doc. no : qw0905-L20URF9653S-50D-AM rev. : a date : 16 - sep. - 2008 L20URF9653S-50D-AM data sheet ligitek electronics co.,ltd. property of ligitek only square with 4leads type led lamps lead-free parts pb
page 1/5 part no. L20URF9653S-50D-AM note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only 60 30 0 directivity radiation -30 75% 50% 0 25%25% -60 50% 75% 100% 100% 3.4 7.6 ? 4.6 1.2c 7.6 ? 1.9 cathode anode 4.4 0.5 0.5 5.08 0.3 3.5 0.5 2.5 0.5 0.4 5.08 0.3 1.55 package dimensions
part no. L20URF9653S-50D-AM * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. ligitek electronics co.,ltd. property of ligitek only unit urf(s) ratings page 2/5 symbol parameter absolute maximum ratings at ta=25 ma ma mw a 70 90 210 10 -40 ~ +100 -40 ~ +85 2000 v i f i fp pd ir power dissipation reverse current @5v peak forward current duty 1/10@10khz forward current tstg t opr storage temperature operating temperature electrostatic discharge( * ) esd min. typ. 17000 1150030 max. typ. 6252.0 203.0 spectral halfwidth nm forward voltage @50ma(v) viewing angle 2 1/2 (deg) luminous intensity @50ma(mcd) lens emitted color water clear red part no L20URF9653S-50D-AM material algainp typical electrical & optical characteristics (ta=25 ) dominant wave length dnm note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance.
typical electro-optical characteristics curve ligitek electronics co.,ltd. property of ligitek only 20urf(s) chip 3/5 page 400 300 02.5 1.5 0.5 1.0 0.6 0.4 0.2 0.0 0.8 6080 02040 -40 0.96 0.94 3.0 2.0 1.02 1.00 0.98 1000 500 0 200 100 0 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.3 forward voltage vs. temperature 0 5.0 10 15 25 20 100 -20 1.2 1.4 -20 100 -40 40 20 080 60 1.04 part no. L20URF9653S-50D-AM 1.0 0.5 700 650 600 550 0 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a fig.5 relative intensity vs. wavelength
2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 5 /sec max temp( c) 260 260 c3sec max 100 150 time(sec) 50 2 /sec max 25 0 0 60 seconds max preheat note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 120 dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) part no. L20URF9653S-50D-AM ligitek electronics co.,ltd. property of ligitek only page 4/5
part no. L20URF9653S-50D-AM mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) thermal shock test high temperature high humidity test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs high temperature storage test low temperature storage test operating life test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) reliability test: test itemtest condition mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 description reference standard
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