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APL5501/2/3 Low IQ, Low Dropout 500mA Fixed Voltage Regulator Features * * * * * * * * * * * * * * * Low Noise : 50VRMS (100Hz to 100kHz) Low Quiescent Current : 50A (No load) Low Dropout Voltage : 170mV (@500mA) Very low Shutdown Current : < 0.5uA Fixed Output Voltage : 1.3V ~ 3.4V Stable with 4.7uF Output Capacitor Stable with Aluminum, Tantalum or Ceramic Capacitors Reverse Current Protection No Protection Diodes Needed Built in Thermal Protection Built in Current Limit Protection Controlled Short Circuit Current : 150mA Fast Transient Response Short Setting Time SOT-23-5, SOT-89, SOT-89-5, SOT-223, SO-8, TO-252 and TO-252-5 Packages Lead Free Available (RoHS Compliant) SOT-89 (Top View) SOT-89-5 (Top View) TAB is GND Design with an internal P-channel MOSFET pass transistor, the APL5501/2/3 maintains a low supply current, independent of the load current and dropout voltage. Other features include reverse current protection, thermal-shutdown protection, current limit protection to ensure specified output current and controlled short-circuit current. The APL5501/2/3 regulator comes in a miniature SOT-23-5, SOT-89, SOT89-5, SOT-223, SO-8, TO-252 and TO-252-5 packages. Pin Configuration APL5501 BP GND SHDN 5 1 2 3 4 2 3 1 V IN GND VOUT VOUT GND VIN * Applications * * * IN 1 2 3 4 8 7 6 5 OUT GND GND GND SHDN GND BYP SHDN 3 4 BP 2 Notebook Computer PDA or Portable Equipments Noise-Sensitive Instrumentation Systems VIN 1 5 V OUT GND General Description The APL5501/2/3 is micropower, low noise, low dropout linear regulator. Operate from 2.7V to 6V input voltage and deliver up to 500mA. Typical output noise is just 50VRMS with the addition of an external 0.1F bypass capacitor in BP pin and typical dropout voltage is only 170mV at 500mA loading . Designed for use in battery-powered system, the low 50uA quiescent current makes it an ideal choice. SO-8 (Top View) GND SOT-23-5 (Top View) VOUT BP GND SHDN VIN TAB is GND 1 2 3 VIN VOUT TO-252 (Top View) TO-252-5 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 1 www.anpec.com.tw 1 2 3 4 5 APL5501/2/3 Pin Configuration (Cont.) APL5501 TAB is GND APL5502 TAB is VIN APL5502 TAB is VIN APL5503 TAB is GND 1 2 3 1 2 3 1 2 3 1 2 3 VIN GND VOUT GND VIN VOUT GND VIN VOUT VOUT GND VIN SOT-223 (Top View) SOT-89 (Top View) SOT-223 (Top View) SOT-223 (Top View) Ordering and Marking Information APL5501/2/3 Lead Free Code Handling Code Temp. Range Package Code Voltage Code Package Code B : SOT-23-5 D : S OT-89 D5 : SOT-89-5 U : TO-252 U5 : TO-252-5 V : SOT-223 K : SO-8 Temp. Range C : 0 to 70 C Handling Code TR : Tape & Reel Voltage Code : 13 : 1.3V ~ 34 : 3.4V Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code , 13 - 1.3V APL5501/2/3 - 13 D/V/K : APL5501/2/3 XXXXX13 13 APL5501/2/3 XXXXX APL5501/2/3 - 13 U : XXXXX - Date Code , 13 - 1.3V Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. Marking Information SOT-23-5 package Product Name Marking Product Name APL5501-13B 517X APL5501-21B APL5501-14B 518X APL5501-22B APL5501-15B 519X APL5501-23B APL5501-16B 51AX APL5501-24B APL5501-17B 51BX APL5501-25B APL5501-18B 51CX APL5501-26B APL5501-19B 51DX APL5501-27B APL5501-20B 51EX The last character "X" in the marking is for data code. Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 2 Marking 51FX 51GX 51HX 51IX 51JX 51KX 51LX Product Name APL5501-28B APL5501-29B APL5501-30B APL5501-31B APL5501-32B APL5501-33B APL5501-34B Marking 51MX 51NX 51OX 51PX 51QX 51RX 51SX www.anpec.com.tw APL5501/2/3 Pin Description PIN Name VIN SHDN (Note1) No. 1 3 2 4 5 I/O I I Description Supply voltage input. t Shutdown control pin, low = off , high = normal. Don' leave open. Ground pins of the circuitry, and all ground pins must be soldered to PCB with proper power dissipation. Bypass signal pin in fixed output type device Output pin of the regulator. GND BP (Note1) VOUT O O Note1: These pins do not exist in 3-pin package. Absolute Maximum Ratings Symbol VIN, VOUT SHDN Parameter Input Voltage or Out Voltage Shutdown Control Pin Rating 6.5 6.5 SOT-89 : 180 SOT-223 : 135 SO-8 : 150 SOT-23-5 : 260 SOT-89 : 38 SOT-223 : 15 SO-8 :20 SOT-23-5 : 130 Internally Limited 0 to 125 0 to 150 -65 to +150 260 C C Unit V V RTH,JA Thermal Resistance - Junction to Ambient C/W RTH,JC Thermal Resistance - Junction to Case C/W W C PD TJ Power Dissipation Operating Junction Temperature Control Section Power Transistor Storage Temperature Range Lead Temperature (Soldering, 10 second) TSTG TL Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1F, COUT=4.7F, SHDN=VIN, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol VIN V OUT Parameter Input Voltage Output Voltage Test Conditions APL5501/2/3 Min. Typ. Max. 2.7 VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2% 3 Unit V V 6 VOUT VOUT +2% Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 www.anpec.com.tw APL5501/2/3 Electrical Characteristics Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1F, COUT=4.7F, SHDN=VIN, TJ=0 to 125C. Typical values refer to TJ=25C. Symbol ILIMIT ISHORT IOUT Parameter Circuit Current Limit Short Current Load Current VIN=4.3V V OUT=0V 500 V OUT+0.5V< V CC <6.0V, IOUT = 1mA V IN =V OUT +1.0V, 0mA< I OUT < IMAX 515X 1.3VVOUT<1.5V IOUT =500mA 1.5VVOUT<2V 2VVOUT<2.5V 2.5VVOUT<3.4V PSRR IQ Ripple Rejection Quiescent Current Shutdown Supply (Note3) Current (Note3) Test Conditions APL5501/2/3 Min. Typ. 0.7 200 4 1 0.1 1100 900 500 280 55 65 50 370 0.01 50 40 7 70 150 100 450 1 10 6 1300 1050 700 380 Max. Unit A mA mA mV mV % mV REG LINE Line Regulation REG LOAD Load Regulation VDROP Dropout Voltage (Note2) F1kHz, 1Vpp at V IN = VOUT +1.0V C load No =10nf IOUT=500mA Shutdown = low IOUT =0, V CC =6.0V 100Hz A Vrms Noise Shutdown Recovery (Note3) Delay OTS Over Temperature Shutdown Over Temperature Shutdown Hysteresis TC C OUT Output Voltage Temperature Coefficient Output Capacitor ESR Shutdown Input (Note3) Threshold Shutdown input Bias (Note3) current Input Reverse Leakage current Reverse Protection Threshold ms C C ppm/ C 5.2 1 1.6 100 0.5 50 F Ohm V nA A mV Hysteries 10 50 4.2 0.02 V OUT+1.0V< V IN <6.0V V SHDN =VIN VOUT-VIN=0.1V 0.4 4.7 0.1 0.7 0.01 0.1 11 ISHDN Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V Note 3 : For 5-pin devices only. Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 4 www.anpec.com.tw APL5501/2/3 Application Circuit INPUT 2.7V to 6V VIN APL5501/2/3 on off SHDN GND VOUT VOUT BP COUT 4.7uF CIN 1uF CBP 0.1uF Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 5 www.anpec.com.tw APL5501/2/3 Typical Characteristics 3 APL5501/2/3-33 Ground Pin Current vs. Load Current (uA) Current Limit vs. Input Voltage Ground Pin Current vs. Output Current 400 350 300 250 200 150 100 50 0 0 150 300 450 600 750 900 APL5501/2/3-33 2.5 Current Limit (mA) 2 1.5 1 0.5 0 3.5 4 4.5 5 5.5 6 Input Voltage (V) Output Current (mA) Ground Pin Current vs. Load Current (uA) Ground Pin Current vs. Input Voltage 350 300 APL5501/2/3-33 Input Voltage vs. Output Voltage 3.5 3 APL5501/2/3-33 Output Voltage (V) 250 200 150 100 50 0 0 1 2 3 4 5 6 2.5 2 1.5 1 0.5 0 0 1 2 3 4 5 6 Input Voltage (V) Input Voltage (V) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 6 www.anpec.com.tw APL5501/2/3 Typical Characteristics Dropout Voltage vs. Output Current 1200 1100 1000 Output Current vs. Output Voltage 0 APL5501/2/3-33 VOUT=1.5V VOUT=1.8V -2 Dropout Voltage (mV) 900 800 700 600 500 400 300 200 100 0 0 100 200 300 400 500 Output Current (uA) -4 VIN=0V -6 VOUT=3.3V VOUT=2.5V -8 -10 -12 0 0.5 1 1.5 2 2.5 3 Output Current (mA) Output Voltage (V) SHDN Threshold Voltage vs. Input Voltage 1 APL5501/2/3-33 PSRR vs. Frequency APL5501/2/3-33 +0 SHDN Threshold Voltage (V) 0.9 -10 -20 0.8 PSRR (dB) VIN=0V -30 -40 -50 -60 -70 VIN=4V IOUT =50mA COUT=10uF CBP=0.1uF 0.7 0.6 0.5 -80 -90 VIN=5V 0.4 3 3.5 4 4.5 5 5.5 6 -100 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k 200k Input Voltage (V) Frequency (HZ) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 7 www.anpec.com.tw APL5501/2/3 Typical Characteristics Output Noise 100u APL5501/2/3-33 Output Noise vs. Bypass Capacitor 500 450 400 VIN=4.3V 80u IOUT =0mA COUT=10uF 60u CBP=0.1uF VOUT (50uV/div) 20u 0 -20u -40u -60u -80u Output Noise (uV) 0 2m 4m 6m 8m 10m 40u 350 300 250 200 150 100 50 0 0 0.1 0.2 0.3 0.4 -100u Time (s) Bypass Capacitor (uF) Shutdown Exit Delay APL5501/2/3-33 Shutdown Exit Delay APL5501/2/3-33 3.3V 3.3V VOUT 0V VOUT CBP=10nF No Load 0V 4V 4V vSHDN CBP=100nF No Load vSHDN 0V 0V Time (1ms/div) Time (20ms/div) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 8 www.anpec.com.tw APL5501/2/3 Typical Characteristics Entering Shutdown APL5501/2/3-33 Region of Stable ESR vs. Load Current 1 APL5501/2/3-33 3.3V VOUT 0.1 VOUT=3.3V COUT=1F No Load 0V 4V COUT ESR () stable 0.01 unstable 0V 0.001 0 150 300 450 600 750 900 Time (200ms/div) Load Current (mA) Output Voltage vs. Temperature 3.35 APL5501/2/3-33 Line-Transient Response APL5901/2-33 Output Voltage (20mV/div) 3.33 VIN 4V 3V Output Voltage (V) 3.31 3.29 VOUT 3.27 3.25 -40 0 40 80 120 Temperature (C ) Time (40s/div) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 9 www.anpec.com.tw APL5501/2/3 Typical Characteristics Load-Transient Response APL5501/2/3-33 Output Voltage (50mV/div) VOUT COUT=1F VIN=VOUT+1V IOUT=1mA~500mA Time (10s/div) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 10 www.anpec.com.tw APL5501/2/3 Application Information Capacitor Selection and Regulator Stability The APL5501/2/3 use at least a 1uF capacitor on the input, and this capacitor can be Aluminum, Tantalum or Ceramic capacitor. The input capacitor with larger value and lower ESR provides better PSRR and linetransient response. The output capacitor also can use Aluminum, Tantalum or Ceramic capacitor, and a minimum v alue of 1uF and ESR abov e 0.06 is recommended. The curve of the stable region in typical characteristics shows the appropriate output capacitor ESR for different load current stable operation. A larger output capacitor can reduce noise and improve load-transient response, stability, and PSRR. Note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. When using this capacitor, a minimum 10uF or more may be required to ensure the stability at low temperature operation. Use a bypass capacitor at BP pin for low output nvise. Increasing the capacitance will slightly decrease the output noise, but increase the start-up time. end-of-life battery voltage. Because the APL5501/2/3 use a p-channel MOSFET pass transistor, the dropout voltage is a function of drain-to-source on-resistance (RDS(ON)) multiplied by the load current. Reverse Current Protection The APL5501/2/3 have an internal reverse protection, it does not need an external schottky diode to connect the regulator input and output. If the output voltage is forced above the input voltage by more than 11mV, the IC will be shutdown and the ground pin current is below 0.1uA. Shutdown/Enable The APL5501/2/3 have an active high enable function. Force EN high (>1.6V) enables the regulator, EN low (<0.4V) disables the regulator and enter the shutdown mode. In shutdown mode, the quiescent current can reduce below 1uA. The EN pin cannot be floating, a floating EN pin may cause an indeterminate state on the output. If it is no use, connect to VIN for normal operation. Load-Transient Considerations The APL5501/2/3 load-transient response graphs in typical characteristics show the transient response. A step change in the load current from 0mA to 500mA at 1us will cause a 100mV transient spike. Larger output capacitor and lower ESR can reduce transient spike. Current Limit The APL5501/2/3 have a current limit protection. The ouptut voltage will drop close to zero volt, when load current reaches the limit, and then the load current will be limited at 150mA after output voltage is below 0.7V. When the load current back to the value where limiting started, the output voltage and current will return to normal value. When output is shorted to ground, the APL5501/2/3 will keep short circuit current at 150mA . 11 www.anpec.com.tw Input-Output (Dropout)Voltage The minimum input-output voltage difference (dropout) determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 APL5501/2/3 Thermal Protection Thermal protection limits total power dissipation in the device. When the junction temperature exceeds TJ=+150J, the thermal sensor generates a logic signal to turn off the pass transistor and allows IC to cool. When the IC' junction temperature is down by s 10J, the thermal sensor will turn the pass transistor on again, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the APL5501/2/3 in the event of fault conditions. For continuous operation, do not exceed the absolute maximum junction temperature of TJ=+150J. Operating Region and Power Dissipation The thermal resistance of the case to circuit board, and the rate of air flow all control the APL5501/2/3' s maximum power dissipation. The power dissipation across the device is PD = IOUT (VIN-VOUT) and the maximum power dissipation is: PDMAX = (TJ-T A) / (c JC + c CA) where TJ-TA is the temperature difference between the junction and ambient air, c JC is the thermal resistance of the package, and c CA is the thermal resistance through the printed circuit board, copper traces, and other materials to the ambient air. The GND pin of the APL5501/3 provide an electrical connection to ground and channeling heat away. If power dissipation is large, connect the GND pin to ground using a large pad or ground plane, can improve the problem of over heat of IC. Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 12 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-23-5 e1 5 4 E1 E 1 2 3 e b D A2 A a L1 A1 L2 L Dim A A1 A2 D E E1 L L1 L2 N Millimeters Min. 0.95 0.05 0.90 2.8 2.6 1.5 0.35 0.20 BSC 0.5 5 0 10 0 0.7 0.020 Max. 1.45 0.15 1.30 3.00 3.00 1.70 0.55 Min. 0.037 0.002 0.035 0.110 0.102 0.059 0.014 Inches Max. 0.057 0.006 0.051 0 . 11 8 0 . 11 8 0.067 0.022 0.008 BSC 0.028 5 10 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 13 www.anpec.com.tw APL5501/2/3 Packaging Information SOP-8 pin ( Reference JEDEC Registration MS-012) E H e1 D e2 A1 A 1 L 0.004max. Dim A A1 D E H L e1 e2 1 Millimeters Min. 1.35 0.10 4.80 3.80 5.80 0.40 0.33 1.27BSC 8 Max. 1.75 0.25 5.00 4.00 6.20 1.27 0.51 Min. 0.053 0.004 0.189 0.150 0.228 0.016 0.013 0.015X45 Inches Max. 0.069 0.010 0.197 0.157 0.244 0.050 0.020 0.50BSC 8 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 14 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-223( Reference JEDEC Registration SOT-223) D B1 A c a H E L K e e1 b A1 B Dim A A1 B B1 c D E e e1 H L K Min. 1.50 0.02 0.60 2.90 0.28 6.30 3.30 Millimeters Max. 1.80 0.08 0.80 3.10 0.32 6.70 3.70 2.3 BSC 4.6 BSC 6.70 0.91 1.50 0 13 15 Inches Min. 0.06 0.02 0.11 0.01 0.25 0.13 0.09 BSC 0.18 BSC 7.30 1.10 2.00 10 0.26 0.04 0.06 0 13 www.anpec.com.tw Max. 0.07 0.03 0.12 0.01 0.26 0.15 0.29 0.04 0.08 10 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 APL5501/2/3 Packaging Information SOT-89 (Reference EIAJ ED-7500A Reg stration SC-62) D D1 a E H 1 2 3 L B1 B e e1 C A a Dim A B B1 C D D1 e e1 E H L Millimeters Min. 1.40 0.40 0.35 0.35 4.40 1.35 1.50 BSC 3.00 BSC 2.29 3.75 0.80 2.60 4.25 1.20 10 0.090 0.148 0.031 Max. 1.60 0.56 0.48 0.44 4.60 1.83 Min. 0.055 0.016 0.014 0.014 0.173 0.053 Inches Max. 0.063 0.022 0.019 0.017 0.181 0.072 0.059 BSC 0.118 BSC 0.102 0.167 0.047 10 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 16 www.anpec.com.tw APL5501/2/3 Packaging Information SOT-89-5 Dim A B C D E F G H I J K L Millimeters Min. 4.40 4.05 1.50 1.30 2.40 0.80 3.00 REF 1.50 REF 0.40 1.40 0.35 5 TYP 0.52 1.60 0.41 0.01 0.05 0.01 Max. 4.60 4.25 1.70 1.50 2.60 Min. 0.17 0.16 0.06 0.05 0.09 0.03 Inches Max. 0.18 0.17 0.07 0.06 0.1 0.12 REF 0.06 REF 0.02 0.06 0.02 0.2 TYP Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 17 www.anpec.com.tw APL5501/2/3 Packaging Information TO-252( Reference JEDEC Registration TO-252) E b2 L2 A C1 D H L1 L b e1 C A1 Dim A A1 b b2 C C1 D E e1 H L L1 L2 Rev. B.2 - May., 2005 Millimeters Min. 2.18 0.89 0.508 5.207 0.46 0.46 5.334 6.35 3.96 9.398 0.51 0.64 0.89 1.02 2.032 18 Inches Max. 2.39 1.27 0.89 5.461 0.58 0.58 6.22 6.73 5.18 10.41 Min. 0.086 0.035 0.020 0.205 0.018 0.018 0.210 0.250 0.156 0.370 0.020 0.025 0.035 0.040 0.080 www.anpec.com.tw Max. 0.094 0.050 0.035 0.215 0.023 0.023 0.245 0.265 0.204 0.410 Copyright (c) ANPEC Electronics Corp. APL5501/2/3 Packaging Information TO-252-5 A B H J M D C L S P K Dim A B C D P S H J K L M Millimeters Min. 6.40 5.20 6.80 2.20 1.27 REF 0.50 2.20 0.45 0 0.90 5.40 0.80 2.40 0.55 0.15 1.50 5.80 0.02 0.08 0.01 0 0.03 0.21 Max. 6.80 5.50 7.20 2.80 Min. 0.25 0.20 0.26 0.08 Inches Max. 0.26 0.21 0.27 0.11 0.05 REF 0.03 0.09 0.02 0.006 0.06 0.22 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 19 www.anpec.com.tw APL5501/2/3 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition TP (IR/Convection or VPR Reflow) tp Critical Zone T L to T P Ramp-up Temperature TL Tsmax tL Tsmin Ramp-down ts Preheat 25 t 25 C to Peak Time Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. (mm) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 20 www.anpec.com.tw APL5501/2/3 Classification Reflow Profiles(Cont.) Table 1. SnPb Entectic Process - Package Peak Reflow Temperature s 3 3 Package Thickness Volume mm Volume mm <350 350 <2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C, 5 SEC 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 100mA Carrier Tape & Reel Dimensions t P P1 D Po E F W Bo Ao Ko D1 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 21 www.anpec.com.tw APL5501/2/3 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Reel Dimensions Application A 330 1 SOP- 8 F 5.5 1 Application A 178 1 SOT-89 F 5.5 0.05 Application A 3301 SOT-223 F 5.5 0.05 Application A 330 3 TO-252 F 7.5 0.1 B 62 +1.5 D 1.55 +0.1 B 70 2 D 1.5 0.1 B 621.5 D 1.5+ 0.1 B 100 2 D 1.5 +0.1 C 12.75+ 0.15 D1 1.55+ 0.25 C 13.5 0.15 D1 1.5 0.1 C 12.75 0.15 D1 1.5+ 0.1 C 13 0. 5 D1 1.5 0.25 J 2 0.5 Po 4.0 0.1 J 3 0.15 Po 4.0 0.1 J 2 0.6 Po 4.0 0.1 J 2 0.5 Po 4.0 0.1 T1 12.4 0.2 P1 2.0 0.1 T1 14 2 P1 2.0 0.1 T1 12.4 +0.2 P1 2.0 0.05 T1 16.4 + 0.3 -0.2 P1 2.0 0.1 T2 2 0.2 Ao 6.4 0.1 T2 1.3 0.3 Ao 4.8 0.1 T2 2 0.2 Ao 6.9 0.1 T2 2.5 0.5 Ao 6.8 0.1 W 12 0. 3 Bo 5.2 0. 1 W 12 + 0.3 12 - 0.1 Bo 4.5 0.1 W 12 0.3 Bo 7.5 0.1 W 16+ 0.3 - 0.1 Bo 10.4 0.1 P 8 0.1 Ko 2.1 0.1 P 8 0.1 Ko 1.80 0.1 P 8 0.1 Ko 2.1 0.1 P 8 0.1 Ko 2.5 0.1 E 1.75 0.1 t 0.3 0.013 E 1.75 0.1 t 0.3 0.013 E 1.75 0.1 t 0.3 0.05 E 1.75 0.1 t 0.3 0.05 (mm) Cover Tape Dimensions Application SOP- 8 SOT- 89 SOT- 223 TO- 252 Carrier Width 12 12 12 16 Cover Tape Width 9.3 9.3 9.3 13.3 Devices Per Reel 2500 1000 2500 2500 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 22 www.anpec.com.tw APL5501/2/3 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - May., 2005 23 www.anpec.com.tw |
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