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| www..com CMT10N40 POWER MOSFET GENERAL DESCRIPTION This high voltage MOSFET uses an advanced termination scheme to provide enhanced voltage-blocking capability without degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in avalanche and commutation modes. The new energy efficient design also offers a drain-to-source diode with a fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage transients. FEATURES Robust High Voltage Termination Avalanche Energy Specified Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode Diode is Characterized for Use in Bridge Circuits IDSS and VDS(on) Specified at Elevated Temperature PIN CONFIGURATION TO-220 SYMBOL D Top View GATE SOURCE DRAIN G S 1 2 3 N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS Rating Drain to Current Continuous Pulsed Continue Total Power Dissipation Derate above 25J Operating and Storage Temperature Range Single Pulse Drain-to-Source Avalanche Energy Thermal Resistance Junction to Case Junction to Ambient TJ = 25J (VDD = 100V, VGS = 10V, IL = 10A, L = 6mH, RG = 25) JC JA TL 1.7 62.5 260 J J /W TJ, TSTG EAS Non-repetitive Symbol ID IDM VGS VGSM PD Value 10 40 20 40 125 1.0 -55 to 150 300 V V W W/J J mJ Unit A Gate-to-Source Voltage Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds 2001/11/07 Draft Champion Microelectronic Corporation Page 1 CMT10N40 POWER MOSFET ORDERING INFORMATION Part Number CMT10N40N220 Package TO-220 ELECTRICAL CHARACTERISTICS Unless otherwise specified, TJ = 25J . CMT10N40 Characteristic Drain-Source Breakdown Voltage (VGS = 0 V, ID = 250 g A) Drain-Source Leakage Current (VDS = 400 V, VGS = 0 V) (VDS = 400 V, VGS = 0 V, TJ = 125J ) Gate-Source Leakage Current-Forward (Vgsf = 20 V, VDS = 0 V) Gate-Source Leakage Current-Reverse (Vgsr = 20 V, VDS = 0 V) Gate Threshold Voltage (VDS = VGS, ID = 250 g A) Static Drain-Source On-Resistance (VGS = 10 V, ID = 5.0A) * Drain-Source On-Voltage (VGS = 10 V) (ID = 5.0 A) Forward Transconductance (VDS = 50 V, ID = 5.0A) * Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Internal Drain Inductance (Measured from the drain lead 0.25" from package to center of die) Internal Drain Inductance (Measured from the source lead 0.25" from package to source bond pad) SOURCE-DRAIN DIODE CHARACTERISTICS Forward On-Voltage(1) Forward Turn-On Time Reverse Recovery Time * Pulse Test: Pulse Width O (IS = 10.0 A, VGS = 0 V, dIS/dt = 100A/s) VSD ton trr ** 250 1.5 V ns ns LS 7.5 nH (VDS = 25 V, VGS = 0 V, f = 1.0 MHz) (VDD = 200 V, ID = 10.0 A, VGS = 10 V, RG = 10) * (VDS = 320 V, ID = 10.0 A, VGS = 10 V)* gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd LD 5.8 1570 230 55 25 37 75 31 46 10 23 4.5 63 mhos pF pF pF ns ns ns ns nC nC nC nH RDS(on) VDS(on) 0.55 6.0 V VGS(th) 2.0 4.0 V IGSSR 100 nA IGSSF IDSS 25 250 100 nA g A Symbol V(BR)DSS Min 400 Typ Max Units V 300s, Duty Cycle O 2% ** Negligible, Dominated by circuit inductance 2001/11/07 Draft Champion Microelectronic Corporation Page 2 CMT10N40 POWER MOSFET TYPICAL ELECTRICAL CHARACTERISTICS 2001/11/07 Draft Champion Microelectronic Corporation Page 3 CMT10N40 POWER MOSFET PACKAGE DIMENSION TO-220 D A c1 F E PIN 1: GATE PIN 2: DRAIN PIN 3: SOURCE E1 A A1 L1 b b1 c c1 D L E E1 e e1 F L b1 e1 e b A1 c Side View L1 Front View 2001/11/07 Draft Champion Microelectronic Corporation Page 4 CMT10N40 POWER MOSFET IMPORTANT NOTICE Champion Microelectronic Corporation (CMC) reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. CMC integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of CMC products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer's applications, the customer should provide adequate design and operating safeguards. HsinChu Headquarter 5F, No. 11, Park Avenue II, Science-Based Industrial Park, HsinChu City, Taiwan T E L : +886-3-567 9979 F A X : +886-3-567 9909 Sales & Marketing 11F, No. 306-3, SEC. 1, Ta Tung Road, Hsichih, Taipei Hsien 221, Taiwan T E L : +886-2-8692 1591 F A X : +886-2-8692 1596 2001/11/07 Draft Champion Microelectronic Corporation Page 5 |
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