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| td-020902 rev. c specifications subject to change without notice. aging: molded crystal package to meet today's demand for pick and place processing. available on tape and reel in quantities of 3k for smt placement. 32.768khz molded smd package C26-SMD model 32.768khz 20ppm 25c 5c -0.034 0.006ppm/c 2 (see chart 1) -40c to 85c -55c to 125c 50k ohm max 12.5pf typ. 0.003pf typ. 1.35pf typ. 450 typ. 1uw max 500m ohm min, dc100v15v frequency: calibration tolerance: turnover temperature: frequency vs temp.: operating temp. range: storage: esr: load capacitance: motional capacitance: shunt capacitance: capacitance ratio: drive level: insulation resistance: 60 25 0 -10 0 -50 temperature c typical temperature characteristic ppm 2 1 43 chart 1 0.216 (5.50) 12 3 4 0.150 (3.80) 0.315 (8.00) 0.098 (2.50) 0.019 (0.50) 0.051 (1.30) 0.051 (1.30) 0.165 (4.20) 0.051 (1.30) 0.075 (1.90) 0.075 (1.90) C26-SMD all dimensions are max unless otherwise specified. dimensions inches (mm) <3ppm 1st/yr max 37 recommended reflow soldering profile 217c 200c 260c 150c 90 secs. max. temperature ramp-up 3c/sec max. preheat 180 secs. max. 8 minutes max. 260c for 10 secs. max. critical temperature zone ramp-down 6c/sec. note: reflow profile with 240c peak also acceptable.
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