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| www..com Crystal unit THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT MC-206 Product number (please refer to page 1) Q1 xMC2 0 6 x x x x x 0 0 * High-density mounting-type SMD of Max. 2.0 mm thickness. * High heat resistance allows reflow soldering. * Excellent environmental capability. Actual size Specifications (characteristics) Item Symbol f TSTG TOPR GL f/f T a CL R1 C1 C0 IR fa S.R. 55 k Max. 1.8 fF Typ. 0.9 pF Typ. 500 M Min. 3 x 10-6 / year Max. 5 x 10-6 / year Max. Ta= +25 C 3 C, first year 32.768 kHz Specifications 32.000 kHz to 100.000 kHz -55 C to +125 C -40 C to +85 C 1.0 W Max. 20 x 10-6, 50 x 10-6 50 x 10-6, 100 x 10-6 Ta=+25 C, DL=0.1 W Stored as bare product after unpacking Remarks Nominal frequency Temperature range Storage temperature Operating temperature Maximum drive level Frequency tolerance (standard) Peak temperature (frequency) Temperature coefficient (frequency) Load capacitance Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging Shock resistance +25 C 5 C -0.04 x 10-6 / C2 Max. 7 pF, 12.5 pF 50 k to 20 k 3.0 fF Max. 1.5 pF Max. Please specify As per below table 5 x 10-6 Max. Three drops on a hard board from 750 mm or excitation test with 29400 m/s2 x 0.3 ms x 1/2 sine wave x 3 directions Series resistance Frequency (kHz) Series resistance () 32 f < 38 50 k Max. 38 f < 65.536 40 k Max. 65.536 f < 75 25 k Max. 75 f 100 20 k Max. External dimensions 7.3 Max. #4 #3 (Unit: mm) Recommended soldering pattern 1.2 3.88 1.2 (Unit: mm) Internal connection #4 #3 E. A. 67 #1 #2 2.5 4.1 #1 #2 2.0 Max. 0.4 5.08 1.8 0.4 Do not connect #2 and #3 to external device. Metal may be exposed on the top or bottom of this product. This won't affect any quality, reliability or electrical spec. 1.3 2.4 1.3 18 DataSheet 4 U .com |
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