17.3 mm (0.68 inch) general purpose 5 x 7 dot matrix alphanumeric displays reliability data description the following cumulative test results have been obtained from testing performed at agilent technologies optoelectronics division in accordance with the latest revision of mil- std-883. agilent tests parts at or beyond the absolute maximum rated conditions recommended for the device. the actual performance you obtain from agilent parts depends on the electrical and environmental characteristics of hdsp-70xe, -70xg, -70xa hdsp-71xe, -71xg, -71xa table 1. life tests demonstrated performance total stress test stress test colors device units units conditions hours tested failed high temperature operating life t a = 55 c i f = 19 ma high efficiency red 5000 10 0 i f = 20 ma green 3528 21 0 i f = 16 ma algaas 5000 10 0 wet high temperature operating life t a = 85 c r.h. = 85% i f = 13 ma high efficiency red 1680 10 0 i f = 15 ma green 3528 21 0 i f = 7 ma algaas 5000 10 0 wet high temperature reverse t a = 85 c r.h. = 85% high efficiency red 5000 10 0 bias operating life 5 v rb green 3528 21 0 algaas 5000 10 0 low temperature operating life t a = -40 c i f = 25 ma high efficiency red 5000 10 0 i f = 25 ma green 3528 21 0 i f = 25 ma algaas 5000 10 0 room temperature operating life t a = 25 c i f = 25 ma high efficiency red 5000 10 0 i f = 25 ma green 3528 21 0 i f = 25 ma algaas 5000 10 0 your application but will probably be better than the performance outlined in table 1.
www.semiconductor.agilent.com data subject to change. copyright ? 2000 agilent technologies, inc. obsoletes 5968-7187e 5980-1049e (4/00) table 2. environmental tests units units test name reference test conditions tested failed solder heat resistance hp internal test - coq solder wave at 250 c for total of 2700 0 ppm 5 seconds + 5 temperature cycles per mil-std-883 method 1010. temperature cycle mil-std-883 method 1010 -25 c to +85 c, 15 min. dwell, 5 min. transfer, 20 cycles 1700 0 50 cycles 1700 0 humidity storage jis c 7021 method b-11 85 c, 85% rh, 168 hours 84 0 solderability mil-std-883 method 2003 16 hours steam aging followed by 40 0 solder dip at 260 c for 5 seconds.
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