eic corp. a subsidiary of eic enterprises, ltd. 45738 northport loop west, fremont, ca 94538 phone: (510) 979-8999 fax: (510) 979-8902 www.eiccorp.com 1 ECM051 4 x 4 mm dual mode cellular band cdma 3.5v power amplifier module target data sheet ss-000505-000 revision e 4 x 4 mm lga module with 10 signal pins dual mode cdma/amps quiescent current control single 3.5v supply for 3-cell ni or li-ion battery power-down activated when vref pin <1v 28.0 dbm cdma power with 39% efficiency 31.0 dbm amps power 50ma typical quiescent current (low power mode) high reliability ingap design with proprietary temperature compensation features applications description 3.5 v cdma/amps cellular handsets caution! sensitive electronic device the ECM051 is a 10 signal pin 4 x 4 mm dual mode power amplifier module at 3.5v vcc with high efficiency. this device was developed using eic?s proprietary ingap gal- lium arsenide heterojunction bipolar transistor (hbt) pro- cess. it is optimized for cellular cdma (digital) and amps (analog) in the 824 mhz to 849 mhz band. it operates from a positive voltage (3.2 - 4.2v vcc) and includes a power-down feature. the input and output are both matched to 50 ? internally. it is housed in a 4 x 4 mm land grid array package with 10 signal pins. a q control pin switches the quiescent current to 50ma for low output power range.
eic corp. a subsidiary of eic enterprises, ltd. 45738 northport loop west, fremont, ca 94538 phone: (510) 979-8999 fax: (510) 979-8902 www.eiccorp.com 2 target data sheet ss-000505-000 revision e ECM051 4 x 4 mm dual mode cellular band cdma 3.5v power amplifier module electrical specifications test conditions: ta = 25 o c, v cc = +3.5 v, v ref / pd (reference / power-down voltage) = +2.9 v, f = 824 to 849 mhz pin function description 1vref / vpd ref. voltage for the bias circuit. no significant amplifier current is drawn until vref reaches approximately 2.5v. 2v q the quiescent current is compensated over the temperature range.in low power mode operation (>2.0v) the current is reduced to 50ma.the efficiency is optimized at the low rf power range ( 16dbm). 4 rf in rf input port connects to internally matched 50 ohm circuit. 5 vcc1 pin 5 connects to the driver stage hbt collector. 6 vcc2 vcc2 connects to the power amplifier stage hbt collector. 7, 9, 10 gnd ground. 11 gnd ground. this ground also serves as heat sink and must connect well to the pcb rf ground and heat sink. 8 rf out rf out is internally matched to 50 ohms and expects a 50 ohm load impedance. all supply pins may be connected together at the supply. pin 3 n/a notes: pin description min. typ. max. f824849mhz g28db p28dbmnote 1 acpr -50 -46 dbc note 2 alt cpr -60 -56 dbc note 3 pae 39 % high power mode pae 9.5 % low power mode g27db pae 48 % 6:1 note 4 10:1 no damage i cq 120 170 ma high power mode i cq 50 70 ma low power mode 310ua v ref / p d 2.9 v v cc 3.5 v icc 460 ma icc 120 ma v q 00.8v v q 22.8 v irl -10 db rxbn -135 dbm/hz -40 dbc t on/off <100 ns operating current @ 28dbm operating current @ 16dbm power added efficiency (cdma) @ 16.0 dbm vq voltage (high power mode) vq voltage (low power mode) output load stability ruggedness for output vswr mismatch gain (amps) @ 31.0 dbm, pin typical +4dbm power added efficiency (amps) @ 31.0 dbm test condition note 1: using application schematic. note 2: @ 885 khz offset from band center, pout 28dbm note 3: @ 1980 khz offset from band center, pout 28dbm symbol parameter limits unit gain (cdma modulation) output power (cdma) frequency power added efficiency (cdma) @ 28.0 dbm adjacent channel power rejection alternate channel power rejection quiescent current (no rf) vref/pd voltage supply voltage leakage current vcc = 3.5v, vref = 0v quiescent current (no rf) power down on/off time note 4: spur < -60dbc for all phase angles receiver band noise harmonics, 2f, 3f, 4f input return loss
eic corp. a subsidiary of eic enterprises, ltd. 45738 northport loop west, fremont, ca 94538 phone: (510) 979-8999 fax: (510) 979-8902 www.eiccorp.com 3 ECM051 4 x 4 mm dual mode cellular band cdma 3.5v power amplifier module target data sheet ss-000505-000 revision e package dimension device marking p ackage dimensions and markings the ECM051 is a laminate based, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. y5 y4 y3 y2 y1 y x1 x2 x3 x 1.88 3.75 2.00 1.70 0.85 4.00 3.65 0.75 1.90 3.90 .152 .078 .083 .071 .038 .162 .158 .034 .067 .148 .074 .079 3.85 1.80 0.95 2.10 4.10 1.60 1.78 1.98 0.94 2.00 1.70 0.84 1.90 1.60 .071 .083 .041 .037 .067 .079 min max nom .158 4.00 3.90 .162 1.04 2.10 1.80 max 4.10 min nom english inches metric millimeters x4 1.94 .080 .076 1.84 2.04 .030 .154 .144 .070 .075 .063 english values are converted from metric values. english values are rounded off. .033 .075 .063 .154 .072 pinout 1 vref 2 vq 3 n/a 4 rfin 5 vcc1 6 vcc2 7 gnd 8 rfout 9 gnd 10 gnd 11 gnd top view y2 x x2 x1 x1 4 56 7 x3 x4 l c l c y y3 y2 y1 y4 bottom side ground pad 1 2 38 9 10 11 y1 bottom side pad .40mm x .40mm (.016" x .016") y5 ECM051 lot number .157" +/- 0.004" (4.00mm +/- 0.1mm) pin 1 indicator xxxx xxxx eic xxxx .157" +/- 0.004" (4.00mm +/- 0.1mm) .062" +/- .004" (1.57 mm +/-0.10 mm)
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