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TGA4823-SM
9.9 - 12.5 Gb/s Linear/Limiting Optical Modulator Driver
Key Features
* * * * * * *
Up to 10 Vpp Linear Output Voltage > 12 Vpp Limiting Mode Output Voltage Gain: 19 dB Internal DC blocks Single-ended Input / Output Bias: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg = -0.3 V Typical for Linear operation Package Dimensions: 8 x 8 x 2.1 mm
Measured Performance
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s; Vin = 1Vpp
Primary Applications
*
Mach-Zehnder Modulator Driver for Metro and Long Haul
Product Description
The TriQuint TGA4823-SM is part of a series of optical driver amplifiers suitable for a variety of driver applications. The TGA4823-SM is a medium power wideband AGC amplifier that typically provides 19 dB small signal gain with 19 dB AGC range. The TGA4823-SM is an excellent choice for applications requiring high drive combined with high linearity. The TGA4823-SM has demonstrated capability to deliver 10Vpp while maintaining output harmonic levels near -30dBc for a 2GHz fundamental. The TGA4823-SM requires a low frequency choke and control circuitry. RoHS and Lead-Free compliant. Evaluation boards available on request.
Datasheet subject to change without notice. TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
1
Table I Absolute Maximum Ratings 1/
Symbol
Vd-Vg Vd Vg Vctrl Id Ig Ictrl Pin 1/ Drain Voltage Gate Voltage Range Control Voltage Range Drain Current Gate Current Range Control Current Range Input Continuous Wave Power
TGA4823-SM
Notes
2/ 2/ 2/ 2/
Parameter
Drain to Gate Voltage
Value
12 V 9V -5 to 0 V -1 to +2 V 400 mA -1.8 to 18.9 mA -1.8 to 18.9 mA 27.8 dBm
These ratings represent the maximum operable values for this device. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device and / or affect device lifetime. These are stress ratings only, and functional operation of the device at these conditions is not implied. Combinations of supply voltage, supply current, input power, and output power shall not exceed the maximum power dissipation listed in Table IV.
2/
Table II Recommended Linear Operating Conditions
Symbol
Vd Id Id_Drive Vg Vctrl Drain Voltage Drain Current Drain Current under RF Drive Typical Gate Voltage Control Voltage
Parameter 1/
Value
8V 310 mA 350 mA -0.3 V 1V
1/
See assembly diagram for bias instructions.
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TGA4823-SM
Table III RF Characterization Table
Bias: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg = -0.3 V, typical
SYMBOL
3dB BW Gain
PARAMETER
Small Signal 3 dB Bandwidth Small Signal Gain
TEST CONDITIONS
Relative to 2 GHz f = 0.1 - 4 GHz f = 6 GHz f = 8 GHz f = 0.1 - 10GHz f = 10 - 16 GHz f = 0.1 - 10 GHz f = 10 - 16 GHz f = 2 GHz f = 2 GHz
MIN
NOMINAL
9.5
MAX
UNITS
GHz
-
20 19 18 15 9 15 12 26 ( 12.5) 25
-
dB
IRL ORL Psat P1dB
Input Return Loss Output Return Loss Saturated Output Power Output Power @ 1dB Compression Small Signal AGC Range
-
dB dB dBm (Vpp) dBm
AGC Range
-
19
-
dB
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TGA4823-SM
Table IV Power Dissipation and Thermal Properties
Parameter
Maximum Power Dissipation
Test Conditions
Tbaseplate = 70 C
Value
Pd = 3.17 W Tchannel = 150 C Tm = 1.0E+6 Hrs jc = 24.3 (C/W) Tchannel = 130 C Tm = 5.8E+6 Hrs jc = 24.3 (C/W) Tchannel = 127 C Tm = 7.6E+6 Hrs
Notes
1/ 2/
Thermal Resistance, jc
Vd = 8 V Id = 310 mA Pd = 2.48 W Vd = 8 V Id = 350 mA Pout = 26.5 dBm Pd = 2.36 W
Thermal Resistance, jc Under RF Drive
Mounting Temperature Storage Temperature 1/ 2/
Refer to Solder Reflow Profiles (pp16) -65 to 150 C
For a median life of 1E+6 hours, Power Dissipation is limited to Pd(max) = (150 C - Tbase C)/jc. Channel operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that channel temperatures be maintained at the lowest possible levels.
Power De-rating Curve
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 Power Dissipated (W) Tm= 1.0E+6 Hrs
25 50 75 100 125 150 175 200 Baseplate Temp (C)
4
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
Measured Data
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical
25 20 Gain (dB) 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
0 Input RL and Output RL (dB)
-10
-20
IRL ORL
-30
-40 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
5 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
Measured Data
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical
25 20 Gain (dB) 15 10 5 0
0.00001 0.0001 0.001 0.01 0.1 1 10
Frequency (GHz)
0 Input RL and Output RL (dB)
IRL ORL
-10
-20
-30
-40
0.00001 0.0001 0.001 0.01 0.1 1 10
Frequency (GHz)
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Measured Data
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical Freq = 2 GHz
14 12 Vout (Vpp) 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Vin (Vpp) 30 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -20 -16 -12 -8 -4 Pin (dBm)
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Pout & Harmonics (dBm)
P_Fundamental P_2nd_Harmonic P_3rd_Harmonic
0
4
8
Measured Data
Linear Mode:
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s
Input Eye: Vin = 250 mVpp
Output Eye: Vin = 250 mVpp, Vopp = 2.5 Vpp
Input Eye: Vin = 500 mVpp
Output Eye: Vin = 500 mVpp, Vopp = 5 Vpp
8
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
Measured Data
Linear Mode:
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s
Input Eye: Vin = 1 Vpp
Output Eye: Vin = 1 Vpp, Vopp = 9.3 Vpp
9 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
Measured Data
Limiting Mode:
TGA4823-SM
Bias conditions: Vd = 8 V, Id = 310 mA, Vctrl = +1 V, Vg -0.3 V Typical PRBS = 231-1; CPC = 50%, 10.7 GB/s
Input Eye: Vin = 1700 mVpp
Output Eye: Vin = 1700 Vpp, Vopp = 4.2 Vpp
Output Eye: Vin = 1700 Vpp, Vopp = 8.3 Vpp
Output Eye: Vin = 1700 Vpp, Vopp = 11 Vpp
10 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
TGA4823-SM
Electrical Schematic
Bias Procedures
Vd=8V, CPC=50% Bias ON
1. Disable the output of the PPG 2. Set VD = 0V, VCTRL = 0V & VG = 0V 3. Set VG = -1.5V 4. Increase VD to 8V observing Id - Assure ID = 0mA 5. Set VCTRL = +1V - ID should still be 0mA 6. Make VG more positive until ID = 310mA. VG will be approximately -0.3V. 7. Enable the output of the PPG. 8. Output Swing Adjust: Adjust VCTRL slightly positive to increase output swing or adjust VCTRL slightly negative to decrease the output swing. 9. Crossover Adjust: Adjust VG slightly positive to push the crossover down or adjust VG slightly negative to push the crossover up.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
Bias OFF
1. Disable the output of the PPG 2. Set VCTRL = 0V 3. Set VD = 0V 4. Set VG = 0V
11
TGA4823-SM
Recommended Application Circuit
Vctrl Vd_Bypass Vd C1 R3 C2 C3 R1 L1
R2
L2
27
26
24
TGA4823-SM
RF In 4 17 RF Out
13 C4 Vg
Label L1 L2 R1,R2 R3 C1 C2,C3 C4 U1 Value 330nH 220uH 270 Ohm 620 Ohm 10uF 1uF 10uF Part Number ELJ-FAR33MF2 ELL-CTV221M ERJ-3GEYJ271V ERJ-3GEYJ621V TAJA106K016R 0603YG105ZAT2A GRM188R60J106ME47D TGA4823-SM Vendor Panasonic Panasonic Panasonic Panasonic AVX AVX Murata TriQuint
** Note: For Hot-Pluggable option, R3 is limited to Rx ohms, for a maximum Vctrl_user such that Vctrl pin on package does not exceed + 2 V Where Rx = (Vctrl_user - Vctrl_pin) / Ictrl_max = (Vctrl_user - 2V) / 18.9 mA
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
12
TGA4823-SM
Recommended Assembly Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
13
TGA4823-SM
Package Pinout
Pin 1 indicator
28
27
26
25
24
23
22
22
23
24
25
26
27
28
Pin 1 indicator
1 2 3 4 5 6 7
21 20 19 18 17 16 15
21 20 19 18 17 16 15 29
1 2 3 4 5 6 7
8
9
10
11
12
13
14
14
13
12
11
10
9
8
Pin
1,2,3,5,6,7,8,9,10, 11,13,14,15,16,18, 19,20,21,22, 23,25,28 4 12 17 24 26 27 29
Description
N/C
RF In Vg RF Out Vd Vd_Bypass Vctrl GND
14 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
TGA4823-SM
Mechanical Drawing
8.000
2.100
0.550 26 places
5.842
0.368
8.000
0.600 28 places
1.000 pitch
0.400 2 places
1.000
1.000
1.000 pitch
0.300
0.200
Isometric View
SCALE 10 : 1
Units: millimeters Unless specified otherwise, tolerances: 0.100 Materials: Package base Aluminum Nitride (AlN) Package lid White Alumina (Al203) Pad finish on package base: Electroless gold (Au) 0.5 - 1.0 um Over Electroless nickel (Ni) 2.0 um min.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
15 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -
0.400
5.842
TGA4823-SM
Assembly Notes
Recommended Surface Mount Package Assembly * Proper ESD precautions must be followed while handling packages. * Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. * TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors' recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. * Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. * Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate
SnPb
3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec
Pb Free
3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec
Ordering Information
Part TGA4823-SM Package Style 8x8 Surface Mount
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
16 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Aug 2007 (c) Rev -

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