low noise gallium arsenide fet reliability data description the following cumulative test results have been obtained from testing performed at hewlett- packard in accordance with the atf-10xxx ATF-13XXX latest revision of mil-std-883. data was gathered from the product qualification, reliability monitor, and engineering evalua- tion for the lyg gaas process. for the purpose of this reliability data sheet, a failure is any part which fails to meet the electrical and/or mechanical specification listed in the communications components designer's catalog. units total total failure rate test name test condition tested device hrs. failed (%/1k hours) high temperature nominal bias at 150 15,000 0 0 operating life t ch = 175 c, 1000 hrs. (o.l.) high temperature ambient temperature 225 225,000 0 0 storage (hts)* t a = 150 c, 1000 hrs. 1. life test a. demonstrated performance point (1) 90% confidence level (2) junction temp. mttf* mttf mttf t j ( c) (hours) fit (3) (hours) fit (3) 175 3 x 10 -6 333 0.5 x 10 -6 2000 150 2 x 10 -7 50 9.5 x 10 -8 105 100 2 x 10 -9 .05 9.5 x 10 -8 1.05 47 8 x 10 -11 .001 3.5 x 10 -11 .0003 *mttf data calculated from high temperature operating life tests. b. failure rate prediction the failure rate will depend on the junction temperature of the device. the estimated life at different temperatures is calcu- lated, using the arrhenius plot with activation energy of 1.2ev, and the device thermal resistance of the stress board is 130 c/w, and listed in the following table.
www.hp.com/go/rf for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 ? far east/australasia: call your local hp sales office. ? japan: (81 3) 3335-8152 europe: call your local hp sales office. ? data subject to change. ? copyright ? 1998 hewlett-packard co. ? obsoletes 5966-0233e printed in u.s.a. 5966-2942e (3/98) c. example of failure rate calculation: at 100 c with a device operating 8 hours a day, 5 days a week, the percent utilization is: % utilization = (8 hrs/day x 5 days/wk) ? 168 hrs/wk = 25% then the point failure rate per year is: (5 x 10 -10 ) x (25%) x (8760 hrs/yr) = 1.1 x 10 -6 % per year likewise, the 90% confidence level failure rate per year is: (1.0 x 10 -9 /hr) x (25%) x (8760 hrs/yr) = 2.2 x 10 -6 % per year mil-std-883 units units test name reference test conditions tested failed thermal shock 1011 -65/150 c, 100 cycles 368 0 temperature cycle 1010 -65 to 150 c, 100 cycles 368 0 moisture resistance +121 c, 100% rh, 96 hrs 290 0 mechanical shock* 2002 1500 gs, 0.5 msec. pulse 135 0 acceleration* 2001 20,000 gs, 1 min. all axis 135 0 solderability 2003 245 c, 5 seconds dwell 245 0 * applicable to ceramic packages only 2. environmental tests notes: 1. the point mttf is simply the total device hours divided by the number of failures. 2. the mttf and failure rate represent the performance level for which there is a 90% probability of the device doing better than the stated value. the confidence level is based on the statistics of failure distribution. the assumed distribution is exponential. this particular distribution is commonly used in describing useful life failures. 3. fit is defined as failure in time, or specifically, failures per billion hours. the relationship between mttf and fit is as follows: fit = 10 9 /(mttf). 400 350 300 250 200 150 100 50 25 t j ? junction temperature, c 10 3 10 4 10 5 10 6 10 7 10 8 10 9 mttf ?mean time to failure (hrs.) e a = 1.2 ev
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