chip capacitor networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. i/o i/o i/o i/o no through hole 0.635 mm chip capacitor network EZANP conventional chip capacitors e 1 product code temperature characteristics capacitance value suffix for special requirement z 2 a 3 n 4 p 5 e 6 1 7 0 8 1 910 11 capacitance tolerance thick film noise suppression and filtering components 8 capacitors, common terminal type np +20 %/?5 % (?5 cto+85 c) e the first two digits are significant figures of capacitance value, and the third one denotes the number of zeroes fellow. ex. 101 100 pf 20 % in the case of 22 pf +30 % ?0 % m 6.4 mm 3.1 mm dimensions and circuit configuration m gnd gnd explanation of part numbers recommended applications digital equipment such as pcs, word processors, print ers, hdd, ppc, and pdas digital audio and video equipment such as cd, md, dat, digital cameras, digital video and digital tv communication equipment, cordless phones, automobile phones, gsm, phs, dect electronic musical instruments, and other digital devices fe atures chip capacitor networks, exclusively developed by panasonic using thick ? lm technology. 8 capacitors bussed in one package (6.4 mm 3.1 mm 0.75 mm, 1.27 mm pitch), halfpitch (0.635 mm) spacing for high density automatic placing excellent noise reduction by connecting both ground terminals and a simple layout pattern (less through hole) excellent mountability using concave terminals, ? rm solder joint (2 times that of convex terminal), self-aligning placement during re? ow soldering chip capacitor networks t ype: EZANP feb. 2006
chip capacitor networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. electrode (outer) protective coating alumina substrate pioi gnd electrode (outer) gnd electrode (outer) gnd gnd 6 1 10 9 8 7 2345 0 10 20 30 40 50 1m 10m 100m 1g 3g frequency (hz) attenuation (db) 22 pf 100 pf 47 pf 22 0pf measurement circuit ~ 50 50 EZANP f1 a1 p e1 l b1 f2 a2 e2 w t pioi b2 f d a2 b2 e2 f2 p f d 0.56 ?.20 0.4 ?.2 0.8 ?.2 0.3 ?.2 1.27 ?.10 0.4 +0.1 t ype (inches) lwta1b1e1f1 EZANP (2512) 6.4 ?.2 3.1 ?.2 0.75 +0.20 0.7 ?.2 0.4 ?.2 0.8 ?.2 0.4 ?.2 construction circuit con? guration mass (weight) [1000 pcs.] : 52 g ratings (1) in measuring at 1 mhz, capacitance value and dissipation fac tor are different. attenuation characteristics item speci? cation capacitance values (25 ?, 1 khz (1) , 1 vrms) 22 pf, 47 pf, 100 pf, 220 pf capacitance tolerance ?0 % ( +30 % in the case of 22 pf) t emperature characteristics e characteristic: +20 %/?5 % (?5 ? to +85 ?) dissipation factor less than 2 % (25 ?, 1 khz (1) , 1 vrms) rated voltage 25 v category temperature range (operating temperature range) ?5 ? to +85 ? ?0 % ?.2 dimensions in mm (not to scale) ?.10 feb. 2006
chip capacitor networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. : land pattern f a g c d (0.20) p b t 1 t 2 chip component p 1 p 2 p 0 compartment sprocket hole f d 0 tape running direction e f w a b f d 1 f b w t f a f c embossed carrier taping ta ping reel pa c kaging methods (taping) standard quantity recommended land pattern design ty pe kind of taping pitch (p 1 ) quantity EZANP embossed carrier taping 4 mm 4000 pcs./reel abwfep 0 dimensions (mm) 3.50 ?.20 6.80 ?.20 12.00 ?.30 5.50 ?.20 1.75 ?.20 4.00 ?.10 p 1 p 2 f d0 t 1 t 2 f d 1 dimensions (mm) 4.00 ?.10 2.00 ?.05 1.50 +0.10 0.25 ?.05 1.30 ?.20 1.50 +0.10 ?0 ?0 dimensions (mm) f a f b f c 180.0 +0 60 min. 13.0 ?.0 ?3.0 dimensions (mm) wt 13.0 ?.0 15.4 ?.0 fgp dimensions (mm) 4.2 to 4.6 7.5 to 7.9 1.27 abcd dimensions (mm) 2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8 feb. 2006
chip capacitor networks design an d speci cations are each subject to change without notice. ask factory for the current technical speci cations befo re purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time recommended soldering conditions recommendations and precautions are described below. please contact us regarding ? ow soldering. recommended soldering conditions for re? ow re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. ? lease measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. safety precautions the following are precautions for individual products. please also refer to the precautions common to emi filters, fuses, and sensors(mr elements) shown on page ex2 of this catalog. 1. take measures against mechanical stress during and after mounting of chip capacitor networks (hereafter called the capacitor networks) so as not to damage their electrodes and protective coatings. be careful not to misplace the capacitor networks on the land patterns. otherwise, solder bridging may occur. 2. do not use halogen-based or other high-activity ? ux. otherwise, the residue may impair the capacitor networks' performance and/or reliability. 3. perform suf? cient preheating so that the difference of the solder temperature and the capacitor networks chip surface temperature becomes 100 c or less. maintain the temperature difference within 100 c during rapid cooling by im mer sion into solvent after soldering. 4. when soldering with a soldering iron, never touch the capacitor networks' bodies with the tip of the soldering iron. when using a soldering iron with a high temperature tip, ? nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the mechanical stress applied to the capacitor networks increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amounts of solder. 6. do not apply shock to the capacitor networks or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the capacitor networks' protective coatings and bodies may be chipped, affecting their performance. 7. avoid excessive bending of printed circuit boards in order to protect the capacitor networks from abnormal stress. 8. the static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant. for soldering (example : sn/pb) t emperature time preheating 140 ? to 160 ? 60 s to 120 s main heating above 200 ? 30 s to 40 s peak 235 ?5 ? max. 10 s for lead-free soldering (example : sn/ag/cu) t emperature time preheating 150 ? to 180 ? 60 s to 120 s main heating above 230 ? 30 s to 40 s peak max. 260 ? max. 10 s feb. 2006
? ex2 ? safety precautions (common precautions for emi filters, fuses, and sensors[mr elements]) when using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this catalog explains the quality and performance of the products as individual components. before use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signi? cant dam age, such as damage to vehicles (automobile, train, vessel), traf? c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ? systems equipped with a protection circuit and a protection device ? systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault (1) precautions for use these products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. av equipment, home electric appliances, of? ce equipment, information and communication e quipment) these products are not intended for use in the following special conditions. before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment wher e strong electromagnetic waves exist. 6. in an environment where these products cause dew condensation 7. sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials these products generate joule heat when energized. carefully position these products so that their heat will not affect the other components. carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. do not mount or place heat-generating components or in? ammables, such as vinyl-coated wires, near these products (except thermal cutoffs). note that non-cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may deteriorate the performance or reliability of the products. carefully select a ? ux cleaning agent for use after soldering. an unsuitable agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. otherwise, the insulation performance may be deteriorated. (2) precautions for storage the performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 c to 35 c and a relative humidity of 45 % to 85 %. (micro chip fuses: guaranteed for 6 months from the date of arrival at your company) the performance of emi filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 c to +40 c and a relative humidity of 40 % to 60 %. check the guarantee period in the speci? cations. the performance of thermal cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 c to +40 c and a relative humidity of 30 % to 75 %. even within the above guarantee periods, do not store these products in the following conditions. otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package markings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. feb. 2006
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