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CD4049UBT
Data Sheet July 1999 File Number
4622.1
CMOS Hex Buffer/Converter
Intersil's Satellite Applications FlowTM (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers, while maintaining a high level of reliability. The CD4049UBT is an Inverting Hex Buffer and features logic level conversion using only one supply (voltage (VCC). The input signal high level (VIH) can exceed the VCC supply voltage when this device is used for logic level conversions. This device is intended for use as CMOS to DTL/TTL converters and can drive directly two DTL/TTL loads. (VCC = 5V, VOL 0.4V, and IOL 3.3mA. The CD4049UBT is the designated replacement for the CD4009UB. Because the CD4049UBT requires only one power supply, it is preferred over the CD4009UB and CD4010B and should be used in place of the CD4009UB in all inverter, current driver, or logic level conversion applications. In these applications the CD4049UBT is pin compatible with the CD4009UB, and can be substituted for this device in existing as well as in new designs. Terminal No. 16 is not connected internally on the CD4049UBT, therefore, connection to this terminal is of no consequence to circuit operation. For applications not requiring high sink current or voltage conversion, the CD4069UB Hex Inverter is recommended.
Features
* QML Class T, Per MIL-PRF-38535 * Radiation Performance - Gamma Dose () 1 x 105 RAD(Si) - SEP Effective LET >75 MEV-gm/cm2 * Inverting Type * High Sink Current for Driving 2 TTL Loads * High-to-Low Level Logic Conversion * 100% Tested for Quiescent Current at 20V * 5V, 10V and 15V Parametric Ratings
Pinouts
CD4049BT (SBDIP), CDIP2-T16 TOP VIEW
VCC G=A A H=B B I=C C VSS
1 2 3 4 5 6 7 8
16 NC 15 L = F 14 F 13 NC 12 K = E 11 E 10 J = D 9D
Specifications
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Detailed Electrical Specifications for the CD4049UBT are contained in SMD 5962-96636. A "hot-link" is provided from our website for downloading. www.intersil.com/spacedefense/newsafclasst.asp Intersil's Quality Management Plan (QM Plan), listing all Class T screening operations, is also available on our website. www.intersil.com/quality/manuals.asp
VCC G=A A H=B B I=C C VSS
CD4049BT (FLATPACK), CDFP4-F16 TOP VIEW
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC L=F F NC K=E E J=D D
Ordering Information
ORDERING NUMBER 5962R9663601TEC 5962R9663601TXC PART NUMBER CD4049UBDTR CD4049UBKTR TEMP. RANGE (oC) -55 to 125 -55 to 125
NOTE: Minimum order quantity for -T is 150 units through
distribution, or 450 units direct. 1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 Satellite Applications FlowTM (SAF) is a trademark of Intersil Corporation.
CD4049UBT Functional Diagram
A 3 2 G=A
B
5
4
H=B
C
7
6
I=C
D VCC VSS NC = 13 NC = 16 1 8 E
9
10
J=D
11
12
K=E
F
14
15
L=F
Schematic
VCC
P R IN N OUT
VSS
SCHEMATIC DIAGRAM, 1 OF 6 IDENTICAL UNITS
2
CD4049UBT Die Characteristics
DIE DIMENSIONS: (1448m x 1880m x 533m 25.4m) 57 x 74 x 21mils 1mil METALLIZATION: Type: Al Thickness: 12.5kA 1.5kA SUBSTRATE POTENTIAL: Leave Floating or Tie to VCC Bond Pad #1 (VCC) First BACKSIDE FINISH: Silicon PASSIVATION: Type: Phosphorus Doped Silox (SiO2) Thickness: 13.0kA 2.6kA WORST CASE CURRENT DENSITY: < 2.0e5 A/cm2 TRANSISTOR COUNT: 12 PROCESS: Bulk CMOS
Metallization Mask Layout
CD4049UBT
74mils
57mils
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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