agilent AMMC-6231 16?32 ghz low noise amplifier data sheet features ? ? ? ? ? wide frequency range: 16 - 32 ghz ? ? ? ? ? high gain: 22 db ? ? ? ? ? low 50 ? ? ? ? ? noise figure: 2.6 db ? ? ? ? ? 50 ? ? ? ? ? input and output match ? ? ? ? ? flat gain response ? ? ? ? ? single 3v supply bias applications ? ? ? ? ? microwave radio systems ? ? ? ? ? satellite vsat, dbs up/down link ? ? ? ? ? lmds & pt-pt mmw long haul ? ? ? ? ? broadband wireless access (including 802.16 and 802.20 wimax) ? ? ? ? ? wll and mmds loops ? ? ? ? ? commercial grade military description agilents AMMC-6231 is a high gain, low-noise amplifier that operates from 16 ghz to 32 ghz. this lna provides a wide-band solution for system design since it covers several bands, thus, reduces part inventory. the device has input / output match to 50 ohm, is unconditionally stable and can be used as either primary or sub-sequential low noise gain stage. by eliminating the complex tuning and assembly processes typically required by hybrid (discrete-fet) amplifiers, the AMMC-6231 is a cost-effective alternative in the 16 - 32 ghz communications receivers. the backside of the chip is both rf and dc ground. this helps simplify the assembly process and reduces assembly related performance variations and costs. it is fabricated in a phemt process to provide exceptional noise and gain performance. AMMC-6231 absolute maximum ratings [1] note: 1. operation in excess of any one of these conditions may result in permanent damage to this device. note: these devices are esd sensitive. the following precautions are strongly recommended. ensure that an esd approved carrier is used when dice are transported from one destination to another. personal grounding is to be worn at all times when handling these devices. for more details, refer to agilent application note a004r: electrostatic discharge damage and control. esd machine model (class a) esd human body model (class 0) chip size: 1900 x 800 mm (74.8 x 31.5 mils) chip size tolerance: 10mm ( 0.4 mils) chip thickness: 100 10mm (4 0.4 mils) rf pad dimensions: 110 x 90 mm (4.33 x 3.54 mils) dc pad dimensions: 100 x 100 mm (3.94 x 3.94 mils) symbol parameters/conditions units min. max. v d positive drain voltage v 7 v g gate supply voltage v na i d drain current ma 100 p in cw input power dbm 15 t ch operating channel temp. c +150 t stg storage case temp. c -65 +150 t max maximum assembly temp (60 sec max) c +300
2 noise figure at 31 ghz AMMC-6231 rf specifications [3, 4, 5] t a = 25c, v d =3.0 v, i d(q)= 60 ma, z in =z o =50 ? ? ? ? ? notes: 1. ambient operational temperature t a =25c unless otherwise noted. 2. channel-to-backside thermal resistance (q ch-b ) = 26c/w at t channel (t c ) = 34c as measured using infrared microscopy. thermal resistance at backside temperature (t b ) = 25c calculated from measured data. 3. small/large -signal data measured in wafer form t a = 25c. 4. 100% on-wafer rf test is done at frequency =18, 26, and 31 ghz. 5. specifications are derived from measurements in a 50 ? test environment. aspects of the amplifier performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching. 6. as derived from measured s-parameters s11 at 31ghz noise figure at 26 ghz typical distribution of small signal gain, noise figure, and return loss. based on 1500 part sampled over several production lots. AMMC-6231 dc specifications/physical properties [1] symbol parameters and test conditions units minimum typical maximum sigma gain small-signal gain [6] db 20 22 0.4 nf noise figure into 50 ? db 18-28 ghz = 2.5 28-32 ghz = 2.7 18-28 ghz = 2.8 28-32 ghz = 2.9 0.1 p -1db output power at 1db gain compression dbm +8.5 oip3 third order intercept point; ? f=100mhz; pin=-35dbm dbm +19 rlin input return loss [6] db -9 -8 0.3 rlout output return loss [6] db -16 -12 0.5 lsl 21 21.2 21.4 21.6 21.8 22 22.2 22.4 usl -10 -9 -8 usl 2.5 2.6 2.7 2.8 2.9 symbol parameters and test conditions units min. typ. max. i d drain supply current (under any rf power drive and temperature) (v d =3.0 v) ma 60 80 ch-b thermal resistance [2] (backside temperature, tb = 25c) c/w 25
3 figure 1. typical gain figure 2. typical isolation figure 3 typical input return loss figure 4. typical output return loss figure 5. typical noise figure into a 50 ? load. figure 6. typical output p -1db and 3 rd order intercept pt. figure 7. gain over temperature figure 8. isolation over temperature figure 9. typical input return loss over temperature AMMC-6231 typical performances (t a = 25c, v d1 = v d2 =3.0 v, i total = 60 ma, z in = z out = 50 ? unless otherwise stated) note: these measurements are in a 50 ? test environment. aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching 0 5 10 15 20 25 14 18 22 26 30 34 frequency (ghz) s21 (db) -80 -60 -40 -20 0 14 18 22 26 30 34 frequency (ghz) s12 (db) -25 -20 -15 -10 -5 0 14 18 22 26 30 34 frequency (ghz) s11 (db) -30 -25 -20 -15 -10 -5 0 14 18 22 26 30 34 frequency (ghz) s22 (db) 1 1.5 2 2.5 3 16 20 24 28 32 frequency (ghz) nf(db) 0 3 6 9 12 15 18 21 16 20 24 28 32 frequency (ghz) op-1db & oip3 (dbm) op-1db oip3 0 5 10 15 20 25 30 16 20 24 28 32 frequency (ghz) s21 (db) 25c -40c +85c -80 -60 -40 -20 0 16 20 24 28 32 frequency (ghz) s12 (db) 25c -40c +85c -20 -15 -10 -5 0 16 20 24 28 32 frequency (ghz) s11 (db) 25c -40c +85c
4 figure 10: total idd over temperature figure 11: gain over vdd AMMC-6231 typical performances (t a = 25c, v d1 =v d2 =3.0 v, i total = 60 ma, z in = z out = 50 ? unless otherwise stated) note: these measurements are in a 50 ? test environment. aspects of the amplifier performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching. figure 12: isolation over vdd figure 13: input return loss over vdd figure 14: output return loss over vdd figure 15: noise figure over vdd figure 16: output ip3 over vdd 54 56 58 60 62 64 66 68 3 3.5 4 4.5 5 vdd (v) total idd (ma) -40c 25c +85c 0 5 10 15 20 25 30 16 20 24 28 32 frequency (ghz) s21 (db) 3v 4v 5v -80 -60 -40 -20 0 16 20 24 28 32 frequency (ghz) s12 (db) 3v 4v 5v -20 -15 -10 -5 0 16 20 24 28 32 frequency (ghz) s11 (db) 3v 4v 5v -30 -25 -20 -15 -10 -5 0 16 20 24 28 32 frequency (ghz) s22 (db) 3v 4v 5v 0 0.5 1 1.5 2 2.5 3 3.5 16 20 24 28 32 frequency (ghz) nf(db) 3v 4v 5v 0 5 10 15 20 25 16 20 24 28 32 frequency (ghz) op1db (dbm) 3v 4v 5v
5 AMMC-6231 typical scattering parameters [1] (tc=25c, v d1 =v d2 = 3 v, i total = 60 ma z in = z out = 50 ? ) note: data obtained from on-wafer measurements s11 s21 s12 s22 freq ghz db mag phase db mag phase db mag phase db mag phase 11.0 -1.224 0.869 169.751 -2.168 0.779 47.164 -68.269 0.000 -45.116 -4.672 0.584 -131.790 12.0 -1.520 0.839 149.847 7.264 2.308 -28.780 -64.182 0.001 178.210 -6.096 0.496 -143.113 13.0 -2.670 0.735 123.576 14.773 5.479 -106.707 -69.718 0.000 -1.991 -7.796 0.408 -153.930 14.0 -6.127 0.494 98.304 18.596 8.507 171.105 -68.541 0.000 179.486 -9.961 0.318 -161.328 15.0 -10.264 0.307 84.852 19.615 9.566 103.508 -64.621 0.001 148.061 -12.266 0.244 -166.179 16.0 -14.521 0.188 65.726 20.236 10.276 49.585 -65.844 0.001 125.856 -14.301 0.193 -165.809 16.5 -17.105 0.140 52.122 20.627 10.749 24.834 -66.450 0.000 39.923 -15.351 0.171 -164.958 17.0 -21.512 0.084 23.785 20.979 11.193 0.992 -63.247 0.001 162.790 -16.452 0.150 -161.912 17.5 -23.536 0.067 -18.771 21.237 11.531 -21.976 -66.021 0.001 0.751 -17.137 0.139 -156.931 18.0 -20.946 0.090 -71.637 21.524 11.918 -44.291 -63.950 0.001 112.065 -17.399 0.135 -154.425 18.5 -17.139 0.139 -99.620 21.779 12.273 -65.931 -58.189 0.001 76.722 -17.706 0.130 -152.650 19.0 -14.086 0.198 -121.971 21.917 12.470 -87.850 -62.310 0.001 53.429 -18.078 0.125 -149.878 19.5 -12.981 0.224 -138.557 21.941 12.504 -108.946 -63.387 0.001 -27.327 -18.219 0.123 -145.515 20.0 -12.151 0.247 -148.771 21.873 12.407 -128.605 -65.475 0.001 -71.930 -17.911 0.127 -143.752 20.5 -11.537 0.265 -158.049 21.776 12.269 -147.868 -63.841 0.001 19.483 -17.733 0.130 -142.200 21.0 -11.306 0.272 -168.343 21.632 12.067 -166.171 -67.516 0.000 21.783 -17.612 0.132 -143.646 21.5 -11.563 0.264 -174.869 21.433 11.793 177.010 -65.795 0.001 -9.861 -17.270 0.137 -144.727 22.0 -11.914 0.254 -178.065 21.430 11.789 160.276 -61.616 0.001 -168.107 -17.431 0.134 -148.407 22.5 -12.017 0.251 179.655 21.456 11.825 144.048 -59.172 0.001 -157.925 -18.073 0.125 -147.601 23.0 -11.999 0.251 177.242 21.377 11.718 127.893 -59.916 0.001 173.807 -18.298 0.122 -145.456 23.5 -12.322 0.242 175.484 21.348 11.679 112.058 -57.137 0.001 159.917 -18.148 0.124 -144.058 24.0 -12.532 0.236 173.191 21.248 11.546 96.990 -57.535 0.001 148.235 -18.008 0.126 -141.442 24.5 -12.530 0.236 171.601 21.258 11.558 82.291 -60.568 0.001 125.011 -17.361 0.136 -142.706 25.0 -12.744 0.231 172.328 21.257 11.557 67.060 -62.987 0.001 136.388 -17.249 0.137 -145.709 25.5 -12.883 0.227 171.212 21.218 11.506 52.687 -56.686 0.001 137.081 -17.278 0.137 -146.019 26.0 -12.891 0.227 171.982 21.251 11.550 38.166 -63.159 0.001 93.342 -16.853 0.144 -147.033 26.5 -12.850 0.228 172.072 21.236 11.529 23.556 -58.666 0.001 131.485 -16.682 0.147 -150.378 27.0 -13.013 0.224 171.665 21.201 11.483 9.169 -57.833 0.001 131.410 -16.552 0.149 -152.151 27.5 -12.893 0.227 172.970 21.190 11.468 -4.750 -59.860 0.001 117.672 -16.393 0.151 -155.696 28.0 -12.895 0.227 174.430 21.178 11.453 -18.352 -58.302 0.001 140.189 -16.364 0.152 -156.583 28.5 -12.636 0.233 178.289 21.259 11.560 -32.627 -56.608 0.001 111.274 -15.830 0.162 -160.401 29.0 -12.387 0.240 176.849 21.316 11.636 -46.562 -57.721 0.001 112.031 -16.138 0.156 -164.619 29.5 -12.143 0.247 177.181 21.331 11.656 -60.321 -52.001 0.003 120.164 -15.957 0.159 -166.799 30.0 -11.576 0.264 178.961 21.372 11.711 -74.237 -50.993 0.003 116.245 -15.438 0.169 -172.729 30.5 -11.248 0.274 179.288 21.403 11.753 -88.063 -52.041 0.003 81.089 -15.872 0.161 -179.133 31.0 -10.636 0.294 178.610 21.393 11.739 -102.278 -50.028 0.003 90.796 -16.260 0.154 175.844 32.0 -9.902 0.320 176.368 21.353 11.685 -130.188 -52.610 0.002 45.032 -17.652 0.131 170.562 33.0 -9.350 0.341 171.820 21.083 11.327 -158.564 -51.333 0.003 57.174 -18.373 0.121 167.809 34.0 -8.813 0.363 171.094 20.755 10.908 175.593 -54.399 0.002 65.576 -18.344 0.121 170.267 35.0 -8.125 0.392 172.451 20.532 10.632 149.898 -55.336 0.002 20.730 -18.098 0.124 168.084 36.0 -6.991 0.447 171.322 20.410 10.484 124.130 -63.736 0.001 34.727 -17.898 0.127 158.553 37.0 -5.494 0.531 167.843 20.277 10.324 97.564 -58.775 0.001 -10.016 -17.799 0.129 151.639 38.0 -4.281 0.611 160.315 19.935 9.925 69.896 -49.909 0.003 43.736 -18.436 0.120 147.104 39.0 -3.260 0.687 152.777 19.443 9.379 42.889 -50.435 0.003 30.726 -18.590 0.118 144.621 40.0 -2.305 0.767 144.157 18.863 8.773 15.719 -47.535 0.004 -7.216 -17.849 0.128 136.198 41.0 -1.513 0.840 134.565 18.019 7.960 -11.114 -47.208 0.004 -6.051 -17.478 0.134 122.522 42.0 -0.772 0.915 123.324 17.035 7.108 -38.077 -48.230 0.004 -16.155 -18.008 0.126 115.316 43.0 -0.343 0.961 112.897 15.871 6.216 -63.626 -48.224 0.004 -64.239 -18.233 0.123 103.928 44.0 -0.275 0.969 100.290 14.549 5.339 -88.002 -51.952 0.003 -98.825 -18.451 0.120 93.181 45.0 -0.349 0.961 89.671 13.180 4.560 -111.566 -47.621 0.004 -132.254 -18.869 0.114 83.605
6 AMMC-6231 typical scattering parameters [1] (tc=25c, v d1 =v d2 = 5 v, i total = 65 ma ,z in = z out = 50 ? ) note: data obtained from on-wafer measurements s11 s21 s12 s22 freq ghz db mag phase db mag phase db mag phase db mag phase 11.0 -1.274 0.864 170.496 -4.446 0.599 46.906 -62.427 0.001 -156.271 -4.570 0.591 -136.719 12.0 -1.686 0.824 150.794 5.539 1.892 -27.167 -70.070 0.000 146.571 -6.069 0.497 -150.437 13.0 -2.969 0.710 124.827 13.758 4.874 -105.528 -73.152 0.000 -24.365 -7.930 0.401 -164.641 14.0 -6.818 0.456 99.979 18.140 8.073 167.923 -68.541 0.000 -112.644 -10.618 0.295 -177.769 15.0 -11.381 0.270 88.861 19.224 9.146 96.994 -63.748 0.001 177.801 -13.733 0.206 171.930 16.0 -16.706 0.146 71.089 19.888 9.872 40.549 -64.261 0.001 -105.733 -17.456 0.134 165.294 16.5 -21.130 0.088 54.844 20.214 10.249 14.975 -66.021 0.001 -177.622 -19.798 0.102 164.208 17.0 -28.509 0.038 10.753 20.589 10.702 -10.127 -75.948 0.000 -69.734 -22.575 0.074 163.370 17.5 -24.565 0.059 -80.986 20.863 11.044 -34.405 -62.673 0.001 87.684 -25.784 0.051 169.587 18.0 -19.254 0.109 -106.949 21.114 11.369 -58.160 -63.899 0.001 99.296 -29.307 0.034 -174.356 18.5 -15.649 0.165 -121.039 21.269 11.573 -80.967 -66.548 0.000 -57.445 -31.860 0.026 -153.056 19.0 -13.321 0.216 -133.732 21.308 11.625 -103.642 -64.119 0.001 65.134 -31.679 0.026 -116.209 19.5 -11.950 0.253 -145.615 21.266 11.570 -125.723 -62.304 0.001 25.072 -29.276 0.034 -95.762 20.0 -11.351 0.271 -156.055 21.076 11.319 -146.826 -62.298 0.001 105.846 -26.317 0.048 -84.659 20.5 -10.896 0.285 -164.209 20.839 11.014 -166.524 -59.782 0.001 99.542 -24.464 0.060 -85.624 21.0 -10.743 0.290 -171.309 20.536 10.636 174.575 -58.005 0.001 29.812 -23.189 0.069 -86.727 21.5 -10.995 0.282 -176.013 20.292 10.342 156.985 -69.607 0.000 -57.692 -23.002 0.071 -89.283 22.0 -11.414 0.269 -177.861 20.125 10.145 140.534 -58.866 0.001 -72.244 -23.362 0.068 -91.514 22.5 -11.291 0.273 -179.031 19.998 9.998 124.072 -60.086 0.001 -161.093 -23.220 0.069 -82.171 23.0 -11.171 0.276 178.842 19.869 9.851 106.958 -63.378 0.001 -147.709 -21.875 0.081 -75.780 23.5 -11.240 0.274 177.701 19.674 9.632 90.996 -57.019 0.001 -168.211 -20.509 0.094 -75.352 24.0 -11.442 0.268 175.886 19.483 9.423 75.675 -57.313 0.001 142.759 -19.265 0.109 -77.135 24.5 -11.413 0.269 174.866 19.354 9.283 60.442 -57.907 0.001 160.988 -18.723 0.116 -82.146 25.0 -11.331 0.271 174.630 19.221 9.142 45.490 -65.563 0.001 148.737 -18.542 0.118 -83.347 25.5 -11.369 0.270 173.890 19.095 9.011 30.836 -57.356 0.001 148.202 -17.909 0.127 -84.462 26.0 -11.248 0.274 173.447 19.023 8.936 16.186 -64.895 0.001 147.000 -17.342 0.136 -87.417 26.5 -11.148 0.277 172.027 18.884 8.794 1.694 -60.673 0.001 116.872 -17.060 0.140 -90.365 27.0 -11.090 0.279 172.311 18.776 8.686 -12.139 -59.647 0.001 127.765 -16.797 0.145 -92.536 27.5 -11.021 0.281 171.687 18.637 8.548 -26.291 -62.419 0.001 173.035 -16.657 0.147 -93.932 28.0 -10.934 0.284 170.556 18.538 8.451 -40.108 -58.100 0.001 154.113 -16.245 0.154 -95.894 28.5 -10.669 0.293 171.414 18.422 8.339 -53.711 -64.651 0.001 89.451 -16.140 0.156 -98.652 29.0 -10.658 0.293 169.830 18.308 8.230 -67.235 -58.638 0.001 118.727 -16.071 0.157 -98.432 29.5 -10.470 0.300 170.126 18.206 8.134 -80.621 -56.694 0.001 155.781 -15.706 0.164 -100.324 30.0 -10.384 0.303 170.606 18.106 8.041 -93.727 -58.675 0.001 136.937 -15.384 0.170 -103.635 30.5 -10.054 0.314 170.547 17.957 7.904 -106.755 -54.652 0.002 106.666 -15.240 0.173 -104.558 31.0 -9.805 0.323 169.344 17.835 7.794 -119.437 -57.676 0.001 119.455 -15.011 0.178 -105.433 32.0 -9.335 0.341 166.637 17.654 7.633 -145.275 -54.093 0.002 95.531 -14.522 0.188 -107.414 33.0 -8.938 0.357 164.399 17.262 7.296 -169.829 -53.735 0.002 32.768 -13.824 0.204 -111.234 34.0 -8.730 0.366 163.933 16.940 7.031 166.626 -67.835 0.000 164.557 -12.655 0.233 -117.582 35.0 -8.386 0.381 164.222 16.819 6.934 144.945 -58.654 0.001 153.048 -12.348 0.241 -124.755 36.0 -7.616 0.416 166.305 16.920 7.015 122.970 -58.632 0.001 129.804 -12.297 0.243 -130.333 37.0 -6.386 0.479 164.858 17.196 7.241 99.591 -54.446 0.002 128.707 -11.875 0.255 -136.111 38.0 -5.174 0.551 161.864 17.375 7.392 75.612 -55.897 0.002 120.920 -11.409 0.269 -141.724 39.0 -4.100 0.624 158.245 17.715 7.687 50.891 -51.032 0.003 77.587 -10.873 0.286 -146.547 40.0 -2.710 0.732 153.014 18.141 8.073 25.237 -50.741 0.003 92.832 -10.333 0.304 -154.439 41.0 -1.282 0.863 146.069 18.403 8.321 -2.083 -49.135 0.003 65.101 -10.118 0.312 -162.794 42.0 -0.755 0.917 135.682 18.675 8.585 -32.624 -45.441 0.005 64.787 -9.440 0.337 -170.419 43.0 -0.381 0.957 121.916 18.550 8.463 -65.229 -47.899 0.004 26.462 -9.082 0.351 179.247 44.0 -0.913 0.900 106.699 17.677 7.653 -99.381 -46.446 0.005 14.717 -8.921 0.358 167.908 45.0 -0.111 0.987 91.299 16.124 6.400 -130.994 -45.355 0.005 -12.481 -8.945 0.357 155.893
7 biasing and operation the AMMC-6231 is normally biased with a positive supply connected to both v d1 and v d2 bond pads through the 100pf bypass capacitor as shown in figure 21. the recommended supply voltage is 3 v. it is important to place the bypass capacitor as close to the die as possible. no negative gate bias voltage is needed for the AMMC-6231. input and output matching are achieved on-die, therefore no other external component is required besides one 100pf bypass capacitor for the main supply. the input and output are dc- blocked with internal coupling capacitors. no ground wires are needed because all ground connections are made with plated through- holes to the backside of the device. refer the absolute maximum ratings table for allowed dc and thermal conditions. assembly techniques the backside of the mmic chip is rf ground. for microstrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1] for best performance, the topside of the mmic should be brought up to the same height as the circuit surrounding it. this can be accomplished by mounting a gold plate metal shim (same length and width as the mmic) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. the amount of epoxy used for the chip and/or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. the ground plan should be free of any residue that may jeopardize electrical or mechanical attachment. the location of the rf bond pads is shown in figure 12. note that all the rf input and output ports are in a ground- signal-ground configuration. rf connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. a single bond wire is normally sufficient for signal connections, however double bonding with 0.7 mil gold wire or use of gold mesh [2] is recommended for best performance, especially near the high end of the frequency band. thermosonic wedge bonding is preferred method for wire attachment to the bond pads. gold mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams and a ultrasonic power of roughly 55 db for a duration of 76 +/- 8 ms. the guided wedge at an untrasonic power level of 64 db can be used for 0.7 mil wire. the recommended wire bond stage temperature is 150 +/- 2c. caution should be taken to not exceed the absolute maximum rating for assembly temperature and time. the chip is 100um thick and should be handled with care. this mmic has exposed air bridges on the top surface and should be handled by the edges or with a custom collet (do not pick up the die with a vacuum on die center). this mmic is also static sensitive and esd precautions should be taken notes: [1] ablebond 84-1 lm1 silver epoxy is recommended. [2] buckbee-mears corporation, st. paul, mn, 800-262-3824 figure 17. AMMC-6231 simplified schematic rfou t rfin vd1 vd2
www.agilent.com/ semiconductors for product information and a complete list of distributors, please go to our web site. data subject to change. copyright ? 2004 agilent technologies, inc. december 13, 2004 5989-1957en figure 18. AMMC-6231 bonding pad locations figure 19. AMMC-6231 assembly diagram 0 0 1900 800 760 1070 1410 700 400 400 1810 90 vd1 vd2 rfin rfout rf input rf output v d1 v d2 gold plated shim (optional) 100 pf capacitor to v dd dc supply AMMC-6231 ordering information AMMC-6231-w10 = 10 devices per tray AMMC-6231-w50 = 50 devices per tray
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