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 New Product
U1B, U1C & U1D
Vishay General Semiconductor
Surface Mount Ultrafast Plastic Rectifier
FEATURES * Oxide planar chip junction * Ultrafast recovery time * Low forward voltage, low power losses * High forward surge capability * Meets MSL level 1, per J-STD-020, LF maximum peak of 260 C
DO-214AC (SMA)
* Solder dip 260 C, 40 s * Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM trr VF at IF = 1.0 A TJ max. 1.0 A 100 V, 150 V, 200 V 30 A 15 ns 0.76 V 150 C
For use in low voltage, high frequency rectifier of switching power supplies, freewheeling diodes, dc-to-dc converters or polarity protection application. MECHANICAL DATA Case: DO-214AC (SMA) Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test Polarity: Color band denotes cathode end
MAXIMUM RATINGS (TA = 25 C unless otherwise noted)
PARAMETER Device marking code Maximum repetitive peak reverse voltage Maximum average forward rectified current (Fig. 1) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range VRRM IF(AV) IFSM TJ, TSTG SYMBOL U1B U1B 100 U1C U1C 150 1.0 30 - 55 to + 150 U1D U1D 200 V A A C UNIT
Document Number: 89065 Revision: 13-May-08
For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
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New Product
U1B, U1C & U1D
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 C unless otherwise noted)
PARAMETER IF = 0.6 A IF = 1.0 A IF = 0.6 A IF = 1.0 A Reverse current (2) rated VR IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A IF = 0.6 A, dI/dt = 50 A/s, VR = 30 V, Irr = 0.1 IRM Storage charge Typical junction capacitance IF = 0.6 A, dI/dt = 50 A/s, VR = 30 V, Irr = 0.1 IRM 4.0 V, 1 MHz TEST CONDITIONS TA = 25 C VF TA = 100 C TA = 25 C TA = 100 C TA = 25 C TA = 25 C TA = 100 C TA = 25 C TA = 100 C IR trr trr Qrr CJ SYMBOL TYP. 0.82 0.87 0.71 0.76 55 24 29 7 13 6.8 MAX. 0.87 0.92 V 0.78 0.84 5.0 100 15 A ns ns nC pF UNIT
Instantaneous forward voltage
(1)
Reverse recovery time
Notes: (1) Pulse test: 300 s pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms
THERMAL CHARACTERISTICS (TA = 25 C unless otherwise noted)
PARAMETER Typical thermal resistance (1) Note: (1) Free air, mounted on recommended copper pad area SYMBOL RJA RJM U1B U1C 115 22 U1D UNIT C/W
ORDERING INFORMATION (Example)
PREFERRED P/N U1D-E3/61T U1D-E3/5AT UNIT WEIGHT (g) 0.064 0.064 PREFERRED PACKAGE CODE 61T 5AT BASE QUANTITY 1800 7500 DELIVERY MODE 7" diameter plastic tape and reel 13" diameter plastic tape and reel
RATINGS AND CHARACTERISTICS CURVES (TA = 25 C unless otherwise noted)
1.2 1.0 D = 0.5 D = 0.8
Average Forward Current (A)
1.0
Average Power Loss (W)
0.8
D = 0.3 D = 0.2 D = 1.0
0.8
0.6
D = 0.1
0.6
0.4 T 0.2 D = tp/T tp 1.0 1.2
0.4
0.2
0 80 90 100 110 120 130 140 150
0 0 0.2 0.4 0.6 0.8
TM - Mount Temperature (C)
Average Forward Current (A)
Figure 1. Forward Derating Curve
Figure 2. Forward Power Loss Characteristics
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For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
Document Number: 89065 Revision: 13-May-08
New Product
U1B, U1C & U1D
Vishay General Semiconductor
10
10 TA = 150 C
Instantaneous Forward Current (A)
1
TA = 125 C TA = 100 C
0.1
TA = 25 C
Junction Capactiance (pF)
TJ = 25 C f = 1.0 MHz Vstg = 50 mVp-p 1 0.1 1 10 100
0.01 0.1
0.3
0.5
0.7
0.9
1.1
1.3
Instantaneous Forward Voltage (V)
Reverse Voltage (V)
Figure 3. Typical Instantaneous Forward Characteristics
Figure 5. Typical Junction Capacitance
Transient Thermal Impedance (C/W)
1000
100 Junction to Ambient TA = 150 C
Instantaneous Reverse Current (A)
100
TA = 125 C TA = 100 C
10
10
1 TA = 25 C
0.1
0.01 10 20 30 40 50 60 70 80 90 100
1 0.001
0.01
0.1
1
10
100
Percent of Rated Peak Reverse Voltage (%)
t - Pulse Duration (s)
Figure 4. Typical Reverse Characteristics
Figure 6. Typical Transient Thermal Impedance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AC (SMA)
Cathode Band
Mounting Pad Layout
0.066 (1.68) MIN. 0.074 (1.88) MAX.
0.065 (1.65) 0.049 (1.25)
0.110 (2.79) 0.100 (2.54)
0.177 (4.50) 0.157 (3.99) 0.012 (0.305) 0.006 (0.152)
0.060 (1.52) MIN. 0.208 (5.28) REF.
0.090 (2.29) 0.078 (1.98)
0.060 (1.52) 0.030 (0.76)
0.008 (0.203) 0 (0) 0.208 (5.28) 0.194 (4.93)
Document Number: 89065 Revision: 13-May-08
For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com
www.vishay.com 3
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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