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CYStech Electronics Corp.
P-CHANNEL Enhancement Mode MOSFET
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 1/6
MTP2305N3
Features
* VDS=-20V RDS(ON)=65m@VGS=-4.5V, IDS=-4.2A RDS(ON)=100m@VGS=-2.5V, IDS=-2A * Advanced trench process technology * Super high density cell design for extremely low on resistance * Reliable and rugged * Compact and low profile SOT-23 package * Pb-free package
Equivalent Circuit
MTP2305N3
Outline
SOT-23 D
GGate SSource DDrain
G
S
Absolute Maximum Ratings (Ta=25C)
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @TA=25C (Note 1) Continuous Drain Current @TA=70C (Note 1) Pulsed Drain Current (Note 2) Maximum Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Symbol VDS VGS ID ID IDM PD Tj, Tstg Limits -20 12 -4.2 -3.4 -10 1.38 0.01 -55~+150 Unit V V A A A W W/C C
Note : 1. Surface mounted on 1 in copper pad of FR-4 board, 270C/W when mounted on minimum copper pad. 2. Pulse width limited by maximum junction temperature.
MTP2305N3 CYStek Product Specification
CYStech Electronics Corp.
Thermal Performance
Parameter Thermal Resistance, Junction-to-Ambient Symbol Rth,ja
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 2/6
Limit 90
Unit C/W
Note : Surface mounted on 1 in copper pad of FR-4 board, 270C/W when mounted on minimum copper pad.
Electrical Characteristics (Tj=25C, unless otherwise specified)
Symbol Static BVDSS BVDSS/Tj VGS(th) IGSS IDSS Min. -20 -0.5 Typ. -0.1 9 740 167 126 5.9 3.6 32.4 2.6 10.6 2.32 3.68 27.7 22 Max. 100 -1 -10 53 65 100 250 -1.2 Unit V V/C V nA A A m S Test Conditions VGS=0, ID=-250A Reference to 25C, ID=-1mA VDS=VGS, ID=-250A VGS=12V, VDS=0 VDS=-20V, VGS=0 VDS=-16V, VGS=0, Tj=70C ID=-4.5A, VGS=-10V ID=-4.2A, VGS=-4.5V ID=-2.0A, VGS=-2.5V ID=-1.0A, VGS=-1.8V VDS=-5V, ID=-2.8A
*RDS(ON)
*GFS Dynamic Ciss Coss Crss *td(ON) *tr *td(OFF) *tf *Qg *Qgs *Qgd Source-Drain Diode *VSD *trr *Qrr -
pF
VDS=-15V, VGS=0, f=1MHz VDS=-15V, ID=-4.2A, VGS=-10V, RD=3.6, RG=6 VDS=-16V, ID=-4.2A, VGS=-4.5V,
ns
nC
V ns nC
VGS=0V, ISD=-1.2A IS=-4.2A, VGS=0V, dI/dt=100A/s
*Pulse Test : Pulse Width 300s, Duty Cycle2%
Ordering Information
Device MTP2305N3 Package SOT-23 (Pb-free) Shipping 3000 pcs / Tape & Reel Marking 2305
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 3/6
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 4/6
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves(Cont.)
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 5/6
MTP2305N3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C417N3 Issued Date : 2007.07.27 Revised Date : Page No. : 6/6
A L
Marking:
3 B 1 2 S
TE 2305
V
G
3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style: Pin 1.Gate 2.Source 3.Drain
C D K
H
J
*: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
* Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP2305N3
CYStek Product Specification

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