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| CL330 3-Channel 30mA Linear LED Driver Features 6% current accuracy @ 4.0 -15V 90V standoff voltage Separate enable pins for each channel allow for PWM dimming Over-temperature protection 8-Lead SOIC (w/Heat Slug) package General Description The CL330 is designed to drive 3 strings of LEDs at a constant current of 30mA. Other drivers with currents in the range of 20 - 30mA are available. The drive current is fixed, with a 6% tolerance over a VOUT range of 4 - 15V. Separate enable pins for each channel allow for PWM dimming, 3-step linear dimming, or individual disconnection of faulty LED strings. Over-temperature protection circuitry shuts down all 3 channels when the nominal die temperature reaches 135C. Normal operation resumes when the die temperature drops by 30C. The CL330 is available in the 8-Lead SOIC (w/Heat Slug) package and requires a single ceramic bypass capacitor which may be shared among several drivers. Applications LCD backlighting Indicator lamps Block Diagram and Typical Application Circuit 6.5 - 90V CIN 100nF 8 7 6 5 VIN OUT1 VDD OUT2 OUT3 REG Host Controller 1 2 3 EN1 EN2 EN3 GND CL330 4 CL330 Ordering Information Device CL330 -G indicates package is RoHS compliant (`Green') Underside plate is ground EN2 EN1 GND EN3 Pin Configuration OUT3 OUT2 OUT1 VIN 8-Lead SOIC (w/Heat Slug) CL330SG-G 8-Lead SOIC (w/Heat Slug) (SG) Absolute Maximum Ratings Parameter Supply voltage, VIN Output voltage, VOUT Enable voltage, VEN Operating temperature Storage temperature (1) Product Marking Value -0.5V to +100V -0.5V to +100V -0.5V to +6.5V -40C YYWW CL330 LLLL YY = Year Sealed WW = Week Sealed L = Lot Number = "Green" Packaging 8-Lead SOIC (w/Heat Slug) (SG) -65C to +150C Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Continuous operation of the device at the absolute rating level may affect device reliability. All voltages are referenced to device ground. Note: (1) Maximum junction temperature internally limited. Recommended Operating Conditions (all voltages with respect to GND pin) Sym VIN VOUT fEN TJ CIN Parameter Supply voltage Output voltage Enable toggling frequency Junction temperature VIN capacitor Min 6.5 4.0 0 -40 Typ 100 Max 90 15 90 100 119 Units V V V kHz o Conditions --EN = 0 EN = 1 ------- C nF Thermal Characteristics Sym JA TLIM THYS Parameter Thermal resistance, junction to ambient Over-temperature limit Over-temperature hysteresis Min 120 Typ 48 135 30 Max 150 Units Conditions O C/W Mounted on JEDEC test PCB (2s 2p) O O C C ----- 2 CL330 Electrical Characteristics (Over recommended operating conditions. Tj @ 25OC unless otherwise specified.) Sym IIN IOUT(OFF) IOUT(ON) VEN(ON) VEN(OFF) CEN IENL IENH tON tRISE tOFF tFALL Parameter VIN supply current Output current, off Min - Typ 220 2.2 4.0 30.0 30.0 5.0 2.0 1.0 130 170 Max 250 2.3 10 31.8 31.8 33.0 0.8 10 1.0 1.0 2.4 1.2 300 250 Units Conditions A mA A EN1-3 = 1 EN1-3 = 0 ENX = 1 ENX = 0, VOUT = 0 - 4.0V mA ENX = 0, VOUT = 4.0 - 15V ENX = 0, VOUT = 15 - 90V V V pF A A s s ns ns ------VEN = 0V VEN = 5.0V --------- Output current, on 28.2 27.0 Enable voltage, on Enable voltage, off Enable input capacitance Enable low input current Enable high input current Enable on delay Output current rise time Enable off delay Output current fall time 2.4 - Timing VEN(OFF) EN VEN(ON) tON tRISE 90% IOUT(ON) tOFF tFALL IOUT 10% IOUT(ON) Temperature Effects Current (Normalized to 25C) 1.05 1.00 0.95 0.90 0.85 0.80 -50 -40 25 120 0 50 100 150 Junction Temperature (C) 3 CL330 Load Regulation 1.20 IOUT (normalized to nominal) 1.00 0.80 0.60 0.40 0.20 scale change 0 0 5 10 15 20 40 60 80 100 VOUT (V) Pin Description Pin # 1,2,3 4 5,6,7 8 Underside Plate Name EN1, EN2, EN3 GND OUT1, OUT2, OUT3 VIN GND Description Output enable, active low. Circuit common. Constant current output (sinking). Connect the cathodes of the LEDs to these pins. Supply voltage. 6.5V to 90V. Bypass locally with a 100nF capacitor to ground. The exposed underside plate is internally connected to the GND pin. The plate may either be left floating or connected to ground. Solder the plate to an exposed copper area on the PCB for heatsinking purposes (see recommended layout). Recommended PCB Layout 1cm2 exposed copper Underside plate soldered to copper area Exposed copper area may be plated 1cm2 exposed copper 4 CL330 Higher LED Current VLL CIN 100nF 8 7 6 5 VIN OUT1 VDD OUT2 OUT3 REG Host Controller 1 2 3 EN1 EN2 EN3 GND CL330 4 By paralleling outputs, higher LED currents can be achieved. In addition, linear dimming in 3 discrete steps may be obtained by enabling 1, 2, or 3 outputs. Lowering CL330 Power Dissipation: Separate VIN Supply VLL VIN CIN 100nF 8 7 6 5 VIN OUT1 VDD OUT2 OUT3 REG Host Controller 1 2 3 EN1 EN2 EN3 GND CL330 4 CL330 power dissipation may be lowered by supplying the CL330 from a voltage source (VIN) that is lower in voltage than the LED supply (VLL). 5 CL330 Lowering CL330 Power Dissipation: Dropping Resistor VLL RDROP CIN 100nF 8 7 6 5 VIN OUT1 VDD OUT2 OUT3 RDROP < VLL(MIN) - 6.5V 2.3mA REG Host Controller 1 2 3 where: RDROP = Dropping resistance VLL(MIN) = minimum supply voltage EN1 EN2 EN3 GND CL330 4 Lowering CL330 Power Dissipation: Zener Diode VLL ZDROP CIN 100nF 8 7 6 5 VIN OUT1 VDD OUT2 OUT3 REG Host Controller 1 2 3 VZ < (VLL(MIN) - 6.5V) where: VZ = Zener Voltage VLL(MIN) = minimum supply voltage EN1 EN2 EN3 GND CL330 4 6 CL330 8-Lead SOIC (w/Heat Slug) Package Outline (SG) 4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch D1 8 Exposed Thermal Pad Zone D 8 1 Note 1 (Index Area D/2 x E1/2) E1 E E2 L2 Gauge Plane 1 1 L1 L Seating Plane Top View A Bottom View View B View B h h A A2 e Seating Plane Note 1 A1 b A Side View View A-A Note 1: This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either a mold, or an embedded metal or marked feature. Symbol MIN Dimension NOM (mm) MAX A 1.25 1.70 A1 0.00 0.15 A2 1.25 1.70 b 0.31 0.51 D 4.80 4.90 5.00 D1 3.30* 3.81* E 5.80 6.00 6.20 E1 3.80 3.90 4.00 E2 2.29* 2.79* e 1.27 BSC h 0.25 0.50 L 0.40 1.27 L1 L2 0O 8 O 1 5O 15O 1.04 0.25 REF BSC JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005. Dimensions marked with (*) are non-JEDEC dimensions. Drawings not to scale. (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to http://www.supertex.com/packaging.html.) Doc.# DSFP-CL330 NR110907 7 |
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