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SEOUL SEMICONDUCTOR
Z-POWER LED Series
Technical Datasheet for X4218X
Z-Power series is designed for high current operation and
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Features * Super high Flux output and high Luminance * Designed for high current operation * Low thermal resistance * SMT solderbility * Lead Free product * RoHS compliant
high flux output applications. Z-Power LED's thermal management perform exceeds other power LED solutions. It incorporates state of the art SMD design and Thermal emission material. Z Power LED is ideal light sources for general illumination applications, custom designed solutions, automotive large LCD backlights
Application * Mobile phone flash * Automotive interior / exterior lighting * Automotive signal lighting * Automotive forward lighting * General Torch * Architectural lighting * LCD TV / Monitor Backlight * Projector light source * Traffic signals * Task lighting * Decorative / Pathway lighting * Remote / Solar powered lighting * Household appliances
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Full Code of Z-Power LED Series
Full code form : X1 X2 X3 X4 X5 X6 X7 -X8 X9 - X10 X11 X12 X13 X14 1. Part Number - X1 : Color - X2 : Z-Power LED series number - X3 : LENS type - X4 : Chip quantity (or Power Dissipation) - X5 : Package outline size - X6 : www..comType of PCB - X7 : Grade of Characteristics code 2. Internal Number - X8 - X9 3. Code Labeling - X10 : Luminous flux (or Radiant flux for royal blue) - X11 X12 X13 : Dominant wavelength (or x,y coordinates rank code) - X14 : Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag
X1 X2 X3 X4 X5 X6 - - X8 PART NO. : X1 X2 X3 X4 X5 X6 X7X7 X8 X9
QUANTITY : ### LOT NUMBER : ########## BIN CODE : X10 X11 X12 X13 X14
For more information about binning and labeling, refer to the Application Note -1
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Outline Dimensions 1. Dome Type
SLUG
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Cathode Mark
Lens
Body Lead
Notes : 1. All dimensions are in millimeters. (tolerance : 0.2 ) 2. Scale : none 3. Slug of package is connected to anode. *The appearance and specifications of the product may be changed for improvement without notice.
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Outline Dimensions 2. PCB Type
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Rectangular Type
Star Typ
Notes : 1. All dimensions are in millimeters. (tolerance : 0.2 ) 2. Scale : none *The appearance and specifications of the product may be changed for improvement without notice.
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Characteristics for Dome type Z-Power LED 1. Pure White (W42181, W42182)
1-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter T rank U rank
[3]
Symbol V [2] V [2] CCT Ra
[4]
Value Min 70 91 65 2.9 Typ 80 100 6300 70 3.25 132 8.5 6.9 Max 91 3.8
Unit lm lm K V deg. C /W C /W
Luminous Flux
[1]
Correlated Color Temperature CRI
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Forward Voltage View Angle
VF 2 1/2
Thermal resistance Thermal resistance
[5] [6]
RJ-B RJ-C
1-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[8]
Symbol IF Pd Tj Topr Tstg -
Value 1000 (@ Tj = 90 C)
[7]
Unit mA W C C C -
1800 (@ 1KHz, 1/10 duty) 4 145(@ IF 700mA) -40 ~ +85 -40 ~ +100 20,000V HBM
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance. [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. (25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC. [7] IF Max is guaranteed under the TJ 90 C. [8] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink.
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Characteristics for Dome type Z-Power LED 2. Warm White (N42181, N42182)
2-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux
[1] [3]
Symbol V [2] CCT Ra
[4]
Value Min Typ 53 3000 93 2.9 3.25 124 8.5 6.9 Max 3.8
Unit lm K V deg. C /W C /W
Correlated Color Temperature CRI Forward Voltage
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VF 2 1/2
View Angle
[5] [6]
Thermal resistance Thermal resistance
RJ-B RJ-C
2-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[7]
Symbol IF Pd Tj Topr Tstg -
Value 800 3.2 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. .(25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
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Characteristics for Dome type Z-Power LED 3. Warm White_2 (N42181L, N42182L)
3-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux
[1] [3]
Symbol V [2] CCT Ra
[4]
Value Min Typ 62 3000 2.9 70 3.25 120 8.5 6.9 Max 3.8
Unit lm K V deg. C /W C /W
Correlated Color Temperature CRI Forward Voltage
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VF 2 1/2
View Angle
[5] [6]
Thermal resistance Thermal resistance
RJ-B RJ-C
3-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[7]
Symbol IF Pd Tj Topr Tstg -
Value 800 3.2 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. .(25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
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Characteristics for Dome type Z-Power LED 4. Natural White (S42181, S42182)
4-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux
[1] [3]
Symbol V [2] CCT Ra
[4]
Value Min Typ 61 2.9 4000 93 3.2 124 8.5 6.9 Max 3.8
Unit lm K V deg. C /W C /W
Correlated Color Temperature CRI Forward Voltage
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VF 2 1/2
View Angle
[5] [6]
Thermal resistance Thermal resistance
RJ-B RJ-C
4-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[8]
Symbol IF Pd Tj Topr Tstg -
Value 800 3.2 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. CCT 5% tester tolerance. [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 110 C) RJ-C is measured with only emitter. (25 C TJ 110 C) Break voltage of Metal PCB is 6.5kVAC. [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
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Characteristics for Dome type Z-Power LED 5. Blue (B42181, B42182)
5-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux
[1]
Symbol V [2] D VF 2 1/2
[5] [6]
Value Min 455 2.9 Typ 22 465 3.25 130 8.5 6.9 Max 475 3.8
Unit lm nm V deg. C /W C /W
Dominant Wavelength[3] Forward Voltage View Angle
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[4]
Thermal resistance Thermal resistance
RJ-B RJ-C
5-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[7]
Symbol IF Pd Tj Topr Tstg -
Value 1000 4 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of 0.5nm for dominant wavelength [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 145 C) RJ-C is measured with only emitter. .(25 C TJ 145 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink 2. Blue power light sources represented here are IEC825 Class 2 for eye safety
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Characteristics for Dome type Z-Power LED 6. Green (G42181, G42182)
6-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux Dominant
[1]
Symbol V [2] D VF 2 1/2
[5] [6]
Value Min 520 2.9 Typ 70 525 3.25 130 9.5 8.0 Max 535 3.8
Unit lm nm V deg. C /W C /W
Wavelength[3]
[4]
Forward Voltage View Angle
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Thermal resistance Thermal resistance
RJ-B RJ-C
6-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[7]
Symbol IF Pd Tj Topr Tstg -
Value 1000 4 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of 0.5nm for dominant wavelength [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 145 C) RJ-C is measured with only emitter. .(25 C TJ 145 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sin
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Characteristics for Dome type Z-Power LED 7. Red (R42181, R42182)
7-1 Electro-Optical characteristics at IF=350mA, TA=25C Parameter Luminous Flux Dominant
[1]
Symbol V [2] D VF 2 1/2
[5] [6]
Value Min 618 2.0 Typ 48 625 2.3 130 9 7.8 Max 630 3.0
Unit lm nm V deg. C /W C /W
Wavelength[3]
[4]
Forward Voltage View Angle
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Thermal resistance Thermal resistance
RJ-B RJ-C
7-2 Absolute Maximum Ratings Parameter Forward Current Power Dissipation Junction Temperature Operating Temperature Storage Temperature ESD Sensitivity
[7]
Symbol IF Pd Tj Topr Tstg -
Value 800 2.4 145 -40 ~ +85 -40 ~ +100 20,000V HBM
Unit mA W C C C -
*Notes : [1] SSC maintains a tolerance of 10% on flux and power measurements. [2] V is the total luminous flux output as measured with an integrated sphere. [3] Dominant wavelength is derived from the CIE 1931 Chromaticity diagram. A tolerance of 0.5nm for dominant wavelength [4] A tolerance of 0.06V on forward voltage measurements [5], [6] RJ-B is measured with a SSC metal core pcb.(25 C TJ 145 C) RJ-C is measured with only emitter. .(25 C TJ 145 C) Break voltage of Metal PCB is 6.5kVAC [7] It is included the zener chip to protect the product from ESD.
--------------------------Caution-------------------------1. Please do not drive at rated current more than 5 sec. without proper heat sink
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Color spectrum, TA=25C
1. Pure White
1 .0
S ta n d a r d e y e r e s p o n s e c u r v e
0 .8
Relative Spectral Power
Distribution
0 .6
0 .4
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0 .2
0 .0 300
400
500
600
700
800
900
W a v e le n g th ( n m )
2. Warm White (N42180)
1 .0
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0 300 400 500 600 700 800
W a v e le n g th
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Color spectrum, TA=25C 3. Warm White(N42180L)
1 .0
0 .8
Relative Spectral Power
0 .6
0 .4
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0 .2
0 .0 300 400 500 600 700 800 900
W a v e le n g th ( n m )
4. Natural White
1 .0
Relative Spectral Power
0 .8
0 .6
0 .4
0 .2
0 .0 300 400 500 600 700 800
W a v e le n g th
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Color spectrum, TA=25C 5. Red, Green, Blue
1 .0
0 .8
Relative Spectral Power
Distribution
0 .6
0 .4
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0 .2
0 .0 400
500
600
700
W a v e le n g th ( n m )
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Junction Temperature Characteristics 1. Relative Light Output vs. Junction Temperature at IF=350mA, TA=25
160 140
Relative Light Output(%)
120 100 80 60 40 20 0 20
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N42180, N42180L, S42180 W42180 B42180 G42180
40 60 80 100 120 140
Junction Temperature
R42180
Relative Light Output [%]
140 120 100 80 60 40 20 0 20
40
60
80
100
o
120
140
Junction Temperature, TJ [ C]
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Junction Temperature Characteristics
2. Junction Temperature vs Wavelength shift TA=25
6
Dominant wavelength shift(nm)
5
R ed G re e n B lu e
4
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2
1
0 0 25 50 75
o
100
125
150
J u n ctio n T em p era tu re( C )
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Forward Current Characteristics 1. Forward Voltage vs. Forward Current, TA=25
1000
Blue, Green, Pure White Warm White, Natural White
Average Forward Current [mA]
800
600
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400
200
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Forward Voltage [V]
Red
800
Average Forward Current [mA]
700 600 500 400 300 200 100 0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
Forward Voltage [V]
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Forward Current Characteristics 2. Forward Current vs. Normalized Relative Luminous Flux, TA=25
2.5
Relative Lumious Flux(a.U)
Blue, Green, Pure White Warm White, Natural White
2.0
1.5
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1.0
0.5
0.0 0 200 400 600 800 1000
Forward Current [mA]
2.5
RED
Relative Lumious Flux(a.U)
2.0
1.5
1.0
0.5
0.0 0 200 400 600 800
Forward Current [mA]
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Forward Current Characteristics 3. Forward Current
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vs Wavelength shift TA=25
6
Dominant wavelength Shift(nm)
RED GREEN B L U E , R o y a l B lu e
4
2
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0
-2
-4 0 100 200 300
F o rw a rd cu rren t(m A )
400
500
600
700
800
900
1000
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Ambient Temperature vs Allowable Forward Current 1-1. Pure White, Warm White, Natural White, Green, Blue (TJMAX = 145 C, @350mA)
400 350 300
Current [mA]
250 200 150 100 50 0
RjaT = 60 C/W RjaT = 50 C/W RjaT = 40 C/W RjaT = 30 C/W
o o o
o
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0
25
50
75
100
o
125
150
Ambient Temperature [ C]
1-2. Pure White, Warm White, Natural White, Green, Blue (TJMAX = 145 C, @700mA)
800 700 600
Current [mA]
500 400 300 200 100 0
RjaT = 35 C/W RjaT = 30 C/W RjaT = 25 C/W RjaT = 20 C/W
o o o
o
0
25
50
75
100
o
125
150
Ambient Temperature [ C]
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Ambient Temperature vs Allowable Forward Current
1-3.
(TJMAX = 90 C, at 1000mA)
1200
Pure White, Green, Blue
1000
Current [mA]
800
600
RjaT = 25 C/W RjaT = 20 C/W
o
o
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400
200
0
0
25
50
75
100
o
125
150
Ambient Temperature [ C]
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Ambient Temperature vs Allowable Forward Current 1-4. Red (TJMAX = 145 C, at 350mA)
400
Current [mA]
300
200
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RjaT = 60 C/W RjaT = 50 C/W
100
o
o
RjaT = 40 C/W RjaT = 30 C/W
o
o
0
0
25
50
75
100
o
125
150
Ambient Temperature [ C]
1-5. Red (TJMAX = 145 C, @700mA)
800 700 600
Current [mA]
500 400 300 200 100 0
RjaT = 60 C/W RjaT = 50 C/W RjaT = 40 C/W RjaT = 30 C/W
0 25 50 75 100
o
o
o
o
o
125
150
Ambient Temperature [ C]
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Typical Dome Type Radiation pattern 1. Pure White
0
1.0
30
0.8
Relative luminous flux
0.6
60
0.4
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0.2
0.0 -80 -60 -40 -20 0
90
Angle(deg.)
2. Warm White, Natural White
0
1.0
30
0.8
Relative Luminous Flux
0.6
60
0.4
0.2
0.0 -80 -60 -40 -20 0
90
Angle(deg.)
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Typical Dome Type Radiation pattern
3. Blue, Green
1.0
0 30
0.8
Relative luminous flux
0.6
60
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0.4
0.2
0.0 -80 -60 -40 -20 0
90
Angle(deg.)
4. Red
0
1.0
30
0.8
Relative luminous flux
0.6
60
0.4
0.2
0.0 -80 -60 -40 -20 0
90
Angle(deg.)
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Recommended Soldering 1. Solder pad
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2. Solder paste pattern
1. Paste thickness : 0.2mm
Note : 1. All dimensions are in millimeters (tolerance : 0.2 ) 2. Scale none *The appearance and specifications of the product may be changed for improvement without notice.
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Soldering profile, TA=25C 1. Reflow Soldering Conditions / Profile
260 240 220 200
Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min)
180
Pre-heating
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~
Rising 5 C/sec
Cooling -5 C/sec
0 Time [Hr]
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280 Slug : Use a thermal-adhesives
* Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
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PCB Type Reel Packaging - Rectangular type
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MIN 1.5
10 pitch cumlative tolerance on tape 0.2
DETALE"A"
CENTER
5TYPICAL
DETAIL 'A'
Note : 1. The number of loaded products in the reel is 100ea 2. All dimensions are in millimeters (tolerance : 0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice.
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PCB Type Reel Packaging - Star type
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MIN 1.5
10 pitch cumlative tolerance on tape 0.2
DETALE"A"
CENTER
5 TYPICAL
DETAIL 'A'
Note : 1. The number of loaded products in the reel is 100ea 2. All dimensions are in millimeters (tolerance : 0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice.
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Packaging Structure
Aluminum Vinyl Bag
PART NO. : ######-## QUANTITY : 250 LOT NUMBER : #######-####### BIN CODE : #######
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Outer Box
TYPE SIZE(mm) a c b 350 350 370
c ZLED
ZLED
PART : W42180-** PO CODE : ## Q'YT : ###### LOT NO : YMDD-##### DATE : ######
b a
SEOUL SEMICONDUCTOR CO.,LTD
Note : 1. 6~10 reels are loaded in box 2. Scale none 3. For more information about binning and labeling, refer to the Application Note - 1
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Precaution for use
* Storage To avoid the moisture penetration, we recommend storing Z Power LEDs in a dry box (or desiccator) with a desiccant . The recommended storage conditions are Temperature 5 to 30 degrees Centigrade. Humidity 50% maximum. * Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction
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- Sealing - Temperature : 5 ~ 40 Humidity : less than 30%
c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 605 * Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. * Please avoid rapid cooling after soldering. * Components should not be mounted on warped direction of PCB. * Anti radioactive ray design is not considered for the products listed here in. * Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. * This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used. * When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. * LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. * The appearance and specifications of the product may be modified for improvement without notice. * Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. * The slug is connected to the anode. Therefore, we recommend to isolate the heat sink. * Attaching LEDs, don't use adhesives to generate organic vapor.
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Handling of Silicone resin LEDs
Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs * Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) * Avoid leaving fingerprints on silicone resin parts. * Dust sensitivity silicone resin need containers having cover for storage. * When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. * Please do not force over 2000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product www..com do not recommend to cover the silicone resin of the LEDs with other resin * Please (epoxy, urethane, etc)
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