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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8178TK
SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The PC8178TK is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can not be realized on internal 50 wide band matched IC. PC8178TK adopts 6-pin lead-less minimold package using same chip as the conventional PC8178TB in 6-pin super minimold. TK suffix IC which is smaller package than TB suffix IC contributes to reduce mounting space by 50 %. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
FEATURES
* Low current consumption * Supply voltage * Excellent isolation : ICC = 1.9 mA TYP. @ VCC = 3.0 V : VCC = 2.4 to 3.3 V : ISL = 40 dB TYP. @ f = 1.0 GHz ISL = 41 dB TYP. @ f = 1.9 GHz ISL = 42 dB TYP. @ f = 2.4 GHz * Power gain : GP = 11.0 dB TYP. @ f = 1.0 GHz GP = 11.0 dB TYP. @ f = 1.9 GHz GP = 11.0 dB TYP. @ f = 2.4 GHz * Gain 1 dB compression output power : PO (1 dB) = -5.5 dBm TYP. @ f = 1.0 GHz PO (1 dB) = -8.0 dBm TYP. @ f = 1.9 GHz PO (1 dB) = -8.0 dBm TYP. @ f = 2.4 GHz * Operating frequency * High-density surface mounting * Light weight : 0.1 to 2.4 GHz (Output port LC matching) : 6-pin lead-less minimold package (1.5 x 1.3 x 0.55 mm) : 3 mg (Standard value)
APPLICAION
* Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information.
Document No. PU10063EJ02V0DS (2nd edition) Date Published March 2005 CP(K) Printed in Japan
The mark
shows major revised points. NEC Compound Semiconductor Devices, Ltd. 2001, 2005
PC8178TK
ORDERING INFORMATION
Part Number Order Number Package 6-pin lead-less minimold (1511) (Pb-Free)
Note
Marking 6B
Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 5 kpcs/reel
PC8178TK-E2
PC8178TK-E2-A
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC8178TK
PRODUCT LINE-UP (TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Parameter 1.0 GHz output port matching frequency ICC Part No. (mA) 1.9 1.9 4.0 2.8 4.2 5.6 GP (dB) 11.0 11.0 13.5 12.5 12.5 23.0 ISL (dB) 39.0 40.0 44.0 39.0 38.0 40.0 PO(1dB) (dBm) -4.0 -5.5 +3.0 -4.0 +2.5 -4.5 1.66 GHz output port matching frequency GP (dB) - - - 13.0 15.0 19.5 ISL (dB) - - - 39.0 36.0 38.0 PO(1dB) (dBm) - - - -4.0 +1.5 -8.5 1.9 GHz output port matching frequency GP (dB) 11.5 11.0 15.5 13.0 15.0 17.5 ISL (dB) 40.0 41.0 42.0 37.0 34.0 35.0 PO(1dB) (dBm) -7.0 -8.0 +1.5 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP (dB) 11.5 11.0 15.5 - - - ISL (dB) 38.0 42.0 41.0 - - - PO(1dB) (dBm) -7.5 -8.0 +1.0 - - - C3B 6B C3C C2P C2U C2V Marking
PC8178TB PC8178TK PC8179TB PC8128TB PC8151TB PC8152TB
Remarks 1. Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2. To know the associated product, please refer to each latest data sheet.
2
Data Sheet PU10063EJ02V0DS
PC8178TK
SYSTEM APPLICATION EXAMPLE
Location examples in digital cellular
Low Noise Tr. RX
DEMOD.
I Q
SW
/N
PLL PLL
I 0 TX PA
90 Q
These ICs can be added to your system around
parts, when you need more isolation or gain. The application
herein, however, shows only examples, therefore the application can depend on your kit evaluation.
Data Sheet PU10063EJ02V0DS
3
PC8178TK
PIN CONNECTIONS
(Top View) (Bottom View) 6 5 4 6 5 4 1 2 3
Pin No. 1 2 3 4 5 6 Pin Name INPUT GND GND OUTPUT GND VCC
6B
Applied Voltage (V) -
1 2 3
PIN EXPLANATION
Pin No. 1 Pin Name INPUT Pin Voltage Note (V) 0.90 Function and Applications Internal Equivalent Circuit
Signal input pin. A internal matching circuit, configured with resisters, enables 50 connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut.
2 3 5
GND
0
-
Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference.
6 4
4
OUTPUT
Voltage as same as VCC through external inductor
-
Signal output pin. This pin is designed as collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1 005 chip inductor can be chosen.
2
3
1
5
6
VCC
2.4 to 3.3
-
Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its impedance.
Note Pin voltage is measured at VCC = 3.0 V.
4
Data Sheet PU10063EJ02V0DS
PC8178TK
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Circuit Current Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC ICC PD TA Tstg Pin TA = +25C Test Conditions TA = +25C, Pin 4, Pin 6 TA = +25C TA = +85C Note Ratings 3.6 15 232 -40 to +85 -55 to +150 +5 Unit V mA mW C C dBm
Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter Supply Voltage Symbol VCC MIN. 2.4 -40 TYP. 3.0 MAX. 3.3 Unit V C Remarks The same voltage should be applied to pin 4 and pin 6. Operating Ambient Temperature TA +25 +85
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , at LC matched frequency)
Parameter Circuit Current Power Gain Symbol ICC GP No signal f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm Isolation ISL f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm Gain 1 dB Compression Output Power PO(1 dB) f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz Noise Figure NF f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz Input Return Loss RLin f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm Test Conditions MIN. 1.4 9.0 9.0 9.0 35.0 36.0 37.0 -8.0 -11.0 -11.5 - - - 4.0 5.0 6.5 TYP. 1.9 11.0 11.0 11.0 40.0 41.0 42.0 -5.5 -8.0 -8.0 5.5 5.5 5.5 7.0 8.0 9.5 MAX. 2.4 13.0 13.5 13.5 - - - - - - 7.0 7.0 7.0 - - - dB dB dBm dB Unit mA dB
Data Sheet PU10063EJ02V0DS
5
PC8178TK
TEST CIRCUITS
<1> f = 1.0 GHz
Output port matching circuit C6 C5 C4 VCC
L1 6 C1 IN 1 4 DUT C2 C3 OUT
Strip Line : 1 mm 2, 3, 5 Strip Line : 5 mm
<2> f = 1.9 GHz
Output port matching circuit C7 C6 C5 C4 VCC
L1 6 C1 IN 1 4 DUT C2 C3 OUT
Strip Line : 7 mm 2, 3, 5
<3> f = 2.4 GHz
Output port matching circuit C6 C5 C4 C3 VCC
L2 6 C1 IN 1 4 DUT L1 C2 OUT
Strip Line : 4 mm 2, 3, 5 Strip Line : 3 mm
6
Data Sheet PU10063EJ02V0DS
PC8178TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
<1> f = 1.0 GHz
VCC
C6
IN
Top View
C5 C4
VCC
OUT
L1
Mounting direction
(1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) : Through holes
COMPONENT LIST
Form Chip capacitor Symbol C1, C3 C2 C4 C5 Feed-though Capacitor Chip inductor C6 L1 Value 1 000 pF 0.75 pF 20 pF 10 pF 1 000 pF 12 nH Type code GRM40CH102J50PT GRM39CKR75C50PT GRM39CH200J50PT GRM39CH100D50PT DFT301-801 x 7R102S50 LL1608-FH12N Maker murata murata murata murata murata TOKO
6B
C1
C2
C3
PC8178TK
Data Sheet PU10063EJ02V0DS
7
PC8178TK
<2> f = 1.9 GHz
VCC
C5
C7
IN
Top View
6B
C1 C4 C6
VCC
OUT
L1
C2
C3
Mounting direction
PC8178TK
(1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) : Through holes
COMPONENT LIST
Form Chip capacitor Symbol C1, C3, C5, C6 C2 C4 Feed-though Capacitor Chip inductor C7 L1 Value 1 000 pF 0.5 pF 8 pF 1 000 pF 2.7 nH Type code GRM40CH102J50PT GRM39CKR5C50PT GRM39CH080D50PT DFT301-801 x 7R102S50 LL1608-FH2N7S Maker murata murata murata murata TOKO
8
Data Sheet PU10063EJ02V0DS
PC8178TK
<3> f = 2.4 GHz
VCC
C4
C6 VCC
IN
Top View
C3
L2
OUT
C5 C1 L1
Mounting direction
(1) 42 x 35 x 0.4 mm polyimide board, double-sided copper clad (2) Back side: GND pattern (3) Gold plated on pattern (4) : Through holes
COMPONENT LIST
Form Chip capacitor Symbol C1, C2, C4, C5 C3 Feed-though Capacitor Chip inductor C6 L1 L2 Value 1 000 pF 10 pF 1 000 pF 2.7 nH 1.8 nH Type code GRM40CH102J50PT GRM39CH100D50PT DFT301-801 x 7R102S50 LL1608-FH2N7S LL1608-FH1N8S Maker murata murata murata TOKO TOKO
6B
C2
PC8178TK
Data Sheet PU10063EJ02V0DS
9
PC8178TK
TYPICAL CHARACTERISTICS (TA = +25C, unless otherwise specified)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
3.0 2.5 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Supply Voltage VCC (V) +50C +85C -40C -20C TA = +25C
Circuit Current ICC (mA)
Remark The graph indicates nominal characteristics.
10
Data Sheet PU10063EJ02V0DS
PC8178TK
f = 1.0 GHz MATCHING
S11-FREQUENCY
1: 63.219 -64.27 2.4764 pF MARKER 1 1.0 GHz MARKER 1 1.0 GHz 1 1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm STOP 3 100.000 000 MHz
S22-FREQUENCY
1: 54.049 -12.43 12.804 pF
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 START 100.000 000 MHz STOP 3 100.000 000 MHz MAG 2 dB/ REF 0 dB 1 : -6.9156 dB S12 log -20 -25 -30 MAG
S12-FREQUENCY
5 dB/ REF -20 dB 1 : -40.104 dB
VCC = 2.4 V 1
Pin = -30 dBm, MARKER 1 f = 1.0 GHz
Pin = -30 dBm, MARKER 1 f = 1.0 GHz
1 VCC = 2.4 V 2.7 V 3.0 V 3.3 V
3.0 V
-35 -40 -45
2.7 V 3.3 V
-50 -55 -60 -65 -70 START 100.000 000 MHz STOP 3 100.000 000 MHz
S21-FREQUENCY
S21 log 20 18 16 14 12 10 8 6 4 2 MAG 2 dB/ REF 0 dB 1 : 11.235 dB S22 log 0 -2 -4 -6 MAG
S22-FREQUENCY
2 dB/ REF 0 dB 1 : -16.86 dB
Pin = -30 dBm, MARKER 1 f = 1.0 GHz
1
-8 -10
VCC = 2.4 V 2.7 V 3.0 V 3.3 V
VCC = 3.3 V 3.0 V 2.7 V
-12 -14 -16 -18 1
2.4 V 0 START 100.000 000 MHz
Pin = -30 dBm, MARKER 1 f = 1.0 GHz
STOP 3 100.000 000 MHz
STOP 3 100.000 000 MHz
-20 START 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
11
PC8178TK
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 +25C +85C MAG 2 dB/ REF 0 dB 1 : -6.8297 dB S12 log -20 -25 MAG
S12-FREQUENCY
5 dB/ REF -20 dB 1 : -39.127 dB
Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz
1
1
TA = -40C
-30 -35 -40 -45 -50 -55 -60 +25C TA = -40C
Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz
STOP 3 100.000 000 MHz
-20 START 100.000 000 MHz
+85C -70 START 100.000 000 MHz
-65
STOP 3 100.000 000 MHz
S21-FREQUENCY
S21 log 20 18 16 14 12 10 8 6 4 2 +85C 0 START 100.000 000 MHz STOP 3 100.000 000 MHz
TA = -40C 1
S22-FREQUENCY
1 : 11.053 dB S22 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 -20 START 100.000 000 MHz MAG 2 dB/ REF 0 dB 1 : -13.758 dB
MAG
2 dB/
REF 0 dB
Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz
TA = -40C +25C +85C
1
+25C
Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 1.0 GHz
STOP 3 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
12
Data Sheet PU10063EJ02V0DS
PC8178TK
OUTPUT POWER vs. INPUT POWER
10 5
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 TA = -40C 5
Output Power Pout (dBm)
VCC = 3.3 V 0 -5 2.7 V -10 -15 -20 f = 1.0 GHz -25 -30 -20 -10 0 10 3.0 V 2.4 V
+25C
0 -5 -10 -15 -20 -25 -30 -20 -10 0 VCC = 3.0 V f = 1.0 GHz 10 +85C
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 IM3 (des) VCC = 2.4 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 Pout (des) IM3 (undes) OIP3 = 3.5 dBm Pout (undes)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 IM3 (undes) VCC = 2.7 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 Pout (des) IM3 (des) Pout (undes) OIP3 = 4.2 dBm
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 IM3 (undes) VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz 0 -10 Pout (des) IM3 (des) OIP3 = 5.0 dBm Pout (undes)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 IM3 (des) -20 VCC = 3.3 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 IM3 (undes) Pout (des) OIP3 = 5.3 dBm Pout (undes)
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
13
PC8178TK
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -25 -20 -15 -10 VCC = 3.0 V TA = -40C f1 = 1 000 MHz f2 = 1 001 MHz -5 0 Pout (des) IM3 (undes) IM3 (des) OIP3 = 3.0 dBm Pout (undes)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 1 000 MHz f2 = 1 001 MHz -10 0 Pout (des) IM3 (undes) IM3 (des) OIP3 = 5.0 dBm Pout (undes)
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -25 -20 -15 IM3 (undes) VCC = 3.0 V TA = +85C f1 = 1 000 MHz f2 = 1 001 MHz -10 -5 0 Pout (des) IM3 (des) OIP3 = 5.0 dBm Pout (undes)
3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
60 50 40 30 20 10 0 -25 f1 = 1 000 MHz f2 = 1 001 MHz -20 -15 -10 -5 0 VCC = 3.0 V 3.3 V 2.4 V 2.7 V
Input Power Pin (dBm)
Output Power of Each Tone Pout (each) (dBm)
NOISE FIGURE vs. SUPPLY VOLTAGE
6.5
Noise Figure NF (dB)
6 TA = +85C 5.5 5 -40C f = 1.0 GHz 4 2 2.5 3 3.5 4 +25C
4.5
Supply Voltage VCC (V)
Remark The graphs indicate nominal characteristics.
14
Data Sheet PU10063EJ02V0DS
PC8178TK
f = 1.9 GHz MATCHING
S11-FREQUENCY
MARKER 1 1.9 GHz 1: 33.535 -44.393 1.8869 pF MARKER 1 1.9 GHz
S22-FREQUENCY
1: 43.529 -16.648 5.0314 pF
1 1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz START 100.000 000 MHz VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm STOP 3 100.000 000 MHz
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 3.0 V 3.3 V VCC = 2.4 V 1 2.7 V MAG 2 dB/ REF 0 dB 1 : -8.4012 dB
S12-FREQUENCY
S12 log MAG 5 dB/ REF -20 dB -20 -25 Pin = -30 dBm, MARKER 1 f = 1.9 GHz -30 -35 -40 -45 -50 -55 -60 1 1 : -41.705 dB VCC = 2.4 V 2.7 V 3.0 V 3.3 V
Pin = -30 dBm, MARKER 1 f = 1.9 GHz
STOP 3 100.000 000 MHz
-65 -70 START 100.000 000 MHz STOP 3 100.000 000 MHz
-20 START 100.000 000 MHz
S21-FREQUENCY
20 18 16 14 12 10 8 6 4 2 0 START 100.000 000 MHz S21 log MAG 2 dB/ REF 0 dB 1 : 11.5 dB S22 log 0 -2 -4 MAG
S22-FREQUENCY
2 dB/ REF 0 dB 1 : -15.578 dB
Pin = -30 dBm, MARKER 1 f = 1.9 GHz
VCC = 3.0 V 1 3.3 V
-6 -8 -10 VCC = 2.4 V 2.7 V 3.0 V 3.3 V 1
2.4 V
-12 -14 -16
2.7 V STOP 3 100.000 000 MHz
-18 Pin = -30 dBm, MARKER 1 f = 1.9 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
15
PC8178TK
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 Pin = -30 dBm, VCC = 3.0 V -18 MARKER 1 f = 1.9 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz -16 +85C 1 TA = -40C +25C MAG 2 dB/ REF 0 dB 1 : -8.2405 dB
S12-FREQUENCY
S12 log MAG 5 dB/ REF -20 dB 1 : -40.84 dB -20 Pin = -30 dBm, VCC = 3.0 V -25 MARKER 1 f = 1.9 GHz TA = -40C -30 -35 -40 -45 -50 -55 -60 -65 -70 START 100.000 000 MHz STOP 3 100.000 000 MHz +25C +85C 1
S21-FREQUENCY
S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, VCC = 3.0 V 18 MARKER 1 f = 1.9 GHz 16 14 12 10 8 6 4 2 0 START 100.000 000 MHz STOP 3 100.000 000 MHz +25C +85C 1 TA = -40C 1 : 11.553 dB S22 log 0 -2 -4 -6 -8 -10 -12 -14 -16 MAG
S22-FREQUENCY
2 dB/ REF 0 dB 1 : -14.437 dB
TA = -40C +25C +85C 1
Pin = -30 dBm, -18 VCC = 3.0 V, -20 MARKER 1 f = 1.9 GHz START 100.000 000 MHz STOP 3 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
16
Data Sheet PU10063EJ02V0DS
PC8178TK
OUTPUT POWER vs. INPUT POWER
10 5
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 TA = -40C 5
0 -5 -10 -15 -20
VCC = 3.3 V 3.0 V 2.7 V 2.4 V
Output Power Pout (dBm)
0 -5 -10 -15 -20 +85C +25C
f = 1.9 GHz
-25 -30
-20
-10
0
10
f = 1.9 GHz, VCC = 3.0 V -25 -10 -30 -20
0
10
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 2.4 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0 Pout (des) IM3 (undes) OIP3 = 0.8 dBm Pout (undes) IM3 (des)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20
OIP3 = 1.6 dBm Pout (undes) IM3 (des) Pout (des) IM3 (undes)
VCC = 2.7 V f1 = 1 900 MHz f2 = 1 901 MHz 0 -10
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 3.3 V f1 = 1 900 MHz f2 = 1 901 MHz 0 -10 IM3 (undes) Pout (des) OIP3 = 2.5 dBm Pout (undes) IM3 (des)
OIP3 = 2.3 dBm Pout (undes) IM3 (des) Pout (des) IM3 (undes)
VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
17
PC8178TK
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 Pout (des) IM3 (undes) IM3 (des) VCC = 3.0 V TA = -40C f1 = 1 900 MHz f2 = 1 901 MHz -10 0 OIP3 = 2.3 dBm Pout (undes)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20
VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz -10 0 Pout (des) IM3 (undes) IM3 (des) OIP3 = 2.3 dBm Pout (undes)
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 Pout (des) IM3 (undes) VCC = 3.0 V TA = +85C f1 = 1 900 MHz f2 = 1 901 MHz -10 0 IM3 (des) OIP3 = 2.1 dBm Pout (undes)
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
3rd Order Intermodulation Distortion IM3 (dBc)
50 45 40 35 30 25 20 15 10 5 0 -25 -20 -15 f1 = 1 900 MHz f2 = 1 901 MHz 0 -10 -5 2.4 V 2.7 V VCC = 3.0 V 3.3 V
Input Power Pin (dBm)
Output Power of Each Tone Pout (each) (dBm)
NOISE FIGURE vs. SUPPLY VOLTAGE
6.5 TA = +85C
6
Noise Figure NF (dB)
5.5
+25C
5
4.5 f = 1.9 GHz 4 2 2.5
-40C
3
3.5
4
Supply Voltage VCC (V)
Remark The graphs indicate nominal characteristics.
18
Data Sheet PU10063EJ02V0DS
PC8178TK
f = 2.4 GHz MATCHING
S11-FREQUENCY
1: 26.945 -32.572 2.0359 pF
S22-FREQUENCY
1: 47.047 13.205 875.69 pH
MARKER 1 2.4 GHz
1
1 VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz
MARKER 1 2.4 GHz VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm START 100.000 000 MHz STOP 3 100.000 000 MHz
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 3.3 V 2.7 V 3.0 V VCC = 2.4 V 1 MAG 2 dB/ REF 0 dB 1 : -10.022 dB
S12-FREQUENCY
S12 log MAG 5 dB/ REF -20 dB -20 -25 Pin = -30 dBm, MARKER 1 f = 2.4 GHz -30 -35 -40 -45 -50 -55 -60 VCC = 2.4 V 2.7 V 3.0 V 3.3 V STOP 3 100.000 000 MHz 1 : -41.967 dB VCC = 2.4 V 2.7 V 3.0 V 3.3 V 1
Pin = -30 dBm, MARKER 1 f = 2.4 GHz
STOP 3 100.000 000 MHz
-65
-20 START 100.000 000 MHz
-70 START 100.000 000 MHz
S21-FREQUENCY
S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, 18 MARKER 1 f = 2.4 GHz 16 14 12 10 8 6 4 2 0 START 100.000 000 MHz STOP 3 100.000 000 MHz 2.7 V 2.4 V VCC = 3.3 V 1 : 11.623 dB S22 log 0 -2 -4 3.0 V 1 -6 -8 -10 -12 -14 -16 -18 MAG
S22-FREQUENCY
2 dB/ REF 0 dB 1 : -16.424 dB
VCC = 2.4 V 2.7 V 3.0 V 3.3 V
1
Pin = -30 dBm, MARKER 1 f = 2.4 GHz
STOP 3 100.000 000 MHz
-20 START 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
19
PC8178TK
S11-FREQUENCY
S11 log 0 -2 -4 -6 -8 -10 -12 -14 -16 -18 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz +85C TA = -40C +25C 1 MAG 2 dB/ REF 0 dB 1 : -10.156 dB
S12-FREQUENCY
S12 log MAG 5 dB/ REF -20 dB 1 : -39.14 dB -20 -25 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz TA = -40C -30 +25C -35 1 -40 -45 -50 -55 -60 -65 -70 START 100.000 000 MHz +85C STOP 3 100.000 000 MHz
S21-FREQUENCY
S21 log MAG 2 dB/ REF 0 dB 20 Pin = -30 dBm, VCC = 3.0 V 18 MARKER 1 f = 2.4 GHz 16 TA = -40C 14 12 10 8 6 4 2 0 START 100.000 000 MHz STOP 3 100.000 000 MHz +85C +25C 1 : 10.851 dB S22 log 0 -2 -4 -6 1 -8 -10 -12 -14 -16 MAG
S22-FREQUENCY
2 dB/ REF 0 dB 1 : -12.302 dB TA = +85C
+25C -40C
1
-18 Pin = -30 dBm, VCC = 3.0 V MARKER 1 f = 2.4 GHz -20 START 100.000 000 MHz STOP 3 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
20
Data Sheet PU10063EJ02V0DS
PC8178TK
OUTPUT POWER vs. INPUT POWER
10 5
Output Power Pout (dBm) Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
10 5
0 -5 -10 -15 -20
VCC = 3.0 V 3.3 V
0 -5 -40C -10 -15 -20 +25C
TA = +85C
2.7 V 2.4 V
f = 2.4 GHz -25 -30 -20 -10 0 10 -25 -30 -20 -10
f = 2.4 GHz, VCC = 3.0 V 0 10
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 2.4 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Pout (des) IM3 (des) OIP3 = 1.0 dBm Pout (undes) IM3 (undes)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 2.7 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Pout (des) IM3 (des) OIP3 = 1.4 dBm Pout (undes) IM3 (undes)
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Pout (des) IM3 (des) OIP3 = 2.1 dBm Pout (undes) IM3 (undes)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 3.3 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Pout (des) IM3 (des) OIP3 = 2.6 dBm Pout (undes) IM3 (undes)
Input Power Pin (dBm)
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
21
PC8178TK
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc) Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 IM3 (des) VCC = 3.0 V TA = -40C f1 = 2 400 MHz f2 = 2 401 MHz -10 0 OIP3 = 1.1 dBm Pout (undes) Pout (des) IM3 (undes)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz -10 0 IM3 (undes) IM3 (des) OIP3 = 2.1 dBm Pout (undes) Pout (des)
Input Power Pin (dBm)
Input Power Pin (dBm)
Output power Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBc)
OUTPUT POWER, IM3 vs. INPUT POWER
20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -30 -20 IM3 (undes) IM3 (des) VCC = 3.0 V TA = +85C f1 = 2 400 MHz f2 = 2 401 MHz -10 0 Pout (des) OIP3 = 2.2 dBm Pout (undes)
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE
3rd Order Intermodulation Distortion IM3 (dBc)
50 45 40 35 30 25 20 15 10 5 0 -25 -20 -15 f1 = 2 400 MHz f2 = 2 401 MHz -10 -5 0 2.4 V 2.7 V VCC = 3.0 V 3.3 V
Input Power Pin (dBm)
Output Power of Each Tone Pout (each) (dBm)
NOISE FIGURE vs. SUPPLY VOLTAGE
6.5 TA = +85C
Noise Figure NF (dB)
6 +25C 5.5
5 -40C 4.5 f = 2.4 GHz 4 2 2.5 3 3.5 4
Supply Voltage VCC (V)
Remark The graphs indicate nominal characteristics.
22
Data Sheet PU10063EJ02V0DS
PC8178TK
f = 3.0 GHz MATCHING
S11-FREQUENCY
1: 67.34 -63.512 1 GHz 2: 34.416 -46.209 1.9 GHz 3: 27.732 -34.887 2.4 GHz 4: 24.257 -25.16 2.1086 pF 4 1 32 1: 100.98 1 GHz 2: 61.047 1.9 GHz 3: 45.648 2.4 GHz 4: 29.031 354.18 fF
S22-FREQUENCY
-350.69 -216.37 -180.84 -149.79 MARKER 4 3 GHz
MARKER 4 3 GHz
VCC = 3.0 V, ICC = 2.11 mA Pin = -30 dBm, TA = +25C (at L loaded) START 100.000 000 MHz
2 4 1 VCC = 3.0 V, ICC = 2.11 mA 3 Pin = -30 dBm, TA = +25C (at L loaded) STOP 3 100.000 000 MHz
START 100.000 000 MHz
STOP 3 100.000 000 MHz
Remark The graphs indicate nominal characteristics.
Data Sheet PU10063EJ02V0DS
23
PC8178TK
PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
(Top View) (Bottom View)
0.480.05 0.480.05
1.50.1
1.10.1 1.30.05
0.20.1
0.160.05
0.90.1
24
0.550.03
Data Sheet PU10063EJ02V0DS
0.11+0.1 -0.05
PC8178TK
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor (L) should be attached between output and VCC pins. The L and series capacitor (C) values should be adjusted for applied frequency to match impedance to next stage. (5) The DC capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260
For soldering
Preheating temperature (package surface temperature) : 120C or below
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PU10063EJ02V0DS
25
PC8178TK
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of March, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
26
Data Sheet PU10063EJ02V0DS
PC8178TK
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
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