product details length width height fin tip to fin tip interface material finish notes: length and width dimensions refer to the size of the component. dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly thermal performance data are provided for reference only. actual performance may vary by application ats reserves the right to update or change its products without notice to improve the design or performance additional tooling fees may be required typical lead time is a minimum of 4-6 weeks contact ats to learn about custom options available 1) 2) 3) 4) 5) 6) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-X50250P-C1-R0 features & benefts high performance bga cooling solutions w/ supergrip? attachment rev0_042109 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 3.9 3.2 2.7 2.5 2.3 2.1 2 3 25 mm 25 mm 17.5 mm 44.9 mm blue-anodized chomerics t766 designed for 25 x 25 mm bga components r equires minimal space around the components perimeter; ideal for densely populated pcbs allows the heat sink to be detached and reattached without damaging the component or the pcb, an important feature in the event a pcb may need to be reworked strong, uniform attachment force helps achieve maximum performance from phase-changing tims eliminates the need to drill mounting holes in the pcb assembly comes standard with a high performance maxiflow? heat sink which maximizes convection (air) cooling comes standard with clean break, reworkable, chomerics t-766 phase change material ? ? ? ? ? ? ? *image above is for illustration purposes only. ft h l w
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