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a
15 kV ESD Protected, 2.7 V to 3.6 V Serial Port Transceivers with Green IdleTM ADM3307E/ADM3310E/ADM3311E/ADM3312E/ADM3315E*
The active receiver can alert the processor, which can then take the ADM33xxE device out of the shutdown mode. The ADM3307E contains five drivers and three receivers and is intended for mobile phone data lump cables and portable computing applications. The ADM3311E contains three drivers and five receivers and is intended for serial port applications on notebook/laptop computers. The ADM3310E is a low current version of the ADM3311E. This device also allows two receivers to be active in shutdown mode. The ADM3312E contains three drivers and three receivers and is intended for serial port applications, PDAs, mobile phone data lump cables, and other hand-held devices. The ADM3315E is a low current version of the ADM3312E, with a 22 k receiver input resistance that reduces the drive requirements of the DTE. Its main applications are PDAs, palmtop computers, and mobile phone data lump cables. The ADM33xxE devices are fabricated using CMOS technology for minimal power consumption. All parts feature a high level of overvoltage protection and latch-up immunity. All ADM33xxE devices are available in a 32-lead 5 mm x 5 mm LFCSP package and in a TSSOP package (ADM3307E, ADM3310E, and ADM3311E in a 28-lead TSSOP; ADM3312E and ADM3315E in a 24-lead TSSOP). The ADM3311E also comes in a 28-lead SSOP package. The ADM33xxE devices are ruggedized RS-232 line drivers/ receivers that operate from a single supply of 2.7 V to 3.6 V. Step-up voltage converters coupled with level shifting transmitters and receivers allow RS-232 levels to be developed while operating from a single supply. Features include low power consumption, Green Idle operation, high transmission rates, and compatibility with the EU directive on electromagnetic compatibility. This EM compatibility directive includes protection against radiated and conducted interference, including high levels of electrostatic discharge. All RS-232 (and CMOS, SD, and EN for ADM3307E) inputs and outputs are protected against electrostatic discharges (up to 15 kV). This ensures compliance with IEC 1000-4-2 requirements. These devices are ideally suited for operation in electrically harsh environments or where RS-232 cables are frequently being plugged/unplugged. They are also immune to high RF field strengths without special shielding precautions. Emissions are also controlled to within very strict limits. CMOS technology is used to keep the power dissipation to an absolute minimum, allowing maximum battery life in portable applications.
FEATURES Green Idle Power-Saving Mode Single 2.7 V to 3.6 V Power Supply Operates with 3 V Logic 0.1 F to 1 F Charge Pump Capacitors Low EMI Low Power Shutdown: 20 nA Full RS-232 Compliance 460 kbits/s Data Rate One Receiver Active in Shutdown (Two for ADM3310E) ESD >15 kV IEC 1000-4-2 on RS-232 I/Os (ADM33xxE) ESD >15 kV IEC 1000-4-2 on CMOS and RS-232 I/Os (ADM3307E) APPLICATIONS Mobile Phone Handsets/Data Cables Laptop and Notebook Computers Printers Peripherals Modems PDAs/Hand-Held Devices/Palmtop Computers GENERAL DESCRIPTION
The ADM33xxE line of driver/receiver products is designed to fully meet the EIA-232 standard while operating with a single 2.7 V to 3.6 V power supply. The devices feature an on-board, charge pump, dc-to-dc converter, eliminating the need for dual power supplies. This dc-to-dc converter contains a voltage tripler and voltage inverter that internally generates positive and negative supplies from the input 3 V power supply. The dc-to-dc converter operates in Green Idle Mode, whereby the charge pump oscillator is gated ON and OFF to maintain the output voltage at 7.25 V under varying load conditions. This minimizes the power consumption and makes these products ideal for battery-powered portable devices. The ADM33xxE devices are suitable for operation in harsh electrical environments and contain ESD protection up to 15 kV on their RS-232 lines (ADM3310E, ADM3311E, ADM3312E, and ADM3315E). The ADM3307E contains ESD protection up to 15 kV on all I/O lines (CMOS, RS-232, EN, and SD). A shutdown facility that reduces the power consumption to 66 nW is also provided. While in shutdown, one receiver remains active (two receivers active with ADM3310E), thereby allowing monitoring of peripheral devices. This feature allows the device to be shut down until a peripheral device begins communication.
*Protected by U.S.Patent No. 5,606,491. Green Idle is a trademark of Analog Devices, Inc.
REV. F
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2002
ADM33xxE
FUNCTIONAL BLOCK DIAGRAMS
C1 0.1 F C2
C1 0.1 F
0.1 F
C4 0.1 F VCC
C3 0.1 F
VCC
0.1 F CERAMIC
V C2+
VOLTAGE
C4 0.1 F
C3+ GND
INVERTER V- 3V TO 9V C1-
10 F TANTALUM ENABLE INPUT SHUTDOWN INPUT
VOLTAGE C2+ VCC TRIPLER/ C3+ INVERTER 3V TO C1+ C2 9V C1 C3- V EN SD V- GND
T1 T2
C3 0.1 F C5 0.1 F
C2 0.1 F 0.1 F CERAMIC ENABLE INPUT T1IN CMOS INPUTS1 T2IN T3IN R1OUT R2OUT CMOS OUTPUTS R3OUT R4OUT R5OUT
VCC TRIPLER / C3- C2 EN
10 F TANTALUM
C5 0.1 F T1OUT T2OUT T3OUT T4OUT T5OUT EIA/TIA-232 OUTPUTS
C1+
T1 T2
SD T1OUT T2OUT T3OUT
R1 R2 R3 R4 R5
SHUTDOWN INPUT
T1IN T2IN
EIA/TIA-232 OUTPUTS
CMOS INPUTS1
T3
T3IN T4IN T5IN R1OUT
T3 T4
R1IN R2IN R3IN R4IN R5IN EIA/TIA-232 INPUTS2
T5 R1 R2 R3
R1OUT R2OUT R3OUT EIA/TIA-232 INPUTS2
CMOS OUTPUTS
R2OUT R3OUT
ADM3307E
NOTES 1INTERNAL 400 k PULL-UP RESISTOR ON EACH CMOS INPUT. 2INTERNAL 5 k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
ADM3310E/ ADM3311E
NOTES 1INTERNAL 400 k PULL-UP RESISTOR ON EACH CMOS INPUT. 2INTERNAL 5 k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
C1 0.1 F C4 0.1 F VCC 10 F TANTALUM 0.1 F CERAMIC ENABLE INPUT T1IN CMOS INPUTS1 T2IN T3IN R1OUT CMOS OUTPUTS R2OUT R3OUT C2 0.1 F V C2+
VOLTAGE INVERTER 3V TO 9V
C3+ GND
C3 0.1 F C5 0.1 F
VCC TRIPLER / C3- C2 EN C1+
T1 T2
V- C1- SD
SHUTDOWN INPUT T1OUT T2OUT T3OUT EIA/TIA-232 OUTPUTS
T3 R1 R2 R3
R1IN R2IN R3IN EIA/TIA-232 INPUTS2
ADM3312E/ ADM3315E
NOTES 1INTERNAL 400 k PULL-UP RESISTOR ON EACH CMOS INPUT. 2INTERNAL 5 k (22 k FOR ADM3315E) PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
-2-
REV. F
ADM33xxE
SPECIFICATIONS (V
Parameter Operating Voltage Range VCC Power Supply Current ADM3307E ADM3311E, ADM3312E
CC
= 2.7 V to 3.6 V, C1-C5 = 0.1 F. All specifications TMIN to TMAX, unless otherwise noted.)
Min 2.7 Typ 3.3 0.75 0.75 0.45 0.45 Max 3.6 1.5 4.5 1 4.5 0.85 35 1 25 1 0.8 0.4 0.4 VCC - 0.6 0.04 0.05 +7.25 -7.25 +6.5 -6.5 -25 0.4 +25 1.3 2.0 0.14 5 22 2.4 1 5 Unit V mA mA mA mA mA mA A A A V V V V V A A V V V V V V V V k k TIN = GND TIN, EN, SHDN TIN, EN, SHDN; VCC = 2.7 V TIN, EN, SHDN IOUT = 1.6 mA IOUT = -200 A EN = VCC, 0 V < ROUT < VCC EN = VCC, 0 V < ROUT < VCC No Load No Load No Load No Load VCC = 3.0 V to 3.6 V; No Load VCC = 2.7 V to 3.6 V; No Load No Load; VCC = 3.0 V to 3.6 V; TA = 0C to 85C No Load; VCC = 2.7 V to 3.6 V; TA = - 40C to +85C VCC = 2.7 V to 3.6 V; No Load RL = 3 k to GND on all TOUTS Test Conditions/Comments
ADM3310E, ADM3315E ADM3310E, ADM3311E, ADM3312E, ADM3315E Shutdown Supply Current Input Pull-Up Current Input Leakage Current, SD, EN Input Logic Threshold Low, VINL Input Logic Threshold High, VINH CMOS Output Voltage Low, VOL CMOS Output Voltage High, VOH CMOS Output Leakage Current ADM3307E ADM3310E, ADM3311E ADM3312E, ADM3315E Charge Pump Output Voltage, V+ ADM3307E, ADM3311E, ADM3312E Charge Pump Output Voltage, V- ADM3307E, ADM3311E, ADM3312E Charge Pump Output Voltage, V+ ADM3310E, ADM3315E Charge Pump Output Voltage, V- ADM3310E, ADM3315E EIA-232 Input Voltage Range EIA-232 Input Threshold Low EIA-232 Input Threshold High EIA-232 Input Hysteresis EIA-232 Input Resistance ADM3307E, ADM3310E, ADM3311E, ADM3312E ADM3315E 2.0
0.35
0.02 10 0.02
3 14
7 31
REV. F
-3-
ADM33xxE SPECIFICATIONS (continued)
Parameter Output Voltage Swing ADM3310E, ADM3315E ADM3307E, ADM3311E, ADM3312 5.0 Min Typ 5.0 6.4 5.5 Max 5.5 Unit V V V mA kbps kbps kbps s s ns ns ns V/s kV kV kV Test Conditions/Comments All Transmitter Outputs Loaded with 3 k to Ground (VCC = 3.0 V) (VCC = 2.7 V) All Transmitter Outputs Loaded with 3 k to Ground VCC = 0 V, VOUT = 2 V
Transmitter Output Resistance RS-232 Output Short Circuit Current Maximum Data Rate ADM3307E
300 15 250 460 720 920 460 0.3 0.17 100 300 500 18 15 15 8 60
ADM3310E, ADM3311E, ADM3312E ADM3315E Receiver Propagation Delay, TPHL, TPLH Receiver Output Enable Time, tER Receiver Output Disable Time, tDR Transmitter Propagation Delay, TPHL, TPLH Transition Region Slew Rate ESD PROTECTION (I/O PINS)
250
RL = 3 k to 7 k, CL = 50 pF to 1000 pF, VCC = 2.7 V RL = 3 k to 7 k, CL = 50 pF to 1000 pF, VCC = 3.0 V RL = 3 k to 7 k, CL = 50 pF to 1000 pF, VCC = 3.0 V CL = 150 pF CL = 150 pF; ADM3307E Only RL = 3 k, CL = 1000 pF RL = 3 k, CL = 50 pF to 1000 pF1 Human Body Model IEC 1000-4-2 Air Discharge IEC 1000-4-2 Contact Discharge2
1
3
NOTES 1 Measured at +3 V to -3 V or -3 V to +3 V. 2 Includes CMOS I/O, SD, and EN for ADM3307E. Specification subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(TA = 25C, unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +4 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC - 0.3 V) to +9 V V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -9 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +6 V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V ROUT . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Thermal Impedance, JA CP-32 LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 32.5C/W RU-28 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . 68.0C/W RU-24 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . 68.0C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76.0C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . 300C ESD Rating (IEC 1000-4-2 Air) (RS-232 I/Os) . . . . . . . 15 kV ESD Rating (IEC 1000-4-2 Contact) (RS-232 I/Os) . . . . 8 kV
*This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
-4-
REV. F
ADM33xxE
PRODUCT SELECTION GUIDE
Generic Voltage ADM3307E
Supply 2.7 V to 3.6 V
Tx 5
Rx 3
No. Rx Active in SD 1
Speed 1 Mbps
15 kV ESD
ICC Max
ICC Shutdown Max* 1 A
Additional Features 15 kV ESD Protection CMOS on RS-232 and CMOS I/Os Including SD and EN Pins. 2 Rxs Active in Shutdown. Green Idle Mode Level 6 V. Low power ADM3311E.
RS-232 1.5 mA CMOS EN and SD RS-232
ADM3310E
2.7 V to 3.6 V
3
5
2
460 kbps
0.85 mA 1 A
ADM3311E ADM3312E ADM3315E
2.7 V to 3.6 V 2.7 V to 3.6 V 2.7 V to 3.6 V
3 3 3
5 3 3
1 1 1
460 kbps RS-232 460 kbps RS-232 460 kbps RS-232
1 mA 1 A 1 mA 1 A 0.85 mA 1 A
22 k Rx I/P Resistance. Green Idle Mode Level 6 V. Low power ADM3312E.
*ICC Shutdown is 20 nA typically.
ORDERING GUIDE
Model ADM3307EARU ADM3307EACP ADM3310EARU ADM3310EACP ADM3311EARS ADM3311EARU ADM3311EACP ADM3312EARU ADM3312EACP ADM3315EARU ADM3315EACP
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description 28-Lead Thin Shrink Small Outline (TSSOP) 32-Lead 5 mm x 5 mm Lead Frame Chip Scale Package (LFCSP) 28-Lead Thin Shrink Small Outline (TSSOP) 32-Lead 5 mm x 5 mm Lead Frame Chip Scale Package (LFCSP) 28-Lead Shrink Small Outline (SSOP) 28-Lead Thin Shrink Small Outline (TSSOP) 32-Lead 5 mm x 5 mm Lead Frame Chip Scale Package (LFCSP) 24-Lead Thin Shrink Small Outline (TSSOP) 32-Lead 5 mm x 5 mm Lead Frame Chip Scale Package (LFCSP) 24-Lead Thin Shrink Small Outline (TSSOP) 32-Lead 5 mm x 5 mm Lead Frame Chip Scale Package (LFCSP)
Package Option RU-28 CP-32 RU-28 CP-32 RS-28 RU-28 CP-32 RU-24 CP-32 RU-24 CP-32
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADM33xxE features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. F
-5-
ADM33xxE
PIN CONFIGURATIONS
V VCC
32 C1- 31 C2- 30 VCC 29 V+ 28 C2+ 27 C3+ 26 C1+ 25 C3-
1 2 3 4 5 6 7 8 9 TOP VIEW (Not to Scale)
28 C2 27 C3 26 C1 25 C3
C2 C1
24 23 22 21
EN SD NC T1IN T2IN T3IN T4IN T5IN
1 2 3 4 5 6 7 8
PIN 1 IDENTIFIER
ADM3307E
TOP VIEW (Not to Scale)
V- GND GND T1OUT 20 T2OUT 19 T3OUT 18 T4OUT 17 T5OUT
EN SD T1IN T2IN T3IN
ADM3307E
24 V 23 GND 22 T1OUT 21 T2OUT 20 T3OUT 19 T4OUT 18 T5OUT 17 R1IN 16 R2IN 15 R3IN
T4IN 10 T5IN 11 R1OUT 12 R2OUT 13 R3OUT 14
10 11
12
13
14
NC R1OUT R2OUT R3OUT
NC R3IN R2IN R1IN
15 16
9
ADM3307E
V C2
27 GND 32 C2- 31 VCC 30 C2+ 29 V+ 28 C3+ 26 C3- 25 V-
1 2 3 4 5 6 7 8 9 TOP VIEW (Not to Scale)
28 C3 27 GND 26 C3 25 V
VCC C2
24 23 22 21 20 19 18 17
EN C1+ NC T1IN T2IN T3IN R1OUT R2OUT
1 2 3 4 5 6 7 8
PIN 1 IDENTIFIER
ADM3310E/ ADM3311E
TOP VIEW (Not to Scale)
C1- SD NC T1OUT T2OUT T3OUT R1IN R2IN
EN C1 T1IN T2IN T3IN
ADM3310E/ ADM3311E
24 C1 23 SD
22 T1OUT 21 T2OUT 20 T3OUT 19 R1IN 18 R2IN 17 R3IN 16 R4IN 15 R5IN
R3OUT 9 R4OUT 10 R5OUT 11
12
NC NC R5IN R4IN R3IN
15 16
13
14
R1OUT 10 R2OUT 11 R3OUT 12 R4OUT 13 R5OUT 14
ADM3310E/ADM3311E
V
27 GND 32 C2- 31 VCC 30 C2+ 29 V+ 28 C3+ 26 C3- 25 V-
1 2 3 4 5 6 7 8 9 TOP VIEW (Not to Scale)
24 C3 23 GND 22 C3 21 V
C2 VCC C2
24 23 22 21 20 19 18 17
EN C1+ NC T1IN T2IN T3IN
1 2 3 4 5 6
PIN 1 IDENTIFIER
ADM3312E/ ADM3315E
TOP VIEW (Not to Scale)
NC 7 NC 8
C1- SD NC T1OUT T2OUT T3OUT NC NC
EN C1 T1IN T2IN T3IN
ADM3312E/ ADM3315E
20 C1 19 SD 18 T1OUT 17 T2OUT 16 T3OUT 15 R1IN 14 R2IN 13 R3IN
R1OUT 9 R2OUT 10 R3OUT 11
15 16
13
12
14
NC NC R3IN R2IN R1IN
R1OUT 10 R2OUT 11 R3OUT 12
ADM3312E/ADM3315E
-6-
REV. F
ADM33xxE
PIN FUNCTION DESCRIPTION
Mnemonic VCC V+ V- GND C1+, C1- C2+, C2- C3+, C3- TIN TOUT RIN ROUT EN SD
Function Power Supply Input 2.7 V to 3.6 V Internally generated positive supply 7.25 V (6.5 V nominal for ADM3310E, ADM3315E). Capacitor C4 is connected between VCC and V+. Internally generated positive supply -7.25 V (-6.5 V nominal for ADM3310E, ADM3315E). Capacitor C5 is connected between GND and V-. Ground Pin. Must be connected to 0 V. External Capacitor 1 is connected between these pins. A 0.1 F capacitor is recommended but larger capacitors up to 1 F may be used. External Capacitor 2 is connected between these pins. A 0.1 F capacitor is recommended but larger capacitors up to 1 F may be used. External Capacitor 3 is connected between these pins. A 0.1 F capacitor is recommended but larger capacitors up to 1 F may be used. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 k pull-up resistor to VCC is connected on each input. Transmitter (Driver) Outputs. Typically 5.5 V ( 6.4 V for ADM3311E and ADM3312E) Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 k pull-down resistor (22 k for ADM3315E) to GND is connected on each of these inputs. Receiver Outputs. These are TTL/CMOS levels. Receiver Enable. A high level three-states all the receiver outputs. Shutdown Control. A high level will disable the charge pump and reduce the quiescent current to less than 1 A. All transmitters and most receivers are disabled. One receiver remains active in shutdown (two receivers active in shutdown for the ADM3310E). * ADM3307E ROUT3 active in shutdown * ADM3310E ROUT4 and ROUT5 active in shutdown * ADM3311E ROUT5 active in shutdown * ADM3312E ROUT3 active in shutdown * ADM3315E ROUT3 active in shutdown
Table I. ADM3307E Truth Table
Table II. ADM3310E Truth Table
SD EN 0 0 1 1 0 1 0 1
Status Normal Operation Normal Operation Shutdown Shutdown
TOUT1-5 Enabled Enabled Disabled Disabled
ROUT1-2 Enabled Disabled Disabled Disabled
ROUT3 Enabled Disabled Enabled Disabled
SD EN 0 0 1 1 0 1 0 1
Status Normal Operation Receivers Disabled Shutdown Shutdown
TOUT1-3 Enabled Enabled Disabled Disabled
ROUT1-3 Enabled Disabled Disabled Disabled
ROUT4-5 Enabled Disabled Enabled Disabled
Table III. ADM3311 Truth Table
Table IV. ADM3312E/ADM3315E Truth Table
SD EN 0 0 1 1 0 1 0 1
Status Normal Operation Receivers Disabled Shutdown Shutdown
TOUT1-3 Enabled Enabled Disabled Disabled
ROUT1-4 Enabled Disabled Disabled Disabled
ROUT5 Enabled Disabled Enabled Disabled
SD EN 0 0 1 1 0 1 0 1
Status Normal Operation Normal Operation Shutdown Shutdown
TOUT1-3 Enabled Enabled Disabled Disabled
ROUT1-2 Enabled Disabled Disabled Disabled
ROUT3 Enabled Disabled Enabled Disabled
REV. F
-7-
ADM33xxE-Typical Performance Characteristics
9 TOUTHIGH 7 5 3 1 -1 -3 -5 -7 0 200 400 600 LOAD CAPACITANCE - pF 800 1000
V
Tx O/P - V
SD
TOUTLOW
TPC 1. Charge Pump V+ Exiting Shutdown
TPC 4. Transmitter Output vs. Load Capacitance (VCC = 3.3 V, Data Rate = 460 kbps)
40 35 30
SD
SLEW RATE - V/ s
25 20 15 10
V
5 0 0 150 470 1000 1500 LOAD CAPACITANCE - pF 2000 2500
TPC 2. Charge Pump V- Exiting Shutdown
9 7 5 3 V+
TPC 5. Slew Rate vs. Load Capacitance (VCC = 3.3 V)
25
20
V+/V- - V
-1 -3 -5 V- -7 -9 0 5 10 LOAD CURRENT - mA 15 20
ICC - mA
1
15
10
5
0 0 200 400 600 800 1000 1200 LOAD CAPACITANCE - pF
TPC 3. Charge Pump V+, V- vs. Load Current (VCC = 3.3 V)
TPC 6. Supply Current vs. Load Capacitance (RL = 3 k) (VCC = 3.3 V, Data Rate = 460 kbps)
-8-
REV. F
ADM33xxE
25 20
ICC - mA
15
SD
10
5 TX O/P LOW 0 0 200 400 600 800 1000 1200 LOAD CAPACITANCE - pF
TCP 7. Supply Current vs. Load Capacitance (RL = Infinite) (VCC = 3.3 V, Data Rate = 460 kbps)
30 28 26 460kbps
TPC 10. Transmitter Output (Low) Exiting Shutdown
10 8 6 250kbps
TxOUT VOLTAGE - V
SUPPLY CURRENT - mA
24 22 20 125kbps 18 16 14 12 10 0 200 400 600 LOAD CAPACITANCE - pF 800 1000
4 2 0 -2 -4 -6 -8
-10 0 200 400 600 800 1000 LOAD CAPACITANCE - pF
TPC 8. Supply Current vs. Load Capacitance (VCC = 3.3 V, RL = 5 k)
TPC 11. Transmitter Output Voltage High/Low vs. Load Capacitance (VCC = 3.3 V, CLK = 1 Mb/s, RL = 5 k, ADM3307E)
300
OSCILLATOR FREQUENCY - kHz
250
200
SD TX O/P HIGH
150
100
50
0
0
5
10 LOAD CURRENT - mA
15
20
TPC 9. Transmitter Output (High) Exiting Shutdown
TPC 12. Oscillator Frequency vs. Load Current
REV. F
-9-
ADM33xxE
600
25
500
20
400
ICC - A
300
ICC - mA
15
10
200
5
100
0 2.6
2.8
3.0
3.2 VCC - V
3.4
3.6
0 2.6
2.8
3.0
3.2 VCC - V
3.4
3.6
TCP 13. ICC vs. VCC (Unloaded)
TPC 14. ICC vs. VCC (RL = 3 k)
-10-
REV. F
ADM33xxE
CIRCUIT DESCRIPTION
The internal circuitry consists mainly of four sections. These include the following: 1. A charge pump voltage converter 2. 3.3 V logic to EIA-232 transmitters 3. EIA-232 to 3.3 V logic receivers 4. Transient protection circuit on all I/O lines
Charge Pump DC-to-DC Voltage Converter
During the oscillator high phase, S10 and S11 are open, while S8 and S9 are closed. C3 is charged to 3 VCC from the output of the voltage tripler over several cycles. During the oscillator low phase, S8 and S9 are open, while S10 and S11 are closed. C3 is connected across C5, whose positive terminal is grounded and whose negative terminal is the V- output. Over several cycles, C5 charges to -3 VCC. The V+ and V- supplies may also be used to power external circuitry if the current requirements are small. Please refer to TPC 3 in the Typical Performance Characteristics section.
What Is Green Idle?
The charge pump voltage converter consists of a 250 kHz (300 kHz for ADM3307E) oscillator and a switching matrix. The converter generates a 9 V supply from the input 3.0 V level. This is done in two stages using a switched capacitor technique, as illustrated. First, the 3.0 V input supply is tripled to 9.0 V using capacitor C4 as the charge storage element. The +9.0 V level is then inverted to generate -9.0 V using C5 as the storage element. However, it should be noted that, unlike other charge pump dc-todc converters, the charge pump on the ADM3307E does not run open-loop. The output voltage is regulated to 7.25 V (or 6.5 V for the ADM3310E and ADM3315E) by the Green Idle circuit and will never reach 9 V in practice. This saves power as well as maintains a more constant output voltage.
S1 C1 + S4 VCC INTERNAL OSCILLATOR S3 S5 C2 + S7 S6 C4 V+ = 3VCC + VCC
Green Idle is a method of minimizing power consumption under idle (no transmit) conditions while still maintaining the ability to transmit data instantly.
How Does it Work?
Charge pump type dc-to-dc converters used in RS-232 line drivers normally operate open-loop, i.e., the output voltage is not regulated in any way. Under light load conditions, the output voltage is close to twice the supply voltage for a doubler and three times the supply voltage for a tripler, with very little ripple. As the load current increases, the output voltage falls and the ripple voltage increases. Even under no-load conditions, the oscillator and charge pump operate at a very high frequency with consequent switching losses and current drain. Green Idle works by monitoring the output voltage and maintaining it at a constant value of around 7 V*. When the voltage rises above 7.25 V** the oscillator is turned off. When the voltage falls below 7 V*, the oscillator is turned on and a burst of charging pulses is sent to the reservoir capacitor. When the oscillator is turned off, the power consumption of the charge pump is virtually zero, so the average current drain under light load conditions is greatly reduced. A block diagram of the Green Idle circuit is shown in Figure 3. Both V+ and V- are monitored and compared to a reference voltage derived from an on-chip band gap device. If either V+ or V- fall below 7 V*, the oscillator will start up until the voltage rises above 7.25 V**.
VCC
S2 GND
Figure 1. Charge Pump Voltage Tripler
The tripler operates in two phases. During the oscillator low phase, S1 and S2 are closed and C1 charges rapidly to VCC. S3, S4, and S5 are open, and S6 and S7 are closed. During the oscillator high phase, S1 and S2 are open, and S3 and S4 are closed, so the voltage at the output of S3 is 2 VCC. This voltage is used to charge C2. In the absence of any discharge current, C2 will charge up to 2 VCC after several cycles. During the oscillator high phase, as previously mentioned, S6 and S7 are closed, so the voltage at the output of S6 will be 3 VCC. This voltage is then used to charge C3. The voltage inverter is illustrated in Figure 2.
FROM VOLTAGE TRIPLER V+ S8 C3 + S11 S10 GND S9 GND C5 + V- = - (V+)
INTERNAL OSCILLATOR
Figure 2. Charge Pump Voltage Inverter
NOTES *For ADM3310E and ADM3315E, replace with 6.25 V. **For ADM3310E and ADM3315E, replace with 6.5 V.
REV. F
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ADM33xxE
V+ VOLTAGE COMPARATOR WITH 250mV HYSTERESIS START/STOP V+ CHARGE PUMP V- START/STOP V- VOLTAGE COMPARATOR WITH 250mV HYSTERESIS TRANSCEIVERS BAND GAP VOLTAGE REFERENCE
Idle maintains the transmitter supply voltages under transmitter idle conditions so this delay does not occur.
Doesn't It Increase Supply Voltage Ripple?
SHUTDOWN
The ripple on the output voltage of a charge pump operating in open-loop depends on three factors: the oscillator frequency, the value of the reservoir capacitor, and the load current. The value of the reservoir capacitor is fixed. Increasing the oscillator frequency will decrease the ripple voltage; decreasing the oscillator frequency will increase it. Increasing the load current will increase the ripple voltage; decreasing the load current will decrease it. The ripple voltage at light loads will naturally be lower than that for high load currents. Using Green Idle, the ripple voltage is determined by the high and low thresholds of the Green Idle circuit. These are nominally 7 V* and 7.25 V**, so the ripple will be 250 mV under most load conditions. With very light load conditions, there may be some overshoot above 7.25 V**, so the ripple will be slightly greater. Under heavy load conditions where the output never reaches 7.25 V**, the Green Idle circuit will be inoperative and the ripple voltage will be determined by the load current, the same as in a normal charge pump.
What About Electromagnetic Compatibility?
Figure 3. Block Diagram of Green Idle Circuit
The operation of Green Idle for V+ under various load conditions is illustrated in Figure 4. Under light load conditions, C1 is maintained in a charged condition and only a single oscillator pulse will be required to charge up C2. Under these conditions, V+ may actually overshoot 7.25 V** slightly.
OVERSHOOT 7.25V1 V+ 7V2 OSC LIGHT LOAD 7.25V1 V+ 7V2 OSC MEDIUM LOAD 7.25V1 V+ 7V2 OSC HEAVY LOAD NOTES 1. FOR ADM3310E AND ADM3315E REPLACE WITH 6.5 V. 2. FOR ADM3310E AND ADM3315E REPLACE WITH 6.25 V.
Green Idle does not operate with a constant oscillator frequency. As a result, the frequency and spectrum of the oscillator signal will vary with load. Any radiated and conducted emissions will also vary accordingly. Like other Analog Devices RS-232 transceiver products, the ADM33xxE devices feature slew rate limiting and other techniques to minimize radiated and conducted emissions.
Transmitter (Driver) Section
The drivers convert 3.3 V logic input levels into EIA-232 output levels. With VCC = 3.0 V and driving an EIA-232 load, the output voltage swing is typically 6.4 V (or 5.5 V for ADM3310E and ADM3315E). Unused inputs may be left unconnected, as an internal 400 kV pull-up resistor pulls them high forcing the outputs into a low state. The input pull-up resistors typically source 8 mA when grounded, so unused inputs should either be connected to VCC or left unconnected in order to minimize power consumption.
Receiver Section
Figure 4. Operation of Green Idle Under Various Load Conditions
Under medium load conditions, it may take several cycles for C2 to charge up to 7.25 V**. The average frequency of the oscillator will be higher because there are more pulses in each burst and the bursts of pulses are closer together and more frequent. Under high load conditions, the oscillator will be on continuously if the charge pump output cannot reach 7.25 V**.
Green Idle Versus Shutdown
The receivers are inverting level shifters that accept RS-232 input levels and translate them into 3.3 V logic output levels. The inputs have internal 5 k pull-down resistors (22 k for the ADM3310E) to ground and are also protected against overvoltages of up to 30 V. Unconnected inputs are pulled to 0 V by the internal 5 k (or 22 k for the ADM3315E) pull-down resistor. This, therefore, results in a Logic 1 output level for unconnected inputs or for inputs connected to GND. The receivers have Schmitt trigger inputs with a hysteresis level of 0.14 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times.
ENABLE AND SHUTDOWN
Shutdown Mode minimizes power consumption by shutting down the charge pump altogether. In this mode, the switches in the voltage tripler are configured so that V+ is connected directly to VCC. V- is zero because there is no charge pump operation to charge C5. This means that there is a delay when coming out of Shutdown Mode before V+ and V- achieve their normal operating voltages. Green
NOTES *For ADM3310E and ADM3315E, replace with 6.25 V. **For ADM3310E and ADM3315E, replace with 6.5 V.
The enable function is intended to facilitate databus connections where it is desirable to three-state the receiver outputs. In the disabled mode, all receiver outputs are placed in a high impedance state. The shutdown function is intended to shut the device down, thereby minimizing the quiescent current. In shutdown, all transmitters are disabled. All receivers are shut down, except for receiver R3 (ADM3307E, ADM3312E, and ADM3315E), receiver R5 (ADM3311E), and receivers R4 and R5 (ADM3310E). REV. F
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ADM33xxE
Note that disabled transmitters are not three-stated in shutdown, so it is not permitted to connect multiple (RS-232) driver outputs together. The shutdown feature is very useful in battery-operated systems since it reduces the power consumption to 66 nW. During shutdown, the charge pump is also disabled. When exiting shutdown, the charge pump is restarted and it takes approximately 100 s for it to reach its steady state operating conditions.
3V EN INPUT 0V VOH RECEIVER OUTPUT VOL VOL + 0.1V
contains two back-to-back high speed clamping diodes. During normal operation with maximum RS-232 signal levels, the diodes have no affect as one or the other is reverse biased depending on the polarity of the signal. If however the voltage exceeds about 50 V, reverse breakdown occurs and the voltage is clamped at this level. The diodes are large p-n junctions that are designed to handle the instantaneous current surge that can exceed several amperes. The transmitter outputs and receiver inputs have a similar protection structure. The receiver inputs can also dissipate some of the energy through the internal 5 k (or 22 k for the ADM3310E) resistor to GND as well as through the protection diodes.
tDR
VOH - 0.1V
RECEIVER INPUT D1 RIN D2 Rx
Figure 5. Receiver Disable Timing
3V EN INPUT 0V VOH RECEIVER OUTPUT VOL
Figure 7a. Receiver Input Protection Scheme
tER
3V 0.4V
Tx D1 D2
TRANSMITTER OUTPUT
Figure 6. Receiver Enable Timing
High Baud Rate
The ADM33xxE features high slew rates permitting data transmission at rates well in excess of the EIA/RS-232E specifications. RS-232 voltage levels are maintained at data rates up to 230 kbps (460 kbps for ADM3307E) under worst-case loading conditions. This allows for high speed data links between two terminals.
LAYOUT AND SUPPLY DECOUPLING
Figure 7b. Transmitter Output Protection Scheme
Because of the high frequencies at which the ADM33xxE oscillator operates, particular care should be taken with printed circuit board layout, with all traces being as short as possible and C1 to C3 being connected as close to the device as possible. The use of a ground plane under and around the device is also highly recommended. When the oscillator starts up during Green Idle operation, large current pulses are taken from VCC. For this reason, VCC should be decoupled with a parallel combination of 10 F tantalum and 0.1 F ceramic capacitors, mounted as close to the VCC Pin as possible. Capacitors C1 to C3 can have values between 0.1 F and 1 F. Larger values will give lower ripple. These capacitors can be either electrolytic capacitors chosen for low equivalent series resistance (ESR) or nonpolarized types, but the use of ceramic types is highly recommended. If polarized electrolytic capacitors are used, then polarity must be observed (as shown by C1+).
ESD/EFT TRANSIENT PROTECTION SCHEME
The ADM3307E protection scheme is slightly different (see Figures 8a and 8b). The receiver inputs, transmitter inputs, and transmitter outputs contain two back-to-back high speed clamping diodes. The receiver outputs (CMOS outputs), SD and EN Pins contain a single reverse biased high speed clamping diode. Under normal operation with maximum CMOS signal levels, the receiver output, SD, and EN protection diodes have no effect because they are reversed biased. If, however, the voltage exceeds about 15 V, reverse breakdown occurs and the voltage is clamped at this level. If the voltage reaches -0.7 V, the diode is forward biased and the voltage is clamped at this level. The receiver inputs can also dissipate some of the energy through the internal 5 k resistor to GND as well as through the protection diodes.
RECEIVER INPUT D1 RIN D2
Rx D3
RECEIVER OUTPUT
Figure 8a. ADM3307E Receiver Input Protection Scheme
TRANSMITTER OUTPUT D3 D4
Tx D1 D2
TRANSMITTER INPUT
The ADM33xxE uses protective clamping structures on all inputs and outputs that clamp the voltage to a safe level and dissipate the energy present in ESD (electrostatic) and EFT (electrical fast transients) discharges. A simplified schematic of the protection structure is shown below in Figures 7a and 7b (see Figures 8a and 8b for ADM3307E protection structure). Each input and output REV. F
Figure 8b. ADM3307E Transmitter Output Protection Scheme
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ADM33xxE
The protection structures achieve ESD protection up to 15 kV on all RS-232 I/O lines (and all CMOS lines, including SD and EN for the ADM3307E). The methods used to test the protection scheme are discussed later.
ESD TESTING (IEC 1000-4-2)
IPEAK - %
36.8 10 100 90
IEC 1000-4-2 (previously 801-2) specifies compliance testing using two coupling methods, contact discharge and air-gap discharge. Contact discharge calls for a direct connection to the unit being tested. Air-gap discharge uses a higher test voltage but does not make direct contact with the unit under testing. With air discharge, the discharge gun is moved toward the unit under testing, which develops an arc across the air gap, hence the term air discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate of closure of the discharge gun. The contact discharge method, while less realistic, is more repeatable and is gaining acceptance in preference to the air-gap method. Although very little energy is contained within an ESD pulse, the extremely fast rise time coupled with high voltages can cause failures in unprotected semiconductors. Catastrophic destruction can occur immediately as a result of arcing or heating. Even if catastrophic failure does not occur immediately, the device may suffer from parametric degradation that may result in degraded performance. The cumulative effects of continuous exposure can eventually lead to complete failure. I/O lines are particularly vulnerable to ESD damage. Simply touching or plugging in an I/O cable can result in a static discharge that can damage or completely destroy the interface product connected to the I/O port. Traditional ESD test methods, such as the MIL-STD-883B method 3015.7, do not fully test a product's susceptibility to this type of discharge. This test was intended to test a product's susceptibility to ESD damage during handling. Each pin is tested with respect to all other pins. There are some important differences between the traditional test and the IEC test: (a) The IEC test is much more stringent in terms of discharge energy. The peak current injected is over four times greater. (b) The current rise time is significantly faster in the IEC test. (c) The IEC test is carried out while power is applied to the device. It is possible that the ESD discharge could induce latch-up in the device under test. This test, therefore, is more representative of a real world I/O discharge where the equipment is operating normally with power applied. For maximum peace of mind however, both tests should be performed, ensuring maximum protection both during handling and later during field service.
HIGH VOLTAGE GENERATOR R1 R2
tRL
tDL
TIME t
Figure 10. Human Body Model ESD Current Waveform
100 90
IPEAK - %
10 0.1 TO 1ns 30ns 60ns TIME t
Figure 11. IEC1000-4-2 ESD Current Waveform
The ADM33xxE devices are tested using both of the above mentioned test methods. All pins are tested with respect to all other pins as per the Human Body Model, ESD Assoc. Std. 55.1 specification. In addition, all I/O pins are tested as per the IEC 1000-4-2 test specification. The products were tested under the following conditions: (a) Power-On--Normal Operation (b) Power-Off There are four levels of compliance defined by IEC 1000-4-2. The ADM33xxE parts meet the most stringent compliance level for both contact and air-gap discharge. This means that the products are able to withstand contact discharges in excess of 8 kV and air-gap discharges in excess of 15 kV.
Table V. IEC 1000-4-2 Compliance Levels
Level
DEVICE UNDER TEST
Contact Discharge (kV) 2 4 6 8
Air Discharge (kV) 2 4 8 15
C1
ESD TEST METHOD HUMAN BODY MODEL ESD ASSOC. STD 55.1 IEC1000-4-2
R2 1.5kV 330V
C1 100pF 150pF
1 2 3 4
Figure 9. ESD Test Standards
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REV. F
ADM33xxE
OUTLINE DIMENSIONS 32-Lead Frame Chip Scale Package [LFCSP] (CP-32)
Dimensions shown in millimeters
5.00 BSC SQ 0.60 MAX 0.60 MAX
25 24 32 1
PIN 1 INDICATOR
PIN 1 INDICATOR
TOP VIEW
4.75 BSC SQ
0.50 BSC
BOTTOM VIEW
2.25 1.70 SQ 0.75
98
0.50 0.40 0.30 12 MAX 0.70 MAX 0.65 NOM 0.05 MAX 0.02 NOM 0.30 0.23 0.18 0.25 REF COPLANARITY 0.08
17 16
3.50 REF
1.00 0.90 0.80 SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
28-Lead Shrink Small Outline Package [SSOP] (RS-28)
Dimensions shown in millimeters
10.50 10.20 9.90
28
15
PIN 1
1 14
5.60 5.30 5.00
8.20 7.80 7.40
2.00 MAX
1.85 1.75 1.65
0.10 COPLANARITY 0.25 0.09
0.05 MIN
0.65 BSC
0.38 0.22
SEATING PLANE
8 4 0
0.95 0.75 0.55
COMPLIANT TO JEDEC STANDARDS MO-150AH
24-Lead Thin Shrink Small Outline Package [TSSOP] (RU-24)
Dimensions shown in millimeters
7.90 7.80 7.70
28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28)
Dimensions shown in millimeters
9.80 9.70 9.60
24
13
28
15
4.50 4.40 4.30 6.40 BSC
1 12
1 14
4.50 4.40 4.30
6.40 BSC
PIN 1
0.65 BSC 1.20 MAX
PIN 1 0.65 BSC 0.15 0.05 1.20 MAX
0.15 0.05
0.30 COPLANARITY 0.19 0.10
SEATING PLANE
0.20 0.09
8 0
0.75 0.60 0.45
0.30 COPLANARITY 0.19 0.10
SEATING PLANE
0.20 0.09
8 0
0.75 0.60 0.45
COMPLIANT TO JEDEC STANDARDS MO-153AD
COMPLIANT TO JEDEC STANDARDS MO-153AE
REV. F
-15-
ADM33xxE Revision History
Location 8/02--Data Sheet changed to REV. F Page
ADM3307E (REV. 0), ADM3311E (REV. E), and ADM3312E (REV. A) data sheets merged into Rev. F of ADM33xxE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UNIVERSAL ADM3310E (REV. PrA now prelims) and ADM3315E (REV. PrA) added . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UNIVERSAL Edits to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Edits to APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Edits to GENERAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Edits to FUNCTIONAL BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Edits to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Edits to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ADM33xx PRODUCT SELECTION GUIDE added . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Added ADM3307E, ADM3310E, ADM3312E, and ADM3315E PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Edits to PIN FUNCTION DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Added ADM3307E, ADM3310E, ADM3312E, and ADM3315E Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Edits to TPCs 1-14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 TPCs 15-18 deleted . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 Edits to CIRCUIT DESCRIPTION section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Edits to Charge Pump DC-to-DC Voltage Converter section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Edits to How Does It Work section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Edits to Green Idle vs. Shutdown section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Edits to Doesn't It Increase Supply Voltage Ripple? section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Edits to What About Electromagnetic Compatibility? section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Edits to Transmitter (Driver) section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Edits to Receiver section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Edits to ENABLE AND SHUTDOWN section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Edits to High Baud Rate section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Edits to ESD/EFT TRANSIENT PROTECTION SCHEME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Added Figures 8a and 8b and renumbered the figures that followed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Edits to ESD TESTING (IEC 1000-4-2) section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Edits to Figure 9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Deleted Table II and Table III and replaced them with Table V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Added RU-24 PACKAGE OUTLINE; updated CP-32, RS-28 and RU-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
-16-
REV. F
PRINTED IN U.S.A.
C02915-0-8/02(F)

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