View TJA1049T118_420660.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TJA1049
High-speed CAN transceiver with Standby mode
Rev. 01 -- 24 September 2010 Product data sheet
1. General description
The TJA1049 high-speed CAN transceiver provides an interface between a Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive industry, supplying the differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. The TJA1049 is a step up from the TJA1040, PCA82C250 and PCA82C251 high-speed CAN transceivers. It offers improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance, and also features:
* Ideal passive behavior to the CAN bus when the supply voltage is off * A very low-current Standby mode with bus wake-up capability
These features make the TJA1049 an excellent choice for all types of HS-CAN networks, in nodes that require a low-power mode with wake-up capability via the CAN bus.
2. Features and benefits
2.1 General
Fully ISO 11898-2 and ISO 11898-5 compliant Suitable for 12 V and 24 V systems Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI) SPLIT voltage output for stabilizing the recessive bus level
2.2 Low-power management
Very low-current Standby mode with host and bus wake-up capability Functional behavior predictable under all supply conditions Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ESD handling capability on the bus pins Bus pins protected against transients in automotive environments Transmit Data (TXD) dominant time-out function Bus-dominant time-out function in Standby mode Undervoltage detection on pin VCC Thermally protected
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
3. Ordering information
Table 1. Ordering information Package Name TJA1049T SO8 Description plastic small outline package; 8 leads; body width 3.9 mm Version SOT96-1 Type number
4. Block diagram
VCC 3 VCC
TJA1049
TEMPERATURE PROTECTION VCC SLOPE CONTROL AND DRIVER 7 CANH
TXD
1
TIME-OUT
6
CANL
VCC
STB
8
MODE CONTROL
5 SPLIT
SPLIT
RXD
4 MUX AND DRIVER WAKE-UP FILTER
2 GND
015aaa164
Fig 1.
Block diagram
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
2 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
5. Pinning information
5.1 Pinning
TJA1049
TXD GND VCC RXD 1 2 3 4
015aaa166
8 7 6 5
STB CANH CANL SPLIT
Fig 2.
Pin configuration diagram
5.2 Pin description
Table 2. Symbol TXD GND VCC RXD SPLIT CANL CANH STB Pin description Pin 1 2 3 4 5 6 7 8 Description transmit data input ground supply supply voltage receive data output; reads out data from the bus lines common-mode stabilization output LOW-level CAN bus line HIGH-level CAN bus line Standby mode control input
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
3 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
6. Functional description
The TJA1049 is a HS-CAN stand-alone transceiver with Standby mode. It combines the functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers and offers improved EMC and ESD handling capability and quiescent current performance. Improved slope control and high DC handling capability on the bus pins provide additional application flexibility. The TJA1049 is 100 % backwards-compatible with the TJA1040, and can be used in existing PCA82C250 and PCA82C251 applications.
6.1 Operating modes
The TJA1049 supports two operating modes, Normal and Standby, which are selectable via pin STB. See Table 3 for a description of the operating modes under normal supply conditions.
Table 3. Mode Normal Standby Operating modes Pin STB LOW HIGH Pin RXD LOW bus dominant wake-up request detected HIGH bus recessive no wake-up request detected
6.1.1 Normal mode
A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram). The differential receiver converts the analog data on the bus lines into digital data which is output on pin RXD. The slope of the output signals on the bus lines is controlled and optimized in a way that guarantees the lowest possible EME.
6.1.2 Standby mode
A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not able to transmit or correctly receive data via the bus lines. The transmitter and Normal-mode receiver blocks are switched off to reduce supply current, and only a low-power differential receiver monitors the bus lines for activity. The wake-up filter on the output of the low-power receiver does not latch bus dominant states, but ensures that only bus dominant and bus recessive states that persist longer than tfltr(wake)bus are reflected on pin RXD. In Standby mode, the bus lines are biased to ground to minimize the system supply current. When pin RXD goes LOW to signal a wake-up request, a transition to Normal mode will not be triggered until STB is forced LOW.
6.2 Fail-safe features
6.2.1 TXD dominant time-out function
A `TXD dominant time-out' timer is started when pin TXD is set LOW. If the LOW state on pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application
TJA1049 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
4 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH. The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
6.2.2 Bus dominant time-out function
In Standby mode, a 'bus dominant time-out' timer is started when the CAN bus changes from recessive to dominant state. If the dominant state on the bus persists for longer than tto(dom)bus, the RXD pin is forced HIGH. This prevents a clamped dominant bus (due to a bus short-circuit or a failure in one of the other nodes on the network) generating a permanent wake-up request. The bus dominant time-out timer is reset when the CAN bus changes from dominant to recessive state.
6.2.3 Internal biasing of TXD and STB input pins
Pins TXD and STB have internal pull-ups to VCC to ensure a safe, defined state in case one (or both) of these pins is left floating.
6.2.4 Undervoltage detection on pin VCC
Should VCC drop below the standby undervoltage detection level, Vuvd(stb)(VCC), the transceiver will switch to Standby mode. The logic state of pin STB will be ignored until VCC has recovered (VCC > Vuvd(stb)(VCC)). Should VCC drop below the switch-off undervoltage detection level, Vuvd(swoff)(VCC), the transceiver will switch off and disengage from the bus (zero load) until VCC has recovered (VCC > Vuvd(swoff)(VCC)).
6.2.5 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes recessive again. Including the TXD condition ensures that output driver oscillation due to temperature drift is avoided.
6.3 SPLIT pin
Using the SPLIT pin in conjunction with a split termination network (see Figure 3 and Figure 6) can help to stabilize the recessive voltage level on the bus. This will reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with poor bus leakage performance). In Normal mode, pin SPLIT delivers a DC output voltage of 0.5VCC. In Standby mode or when VCC is off, pin SPLIT is floating.
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
5 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
VCC
TJA1049
CANH
R
60
VSPLIT = 0.5 VCC in normal mode; otherwise floating
R
SPLIT
60
CANL
GND
015aaa167
Fig 3.
Stabilization circuitry
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
6 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND. Symbol Parameter Vx voltage on pin x Conditions no time limit; DC value on pins CANH, CANL and SPLIT on any other pin Vtrt VESD transient voltage electrostatic discharge voltage on pins CANH and CANL IEC 61000-4-2 at pins CANH and CANL HBM at pins CANH and CANL at any other pin MM at any pin CDM at corner pins at any pin Tvj Tstg Tamb
[1] [2] [3] [4] [5] [6] [7]
[6] [5] [1] [2] [3] [4]
Min -58 -0.3 -150 -8 -8 -4 -300 -750 -500
[7]
Max +58 +7 +100 +8 +8 +4 +300 +750 +500 +150 +150 +125
Unit V V V kV kV kV V V V C C C
virtual junction temperature storage temperature ambient temperature
-40 -55 -40
Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a and 3b. IEC 61000-4-2 (150 pF, 330 ); direct coupling. ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 ) has been be verified by an external test house. The result is equal to or better than 8 kV (unaided). Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k). Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ). Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF); grade C3B. In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P x Rth(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb).
8. Thermal characteristics
Table 5. Thermal characteristics According to IEC 60747-1. Symbol Rth(vj-a) Parameter thermal resistance from virtual junction to ambient Conditions SO8 package; in free air Value 145 Unit K/W
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
7 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
9. Static characteristics
Table 6. Static characteristics Tvj = -40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 unless specified otherwise; All voltages are defined with respect to ground. Positive currents flow into the IC.[1] Symbol VCC ICC Parameter supply voltage supply current Standby mode Normal mode recessive; VTXD = VCC dominant; VTXD = 0 V Vuvd(stb)(VCC) standby undervoltage detection voltage on pin VCC 2.5 20 3.5 1.3 5 45 2 7.5 65 4.75 2.7 mA mA V V Conditions Min 4.75 Typ 10 Max 5.25 15 Unit V A Supply; pin VCC
Vuvd(swoff)(VCC) switch-off undervoltage detection voltage on pin VCC Standby mode control input; pin STB VIH VIL IIH IIL VIH VIL IIH IIL Ci IOH IOL VO(dom) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current input capacitance HIGH-level output current LOW-level output current dominant output voltage VRXD = VCC - 0.4 V VRXD = 0.4 V; bus dominant VTXD = 0 V; t < tto(dom)TXD pin CANH pin CANL Vdom(TX)sym VO(dif)bus transmitter dominant voltage Vdom(TX)sym = VCC - VCANH - VCANL symmetry bus differential output voltage recessive output voltage VTXD = 0 V; t < tto(dom)TXD RL = 45 to 65 VTXD = VCC recessive; no load VO(rec) Normal mode; VTXD = VCC; no load Standby mode; no load VTXD = VCC Normal mode; VTXD = 0 V
[2]
0.7VCC -0.3 VSTB = VCC VSTB = 0 V -1 -15 0.7VCC -0.3 -5 -260 -8 1
-150 5 -3 -
VCC + 0.3 0.3VCC +1 -1 VCC + 0.3 0.3VCC +5 -30 10 -1 12
V V A A V V A A pF mA mA
CAN transmit data input; pin TXD
CAN receive data output; pin RXD
Bus lines; pins CANH and CANL 2.75 0.5 -400 1.5 -50 2 -0.1 3.5 1.5 4.5 2.25 +400 3 +50 +0.1 V V mV V mV V V
0.5VCC 3
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
8 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
Table 6. Static characteristics ...continued Tvj = -40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 unless specified otherwise; All voltages are defined with respect to ground. Positive currents flow into the IC.[1] Symbol Vth(RX)dif Parameter differential receiver threshold voltage Conditions Vcm(CAN) = -12 V to +12 V Normal mode Standby mode Vhys(RX)dif IO(dom) differential receiver hysteresis voltage dominant output current Vcm(CAN) = -12 V to +12 V Normal mode VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V pin CANH; VCANH = 0 V pin CANL; VCANL = 5 V / 40 V IO(rec) IL Ri Ri Ri(dif) Ci(cm) Ci(dif) VO recessive output current leakage current input resistance input resistance deviation differential input resistance common-mode input capacitance differential input capacitance output voltage Normal mode ISPLIT = -500 A to +500 A Normal mode; RL = 1 M IL leakage current Standby mode VSPLIT = -58 V to +58 V
[2] [2] [3]
Min 0.5 0.4 100
Typ -
Max 0.9 1.15 300
Unit V V mV
-100 40 -5 -3 9 -3 19 0.3VCC
-70 70 15 30 -
-40 100 +5 +3 28 +3 52 20 10
mA mA mA A k % k pF pF V
Normal mode; VTXD = VCC VCANH = VCANL = -27 V to +32 V VCC = 0 V; VCANH = VCANL = 5 V between VCANH and VCANL
[2]
Common mode stabilization output; pin SPLIT 0.5VCC 0.7VCC
0.45VCC 0.5VCC 0.55VCC V -5 +5 A
Temperature detection Tj(sd) shutdown junction temperature 190 C
[1] [2] [3]
All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. Not tested in production; guaranteed by design. Vcm(CAN) is the common mode voltage of CANH and CANL.
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
9 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
10. Dynamic characteristics
Table 7. Dynamic characteristics Tvj = -40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 unless specified otherwise. All voltages are defined with respect to ground. Positive currents flow into the IC.[1] Symbol td(TXD-busdom) td(TXD-busrec) td(busrec-RXD) tPD(TXD-RXD) tto(dom)TXD tto(dom)bus tfltr(wake)bus td(stb-norm)
[1]
Parameter delay time from TXD to bus dominant delay time from TXD to bus recessive delay time from bus recessive to RXD propagation delay from TXD to RXD TXD dominant time-out time bus dominant time-out time bus wake-up filter time standby to normal mode delay time
Conditions Normal mode Normal mode Normal mode Normal mode Normal mode VTXD = 0 V; Normal mode Standby mode Standby mode
Min 60 0.3 0.3 0.5 7
Typ 65 90 60 65 1.7 1.7 25
Max 140 140 140 140 220 5 5 5 47
Unit ns ns ns ns ns ms ms s s
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5
td(busdom-RXD) delay time from bus dominant to RXD
All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range.
+5 V
47 F 100 nF
VCC TXD CANH
TJA1049
SPLIT RXD GND
15 pF
RL
100 pF
CANL STB
015aaa165
Fig 4.
Timing test circuit for CAN transceiver
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
10 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
HIGH TXD LOW CANH
CANL dominant 0.9 V
VO(dif)(bus) 0.5 V recessive HIGH RXD 0.7VCC 0.3VCC LOW td(TXD-busdom) td(TXD-busrec) td(busdom-RXD) tPD(TXD-RXD) tPD(TXD-RXD) td(busrec-RXD)
015aaa169
Fig 5.
CAN transceiver timing diagram
11. Application information
BAT
5V
VCC
CANH
CANH
STB
Pxx Pyy
VDD
SPLIT
TJA1049
TXD RXD
TX0 RX0
MICROCONTROLLER
GND
015aaa168
CANL
CANL GND
Fig 6.
Typical application with TJA1049 and a 5 V microcontroller.
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
11 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
12. Test information
12.1 Quality information
This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications.
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
12 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
D
E
A X
c
y
HE
vMA
Z
8 5
Q A2
pin 1 index
A1
(A 3) Lp L
A
1
4
e
bp
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC
076E03
A max. 1.75
0.069
A1 0.25 0.10
A2 1.45 1.25
A3 0.25
0.01
bp 0.49 0.36
c 0.25 0.19
D (1) 5.0 4.8
0.20 0.19
E (2) 4.0 3.8
0.16 0.15
e 1.27
0.05
HE 6.2 5.8
L 1.05
Lp 1.0 0.4
Q 0.7 0.6
v 0.25
0.01
w 0.25
0.01
y 0.1
0.004
Z (1) 0.7 0.3
0.028 0.012
o
0.010 0.057 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.041 0.228 0.016 0.024
8 o 0
JEDEC
MS-012
JEITA
EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-18
Fig 7.
TJA1049
Package outline SOT96-1 (SO8)
All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
13 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
TJA1049 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
14 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
14.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 8.
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
15 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8.
Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
15. Revision history
Table 10. Revision history Release date 20100924 Data sheet status Product data sheet Change notice Supersedes Document ID TJA1049 v.1
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
16 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
17 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1049
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 -- 24 September 2010
18 of 19
NXP Semiconductors
TJA1049
High-speed CAN transceiver with Standby mode
18. Contents
1 2 2.1 2.2 2.3 3 4 5 5.1 5.2 6 6.1 6.1.1 6.1.2 6.2 6.2.1 6.2.2 6.2.3 6.2.4 6.2.5 6.3 7 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Low-power management . . . . . . . . . . . . . . . . . 1 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4 TXD dominant time-out function . . . . . . . . . . . . 4 Bus dominant time-out function . . . . . . . . . . . . 5 Internal biasing of TXD and STB input pins . . . 5 Undervoltage detection on pin VCC . . . . . . . . . . 5 Overtemperature protection . . . . . . . . . . . . . . . 5 SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Quality information . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering of SMD packages . . . . . . . . . . . . . . 14 Introduction to soldering . . . . . . . . . . . . . . . . . 14 Wave and reflow soldering . . . . . . . . . . . . . . . 14 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 14 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 September 2010 Document identifier: TJA1049

▲Up To Search▲

Price & Availability of TJA1049T118

	To Download TJA1049T118 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .