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1 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com key features ? 3.5 ghz application frequency range ? 9 db nominal gain ? 10 watt nominal psat ? 2.5% evm at 30 dbm output power ? imd3 -45 dbc @ 28 dbm scl, typical ? bias conditions: 8 v @ 1.2 a (quiescent) ? 0.5 m hfet technology ? 2 lead cu-alloy base and internally partially matched package fixtured measured performance bias conditions: vd = 8 v, idq =1.2 a performance data taken in a 3.5 ghz application circuit primary applications ? 802.16 broadband wireless ? wimax the tga2923-sg hpa provides 9 db of gain, 10 w of output power at 3.5 ghz and 2.5% evm at 30 dbm output power for ofdm 64 qma. the device is ideally suited for high linearity, high power wireless data applications such as 802.16 and wimax. the package has a high thermal conductivity copper alloy base. internal partial matching simplifies system board layout by requiring a minimum of external components.the device can be tuned to 3.3 - 3.8ghz range in 200 mhz bandwidth. 2 object components (c4 & c5) can be tuned for bandwidth. lead-free & rohs compliant. evaluation boards are available. product description -25 -20 -15 -10 -5 0 5 10 15 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 frequency (ghz) s parameter (db) s21 s22 s11 37 37.5 38 38.5 39 39.5 40 3.3 3.4 3.5 3.6 3.7 3.8 frequency (ghz) output power (dbm) p2db p1db 10 watt mmds packaged amplifier datasheet subject to change without notice
2 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table i maximum ratings 1/ symbol parameter value notes vd drain supply voltage 10 v 2 / vg gate supply voltage range 0 v to -5 v id drain supply current 4 a 2 / | ig | gate current 39 ma p in input continuous wave power 36 dbm 2 / p d power dissipation 14.4 w 2 /, 3 / t ch operating channel temperature 200 c 4/ mounting temperature (30 seconds) 260 c t stg storage temperature -65 to 150 c 1 / these ratings represent the maximum operable values for this device. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3 / when operated at this bias condition with a base plate temperature of 85 c, the median life is 7.5e5 hours. 4/ junction operating temperature will directly affect the device median time to failure (tm). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
3 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table ii rf characterization table (t a = 25 c, nominal) (vd = 8 v, idq = 1.2 a) symbol parameter test condition typical units gain small signal gain f = 3.5 ghz 9 db irl input return loss f = 3.5 ghz 12 db orl output return loss f = 3.5 ghz 15 db psat saturated output power f = 3.5 ghz 40 dbm
4 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table iii thermal information parameter test conditions t ch (c) jc (c/w) tm (hrs) jc thermal resistance (channel to backside of package) vd = 8 v i d = 1.2 a pdiss = 9.6 w 162 8 3.5 e+7 note: package backside was soldered to carrier at 85 c baseplate temperature. at saturated output power, the dc power consumption is 20w with 10w rf power delivered to the load and 10w dissipated. a dding the 1w rf input power results in 11w total power dissipation and a maximum channel temperature of 173 c at 85 c baseplate temperature. median lifetime (tm) vs. channel temperature
5 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 3.5 ghz -50 -40 -30 -20 -10 0 10 20 00.511.522.533.544.55 frequency (ghz) s parameter (db) s21 s22 s11 s12
6 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 3.5 ghz
7 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 3.5 ghz
8 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 3.5 ghz
9 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com side view bias procedure 1. ensure no rf power is applied to the device. 2. pinch off device by setting vg to ?3v. 3. increase vd to 8.0v while monitoring drain current. 4. increase vg until drain current reaches 1.2a 5. apply rf power. mechanical drawing top view note: all dimensions are in inches 0.068
10 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com 3.5 ghz application circuit schematic pcb is 20 mil thick rogers 4003 substrate
11 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com typical evaluation board layout * *the layout is a general purpose drawing that needs to be tuned for the specific application. pcb is ro4003 20 mil thickness, 0. 5 oz standard copper cladding, with r = 3.38. external component listing part type reference description capacitor c1 avx 06035j5r6bbt, 1.2 pf capacitor c2 avx 06035j5r6bbt, 3.3pf capacitor c3 4.7uf capacitor c4 avx 06035j8r2bbt, 1.2pf capacitor c5 avx 06035j8r2bbt, 6.8pf resistor r1 0805, 50 c1 c2 c3 c4 c5 r1 207 mil 518 mil 566 mil 517 mil
12 tga2923-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com ordering information part package style tga2923-sg gull wing leads recommended surface mount package assembly proper esd precautions must be followed while handling packages. clean the board with acetone. rinse with alc ohol. allow the circuit to fully dry. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste c an be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. clean the assembly with alcohol. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec

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