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eight character 5 mm smart alphanumeric display technical data features ? xy stackable ? 128 character ascii decoder ? programmable functions ? 16 user definable characters ? multi-level dimming and blanking ? ttl compatible cmos ic ? wave solderable applications ? avionics ? computer peripherals ? industrial instrumentation ? medical equipment ? portable data entry devices ? telecommunications ? test equipment hdsp-253x series description the hdsp-253x is ideal for applications where displaying eight or more characters of dot matrix information in an aesthetically pleasing manner is required. these devices are eight- digit, 5 x 7 dot matrix, alphanu- meric displays. the 5.0 mm (0.2 inch) high characters are pack- aged in a 0.300 mm (7.62 inch) 30 pin dip. the on-board cmos ic has the ability to decode 128 ascii characters, which are permanently stored in rom. in addition, 16 programmable symbols may be stored in on- board ram. seven brightness levels provide versatility in adjusting the display intensity and power consumption. the hdsp-253x is designed for stan- device selection guide algaas red her orange yellow green hdsp-2534 hdsp-2532 HDSP-2530 hdsp-2531 hdsp-2533 dard microprocessor interface techniques. the display and special features are accessed through a bidirectional eight-bit data bus.
2 package dimensions esd warning: normal cmos handling precautions should be observed to avoid static discharge. absolute maximum ratings supply voltage, v dd to ground [1] .................................... -0.3 v to 7.0 v operating voltage, v dd to ground [2] .............................................. 5.5 v input voltage, any pin to ground........................... -0.3 v to v dd +0.3 v free air operating temperature range, t a [3 ] .............. -40 c to + 85 c relative humidity (non-condensing) .............................................. 85% storage temperature range, t s ...................................... -55 c to 100 c maximum solder temperature 1.59 mm (0.063 in.) below seating plane, t< 5 sec. ................ 260 c esd protection @ 1.5 k w , 100 pf ................................. 4 kv (each pin) notes : 1. maximum voltage is with no leds illuminated. 2. 20 dots on in all locations at full brightness. 3. see thermal considerations section for information about operation in high temperature ambients. notes: 1. dimensions are in mm (inches). 2. unless otherwise specified, tolerance on dimensions is 0.25 mm (0.010 in.). 3. for yellow and green displays only. gso s o os pin # 1 identifier 42.93 (1.690) max. 2.68 (0.105) sym. 5.36 (0.211) typ. 11.43 (0.450) max. 2.54 (0.100) typ. 4.57 (0.180) typ. 2.29 0.090 sym. 0 12 345 6 7 hdsp-253x yyww xz hp pin # 1 luminous intensity category date code (year, week) color bin (3) part number 5.31 (0.209) typ. 0.46 0.13 (0.018 0.005) 2.54 0.13 (0.100 0.005) (tol. non accum.) typ. 10.16 (0.400) 4.01 (0.158) typ 5.08 (0.200) sym pin #15 pin function assignment table pin # function pin # function 1 rst 16 gnd (supply) 2 fl 17 thermal test 3 a 18 gnd (logic) 4 a 19 rd 5 a 20 d 6 a 21 d 7 no pin 22 no pin 8 no pin 23 no pin 9 no pin 24 no pin 10 a 25 d 11 cls 26 d 12 clk 27 d 13 wr 28 d 14 ce 29 d 15 v 30 d 1 7.62 (0.300) 3.81 (0.150) sym pin # 15 1.52 (0.060) _ _ _ _ _ _ _ [4]
3 ascii character set d7 d6 d5 d4 bits d3 d0 d2 d1 row column 0000 0 0001 1 0010 2 0011 3 0100 4 0101 5 0110 6 0111 7 1000 8 1001 9 1010 a 1011 b 1100 c 1101 d 1110 e 1111 f 0 0 0 0 0 0 0 0 1 1 0 0 1 0 2 0 0 1 1 3 0 1 0 0 4 0 1 0 1 5 0 1 1 0 6 0 1 1 1 7 1 x x x 8? 16 u s e r d e f i n e d c h a r a c t e r s optical characteristics at 25 c [1] v dd = 5.0 v at full brightness luminous intensity character average (#) peak dominant i v (mcd) wavelength wavelength [2] l peak (nm) l d (nm) led color part number min. typ. typ. typ. algaas red hdsp-2534 5.1 25 645 637 high eff. red hdsp-2532 2.5 7.5 635 626 orange HDSP-2530 2.5 7.5 600 602 yellow hdsp-2531 2.5 7.5 583 585 green hdsp-2533 2.5 7.5 568 574 notes: 1. refers to the initial case temperature of the device immediately prior to measurement. 2. dominant wavelength, l d , is derived from the cie chromaticity diagram, and represents the single wavelength which defines the color of the device.
4 recommended operating conditions parameter symbol minimum nominal maximum units supply voltage v dd 4.5 5.0 5.5 v electrical characteristics over operating temperature range 4.5 < v dd < 5.5 unless otherwise specified 25 c25 c parameter symbol min. typ. [1] max. [1] max. units test conditions input leakage i i -1.0 1.0 m av in = 0 to v dd , pins clk, (input without pull-up) d 0 -d 7 , a 0 -a 4 input current i ip -30 -11 -18 0 m av in = 0 to v dd , pins cls, (input with pull-up) rst, wr, rd, ce, fl i dd blank i dd (bl) 0.5 3.0 4.0 ma v in = v dd i dd 8 digits 12 dots/char [2,3,4] i dd (v) 230 295 390 ma "v" on in all 8 locations (algaas) i dd 8 digits 20 dots/char [2,3,4] i dd (#) 330 410 480 ma "#" on in all 8 locations (algaas) i dd 8 digits 12 dots/char [2,3,4] i dd (v) 200 255 330 ma "v" on in all 8 locations (all colors except algaas) i dd 8 digits 20 dots/char [2,3,4] i dd (#) 300 370 430 ma "#" on in all 8 locations (all colors except algaas) input voltage high v ih 2.0 v dd v +0.3 v input voltage low v il gnd v -0.3 v output voltage high v oh 2.4 v v dd = 4.5 v, i oh = -40 m a output voltage low v ol 0.4 v v dd = 4.5 v, i ol = 1.6 ma d 0 -d 7 output voltage low v ol 0.4 v v dd = 4.5 v, i ol = 40 m a clk thermal resistance ic r q j-pin 16 c/w measured at pin 17 junction-to-pin notes: 1. v dd = 5.0 v. 2. see thermal considerations section for information about operation in high temperature ambients. 3. average i dd measured at full brightness. see table 2 in control word section for i dd at lower brightness levels. peak i dd = 28/15 x i dd (#). 4. maximum i dd occurs at -55 c.
5 ac timing characteristics over temperature range v dd = 4.5 to 5.5 v unless otherwise specified. reference number symbol description min. [1] units 1t acc display access time write 210 read 230 ns 2t acs address setup time to chip enable 10 ns 3t ce chip enable active time [2, 3] write 140 read 160 ns 4t ach address hold time to chip enable 20 ns 5t cer chip enable recovery time 60 ns 6t ces chip enable active prior to rising edge of [2, 3] write 140 read 160 ns 7t ceh chip enable hold time to rising edge of read/write signal [2, 3] 0ns 8t w write active time 100 ns 9t wd data valid prior to rising edge of write signal 50 ns 10 t dh data write hold time 20 ns 11 t r chip enable active prior to valid data 160 ns 12 t rd read active prior to valid data 75 ns 13 t df read data float delay 10 ns t rc reset active time [4] 300 ns notes: 1. worst case values occur at an ic junction temperature of 125 c. 2. for designers who do not need to read from the display, the read line can be tied to v dd and the write and chip enable lines can be tied together. 3. changing the logic levels of the address lines when ce = "0" may cause erroneous data to be entered into the character ram, regardless of the logic levels of the wr and rd lines. 4. the display must not be accessed until after 3 clock pulses (110 m s min. using the internal refresh clock) after the rising edge of the reset line. symbol description 25 c typical minimum [1] units f osc oscillator frequency 57 28 khz f rf [5] display refresh rate 256 128 hz f fl [6] character flash rate 2 1 hz t st [7] self test cycle time 4.6 9.2 sec notes: 5. f rf = f osc /224. 6. f fl = f osc /28,672. 7. t st = 262,144/f osc .
6 write cycle timing diagram read cycle timing diagram
7 electrical description pin function description reset (rst, pin 1) reset initializes the display. flash (fl, pin 2) fl low indicates an access to the flash ram and is unaffected by the state of address lines a 3 -a 4 . address inputs each location in memory has a distinct address. address inputs (a 0 -a 2 ) (a 0 -a 4 , pins 3-6, 10) select a specific location in the character ram, the flash ram or a particular row in the udc (user-defined character) ram. a 3 -a 4 are used to select which section of memory is accessed. table 1 shows the logic levels needed to access each section of memory. table 1. logic levels to access memory fl a 4 a 3 section of memory a 2 a 1 a 0 0 x x flash ram character address 1 0 0 udc address register dont care 1 0 1 udc ram row address 1 1 0 control word register dont care 1 1 1 character ram character address clock select this input is used to select either an internal (cls = 1) or external (cls = 0) (cls, pin 11) clock source. clock input/output outputs the master clock (cls = 1) or inputs a clock (cls = 0) for slave (clk, pin 12) displays. write (wr, pin 13) data is written into the display when the wr input is low and the ce input is low. chip enable (ce, pin 14) this input must be at a logic low to read or write data to the display and must go high between each read and write cycle. read (rd, pin 19) data is read from the display when the rd input is low and the ce input is low. data bus the data bus is used to read from or write to the display. (d 0 -d 7 , pins 20, 21, 25-30) gnd (supply) (pin 16) this is the analog ground for the led drivers. gnd (logic) (pin 18) this is the digital ground for internal logic. v dd (power) (pin 15) this is the positive power supply input. thermal test (pin 17) this pin is used to measure the ic junction temperature. do not connect.
8 figure 1. hdsp-253x internal block diagram.
9 character ram this ram stores either ascii character data or a udc ram address. flash ram this is a 1 x 8 ram which stores flash data. user-defined character ram this ram stores the dot pattern for custom characters. (udc ram) user-defined character this register is used to provide the address to the udc ram when address register the user is writing or reading a custom character. (udc address register) control word register this register allows the user to adjust the display brightness, flash individual characters, blink, self test or clear the display. driving of eight 5 x 7 dot matrix characters. the major user accessible portions of the display are listed below: flash ram, a 128 character ascii decoder, a 16 character udc ram, a udc address register, a control word register and the refresh circuitry necessary to synchronize the decoding and display internal block diagram figure 1 shows the internal block diagram of the hdsp-253x display. the cmos ic consists of an 8 byte character ram, an 8 bit character ram figure 2 shows the logic levels needed to access the hdsp-253x character ram. during a normal access the ce = 0 and either rd = 0 or wr = 0. however, erroneous data may be written into the character ram if the address lines are unstable when ce = 0 regardless of the logic levels of the rd or wr lines. address lines a 0 -a 2 are used to select the location in the charac- ter ram. two types of data can be stored in each character ram location: an ascii code or a udc ram address. data bit d 7 is used to differentiate between the ascii character and a udc ram address. d 7 = 0 enables the ascii decoder and d 7 = 1 enables the udc ram. d 0 -d 6 are used to input ascii data and d 0 -d 3 are used to input a udc address. figure 2. logic levels to access the character ram.
10 udc ram and udc address register figure 3 shows the logic levels needed to access the udc ram and the udc address register. the udc address register is eight bits wide. the lower four bits (d 0 -d 3 ) are used to select one of the 16 udc locations. the upper four bits (d 4 -d 7 ) are not used. once the udc address has been stored in the udc address register, the udc ram can be accessed. to completely specify a 5 x 7 character requires eight write cycles. one cycle is used to store the udc ram address in the udc address register. seven cycles are used to store dot data in the udc ram. data is entered by rows. one cycle is needed to access each row. figure 4 shows the organization of a udc character assuming the symbol to be stored is an f. a 0 -a 2 are used to select the row to be accessed and d 0 -d 4 are used to transmit the row dot data. the upper three bits (d 5 -d 7 ) are ignored. d 0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and d 4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix. flash ram figure 5 shows the logic levels needed to access the flash ram. the flash ram has one bit associated with each location of the character ram. the flash input is used to select the flash ram. address lines a 3 -a 4 are ignored. address lines a 0 -a 2 are used to select the location in the flash ram to store the attribute. d 0 is used to store or remove the flash attribute. d 0 = 1 stores the attribute and d 0 = 0 removes the attribute. when the attribute is enabled through bit 3 of the control word and a 1 is stored in the flash ram, the corresponding character will flash at approxi- mately 2 hz. the actual rate is dependent on the clock frequency. for an external clock the flash rate can be calculated by dividing the clock frequency by 28,672. figure 3. logic levels to access a udc character. figure 4. data to load ""f'' into the udc ram.
11 table 2. current requirements at different brightness levels for all colors except algaas %v dd = 5.0 v symbol d 2 d 1 d 0 brightness 25 c typ. units i dd (v) 0 0 0 100 200 ma 001 80 160 ma 010 53 106 ma 0 1 1 40 80 ma 1 0 0 27 54 ma 1 0 1 20 40 ma 1 1 0 13 26 ma figure 5. logic levels to access the flash ram. control word register figure 6 shows how to access the control word register. this is an eight bit register which performs five functions. they are brightness control, flash ram control, blinking, self test and clear. each function is independent of the others. how- ever, all bits are updated during each control word write cycle. brightness (bits 0-2) bits 0-2 of the control word adjust the brightness of the display. bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. in addition to varying the display brightness, bits 0-2 also vary the average value of i dd . i dd can be calculated at any brightness level by multiplying the percent brightness level by the value of i dd at the 100% brightness level. these values of i dd are shown in table 2. flash function (bit 3) bit 3 determines whether the flashing character attribute is on or off. when bit 3 is a 1, the output of the flash ram is checked. if the content of a loca- tion in the flash ram is a 1, the associated digit will flash at approximately 2 hz. for an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. if the flash enable bit of the control word is a 0, the content of the flash ram is ignored. to use this function with multiple display systems see the reset section. blink function (bit 4) bit 4 of the control word is used to synchronize blinking of all eight digits of the display. when this bit is a 1 all eight digits of the display will blink at approxi- mately 2 hz. the actual rate is dependent on the clock frequency. for an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. this function will override the flash function when it is active. to use this function with multiple display systems see the reset section. figure 6. logic levels to access the control word register
12 self test function (bits 5, 6) bit 6 of the control word regis- ter is used to initiate the self test function. results of the internal self test are stored in bit 5 of the control word. bit 5 is a read only bit where bit 5 = 1 indicates a passed self test and bit 5 = 0 indicates a failed self test. setting bit 6 to a logic 1 will start the self test function. the built-in self test function of the ic consists of two internal routines which exercises major portions of the ic and illuminates all of the leds. the first routine cycles the ascii decoder rom through all states and performs a checksum on the output. if the checksum agrees with the correct value, bit 5 is set to 1. the second routine provides a visual test of the leds using the drive circuitry. this is accomplished by writing checkered and inverse checkered patterns to the display. each pattern is displayed for approxi- mately 2 seconds. during the self test function the display must not be accessed. the time needed to execute the self test function is calculated by multiplying the clock period by 262,144. for example, assume a clock frequency of 58 khz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration. at the end of the self test func- tion, the character ram is loaded with blanks, the control word register is set to zeros except for bit 5, and the flash ram is cleared and the udc address register is set to all ones. clear function (bit 7) bit 7 of the control word will clear the character ram and the flash ram. setting bit 7 to a 1 will start the clear function. three clock cycles (110 m s min. using the internal refresh clock) are required to complete the clear function. the display must not be accessed while the display is being cleared. when the clear function has been completed, bit 7 will be reset to a 0. the ascii character code for a space (20h) will be loaded into the character ram to blank the display and the flash ram will be loaded with 1s. the udc ram, udc address register and the re- mainder of the control word are unaffected. display reset figure 7 shows the logic levels needed to reset the display. the display should be reset on power- up. the external reset clears the character ram, flash ram, control word and resets the internal counters. after the rising edge of the reset signal, three clock cycles (110 m s min. using the internal refresh clock) are required to complete the reset sequence. the display must not be accessed while the display is being reset. the ascii character code for a space (20h) will be loaded into the character ram to blank the display. the flash ram and control word register are loaded with all "0"s. the udc ram and udc address register are unaffected. all displays which operate with the same clock source must be simultaneously reset to synchronize the flashing and blinking functions. mechanical considerations the hdsp-253x is assembled by die attaching and wire bonding 280 led chips and a cmos ic to a thermally conductive printed circuit board. a polycarbonate lens placed over the pcb creates an air gap over the led wire bonds. a backfill epoxy seals the display package. figure 8 shows the proper method to insert the display by hand. to prevent damage to the led wire bonds, apply pressure uniformly with fingers located at both ends of the part. using a tool, shown in figure 9, such as a screwdriver or pliers to push the display into the printed circuit board or socket may damage the led wire bonds. the force exerted by a screwdriver is sufficient to push the lens into the led wire bonds. the bent wire bonds cause shorts or opens that result in catastrophic failure of the leds. figure 7. logic levels to reset the display.
13 figure 9. improper method to manually insert a display. thermal considerations the hdsp-253x can operate from -40 c to +85 c. the displays low thermal resistance allows heat to flow from the cmos ic to the 24 package pins. typically, this heat is conducted through the printed circuit board traces to free air. for most applications, no additional heatsinking is needed. illuminating all 280 leds simultaneously at full brightness is not recommended for continuo- us operation. however, all 280 leds can be illuminated simul- taneously at full brightness for 10 seconds at 25 c as a lamp test. the ic has a maximum allowable junction temperature of 150 c. the ic junction temperature can be calculated with the following equation: t j max = t a + (p d x r q j-a ) t j max is the maximum allowable ic junction temperature. t a is the ambient temperature surrounding the display. p d is the power dissipated by the ic. r q j-a is the thermal resistance from the ic through the display package and printed circuit board to the ambient. a typical value for r q j-a is 39 c/w. this value is typical for a display mounted in a socket and covered with a plastic filter. the socket is soldered to a 0.062 in. thick printed circuit board with 0.020 in. wide one-ounce copper traces. p d can be calculated as follows: p d = v dd x i dd v dd is the supply voltage and i dd is the supply current. v dd can vary from 4.5 v to 5.5 v. i dd changes with v dd , temperature, brightness level, and number of on-pixels. for algaas i dd (#) = (83.8 x v dd -0.35 x t j ) x b x n/8 i dd (v) = (63 x v dd -0.79 x t j ) x b x n/8 for the other colors i dd (#) = (75.4 x v dd -0.28 x t j ) x b x n/8 figure 8. proper method to manually insert a display.
14 i dd (v) = (54 x v dd -0.6 x t j ) x b x n/8 i dd (#) is the supply current using # as the displayed character. i dd (v) is the supply current using v as the displayed character. t j is the ic junction temperature. b is the percent brightness level. n is the number of characters illuminated. operation in high temperature ambients may require power derating or heatsinking. figure 10 shows how to derate the power for an hdsp-253x. you can reduce the power by tighter supply voltage regulation or lowering the brightness level. table 3 shows the calculated maximum allowable ambient temperature for several different sets of operating conditions. the worst case alphanumeric characters (#,@,b) have 20 pixels. displaying eight 20-pixel characters will not occur in normal operation. thus, using eight 20-pixel characters to calculate power dissipation will over estimate the power and the ic junction temperature. the average number of pixels per character, supply voltage, brightness level, and number of characters are needed to calculate the power dissipated by the ic. the ambient temperature, power dissipated by the ic, and the thermal resistance are then used to calculate ic junction tempera- ture. the typical alphanumeric character is 15 pixels. for conditions not listed in table 3, you can calculate the power dissipated by the ic and use figure 10 to determine the maximum ambient temperature. table 3. maximum allowable ambient temperature for various operating conditions algaas red number of brightness v dd i dd p d r q j-a t a max character characters level v ma w c/w c # (20 dots) 8 100% 5.5 408 2.2 39 64 # (20 dots) 8 100% 5.25 387 2.0 39 72 # (20 dots) 8 100% 5.0 366 1.8 39 80 # (20 dots) 7 100% 5.5 357 2.0 39 72 # (20 dots) 6 100% 5.5 306 1.7 39 84 # (20 dots) 8 80% 5.5 327 1.8 39 80 # (20 dots) 8 80% 5.25 310 1.6 39 85 # (20 dots) 8 53% 5.5 216 1.2 39 85 v (12 dots) 8 100% 5.5 228 1.3 39 85 figure 10. maximum allowable power dissipation vs. ambient temperature. t j max = 150 c or 120 c.
15 table 3. maximum allowable ambient temperature for various operating conditions (contd.) all colors except algaas red number of brightness v dd i dd p d r q j-a t a max character characters level v ma w c/w c # (20 dots) 8 100% 5.5 373 2.0 39 72 # (20 dots) 8 100% 5.25 354 1.9 39 77 # (20 dots) 8 100% 5.0 335 1.67 39 85 # (20 dots) 7 100% 5.5 326 1.8 39 80 # (20 dots) 6 100% 5.5 280 1.5 39 85 # (20 dots) 8 80% 5.5 298 1.6 39 85 v (12 dots) 8 100% 5.5 207 1.1 39 85 the actual ic temperature is easy to measure. pin 17 is thermally and electrically connected to the ic substrate. the thermal resistance from pin 17 to the ic is 16 c/w. the procedure to measure the ic junction temperature is as follows: 1. measure v dd and i dd for the display. measure v dd between pins 15 and 16. measure the current entering pin 15. 2. measure the temperature of pin 17 after 45 minutes. use an electrically isolated thermal couple probe. 3. t j (ic) = t pin + v dd x i dd x 16 c/w. ground connections two ground pins are provided to keep the internal ic logic ground clean. the designer can, when necessary, route the analog ground for the led drivers separately from the logic ground until an appropriate ground plane is available. on long inter- connections between the display and the host system, the designer can keep voltage drops on the analog ground from affecting the display logic levels by isolating the two grounds. the logic ground should be con- nected to the same ground poten- tial as the logic interface circuitry. the analog ground and the logic ground should be connected at a common ground which can withstand the current induced by the switching led drivers. when separate ground connections are used, the analog ground can vary from -0.3 v to +0.3 v with respect to the logic ground. voltage below -0.3 v can cause all dots to be on. voltage above +0.3 v can cause dimming and dot mismatch. solder and post solder cleaning note: freon vapors can cause the black paint to peel off the display. see application note 1027 for information on soldering and post solder cleaning. contrast enhancement (filtering) see application note 1015 for information on contrast enhancement.
www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. obsoletes 5091-3970e (5/92) 5964-6377e (11/99)

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