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d a t a sh eet product speci?cation supersedes data of march 1992 file under integrated circuits, ic01 1996 sep 02 integrated circuits TDA1591 pll stereo decoder and noise blanker
1996 sep 02 2 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 features adjustment-free voltage controlled pll oscillator for ceramic resonator (f = 456 khz) pilot signal dependent mono/stereo switching analog control of mono/stereo change over [stereo blend, stereo noise controller (snc)] adjacent channel noise suppression (114 khz) pilot canceller analog control of de-emphasis; high cut control (hcc) applicable as source selector for am/fm/cassette switching separate interference noise detector integrated input low-pass filter for delayed noise blanking noise blanking at mpx-demodulator outputs internal voltage stabilization. general description the TDA1591 is a monolithic bipolar integrated circuit providing the stereo decoder function and noise blanking for fm car radio applications. the device operates in a power supply range of 7.5 to 12 v. quick reference data ordering information symbol parameter min. typ. max. unit v p supply voltage (pin 5) 7.5 10 12 v i p supply current - 12 - ma v o(rms) audio output signal (rms value) - 900 - mv thd total harmonic distortion - 0.1 0.3 % s/n signal-to-noise ratio - 76 - db a cs channel separation - 40 - db v trigg interference voltage trigger level - 10 - mv type number package name description version TDA1591 dip20 plastic dual in-line package; 20 leads (300 mil) sot146-1 TDA1591t so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1
1996 sep 02 3 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 block diagram handbook, full pagewidth stereo indication snc hcc v i mpx 68 k w 82 k w 0.1 f 68 pf c comp 470 k w 0.1 f 10 k w v ref = 1 to 5 v from pin 5 27 k w 27 k w from if level detector 100 k w 100 k w 12 3 4567 8 9 10 11 12 13 14 15 16 20 19 18 17 + + + + 6.8 nf 6.8 nf 47 k w 0.22 f 0.22 f v 0.22 f 47 k w 47 k w 47 k w 0.22 f mute on vco off 6.5 k w 6.5 k w pilot detector switch stereo blend 4-pole filter (80 khz) pilot cancel 2-pole filter (30 khz) gate and hcc phase detector logic interference detector pulse former vco voltage stabilizer reference current noise detector 470 pf 2.2 k w 470 pf 1.2 nf 0.1 f 100 k w csb456f11 (murata) 22 nf 0.22 f 27 k w v p = 10 v infi interference signal (tda1596, pin 3) 19 khz TDA1591 r1 75 k w forced mono 7.4 k w 7.4 k w 47 nf ident 38 khz 100 f fb-r r2 r3 fb-l 10 w (1) meh027 iaux v ol v or v iaux pilot 12 k w fig.1 block diagram with external components, also used as test circuit. (1) simulates the roll-off of the fm demodulator.
1996 sep 02 4 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 pinning symbol pin description pll 1 phase locked loop ?lter osc 2 oscillator input/output pin for ceramic resonator gnd 3 ground (0 v) i ref 4 reference current v p 5 supply voltage (+10 v) infi 6 interference signal input pufo 7 pulse former time constant; vco off ndet 8 noise detector time constant; mute on fb-l 9 af feedback input for left audio signal v ol 10 af output signal left v or 11 af output signal right fb-r 12 af feedback input for right audio signal c deel 13 de-emphasis capacitor for left channel c deer 14 de-emphasis capacitor for right channel hcc 15 hcc input for de-emphasis control snc 16 stereo blend input v ref 17 externally applied reference voltage of 1 to 5 v ident 18 identi?cation output (high = pilot existing; stereo) pilot 19 pilot detector level (forced mono input) v i mpx 20 mpx input signal from if demodulator fig.2 pin configuration. handbook, halfpage TDA1591 mha363 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 pll osc gnd infi pufo ndet fb-l v ol i ref v p v i mpx v or c deel c deer hcc snc ident pilot v ref fb-r
1996 sep 02 5 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 functional description adapting the mpx input to the level of the fm demodulator output is realized by the value of input resistor r1 (see fig.3). the total gain of the stereo decoder is applicable by varying the feedback resistors r2 and r3 (see figs 1 and 4). in mute position and the vco switched off (pin 7), the output amplifiers can be used for cassette playback, am stereo purpose or other signal sources. the stereo noise controller (snc) provides a smooth mono to stereo take-over (see fig.5). for high cut control (hcc), the de-emphasis time constant can be changed to higher values (see figs 7 and 8). this function is controlled by an analog input signal. the noise blanking facility is achieved by gating the stereo decoder output signal. the interference detector generates a gating pulse preferable forced by the level detector voltage of the if part. limiting values in accordance with the absolute maximum rating system (iec 134). note 1. equivalent to discharging a 200 pf capacitor through a 0 w series resistor. symbol parameter min. max. unit v p supply voltage (pin 5) 0 13.2 v p tot total power dissipation 0 0.25 w t stg storage temperature - 55 +150 c t amb operating ambient temperature - 40 +85 c v es electrostatic handling; note 1 pins 1 and 16 - 400 +400 v pin 5 - 300 +300 v all other pins - 600 +600 v
1996 sep 02 6 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 characteristics v p = 10 v; t amb =25 c; input signal v i mpx(p-p) = 1.7 v; m = 100% ( d f= 75 khz, f mod = 1 khz); de-emphasis of 50 m s and series resistor at input r1 = 150 k w ; measurements taken in fig.1; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supply v p supply voltage (pin 5) 7.5 10 12 v i p supply current - 12 - ma stereo decoder v i mpx(p-p) mpx input signal on pin 20 (peak-to-peak value) - 1.7 - v d v i mpx(p-p) overdrive margin of mpx input signal thd = 1% 3 -- db v o(rms) af mono output signal at pins 10 and 11 (rms value) without pilot - 900 - mv d v o overdrive margin of output signal thd = 1% 3 -- db v 10-11 /v o difference of output voltage levels -- 1db v o 10,11 dc output voltage (pins 10 and 11) 3.3 3.8 4.3 v r o 10,11 output resistance - 130 -w a cs channel separation pin 16 open-circuit; see fig.6 - 40 - db thd total harmonic distortion - 0.1 0.3 % s/n signal-to-noise ratio f = 20 to 16000 hz - 76 - db a 19 pilot signal suppression f = 19 khz - 50 - db a 38 subcarrier suppression f = 38 khz - 50 - db a 57 f = 57 khz - 46 - db a 76 f = 76 khz - 60 - db im2 intermodulation for f spur = 1 khz f mod = 10 khz; note 1 - 60 - db im3 f mod = 13 khz; note 1 - 58 - db a 57 ari traf?c radio (ari) f = 57 khz; note 2 - 70 - db a 67 subsidiary communication authorization (sca) f = 67 khz; note 3 70 -- db a 114 adjacent channel interference (aci) f = 114 khz; note 4 - 80 - db a 190 f = 190 khz; note 4 - 70 - db psrr power supply ripple rejection f = 100 hz; v ripple(rms) = 100 mv - 35 - db vco (pin 2) f osc oscillator frequency (ceramic resonator) - 456 - khz frequency range of free running oscillator 452 - 460 khz d f/f capture and holding range - 1 - % v 7 vco- off voltage (pin 7) 0 - 0.6 v
1996 sep 02 7 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 mono/stereo control (pins 16, 17 and 19) v i pilot(rms) pilot threshold voltage for automatic switching by pilot input voltage (rms value) stereo on - 24 30 mv stereo off 820 - mv hys hysteresis of pilot threshold voltage - 2 - db v 19 switching voltage for external mono control (pin 19) 0 - 1v v ref reference input voltage range (pin 17) 1 - 5v v 16-17 control voltage for channel separation due to pin 17 (v ref ) a cs = 6 db; see fig.5 -- 85 - mv a cs = 26 db; see fig.5 -- 32 - mv pilot indicator logic level output (pin 18) v 18 low voltage i 18 = - 200 m a - 250 400 mv i 18 high current v 18 =10v -- 1 m a muting (pin 8) mute att mute attenuation (pin 8) v 8 < 0.4 v - 80 - db v 8 >4v -- 0.2 db v o(offset) dc offset voltage (pins 10 and 11) after muting -- 400 mv hcc (pin 15) cr deem control range of de-emphasis see figs 7 and 8 for european standard c deem = 6.8 nf 50 - 150 m s for usa standard c deem =10nf 75 - 225 m s v 15-17 control voltage (pin 15 due to pin 17) in both standards lower value cr deem - 0 - mv upper value cr deem -- 300 - mv noise interference detector v trigg trigger threshold (pin 6) f int = 120 khz v 8(dc) = 7.7 v - 10 - mv v 8(dc) = 6.7 v - 100 - mv d v 8 voltage offset as a function of v trigg v 6 trigg =10mv - 200 - mv v 6 trigg = 100 mv - 2.3 - v t sup af suppression time; pulse width - 40 -m s i 13,14 input offset current (pins 13 and 14) during af suppression time - 20 - na v pulse trigger sensitivity (pin 6) t pulse =10 m s - 10 - mv symbol parameter conditions min. typ. max. unit
1996 sep 02 8 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 notes 1. intermodulation suppression [beat frequency components (bfc)]: ; ; measured with 91% mono signal; f mod = 10 khz or 13 khz; 9% pilot signal. 2. ari suppression: measured with 91% stereo signal; f mod = 1 khz; 9% pilot signal; 5% ari subcarrier (f s = 57 khz; f mod = 23 hz; am m = 0.6). 3. subsidiary communication authorization (sca): ; measured with 81% mono signal; f mod = 1 khz; 9% pilot signal; 10% sca subcarrier (f s = 67 khz, unmodulated). 4. adjacent channel interference (aci): ; ; measured with 90% mono signal; f mod = 1 khz; 9% pilot signal; 1% spurious signal (f s = 110 khz or 186 khz, unmodulated). im2 v o(signal) at 1 khz () v o(spurious) at 1 khz () ------------------------------------------------------- - = f s 2 10 khz () 19 khz C = im3 v o(signal) at 1 khz () v o(spurious) at 1 khz () ------------------------------------------------------- - = f s 3 13 khz () 38 khz C = a 57 ari v o(signal) at 1 khz () v o(spurious) at 1 khz 23 hz () ---------------------------------------------------------------------------- - = a 67 v o(signal) at 1 khz () v o(spurious) at 9 khz () ------------------------------------------------------- - = f s 238khz () 67 khz C = a 114 v o(signal) at 1 khz () v o(spurious) at 4 khz () ------------------------------------------------------- - = f s 110 khz 3 38 khz () C = a 190 v o(signal) at 1 khz () v o(spurious) at 4 khz () ------------------------------------------------------- - = f s 186 khz 5 38 khz () C =
1996 sep 02 9 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 fig.3 input signal as a function of series input resistor r1. handbook, full pagewidth 300 r1 (k w ) 100 0 (v) 0 200 2 4 v i mpx(p-p) meh029 fig.4 overall signal gain as a function of feedback resistors r2 and r3 (r1 = 150 k w ). handbook, halfpage g (db) 0204060 r2, r3 (k w ) 0 - 2 - 4 - 6 2 4 6 meh030 fig.5 stereo blend characteristic (snc). handbook, halfpage - 200 - 100 0 control voltage v 16 - 17 (mv) 50 40 30 20 10 0 a cs (db) meh031
1996 sep 02 10 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 fig.6 channel separation as a function of audio frequency. (1) coupling capacitor c k at pin 20 = 10 m f. (2) coupling capacitor c k at pin 20 = 0.1 m f. handbook, full pagewidth (1) (2) (db) a cs 0 50 10 20 30 40 meh032 10 f oaf (hz) 10 2 10 3 10 4 10 5 handbook, full pagewidth f oaf (hz) v oaf (db) (2) (1) - 10 2 0 - 6 - 8 - 2 - 4 meh033 10 10 2 10 3 10 4 fig.7 hcc as a function of audio frequency (pin 7 connected to gnd; without pre-emphasis). (1) v 15-17 =0. (2) v 15-17 = - 300 mv.
1996 sep 02 11 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 fig.8 hcc with f mod = 10 khz. handbook, full pagewidth 0 control voltage v 15 - 17 (mv) - 200 - 300 0 - 100 - 10 - 2 d v o (db) - 4 - 6 - 8 meh034
1996 sep 02 12 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 test information fig.9 TDA1591 test board (component side). handbook, full pagewidth mha364 12 k w 47 k w 47 k w 2.2 k w 47 k w 47 k w 27 k w 10 w 27 k w 100 k w 100 k w 470 k w 10 k w 68 k w 82 k w 27 k w 100 k w 100 m f 100 nf 100 nf 220 nf 220 nf csb456f11 220 nf 470 pf 470 pf 220 nf 22 nf 1.2 nf 220 nf 100 nf 47 nf 6.8 nf 6.8 nf TDA1591 101.5 76.5 1 aux in af out af out aux in mute vco off mpx in intf in v ref snc hcc pil gnd v p mono dimensions in mm.
1996 sep 02 13 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 package outlines unit a max. 1 2 b 1 cd e e m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot146-1 92-11-17 95-05-24 a min. a max. b z max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.0 4.2 0.51 3.2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.078 0.17 0.020 0.13 sc603 m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 20 1 11 10 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) (1) dip20: plastic dual in-line package; 20 leads (300 mil) sot146-1
1996 sep 02 14 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot163-1 92-11-17 95-01-24 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013ac pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.050 1.4 0.055 0.42 0.39 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1
1996 sep 02 15 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). dip s oldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. r epairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. so r eflow soldering reflow soldering techniques are suitable for all so packages. reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several techniques exist for reflowing; for example, thermal conduction by heated belt. dwell times vary between 50 and 300 seconds depending on heating method. typical reflow temperatures range from 215 to 250 c. preheating is necessary to dry the paste and evaporate the binding agent. preheating duration: 45 minutes at 45 c. w ave soldering wave soldering techniques can be used for all so packages if the following conditions are observed: a double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. the longitudinal axis of the package footprint must be parallel to the solder flow. the package footprint must incorporate solder thieves at the downstream end. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. maximum permissible solder temperature is 260 c, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 c within 6 seconds. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. r epairing soldered joints fix the component by first soldering two diagonally- opposite end leads. use only a low voltage soldering iron (less than 24 v) applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1996 sep 02 16 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1996 sep 02 17 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 notes
1996 sep 02 18 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 notes
1996 sep 02 19 philips semiconductors product speci?cation pll stereo decoder and noise blanker TDA1591 notes
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