smd fyl fyl fyl fyls ss s 3528 3528 3528 3528gc gcgc gc features: singlecolor suitableforallsmtassemblyandsolderprocess. availableontapeandreel package:2000pcs/reel description. the green source color devices are made with galliu m arsenide phosphide on gallium phosphide green lightemittingdiode. itisrecommendedtousea wristbandorantielec trostaticglovewhenhandlingtheleds. alldevices.equipmentandmachinerymustbeelectri callygrounded. packagedimensions notes: 1. alldimensionunitsaremillimeters inches 2. alldimensiontolerance0.2mmunlessotherwisenot ed. 3. anepoxymeniscusmayextendabout1.5mmdownthel eads.
smd selectionguide iv(mcd)@20ma viewing angle partno. dice lenstype min typ 2 1/2 fyls3528gc green(gap) waterclear 22 40 120 electrical/opticalcharacteristicsatta=25 b symbol parameter device min. typ. units testconditions d dominate wavelength green 567 570 nm if=20ma vf forwardvoltage 1.6 2.0 v if=20ma ir reversecurrent 5 a vr=5v absolutemaximumratingsat=25 b parameter white units powerdissipation 70 mw dcforwardcurrent 25 ma peakforwardcurrent(1) 140 ma reversevoltage 5 v operating/storagetemperature 40 to+85 note: 1. 1/10dutycycle,0.1mspulsewidth.
smd ambient temperature ta( ) l u m i n o u s i n t e n s i t y v s . f o r w a r d c u r r e n t forward current(ma) forward current derating curve forward current(ma) r e l a t i v e l u m i n o u s i n t e n s i t y ( % ) l u m i n o u s i n t e n s i t y v s . a m b i e n t t e m p e r a t u r e ambient temperature ta( ) c c relative luminous intensity 0 1 0 2 0 3 0 4 0 5 0 6 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0 100 1000 100 1000 0 -60 -35 -10 15 40 65 90 1 10 100 1000 2.4 0 10 r e l a t i v e l u m i n o u s i n t e n s i t y ( % ) f o r w a r d v o l t a g e ( v f ) - v o l t s l u m i n o u s i n t e n s i t y v s . f o r w a r d c u r r e n t 2 0 30 40 50 2.8 3.2 3.6 4.0 4.4 reliabilitytestitemsandconditions thereliabilityofproductsshallbesatisfiedw ithitemslistedbelow. confidencelevel:90% ltpd:10% no. items testcondition test hours/cycles sample size ac/rc 1 reflow temp:240 5 min:5sec 6min 22pcs 0/1 2 temperaturecycle h:+100 15min. 5min l:40 15min 300cycles 22pcs 0/1 3 thermalshock h:+100 5min. 10sec. l:10 5min 300cycles 22pcs 0/1 4 high temperature storage temp:100 1000hrs. 22pcs 0/1 5 lowtemperaturestorage temp:55 1000hrs. 22pcs 0/1 6 dcoperatinglife if=20ma 1000hrs. 22pcs 0/1 7 high temperature/high humidity 85 /r,h80% 1000hrs. 22pcs 0/1 (1)gap&algainp568/green (1)
smd time temperature over 120 sec 140-160c 230c temperature profile (lead solder) 4c/sec max 8sec max above 200c 60sec.max 60sec.max above 220c 5sec max 4c/sec max temperature profile (lead solder) 260c 180-200c over 120 sec temperature time 4c/sec max 4c/sec max smtreflowsolderinginstuctions smtreflowsolderinginstuctions smtreflowsolderinginstuctions smtreflowsolderinginstuctions numberofreflowprocessshallbelessthan2times andcooling processtonormaltemperatureisrequiredbetweenf irstandsecondsolderingprocess recommendedsolderingpattern(units:mm)
smd unit:mm sb sb l1 w1 desiccant antistatic bag zip-lock desiccant spec. spec. spec. 203.0. 198.0 p a r t n o . q ' t y ( p c s ) b ox dimension(cm):30 * 19* 11.5 10 reels per box c/no g . w n . w m e a s : 3 8 * 3 1 * 3 8 c m k g s k g s c arton dimension(cm):39*32*38 6boxs/carton 0603b/0603/0805: 4000pcs*10reels*6boxs 0805b/1206b/ 1206 1210 /1204: 3000pcs*10reels*6boxs* 3528:2000pcs*10reels*6boxs 5050:1000pcs*8reels*6boxs packingandshippingspec. packingandshippingspec. packingandshippingspec. packingandshippingspec.
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