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IFX91041
1.8A DC/DC Step-Down Voltage Regulator 5.0V, 3.3V or Adjustable Output Voltage
IFX91041EJV50 IFX91041EJV33 IFX91041EJV
Data Sheet
Rev. 1.02, 2010-02-23
Standard Power
1.8A DC/DC Step-Down Voltage Regulator
IFX91041
1
* * * * * * * * * * * * *
Overview
1.8A step down voltage regulator Output voltage versions: 5.0 V, 3.3 V and adjustable 2% output voltage tolerance (+-4% for full load current range) Integrated power transistor PWM regulation with feedforward Input voltage range from 4.75V to 45V 370 kHz switching frequency Synchronization input Very low shutdown current consumption (<2uA) Soft-start function Input undervoltage lockout Suited for industrial applications: Tj = -40 C to +125 C Green Product (RoHS compliant)
PG-DSO-8-27
For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series.
Description The IFX91041 series are monolithic integrated circuits that provide all active functions for a step-down (buck) switching voltage regulator, capable of driving up to 1.8A load current with excellent line and load regulation. These devices are suited for use in industrial applications featuring protection functions such as current limitation and overtemperature shutdown. Versions with a fixed 5.0V and 3.3V (IFX91041EJV50, IFX91041EJV33) output voltage as well as an adjustable device (IFX91041EJV) with 0.60V reference feedback voltage are available. The switching frequency of 370kHz allows to use small and inexpensive passive components. The IFX91041 features an enable function reducing the shut-down current consumption to <2uA. The voltage mode regulation scheme of this device provides a stable regulation loop maintained by small external compensation components. Besides the feedforward control path offers an excellent line transient rejection. The integrated soft-start feature limits the current peak as well as voltage overshot at start-up.
Type IFX91041EJV50 IFX91041EJV33 IFX91041EJV Data Sheet
Package PG-DSO-8-27 PG-DSO-8-27 PG-DSO-8-27 2
Marking I9104150 I9104133 I91041V Rev. 1.02, 2010-02-23
IFX91041
Block Diagram
2
Block Diagram
EN VS
7
8
Enable Charge Pump Over Temperature Shutdown Feedforward COMP
3
5
BDS
Buck Converter
Oscillator
6
BUO
SYNC
1
4
FB
Bandgap Reference
Soft start ramp generator
IFX91041
2
GND
Figure 1
Block Diagram
Data Sheet
3
Rev. 1.02, 2010-02-23
IFX91041
Pin Configuration
3
3.1
Pin Configuration
Pin Assignment
SYNC GND COMP FB
1 2 3 4
IFX91041
8 7 6 5
S08_PIN.vsd
VS EN BUO BDS
Figure 2
Pin Configuration
3.2
Pin 1
Pin Definitions and Functions
Symbol Function SYNC Synchronization Input. Connect to an external clock signal in order to synchronize/adjust the switching frequency. If not used connect to GND. Ground. Compensation Input. Frequency compensation for regulation loop stability. Connect to compensation RC-network. Feedback Input. For the adjustable output voltage versions (IFX91041EJV) connect via voltage divider to output capacitor. For the fixed voltage version (IFX91041EJV50, IFX91041EJV33) connect this pin directly to the output capacitor. Buck Driver Supply Input. Connect the bootstrap capacitor between this pin and pin BUO. Buck Switch Output. Source of the integrated power-DMOS transistor. Connect directly to the cathode of the catch diode and the buck circuit inductance. Enable Input. Active-high enable input with integrated pull down resistor. Supply Voltage Input. Connect to supply voltage source. Connect to heatsink area and GND by low inductance wiring.
2 3
GND
COMP
4
FB
5 6
BDS BUO
7 8
EN VS
Exposed Pad
Data Sheet
4
Rev. 1.02, 2010-02-23
IFX91041
General Product Characteristics
4
4.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings1)
Tj = -40 C to +125 C; all voltages with respect to ground (unless otherwise specified)
Pos. Voltages 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 4.1.6 4.1.7 4.1.8 4.1.9 4.1.10 4.1.11 4.1.12 Buck Driver Supply Input Buck Switch Output Enable Input Supply Voltage Input Junction Temperature Storage Temperature ESD Resistivity Feedback Input Synchronization Input Compensation Input Parameter Symbol Limit Values Min. Max. 5.5 6.2 5.5 6.2 10 5.5 V V V V V V V V V V C C kV - - HBM 3) - Unit Conditions
VSYNC VCOMP VFB
-0.3 -0.3 -0.3 -0.3
t < 10s2)
-
t < 10s1)
IFX91041EJV50; IFX91041EJV33 IFX91041EJV
VBDS VBUO VEN VVS Tj Tstg VESD
VBUO
- 0.3 -2.0 -40 -0.3 -40 -55 -2
VBUO
+ 5.5
VVS + 0.3
45 45 150 150 2
Temperatures
ESD Susceptibility
1) Not subject to production test, specified by design. 2) Exposure to those absolute maximum ratings for extended periods of time (t > 10s) may affect device reliability 3) ESD susceptibility HBM according to EIA/JESD 22-A 114B (1.5k,100pF).
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
Data Sheet
5
Rev. 1.02, 2010-02-23
IFX91041
General Product Characteristics
4.2
Pos. 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6
Functional Range
Parameter Supply Voltage Output Voltage adjust range Buck inductor Buck capacitor Buck capacitor ESR Junction Temperature Symbol Min. Limit Values Max. 45 16 56 120 0.3 150 V V H F C - IFX91041EJV - - - 1) - 4.75 0.60 18 33 - -40 Unit Conditions
VS VCC LBU CBU1 ESRBU1 Tj
1) See section ""Application Information" on Page 12" for loop compensation requirements.
Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Pos. 4.3.1 4.3.2
Thermal Resistance
Parameter Junction to Case
1)
Symbol Min.
Limit Values Typ. - 52 Max. 12 - - -
Unit K/W K/W
Conditions -
2)
Junction to ambient1)
RthJC RthJA
1) Not subject to production test, specified by design. 2) According to Jedec JESD52-1,-5,-7 at natural convection on 2s2p FR4 PCB for 1W power dissipation. PCB 76.2x114.3x1.5mm3 with 2 inner copper layers of 70m thickness. Thermal via array conected to the first inner copper layer under the exposed pad.
Data Sheet
6
Rev. 1.02, 2010-02-23
IFX91041
Buck Regulator
5
5.1
Buck Regulator
Description
The gate of the power switch is driven by the external capacitor connected to pin BDS (Buck Driver Supply) using the bootstrap principle. An integrated under voltage lockout function supervising the 'bootstrap' capacitor voltage ensures that the device is always driven with a sufficient bootstrap voltage in order to prevent from extensive heat up of the power transistor. An integrated charge pump supports the gate drive in case of low input supply voltage, small differential voltage between input supply and output voltage at low current and during startup. In order to minimize emission, the charge pump is switched off if the input voltage is sufficient for supplying the bootstrap. The soft start function generates a defined ramp of the output voltage during the first 0.5 ms (typ.) after device initialization. The device initialization is triggered either by the EN voltage level crossing the turn-on threshold, rising supply voltage (during EN=H), and also when the device restarts a after thermal shutdown. The ramp starts after the BDS external capacitor is charged. The regulation scheme uses a voltage controlled pulse width modulation with feed forward path (the feed forward operates for supply voltages from 8.0V to 36V) which provides a fast line transient reaction. In order to maintain the output voltage regulation even under low duty cycle conditions (light load conditions down to ICC=0mA, high input voltage) a pulse skipping operation mode is implemented. Pulse skipping is also used for operation with low supply voltages, related to high duty cycles >92% In case of a lost connection to the pin FB , an internal pull-up current prevents from a uncontrolled rise of the output voltage (version IFX91041EJV only).
COMP
L when Overcurrent
OC Comp. =
VS
FB Soft start
Error Amp.
BDS PWM H when Comp. Error -Signal < Error -Signal Error -Ramp Error -Ramp NOR1 Output Stage OFF when H OFF when H R & Q S & S Clock Q Error -FF & Q
_ >1
Charge Pump R & H = INV Q OFF 1
Gate Driver Supply H= ON Gate Driver Power D-MOS BUO
VRef
0.6 V
= Ramp Generator
L when Tj > 175 C L when Output overvoltage Schmitt-Trigger 1 Ramp Vhigh
Feedforward V=k X VS Oscillator SYNC
PWM-FF NAND 2 & H when UV at V BDS BDS UV Comp. =
V max V min
tr tf tr
t
V low
tr tf tr
t
Figure 3
Block Diagram Buck Regulator
Data Sheet
7
Rev. 1.02, 2010-02-23
IFX91041
Buck Regulator
5.2
Electrical Characteristics
Electrical Characteristics: Buck Regulator
VS = 6.0 V to 40 V, Tj = -40 C to +125 C, all voltages with respect to ground (unless otherwise specified)
Pos. 5.2.1 Parameter Output voltage Symbol Limit Values Min. Typ. 5.00 Max. 5.10 V IFX91041EJV50; VVEN = VS 0.1A < ICC < 1.0A 5.2.2 IFX91041EJV50; 4.90 Unit Conditions
VFB
VFB
4.80
5.00
5.20
V
VVEN = VS;
3.23 3.30 3.37 V 1mA < ICC < 1.8A IFX91041EJV33; VVEN = VS; 0.1A < ICC < 1.0A IFX91041EJV33; VVEN = VS; 1mA < ICC < 1.8A IFX91041EJV; VVEN = VS; FB connected to VCC; VS = 12V 0.1A < ICC < 1.0A IFX91041EJV; VVEN = VS; FB connected to VCC; VS = 12V 1mA < ICC < 1.8A IFX91041EJV501) IFX91041EJV331) IFX91041EJV
5.2.3
Output voltage
VFB
5.2.4
VFB
Output voltage
3.17
3.30
3.43
V
5.2.5
VFB
0.588 0.60
0.612
V
5.2.6
VFB
0.576 0.60
0.624
V
5.2.7 5.2.8 5.2.9 5.2.10 5.2.11 5.2.12 5.2.13 5.2.14 5.2.15 5.2.16 5.2.17 5.2.18
Minimum output load requirement
ICC,MIN
0 1 1.5 5 10
- -
- -
mA mA mA mA
VCC > 3V1)
IFX91041EJV
VCC > 1.5V1)
- -0.1 - - 50 - - 0 900 500 - 3.6 - - mA A A m ns A V mA IFX91041EJV
VCC > =0.6V1)
FB input current FB input current Power stage on-resistance Current transition rise/fall time Buck peak over current limit Bootstrap under voltage lockout, turn-off threshold Charge pump current
IFB IFB Ron tr IBUOC VBDS,off ICP
-1 - - - 2.2 +3.3 2
IFX91041EJV
VFB = 0.6V
IFX91041EJV50, IFX91041EJV33 tested at 300 mA
ICC=1 A 2) -
Bootstrap voltage decreasing
VBUO -
-
VS = 12V; VBUO = VBDS = GND
Rev. 1.02, 2010-02-23
Data Sheet
8
IFX91041
Buck Regulator Electrical Characteristics: Buck Regulator
VS = 6.0 V to 40 V, Tj = -40 C to +125 C, all voltages with respect to ground (unless otherwise specified)
Pos. 5.2.19 5.2.20 5.2.21 Parameter Charge pump switch-off threshold Maximum duty cycle Soft start ramp Symbol Limit Values Min. Typ. - - 500 Max. 5 100 750 V % s (VBDS - VBUO) increasing
3)
Unit
Conditions
VBDS VBUO Dmax tstart
- - 350
VFB rising from 5% to 95% of VFB,nom VS decreasing VS increasing
-
5.2.22 5.2.23 5.2.24
Input under voltage shutdown threshold Input voltage startup threshold Input under voltage shutdown hysteresis
VS,off VS,on VS,hyst
3.75 - 150
- - -
- 4.75 -
V V mV
1) Not subject to production test, application related parameter 2) Not subject to production test; specified by design. 3) Consider "Chapter 4.2, Functional Range"
Data Sheet
9
Rev. 1.02, 2010-02-23
IFX91041
Module Enable and Thermal Shutdown
6
6.1
Module Enable and Thermal Shutdown
Description
With the enable pin the device can be set in off-state reducing the current consumption to less than 2A. The enable function features an integrated pull down resistor which ensures that the IC is shut down and the power switch is off in case the pin EN is left open. The integrated thermal shutdown function turns the power switch off in case of overtemperature. The typ. junction shutdown temperature is 175C, with a min. of 160C. After cooling down the IC will automatically restart operation. The thermal shutdown is an integrated protection function designed to prevent IC destruction when operating under fault conditions. It should not be used for normal operation.
6.2
Electrical Characteristics Module Enable, Bias and Thermal Shutdown
Electrical Characteristics: Enable, Bias and Thermal Shutdown
VS = 6.0 V to 40 V, Tj = -40 C to +125 C, all voltages with respect to ground (unless otherwise specified)
Pos. 6.2.1 6.2.2 Parameter Current Consumption, shut down mode Current Consumption, active mode Current Consumption, active mode Enable high signal valid Enable low signal valid Symbol Min. Limit Values Typ. 0.1 - Max. 2 7 A mA - - Unit Conditions
Iq,OFF Iq,ON
6.2.3
Iq,ON
-
-
10
mA
VEN = 0.8V; Tj < 105C; VS = 16V VEN = 5.0V; ICC = 0mA; VS = 16V FB connected to VOUT VEN = 5.0V; ICC = 1.8A; VS = 16V FB connected to VOUT1)
- -
1)
6.2.4 6.2.5 6.2.6 6.2.7 6.2.8 6.2.9 6.2.10
VEN,lo VEN,hi Enable hysteresis VEN,HY Enable high input current IEN,hi Enable low input current IEN,lo Over temperature shutdown Tj,sd Over temperature shutdown Tj,sd_hyst
hysteresis
3.0 - 50 - - 160 -
- - 200 - 0.1 175 15
- 0.8 400 30 1 190 -
V V mV A A C K
VEN = 16V VEN = 0.5V
1) 1)
1) Specified by design. Not subject to production test.
Data Sheet
10
Rev. 1.02, 2010-02-23
IFX91041
Module Oscillator
7
7.1
Module Oscillator
Description
The oscillator turns on the power switch with a constant frequency while the buck regulating circuit turns the power transistor off in every cycle with an appropriate time gap depending on the output and input voltage. The internal sawtooth signal used for the PWM generation has an amplitude proportional to the input supply voltage (feedforward). The turn-on frequency can optionally be set externally via the 'SYNC' pin using a TTL compatible input signal. In this case the synchronization of the PWM-on signal refers to the falling edge of the 'SYNC'-pin input signal. In case the synchronization to an external clock signal is not needed the 'SYNC' pin should be connected to GND. Leaving pin SYNC open or short-circuiting it to GND leads to normal operation with the internal switching frequency.
7.2
Electrical Characteristics Module Oscillator
Electrical Characteristics: Buck Regulator
VS = 6.0 V to 40 V, Tj = -40 C to +125 C, all voltages with respect to ground (unless otherwise specified)
Pos. 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 Parameter Oscillator frequency Synchronization capture range SYNC signal high level valid SYNC signal low level valid SYNC input internal pull-down Symbol Min. Limit Values Typ. 370 Max. 420 530 0.8 0.60 1.0 1.4 kHz kHz V V M
1) 1)
Unit
Conditions
fosc fsync VSYNC,hi VSYNC,lo RSYNC
330 200 2.9
VSYNC = 0V
VSYNC = 5V
1) Synchronization of PWM-on signal to falling edge.
Data Sheet
11
Rev. 1.02, 2010-02-23
IFX91041
Application Information
8
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.
8.1
Frequency Compensation
The stability of the output voltage can be achieved with a simple RC connected between pin COMP and GND. The standard configuration using the swiching frequency of the internal oscillator is a ceramic capacitor CCOMP = 22nF and RCOMP = 22k. By slight modifications to the compensation network the stability can be optimized for different application needs, such as varying switching frequency (using the sychronizing function), different types of buck capacitor (ceramic or tantalum) etc. The compensation network is essential for control loop stability. Leaving pin COMP open might lead to instable operation.
8.2
Compensating a tantalum buck capacitor CBU1
The TLE control loop is optimized for ceramic buck capacitors CBU. In order to maintain stability also for tantalum capacitors with ESR up to 300m, an additional compensation capacitance CCOMP2 at pin COMP to GND is required. It's value calculates:
CCOMP2 = CBU * ESR(CBU) / RCOMP ,
whereas CCOMP2 needs to stay below 5nF.
Application _C-COMP2.vsd
COMP
3
IFX91041
CCOMP CCOMP2 RCOMP
2
GND
Figure 4
High-ESR buck capacitor compensation
8.3
Catch Diode
In order to minimize losses and for fast recovery, a schottky catch diode is required. Disconnecting the catch diode during operation might lead to destruction of the IC.
Data Sheet
12
Rev. 1.02, 2010-02-23
IFX91041
Application Information
8.4
IFX91041EJV50, IFX91041EJV33 with fixed Output Voltage
D1
LI 22...47H
VBatt
Ignition Key Terminal 15
7
EN
8
VS
Enable Charge Pump Over Temperature Shutdown Feedforward COMP
3
5
BDS CBOT 220nF BUO DBU LBU 47H CBU1 VOUT
Buck Converter
Oscillator
6
CCOMP SYNC
1
CBU2 220nF
4
FB
100F
RCOMP Bandgap Reference Soft start ramp generator
IFX91041EJV50 IFX91041EJV33
2
GND
Figure 5
Application Diagram IFX91041EJV50 or IFX91041EJV33
Note: This is a very simplified example of an application circuit. The function must be verified in the real application
Data Sheet
13
Rev. 1.02, 2010-02-23
IFX91041
Application Information
8.5
Adjustable Output Voltage Device
LI 22...47H
D1
VBatt
Ignition Key Terminal 15
7
EN
8
VS
Biasing & Enable Over Temperature Shutdown Feedforward COMP
3
Charge Pump
5
BDS CBOT 220nF LBU 47H CBU1 100F R2 VOUT
Buck Converter
Oscillator
6
BUO DBU
CCOMP SYNC
1
R1
4
CBU2 220nF
FB CFB
RCOMP Bandgap Reference Soft start ramp generator
IFX91041EJV
2
GND
Figure 6
Application Diagram IFX91041EJV
Note: This is a very simplified example of an application circuit. The function must be verified in the real application The output voltage of the IFX91041EJV can be programmed by a voltage divider connected to the feedback pin FB. The divider cross current should be 300 A at minimum, therefore the maximum R2 calculates:
R2 VFB / IR2 --> R2 0.6V / 300 A = 2 k
For the desired output voltage level VCC, R1 calculates then (neglecting the small FB input current): V CC R 1 = R 2 --------- - 1 . V
FB
Add a 0.5 nF capacitor close to FB pin.
Data Sheet
14
Rev. 1.02, 2010-02-23
IFX91041
Package Outlines
9
Package Outlines
0.35 x 45 3.9 0.11)
Stand Off (1.45)
1.7 MAX.
0.1 C D 2x
8 MAX.
8 MAX. 0...8
0.2 +0 -0.1
0.19 +0.06
0.64 0.25
6 0.2
0.1+0 -0.1
1.27 0.410.09 2)
0...8 0.2
C
0.08 C Seating Plane C A-B D 8x
8 MAX.
M
M
D
0.2
D 8x
A
8 5
Bottom View 3 0.1
1 4
1
4
8
5
B 4.9 0.11)
Index Marking
0.1 C A-B 2x
1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Lead width can be 0.61 max. in dambar area 3) JEDEC reference MS-012 variation BA
2.65 0.1
GPS01206
Figure 7
Outline PG-DSO-8-27
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further package information, please visit our website: http://www.infineon.com/packages. Data Sheet 15
Dimensions in mm Rev. 1.02, 2010-02-23
IFX91041
Revision History
10
Revision History
Rev.1.02 2010-02-23 Editorial change Rev.1.01 2009-10-19 Overview page: Inserted reference statement to TLE/TLF series. Rev.1.0 2009-05-04 Final data sheet
Data Sheet
16
Rev. 1.02, 2010-02-23
Edition 2010-02-23 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2010 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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