the duration of the applied forces shall be 60 (+ 5) sec. ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
pg. 5 superworld electronics (s) pte ltd derating curve for the ferrite chip bead which withstanding current over 1.5a, as the operating temperature over 85c, the derating current information is necessary to consider with. for the detail derating of current, please refer to the derated current vs. operating temperature curve. not be allowed. appearance : cracking, shipping & any other defec ts harmful to the c haracteristics should the ferrite should not be dam aged by forces appl i ed on the ri ght condition. random vibration test bending str ength item 1.0(0.039) r0.5(0.02) mutually perpendicular directions (total 9hours). amplitude : 1.52mm frequency : 10-55-10hz for 15 min. directions & times : x, y, z directions for 15 min. this cycle shall be performed 12 times in each of three a performance test condition chip temperature life testing at high h umi di ty : 90~95% rh. temperature : 402c d urati on : 5048hrs duration : 1008 12hrs applied current : rated current temperature : 1252c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. humidity measured : 500 times appearance : no dam age. phase impedance: within30%of initial value low temperature s torage test thermal shock number of cycles : 500 step2 : +1052c 305 min. d urati on : 5008hrs temperature : -402c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. room temp -402c 2 1 0.5 Q 305 step1 : -402c 305 min. condition for 1 cycle temperature (c) times (min.) height of 75cm. drop 10 times on a concrete floor from a drop a. no mechanical damage b. impedance change: 30% 7. re li abil it y & te st condition : +1052c 3 305 2.5 2.70 (0.106) 7 0.80 (0.033) mm (inches) 1.40 (0.055) 2.00 (0.079) 3 4 5 s eri es name 2 1.0 2.5 0.3 p-kgf appearance : no dam age. impedance: within30%of initial value 6 impedance: within30% ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information. 1a 1.5a 3a 2a 6a 5a 4a 4 5 6 2 3 1 0 derating derated current(a) operating temperature(?c) 125 85 oper ati ng temper atur e( )
pg. 6 8. soldering and mounti ng : 8-1. recommended pc board pattern air soldering tools. 8-2.2 soldering iron : 8-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to the inherent process control limitations. in the event that a) preheat circuit and products to 150c. b) 350c tip temperature for ferrite chip bead (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. for iron soldering in figure 2. note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient preheating tp(260c/40s max.) 60~180s 4 80s max. figure 1. re-flow soldering:3 times max temperature c 150 25 200 217 time(sec.) within4~5s g rad ual cooling o ve r 60s. figure 2. wave soldering:1 times max cooling 60~150s 20~40s s olde ring natu ral cooling temperature c 150 350 preheating soldering natural superworld electronics (s) pte ltd 0.55 1.50 0.40 superworld electronics (s) pte ltd re-flow soldering temperatures below 240 degrees, there will be unwitting risk if use wave soldering is there will be some risk. note. ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
pg. 7 superworld electronics (s) pte ltd may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 4. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 4 r ec ommendable upper limit t 8-3. solder volume minimum fillet height = soldering thickness + 25% product height ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
pg. 8 superworld electronics (s) pte ltd superworld electronics (s) pte ltd 9-1. reel dimension 7" x 12mm r0.5 r10.5 13.50.5 7" x 8mm d b 7" x 8mm c 1 2 0 7" x 12mm r1.9 20.5 a 178.02.0 178.02.0 60.02.0 b(mm) 60.02.0 13.50.5 9.00.5 a(mm) type 13.50.5 13.50.5 c(mm) d(mm) 9. packaging information : d1:10.1 f:3.50.05 p2:20.05 p e:1.750.1 po:40.1 3(09) size 3(12) w:8.00.1 bo section a-a ko ao a 5 4(11) t a d:1.5+0.1 2 4.00.1 0.220.05 1.040.10 1.420.10 2.250.10 1.270.10 1.450.10 1.550.10 3.420.10 2.770.10 3.500.10 2.350.10 1.880.10 1.500.10 4.00.1 0.220.05 4.00.1 4.00.1 0.220.05 0.220.05 1.050.10 ko(mm) bo(mm) 1.950.10 1.050.10 ao(mm) p(mm) 4.00.1 0.230.05 t(mm) material of taping is plastic 1.00.10 1.00.10 1.00.10 1.00.10 none d1(mm) 2.00.1 p(mm) 4.00.1 4.00.1 0.620.03 1.500.05 1.050.05 1.850.05 2 3(09) 2.300.05 1 size bo(mm) 1.120.03 0.950.05 0.950.05 ko(mm) 0.600.03 ao(mm) none 0.950.05 0.950.05 none t(mm) 0.600.03 d1(mm) none p po:40.1 p2:20.1 f:3.50.1 e:1.750.1 ao d:1.56 +0.1 -0.05 bo w:8.00.1 ko t 2.00.05 p(mm) 0.380.05 0 size bo(mm) 0.680.05 ko(mm) 0.50max ao(mm) t(mm) 0.50max d1(mm) none material of taping is paper p po:40.1 f:3.50.05 e:1.750.1 ao d:1.5 +0.1 -0 .0 bo w:8.00.3 ko t 9-2 tape dimension / 8mm 4(09) 1.040.10 3.400.10 1.770.10 4.00.1 0.220.05 1.00.10 series z / l z / l series z / l series ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
pg. 9 superworld electronics (s) pte ltd superworld electronics (s) pte ltd 9-2.1 tape dimension / 12mm p f:5.50.05 d1:1.50.1 a e:1.750.1 po:40.1 d:1.5+0.1 a size w:12.00.1 bo section a-a ko ao p2:20.05 t 6 1.930.1 ko(mm) ao(mm) bo(mm) 4.950.1 1.930.1 p(mm) t(mm) 4.00.1 0.240.05 application notice a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. b) recommended products should be used within 6 months from the time of delivery. a) temperature and humidity conditions : -10~ 40c and 30~70% rh. 2. transportation : 1. storage conditions : to maintain the solderabililty of terminal electrodes : base tape 9-4. tearing off force top cover tape 165 to 180 f bulk (bags) chip size chip / reel inner box middle box carton 9-3. packaging quantity 30000 125000 62500 12000 40000 20000 50000 75000 150000 2500 12500 4000 1000 75 15000 3000 4(11) the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. (c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) 200000 200000 100000 100000 150000 100000 200000 50000 100000 20000 2 4000 20000 10000 2000 4000 3(09) 3(12) d1(mm) 1.50.1 7 1.850.1 4.950.1 3.660.1 8.00.1 0.240.05 1.50.1 300000 500000 250000 50000 1 10000 - 750000 375000 75000 0 15000 20000 80000 40000 2000 8000 6 50000 75000 150000 3000 15000 4(09) series z / l ferrite chip bead z1g series 10.11.2011 note : specifications subject to change without notice. please check our website for latest information.
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