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MBRS2H100T3G, MBRA2H100T3G Surface Mount Schottky Power Rectifier
SMA/SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
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SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 100 VOLTS
MARKING DIAGRAMS
SMA CASE 403D PLASTIC AYWW A210G G
* * * * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guard-Ring for Overvoltage Protection Low Forward Voltage Drop This is a Pb-Free Device Case: Molded Epoxy Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 70 mg (SMA), 95 mg (SMB) (Approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable ESD Ratings: Machine Model = C, Human Body Model = 3B Device Meets MSL1 Requirements
Mechanical Characteristics
SMB CASE 403A PLASTIC AYWW B210G G
A210 = MBRA2H100T3G B210 = MBRS2H100T3G A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device MBRA2H100T3G MBRS2H100T3G Package SMA (Pb-Free) SMB (Pb-Free) Shipping 5000 / Tape & Reel 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
March, 2009 - Rev. 5
1
Publication Order Number: MBRS2H100/D
MBRS2H100T3G, MBRA2H100T3G
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TL = 150C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage Temperature Range Operating Junction Temperature (Note 1) Symbol VRRM VRWM VR IO IFSM Tstg TJ Value 100 Unit V
2.0 130 -65 to +175 -65 to +175
A A C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Lead (Note 2) Thermal Resistance, Junction-to-Ambient (Note 2) Thermal Resistance, Junction-to-Ambient (Note 3) MBRA2H100 MBRS2H100 MBRA2H100 MBRS2H100 MBRA2H100 MBRS2H100 Symbol YJCL RqJA RqJA Value 14 12 75 71 275 230 Unit C/W C/W C/W
ELECTRICAL CHARACTERISTICS
Value Characteristic Maximum Instantaneous Forward Voltage (Note 4) Maximum Instantaneous Reverse Current (Note 4) (iF = 2.0 A) (VR = 100 V) Symbol vF IR TJ = 25C 0.79 0.008 TJ = 125C 0.65 1.5 Unit V mA
2. Mounted with 700 mm square copper pad size (Approximately 1 inch square) 1 oz FR4 Board. 3. Mounted with minimum recommended pad size 1 oz FR4 Board. 4. Pulse Test: Pulse Width 380 ms, Duty Cycle 2.0%.
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2
MBRS2H100T3G, MBRA2H100T3G
TYPICAL CHARACTERISTICS
100 IF, FORWARD CURRENT (A) IF, FORWARD CURRENT (A) 100
150C 10
125C
25C
10 125C 150C 1 25C
1
0.1
0.2 0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
10 IR, REVERSE CURRENT (mA) 1 0.1 0.01 0.001 0.0001 25C IR, REVERSE CURRENT (mA) 150C 10
Figure 2. Maximum Forward Voltage
150C 1 125C
125C
0.1
0.01 25C 0 10 20 30 40 50 60 70 80 90 100
0.00001
0
10
20
30
40
50
60
70
80
90
100
0.001
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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3
MBRS2H100T3G, MBRA2H100T3G
TYPICAL CHARACTERISTICS
450 TJ = 25C f = 1 MHz IF(AV), AVERAGE FORWARD CURRENT (A) 400 C, CAPACITANCE (pF) 350 300 250 200 150 100 50 0 0 10 20 30 40 50 60 70 80 90 4.0 dc 3.0 Square Wave 2.0 RqJL = 14C/W
1.0
100
0
100
110
120
130
140
150
160
170
VR, REVERSE VOLTAGE (V)
TL, LEAD TEMPERATURE (C)
Figure 5. Typical Capacitance
IF(AV), AVERAGE FORWARD CURRENT (A) PFO, AVERAGE POWER DISSIPATION (W) 4.0 dc 3.0 dc 5
Figure 6. Current Derating - Lead
RqJA = 71C/W RqJA = 100C/W
TJ = 175C 4 Square Wave 3 dc 2 1 0
2.0 Square Wave 1.0
0
0
20
40
60
80
100
120
140
160 175
0
1
2
3
4
5
TA, AMBIENT TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (A)
Figure 7. Current Derating, Ambient
Figure 8. Maximum Forward Power Dissipation
100
10 R(t) (C/W)
50% (DUTY CYCLE) 20% 10% 5.0% 2.0% 1.0%
1.0
0.1 SINGLE PULSE 0.01 0.001 0.000001 0.00001 0.0001 0.001 0.01 PULSE TIME (s) 0.1 1.0 10 100 1000 SMB Die X 1.8 mm Die Y 1.8 mm PCB Cu Area 645.2 mm2 PCB Cu thk 1.0 oz
Figure 9. Thermal Response, Junction-to-Ambient (1 inch pad) - MBRS2H100
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MBRS2H100T3G, MBRA2H100T3G
TYPICAL CHARACTERISTICS
1000 50% (DUTY CYCLE) 100 R(t) (C/W) 20% 10% 5.0% 2.0% 1.0%
10
1.0
0.1 0.01 SINGLE PULSE 0.000001 0.00001 0.0001 0.001 0.01 PULSE TIME (s) 0.1
SMB Die X 1.8 mm Die Y 1.8 mm PCB Cu Area 11.8 mm2 PCB Cu thk 1.0 oz 1.0 10 100 1000
Figure 10. Thermal Response, Junction-to-Ambient (min pad) - MBRS2H100
100
10 R(t) (C/W)
50% (DUTY CYCLE) 20% 10% 5.0% 2.0% 1.0%
1.0
0.1 SINGLE PULSE
0.01 0.001
0.000001
0.00001
0.0001
0.001
0.01 PULSE TIME (s)
0.1
1.0
10
100
1000
Figure 11. Thermal Response, Junction-to-Ambient (1 inch pad) - MBRA2H100
1000 50% (DUTY CYCLE) 100 R(t) (C/W) 20% 10% 5.0% 2.0% 1.0%
10
1.0
0.1 SINGLE PULSE 0.01 0.000001 0.00001 0.0001 0.001 0.01 PULSE TIME (s) 0.1 1.0 10 100 1000
Figure 12. Thermal Response, Junction-to-Ambient (min pad) - MBRA2H100
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5
MBRS2H100T3G, MBRA2H100T3G
2.5 Power Based on TA = 25C POWER DISSIPATION (W) 2.0 1.5 1.0 0.5 0 2.0 oz 1.0 oz
0
100
200
300
400
500
600
700
COPPER AREA (sq mm)
Figure 13. PD, Junction-to-Ambient (URS copper area)
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MBRS2H100T3G, MBRA2H100T3G
PACKAGE DIMENSIONS
SMA CASE 403D-02 ISSUE F
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02. DIM A A1 b c D E HE L MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.006 0.064 0.016 0.115 0.180 0.220 0.060
b
D
POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES)
A A1
L
c
SOLDERING FOOTPRINT*
4.0 0.157
2.0 0.0787
2.0 0.0787
SCALE 8:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MBRS2H100T3G, MBRA2H100T3G
PACKAGE DIMENSIONS
SMB CASE 403A-03 ISSUE G
HE E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MBRS2H100/D

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