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revisions ltr description date (yr - mo - da) approved rev sheet rev sheet 15 16 17 18 rev status rev of shee ts sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by phu h. nguyen defense supply center columbus standard microcircuit drawing checked by phu h. nguyen columbus, ohio 43216 http://www.dscc.dla.mil this drawing is available for use by all departments approved by thomas m. hess and agencies of the department of defense drawing approval date 01 - 08 - 08 microcircuit, digital, asic, multi channels ieee 1355 communication controller, monolithic silicon amsc n/a revision level size a cage code 67268 5962 - 01a17 sheet 1 of 18 dscc form 2233 apr 97 5962 - e485 - 01 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 2 dscc form 223 4 apr 97 1. scope 1.1 scope . this drawing documents two p roduct assurance class levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). when availa ble, a choice of radiation hardness assurance (rha) levels are reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 - 01a17 01 q x c federal stock c lass designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \ / drawing num ber 1.2.1 rha designator . device classes q and v rha marked devices meet the mil - prf - 38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil - prf - 38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash ( - ) indicates a non - rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 tss901e scal eable multi channels subsystems smcs332 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation m vendor sel f - certification to the requirements for mil - std - 883 compliant, non - jan class level b microcircuits in accordance with mil - prf - 38535, appendix a q or v certification and qualification to mil - prf - 38535 1.2.4 case outline(s) . the case outline(s) are as d esignated in mil - std - 1835, and as follows: outline letter descriptive designator terminals package style x see figure 1 196 flat pack gull wing leads 1.2.5 lead finish . the lead finish is as specified in mil - prf - 38535 for device classes q a nd v or mil - prf - 38535, appendix a for device class m.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 3 dscc form 223 4 apr 97 1.3 absolute maximum ratings . 1 / 2 / supply voltage range (v dd ) ................................ ............................ - 0.5 v to 7.0 v input voltage range (v in ) ................................ ............................... - 0.5 v to v dd +0.5 v 3 / input current (i in ) signal pin ................................ ................................ ........... - 10.0 ma to 10.0 ma power pin ................................ ................................ .......... - 50.0 ma to 50.0 ma output short circuit current 4 / v out = v dd ................................ ................................ ........ 110 ma v out = v ss ................................ ................................ ....... - 90 ma lead temperature (soldering, 10 sec) ................................ ............. +300 o c storage temperature range ................................ ............................ - 65 o c to +150 o c maximum junction temperature (t j ) ................................ ............... +175 o c 1.4 recommended operating conditions . supply voltage range (v dd ) ................................ ............................. 4.5 v to 5.5 v case temperature (t c ) ................................ ................................ .... - 55 o c to 125 o c 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbook s form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those listed in the issue of the department of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solicitation. specification department of defense mil - prf - 38535 - integrated circuits, manufacturing, general specification for. standards department of defense mil - std - 883 - test method standard microcircuits. mil - std - 1835 - interface standard electronic component case outlines. handbooks department of defense mil - hdbk - 103 - list of standard microcircuit drawings. mil - hdbk - 780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specifica tion, standards, and handbooks are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111 - 5094.) 1 / stresses above the absolute maximum rating may cause permanent damage to the device. e xtended operation at the maximum levels may degrade performance and affect reliability. 2 / all voltages referenced to ground unless otherwise specified. 3 / v dd + 0.5 v shall not exceed 7.0 v 4 / the maximum output current of any single output in a short ed condition for a maximum duration of 1 second. 5 / duration 10 second maximum at a distance not less than 1.6 mm
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 4 dscc form 223 4 apr 97 2.2 non government publications . the following document(s) form a part of this document to the extent specified herin. unless otherwise sp ecified, the issues of the documents(s) which are dod adopted are those listed in the dodiss cited in the solicitation institute of electrical and electronics engineers (ieee) ieee standard 1355 - ieee standard for heterogeneous interconnect (hic) (low - cost, low latency scalable serial interconnect for parallel system construction) (applications for copies should be addressed to the institute of electrical and electronic engineers, 445 hoes lane, piscataway, nj 08854 - 4150 2.3 order of precedence . i n the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtai ned. 3. requirements 3.1 item requirements . the individual item requirements for device classes q, and v shall be in accordance with mil - prf - 38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. the individual item requirements for device class m shall be in accordance with mil - prf - 38535, appendix a for non - jan class level b devices and as spec ified herein. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil - prf - 38535 and herein for device classes q and v or mil - prf - 38535, appendix a and herein for device class m. 3.2.1 case outline(s) . the case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 2. 3.2.3 truth table . the truth table shall test patterns defined and controlled in atmel nantes device - spec. tss901e which have been developed from customer provided vectors and simulations specific to this device. 3.2.4 block diagram . the block diagram shall be as specified on figure 3. 3.3 electrical performan ce characteristics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table i and shall apply over the full case operating temperatur e range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's pin may also be marked as listed in mil - hdbk - 103. for packages where marking of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962 - " on the device. for rha product using this option, the rha designator shall still be marked. marking for device classes q, and v shall be in accordance with mil - prf - 38535. marking for device class m shall be in accordance with mil - prf - 38535, appendix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil - prf - 38535. the compliance mark for device class m shall be a "c" as required in mil - prf - 38535, appendix a. 3.6 certificate of co mpliance . for device classes q and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). for device class m, a certificate of compliance shall be re quired from a manufacturer in order to be listed as an approved source of supply in mil - hdbk - 103 (see 6.6.2 herein). the certificate of compliance submitted to dscc - va prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes q and v, the requirements of mil - prf - 38535 and herein or for device class m, the requirements of mil - prf - 38535, appendix a and herein.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 5 dscc form 223 4 apr 97 3.7 certificate of conformance . a certificate of conformance as requ ired for device classes q and v in mil - prf - 38535 or for device class m in mil - prf - 38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m . for device class m, notificatio n to dscc - va of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in mil - prf - 38535. 3.9 verification and review for device class m . for device class m, dscc, dscc's agent, and the acquiri ng activity retain the option to review the manufacturer's facility and applicable required documentation. offshore documentation shall be made available onshore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . devi ce classes m devices covered by this drawing shall be in microcircuit group number 123 (see mil - prf - 38535, appendix a).
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 6 dscc form 223 4 apr 97 table i. electrical performance characteristics . test symbol group a subgroups limits units conditions - 55 c t c 125 c v dd = 5.0 v 10% unless othe rwise specified min. max. input clamp voltage to gnd 1 / v ic i oh = - 300 m a 1,2,3 - 1.2 - 0.2 v low level input current 2 / i il v in = gnd, v dd = 5.5 v 1,2,3 - 10 m a low level input current, pull - up 2/ i ilpu v in = gnd, v dd = 5.5 v 1,2,3 - 250 m a low level input current, pull - down 2/ i ilpd v in = gnd, v dd = 5.5 v 1,2,3 - 10 m a high level input current 2/ i ih v in = v dd = 5.5 v 1,2,3 10 m a high level input current, pull - up 2/ i ihpu v in = v dd = 5.5 v 1,2,3 10 m a high level input current, pull - down 2/ i ihpd v in = v dd = 5.5 v 1,2,3 450 m a output leakage low current 2 / i ozl outputs disabled, v out = v dd 1,2,3 - 10 m a output leakage high current, pull - down output 2 / i ozhpd outputs disa bled, v out = v dd 1,2,3 450 m a output leakage low current, pull - up output 2 / i ozlpu outputs disabled, v out = v dd 1,2,3 250 m a output leakage high current 2 / i ozh outputs disabled, v out = v dd 1,2,3 10 m a low level output voltage, buf 2 / v ol1 v dd = 5.5 v, i ol = 3 ma 1,2,3 0.4 v low level output voltage, buf 2 / v ol2 v dd = 5.5 v, i ol = 6 ma 1,2,3 0.4 v low level output voltage, buf 2 / v ol3 v dd = 5.5 v, i ol = 12 ma 1,2,3 0.4 v high level output voltage, buf 2 / v oh1 v dd = 4.5 v, i ol = - 3 ma 1,2,3 3.9 v high level output voltage, buf 2 / v oh2 v dd = 4.5 v, i ol = - 6 ma 1,2,3 3.9 v high level output voltage, buf 2 / v oh3 v dd = 4.5 v, i ol = - 12 ma 1,2,3 3.9 v schmitt trigger positive threshold 3 / cmos in put ttl input v t+ 1,2,3 2.2 1.4 v schmitt trigger negative threshold 3 / cmos input ttl input v t - 1,2,3 0.9 0.9 v low level input voltage 1 / v il functional verification 1,2,3 0.8 v high level input voltage 1 / v ih functional verification 1,2,3 2.2 v input capacitance 3 / c i v dd = 0 v 4 15 pf output capacitance 3 / c io v dd = 0 v 4 15 pf see notes at end of table.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 7 dscc form 223 4 apr 97 table i. electrical performance characteristics - continued. test symbol group a subgroups limits units cond itions - 55 c t c 125 c v dd = 5.0 v 10% unless otherwise specified min. max. supply current standby for array 2 / i ddsba v dd = 5.5 v, static mode output = 0 ma 1,2,3 100 m a supply current standby oper ating for array 2 / i ddopa v dd = 5.5 v, f = 10 mhz output = 0 ma 1,2,3 20 ma supply current standby operating for buffers 2 / i ddopb v dd = 5.5 v,f = 10 mhz output = 0 ma 1,2,3 20 ma propagation delay clk / to hack / d t1 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation delay clk \ to hintr \ d t2 v dd = 4.5 v, v dd = 5.5 v 9,10,11 49 ns propagation delay clk \ to hdata0 / d t3 v dd = 4.5 v, v dd = 5.5 v 9,10,11 45 ns propagation delay clk \ to hdata7 / d t4 v dd = 4.5 v, v dd = 5.5 v 9,10,11 45 ns propagation delay clk / to cpur \ d t5 v dd = 4.5 v, v dd = 5.5 v 9,10,11 35 ns propagation delay clk / to coco / d t6 v dd = 4.5 v, v dd = 5.5 v 9,10,11 40 ns p ropagation delay clk / to cmcs0 \ d t7 v dd = 4.5 v, v dd = 5.5 v 9,10,11 22 ns propagation delay clk/ to cmadr0 / d t8 v dd = 4.5 v, v dd = 5.5 v 9,10,11 28 ns propagation delay clk / to cmdata0 / d t9 v dd = 4.5 v, v dd = 5.5 v 9,10,11 46 ns propagation delay clk10 / to ido1 / d t10 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation delay clk10 / to iso1 \ d t11 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation delay clk10 / to ido2 / d t12 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation delay clk10 / to iso2 / d t13 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation delay clk10 / to ido3 / d t14 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns propagation d elay clk10 / to iso3 \ d t15 v dd = 4.5 v, v dd = 5.5 v 9,10,11 27 ns 1 / forcing conditions of the functional test, assure that these limits are met, but they will not be recorded. 2 / read and record measurements in accordance with mil - prf - 3 8535. 3 / tested at initial design and after major process changes, otherwise guaranteed.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 8 dscc form 223 4 apr 97 case x figure 1. case outline
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 9 dscc form 223 4 apr 97 pin number pin type pin name output load wired to comment vss pll_xxxvee1 analog power suppl y 1 vdd pll_xxxvcchf digital power supply 2 vss pll_xxxveehf digital power supply 3 i / pd byppll v cc 4 i / pu clk s1 5 i reset v cc 6 i / pu clk10 s1 7 i / pd hostbige s5 8 i / pu tck s1 9 i / pu tms v cc 10 i / pu tdi v cc 11 i / pd trst gnd 12 o/z tdo r 13 vdb vccb0 v cc 14 vsb vssb0 gnd 15 i / pu hsel s3 16 i / pu hrd s3 17 i / pu hwr v cc 18 o/z hack r 19 o/z hintr r 20 vda vcca0 v cc 21 vsa vssa0 gnd 22 i / pu hadr0 s4 23 i / pu hadr1 s5 24 i / pu hadr s6 25 i / pu hadr3 s7 26 i / pu hadr4 s8 27 i / pu hadr5 s9 28 i / pu hadr6 s10 29 i / pu hadr7 s10 30 vda vcca1 v cc 31 vsa vssa1 gnd 32 i / pu bootlink gnd 33 i / pu smcsadr0 s10 34 i / pu smcsadr1 s10 35 i / pu smcsadr s10 36 i / pu smcsadr3 s10 37 i / pu smcsid0 s10 38 i / pu smcsid1 s10 39 i / pu smcsid2 s10 figure 2. terminal connections and electrical circuit for power burn - in .
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 10 dscc form 223 4 apr 97 pin number pin type pin name output load wired to commen t 40 i / pu smcsid3 s10 41 vdb vccb1 v cc 42 vsb vssb1 gnd 43 i/o / pu hdata0 r 44 i/o / pu hdata1 r 45 i/o / pu hdata2 r 46 i/o / pu hdata3 r 47 i/o / pu hdata4 r 48 i/o / pu hdata5 r 49 i/o / pu hdata6 r 50 vdb vccb2 v cc 51 vsb vssb2 gnd 52 i/o / pu hdata7 r 53 i/o / pu hdata8 r 54 i/o / pu hdata9 r 55 i/o / pu hdata10 r 56 i/o / pu hdata11 r 57 vdb vccb3 v cc 58 vsb vssb3 gnd 59 i/o / pu hdata12 r 60 i/o / pu hdata13 r 61 i/o / pu hdata14 r 62 i/o / pu hdata15 r 63 i/o / pu hdata16 r 64 i/o / pu hdata17 r 65 vdb vccb4 v cc 66 vsb vssb4 gnd 67 i/o / pu hdata18 r 68 i/o / pu hdata19 r 69 i/o / pu hdata20 r 70 i/o / pu hdata21 r 71 i/o / pu hdata22 r 72 i/o / pu hda ta23 r 73 vdb vccb5 v cc 74 vsb vssb5 gnd 75 i/o / pu hdata24 r 76 i/o / pu hdata25 r 77 i/o / pu hdata26 r 78 vda vcca2 v cc 79 vsa vssa2 gnd
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 11 dscc form 223 4 apr 97 figure 2. terminal connections and electrical circuit for power burn - in ? continued.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 12 dscc form 223 4 apr 97 pi n number pin type pin name output load wired to comment 80 i/o / pu hdata27 r 81 i/o / pu hdata28 r 82 i/o / pu hdata29 r 83 vdb vvcb6 v cc 84 vsb vssb6 gnd 85 i/o / pu hdata30 r 86 i/o / pu hdata31 r 87 o/z cpur r 88 o/z ses0 r 89 o/z ses1 r 90 o/z ses2 r 91 o/z ses3 r 92 i / pu cam v cc 93 i / pu coci gnd 94 o/z coco r 95 o/z cmcs0 r 96 o/z cmcs1 r 97 vdb vccb7 v cc 98 vsb vssb7 gnd 99 o/z cmrd r 100 o/z cmwr r 101 o/z cmadr0 r 102 o/z cmadr1 r 103 o/z cmadr2 r 104 o/z cmadr3 r 105 o/z cmadr4 r 106 vdb vccb8 v cc 107 vsb vssb8 gnd 108 o/z cmadr5 r 109 o/z cmadr6 r 110 o/z cmadr7 r 111 o/z cmadr8 r 112 o/z cmadr9 r 113 o/z cmadr10 r 114 o/z cmadr11 r 115 vd b vccb9 v cc 116 vsb vssb9 gnd 117 o/z cmadr12 r 118 o/z cmadr13 r 119 o/z cmadr14 r figure 2. terminal connections and electrical circuit for power burn - in ? continued.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 13 dscc form 223 4 apr 97 pin number pin type pin name output load wired to comment 120 o/z c madr15 r 121 i/o / pu cmdata0 r 122 i/o / pu cmdata1 r 123 i/o / pu cmdata2 r 124 vdb vccb10 v cc 125 vsb vssb10 gnd 126 i/o / pu cmdata3 r 127 i/o / pu cmdata4 r 128 i/o / pu cmdata5 r 129 vda vcca3 v cc 130 vsa vssa3 gnd 13 1 i/o / pu cmdata6 r 132 i/o / pu cmdata7 r 133 i/o / pu cmdata8 r 134 vdb vccb11 v cc 135 vsb vssb11 gnd 136 i/o / pu cmdata9 r 137 i/o / pu cmdata10 r 138 i/o / pu cmdata11 r 139 i/o / pu cmdata12 r 140 i/o / pu cmdata13 r 14 1 i/o / pu cmdata14 r 142 vdb vdb v cc 143 vsb vsb gnd 144 i/o / pu cmdata15 r 145 i/o / pu cmdata16 r 146 i/o / pu cmdata17 r 147 i/o / pu cmdata18 r 148 i/o / pu cmdata19 r 149 i/o / pu cmdata20 r 150 vdb vccb13 v cc 151 vsb v ssb13 gnd 152 i/o / pu cmdata21 r 153 i/o / pu cmdata22 r 154 i/o / pu cmdata23 r 155 vda vcca4 v cc 156 vsa vssa4 gnd 157 i/o / pu cmdata24 r 158 i/o / pu cmdata25 r 159 i/o / pu cmdata26 r
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 14 dscc form 223 4 apr 97 figure 2. terminal connections and el ectrical circuit for power burn - in ? continued.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 15 dscc form 223 4 apr 97 pin number pin type pin name output load wired to comment 160 vdb vccb14 v cc 161 vsb vssb14 gnd 162 i/o / pu cmdata27 r 163 i/o / pu cmdata28 r 164 i/o / pu cmdata29 r 165 i/o / pu cmdata30 r 166 i/o / pu cmdata31 r 167 i / pd scande gnd 168 i scnclk gnd 169 170 i / pd scan_set gnd 171 i / pd scance gnd 172 vdb vdb v cc 173 vsb vsb gnd 174 vsb vsb gnd 175 o/z len1 r 176 i / pd ldi1 s1 177 i / pd lsi1 s2 178 o/z ldo1 r 179 o/z lso1 r 180 i / pd ldi2 s1 181 i / pd lsi2 s2 182 o/z len2 r 183 vdb vccbq1 v cc 184 vdb vccbq2 v cc 185 vdb vccbn2 v cc 186 o/z ldo2 r 187 o/z lso2 r 188 i / pd ldi3 s1 189 i / pd lsi3 s2 190 o/z ld o3 r 191 o/z lso3 r 192 o/z len3 r 193 vsb vssbq2 gnd 194 vss pll_xxxvee2 analog power supply 195 vdd pll_xxxvcc analog power supply 196 pll_xxxoutf external filter connection figure 2. terminal connections and electrical circuit f or power burn - in ? continued.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 16 dscc form 223 4 apr 97 figure 3. block diagram .
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 17 dscc form 223 4 apr 97 4. quality assurance provisions 4.1 sampling and inspection . for device classes q, and v, sampling and inspection procedures shall be in accordance with mi l - prf - 38535 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. for device class m, sampling and inspection procedures shall be in acco rdance with mil - prf - 38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil - prf - 38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. for device class m, screening shall be in accordance with method 5004 of mil - std - 883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 additional criteria for device class m . a. burn - in test, method 1015 of mil - std - 883. ( 1) test condition a, b, c, d or e. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) t a = +125 c, minimum. b. interim and final electrical test parameters shall be as specified in table ii herein. 4.2.2 additional criteria for device classes q and v . a. the burn - in test duration, test condition and test temperature, or approved alternativ es shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the burn - in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance wit h mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mil - std - 883. b. interim and final electrical test parameters shall be as specified in table ii herein. c. additional screening for device class v beyond the requirements of device class q shall be as specified in mil - prf - 38535 appendix b. 4.3 qualifi cation inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil - prf - 38535. inspections to be performed shall be those specified in mil - prf - 38535 and herein for groups a, b, c, d, and e ins pections (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil - prf - 38535 including groups a, b, c, d, and e inspections and as specified herein. quality conformance inspection for device class m shall be in accordance with mil - prf - 38535, appendix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mil - std - 883 and herein for groups a, b, c, d, and e insp ections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . a. tests shall be as specified in table ii herein. b. for device class m, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. for device classes q and v, su bgroups 7 and 8 shall include verifying the functionality of the device. 4.4.2 group c inspection . the group c inspection end - point electrical parameters shall be as specified in table ii herein.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 18 dscc form 223 4 apr 97 table ii. electrical test requirements . test requirem ents subgroups (in accordance with mil - std - 883, method 5005, table i) subgroups (in accordance with mil - prf - 38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) 1,7,9 1,7,9 1,7,9 final electrical parameters (see 4.2) 1,2,3,7,8,9,10,11 1 / 1,2,3,7,8,9, 10,11 1 / 3 / 1,2,3,7,8,9, 10,11 2 / 3 / group a test requirements (see 4.4) 1,2,3,4,7,8,9,10,11 1,2,3,4,7,8, 9,10,11 3 / 1,2,3,4,7,8 , 9,10,11 3 / group c end point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 group d end point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 group e end point electrical parameters (see 4.4) 1,7,9 1,7,9 1,7,9 1 / pda app lies to subgroup 1. 2 / pda applies to subgroups 1 and 7. 3 / delta limits are as specified in table iib herein and shall be required where specified in table i. table iib. delta limits parameter 1 / symbol test method test conditions change limits u nit low level input current 2 / i il as per table i 0.1 m a high level input current 2 / i ih 0.1 m a output leakage low current 2 / i ozl 0.1 m a output leakage high current 2 / i ozh 0.1 m a supply current stand - by for array i ddsba as per tabl e i 10 m a low level output voltage buf2 v ol1 100 mv low level output voltage buf4 v ol2 100 mv high level output voltage buf2 v oh1 100 mv high level output voltage buf4 v oh2 100 mv 1 / the parameters shall be recorded before and after the required burn - in and life test to determine the delta limits. 2 / only for inputs and i/o without pull up or pull down.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 19 dscc form 223 4 apr 97 4.4.2.1 additional criteria for device class m . steady - state life test conditions, method 1005 of mil - std - 883: a. test condition a , b, c, d, or e. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil - std - 883. b. t a = +125c, minimum. c. test duration: 1,000 hours, except as permitted by method 1005 of mil - std - 883. 4.4.2.2 additional criteria for device classes q and v . the steady - state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the test circuit shall be maintained u nder document revision level control by the device manufacturer's trb in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power di ssipation, as applicable, in accordance with the intent specified in test method 1005 of mil - std - 883. 4.4.3 group d inspection . the group d inspection end - point electrical parameters shall be as specified in table ii herein. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end - point electrical parameters shall be as specified in table ii herein. b. for device classes q and v, the devices or test vehicl e shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535, appendix a for the rha level being tested. all device classes must meet the postirradiation end - point electrical parameter limits as defined in table i at t a = +25 o c 5 o c, after exposure, to the subgroups specified in table ii herein. c. when specified in the purchase ord er or contract, a copy of the rha delta limits shall be supplied. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil - prf - 38535 for device classes q and v or mil - prf - 38535, appendix a for device clas s m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor - prepared specification or drawing. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual docu ments. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users shall inform defense supply center columbus when a system application requires configuration control and w hich smd's are applicable to that system. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc - va, telephone (614) 692 - 0544. 6.4 comments . comments on this drawing should be directed to dscc - va, columbus, ohio 43216 - 5000, or telephone (614) 692 - 0547. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil - prf - 38535 and mil - hdbk - 1331.
standard microcircuit drawing size a 5962 - 01a17 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 20 dscc form 223 4 apr 97 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in qml - 38535. the vendors listed in qml - 38535 have submit ted a certificate of compliance (see 3.6 herein) to dscc - va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . approved sources of supply for class m are listed in mil - hdbk - 103. the vendors listed in mil - hdbk - 103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by dscc. .
standard microcircuit drawing bulletin date: 01 - 08 - 08 approved sources of supply for smd 5962 - 01a17 are listed below for immed iate acquisition information only and shall be added to mil - hdbk - 103 and qml - 38535 during the next revision. mil - hdbk - 103 and qml - 38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing a nd a certificate of compliance has been submitted to and accepted by dscc - va. this bulletin is superseded by the next dated revision of mil - hdbk - 103 and qml - 38535. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962 - 01 a1701qxc f7400 tss901eamq 5962 - 01a1701vxc f7400 tss901easv 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contac t the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address f7400 atmel nantes s.a. part of atmel wireless & microcontrollers la chantrerie bp 70602 44306 nantes cedex 3 france the information contained herein is disseminated for convenience only and the government assumes no lia bility whatsoever for any inaccuracies in the information bulletin.

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