1 b3b mechanical key switch (ultra-low profile) b3b ultra-low profile mechanical key switch with a thickness of only 0.47 mm surface-mounting model with dimensions of 4.7 x 4.7 x 0.47 mm allows high-density mounting. contributes to making devices with this mechanical key switch more compact, slim, and lightweight. available on embossed tape that enables automat - ic mounting. dust-sealed construction provides high reliability. available for reflow soldering. ordering information model number legend: b3b- 12345 1. size 1: 4.7 mm x 4.7 mm 2. ground terminal 0: none 3. plunger 0: none 4. operating force (of) 2: 1.58 n 5. shipment package p: embossed tape list of models item model embossed tape packing (unit: 10,000 pcs.) B3B-1002P note: the switches are available in units of 10,000 pieces. orders must be made in units of 10,000 pieces; no partial units can be shipp ed. specifications ratings/characteristics switching capacity 1 to 20 ma, 5 to 15 vdc, (resistive load) insulation voltage 30 vdc contact configuration spst-no contact material silver plating contact resistance 10 w max. (initial value) (rated: 1 ma, 5 vdc) insulation resistance 100 m w min. (at 100 vdc) dielectric strength 250 v ac, 50/60 hz for 1 min bounce time 10 ms max. v ibration resistance malfunction: 10 to 55 hz, 1.5-mm double amplitude shock resistance destruction: 735 m/s 2 min. {approx. 75g min.} life expectancy 50,000 operations min. ambient temperature operating: 25 c to 70 c (with no icing) ambient humidity operating: 25% to 85% weight approx. 0.1 g max.
b3b b3b 2 dimensions note: all units are in millimeters unless otherwise indicated. 3.5 3.5 r0.6 pcb mounting (t op v iew) t erminal arrangement /internal connections (t op v iew) 3 3 4.8 4.8 4.7 +0.15 0.20 0.47 +0.15 0.10 4.7 +0.15 0.20 4.7 +0.15 0.20 operating characteristics item standard value operating force (of) 1.58 0.49 n {160 50 gf} releasing force (rf) 0.29 n {30 gf} min. pretravel (pt) 0.2 0.1 mm
b3b b3b 3 precautions soldering soldering conditions for reflow soldering carry out soldering within the temperature curve shown in the fol- lowing illustration. note: the above heating curve will apply if the thickness of the circuit board is 1.6 mm. 30 s max. time (s) 60 to 90 s 20 s normal temperature 1 to 4 c/s 1 to 5 c/s t emperature ( c) since the peak value may vary depending on the reflow soldering device, be sure to conduct a verification test in advance. soldering conditions for manual soldering soldering temperature: 300 5 c at the soldering iron tip soldering time: 3 seconds max. soldering operations must be performed no more than twice includ - ing touch-up soldering. allow at least 5 minutes between the first and second soldering. do not apply flow soldering. washing no washing is allowed after soldering to prevent detergent or flux from entering into the switch. doing so may cause malfunction. tape packing specifications standard quantity conforms to eiaj standard 10,000 pieces 13 0.2 dia. 370 2 dia. (18) 0.65 0.2 dia. 8 0.1 4 0.1 2 0.1 1.75 0.1 dia. 9 12 0.3 5.5 0.1 a unreeling direction 5.1 +0.2 0 1.5 +0.1 0 dia. reel a section a-a
b3b b3b 4 omron corporation c&c components division h.q. mechanical-components division 28th fl., crystal t ower bldg., 1-2-27, shiromi, chuo-ku, osaka 540-6028 japan phone: (81)6-949-6017 fax: (81)6-949-6134 all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.03937. t o convert grams into ounces, multiply by 0.03527. cat. no. a110-e1-1 in the interest of product improvement, specifications are subject to change without notice. printed in japan 0998-1m (0998) a
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