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IP4284CZ10-TB; IP4284CZ10-TT
ESD protection for ultra high-speed interfaces
Rev. 02 -- 1 April 2010 Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface (HDMI), DisplayPort, SuperSpeed USB, external Serial Advanced Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces against ElectroStatic Discharge (ESD). The devices include high-level ESD protection diodes for ultra high-speed signal lines and are available in two package variants: XSON10U and TSSOP10. All signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.5 pF. These diodes provide protection to downstream components from ESD voltages up to 8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) System ESD protection for USB 2.0 and USB SuperSpeed 3.0, HDMI 1.3 and HDMI 1.4, DisplayPort, eSATA and LVDS All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 8 kV according to IEC 61000-4-2, level 4 Matched 0.5 mm trace spacing Signal lines with 0.05 pF matching capacitance between signal pairs Line capacitance of only 0.5 pF for each channel 4-channel, XSON10U or TSSOP10 Pb-free package Design-friendly 'pass-thru' signal routing
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection: TVs, monitors DVD recorders and players Notebooks, mother boards, graphic cards and ports Set-top boxes and game consoles
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1. Pin 1 2 3 4 5 6 7 8 9 10 Pinning Description channel 1 ESD protection channel 2 ESD protection ground channel 3 ESD protection channel 4 ESD protection not connected not connected ground not connected not connected
5 6 4 7 3 8 3, 8
018aaa001
Symbol CH1 CH2 GND CH3 CH4 n.c. n.c. GND n.c. n.c.
Simplified outline
Graphic symbol
IP4284CZ10-TB (SOT1059-1)
1 1 10 2 4 5
2
9
Transparent top view
XSON10U IP4284CZ10-TT (SOT552-1) 1 2 3 4 5 6 7 8 9 10 CH1 CH2 GND CH3 CH4 n.c. n.c. GND n.c. n.c. channel 1 ESD protection channel 2 ESD protection ground channel 3 ESD protection channel 4 ESD protection not connected not connected ground not connected not connected
1 5 3, 8
018aaa001
10
6
1
2
4
5
TSSOP10
3. Ordering information
Table 2. Ordering information Package Name IP4284CZ10-TB IP4284CZ10-TT XSON10U TSSOP10 Description plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm plastic thin shrink small outline package; 10 leads; body width 3 mm Version SOT1059-1 SOT552-1 Type number
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
2 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
4. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VI VESD Tamb Tstg
[1]
Parameter input voltage electrostatic discharge voltage ambient temperature storage temperature
Conditions IEC 61000-4-2, level 4; contact discharge
[1]
Min -0.5 -40 -55
Max +5.5 8 +85 +125
Unit V kV C C
All pins to ground.
5. Characteristics
Table 4. Characteristics Tamb = 25 C unless otherwise specified. Symbol VBRzd ILRzd VF Cch(TMDS) Cch(TMDS) Cch(mutual) Rdyn Parameter Zener diode breakdown voltage Zener diode reverse leakage current forward voltage TMDS channel capacitance TMDS channel capacitance difference mutual channel capacitance dynamic resistance f = 1 MHz; Vbias = 2.5 V f = 1 MHz; Vbias = 2.5 V f = 1 MHz; Vbias = 2.5 V I=1A positive transient negative transient VCL(ch)trt(pos) positive transient channel VESD = 8 kV clamping voltage
[1] [2] [3] [4] This parameter is guaranteed by design. Between signal pin and pin n.c. Human Body Model (HBM) according to JESD22-A-J114D. According to IEC 61000-4-5 and IEC 61000-4-9.
[3] [1]
Conditions Itest = 1 mA per TMDS channel; VI = 3.0 V
Min 6 0.4 -
Typ 0.7 0.5 0.05 0.07
Max 9 1 0.7 -
Unit V A V pF pF pF
[1]
[1][2]
[4]
-
1 1 8
-
V
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
3 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
3 Sdd21; Scc21 (dB) -3
018aaa002
0 Sdd21; NEXT (dB) -30
018aaa003
(1)
(2)
-9
-60
-15 106
107
108
109 f (Hz)
1010
-90 108
109 f (Hz)
1010
(1) Sdd21 (2) Scc21 normalized to 100 ; differential pairs at CH1/CH2 or at CH3/CH4
Sdd21 normalized to 100 ; differential pairs CH1/CH2 versus CH3/CH4
Fig 1.
Mixed-mode differential and common-mode insertion loss; typical values
Fig 2.
Mixed-mode differential NEXT crosstalk; typical values
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
4 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
018aaa004
018aaa005
5 Gbit/s; USB 3.0 CP0 pattern
5 Gbit/s; USB 3.0 CP0 pattern
Fig 3.
Eye diagram using reference PCB
0.4 Cd (pF) 0.2
Fig 4.
Eye diagram using IP4284CZ10-TB
018aaa006
(1)
0.0
(2)
-0.2
-0.4 -0.5
1.5
3.5 Vbias (V)
5.5
(1) Pin 2 (2) Pin 1 Deviation from typical capacitance normalized at Vbias = 2.5 V
Fig 5.
Line capacitance as a function of bias voltage; typical values
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
5 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
8.5 VCL (V) 8.0
018aaa008
3.5 VCL (V) 3.0
018aaa007
2.5
7.5 2.0
7.0 0.5
1.0
1.5
2.0 I (A)
2.5
1.5 0.5
1.0
1.5
2.0 I (A)
2.5
IEC 61000-4-5; tp = 8/20 s; positive pulse
IEC 61000-4-5; tp = 8/20 s; negative pulse
Fig 6.
18 VCL (V) 12
Dynamic resistance with positive clamping
018aaa009
Fig 7.
0 VCL (V) -4
Dynamic resistance with negative clamping
018aaa010
-8
6 -12
0 0 2 4 6 8 10 12 I (A) 14
-16 -16
-12
-8
-4
0 I (A)
tp = 100 ns; Transmission Line Pulse (TLP)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 8.
Dynamic resistance with positive clamping
Fig 9.
Dynamic resistance with negative clamping
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
6 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
6. Application information
The devices are designed to provide high-level ESD protection for high-speed serial data buses such as HDMI, DisplayPort, eSATA and LVDS data lines. When designing the Printed-Circuit Board (PCB), careful consideration should be given to basic high-speed routing guidelines, impedance matching, and signal coupling. Basic application diagrams for the ESD protection of an HDMI interface are shown in Figure 10 and Figure 11.
IP4284CZ10-TB
5 4 8 3 2 1 TMDS_CH2+
TMDS_D2+ TMDS_GND TMDS_CH2- TMDS_D2- GND TMDS_D1+ TMDS_CH1+ TMDS_GND TMDS_CH1- TMDS_D1- TMDS_D0+ TMDS_CH2+ TMDS_GND TMDS_CH2- TMDS_D0- GND TMDS_CLK+ TMDS_CH1+ TMDS_GND TMDS_CH1- TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION HDMI CONNECTOR
IP4284CZ10-TB
5 4 8 3 2 1
6
5
4
100 nF
IP4221CZ6
1 2 3
018aaa011
Fig 10. Application diagram of HDMI ESD protection using IP4284CZ10-TB
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
7 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
IP4284CZ10-TT
TMDS_D2+
TMDS_D2+ TMDS_GND
TMDS_D2- TMDS_D2- TMDS_D1+ TMDS_D1+ TMDS_GND TMDS_D1- TMDS_D1-
IP4284CZ10-TT
TMDS_D0+
TMDS_D0+ TMDS_GND
TMDS_D0- TMDS_D0- TMDS_CLK+ TMDS_CLK+ TMDS_GND TMDS_CLK1- TMDS_CLK- CEC n.c. DDC_CLK DDC_DAT GND +5 V HOT PLUG DETECTION HDMI CONNECTOR
IP4220CZ6
100 nF
018aaa012
Fig 11. Application diagram of HDMI ESD protection using IP4284CZ10-TT
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
8 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
7. Package outline
XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm
SOT1059-1
D
B
A
E
A A1
terminal 1 index area detail X
e1 L1
1
e
b
5
v w
M M
CAB C
C y1 C y
L2 e2 L
10 6
X
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 0.5 A1 0.05 0.00 b 0.25 0.15 D 2.6 2.4 E 1.1 0.9 e 0.5 e1 2 e2 0.6 L 0.4 0.2 L1 0.15 0.00 L2 0.45 0.25 v 0.1 w 0.05 y 0.05 y1 0.1
OUTLINE VERSION SOT1059-1
REFERENCES IEC --JEDEC JEITA ---
EUROPEAN PROJECTION
ISSUE DATE 07-12-20 08-01-18
Fig 12. Package outline SOT1059-1 (XSON10U)
IP4284CZ10-TB_TT_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
9 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
D
E
A
X
c y HE vMA
Z
10
6
A2 pin 1 index
A1
(A3)
A
Lp L
1
e bp
5
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.15 c 0.23 0.15 D (1) 3.1 2.9 E (2) 3.1 2.9 e 0.5 HE 5.0 4.8 L 0.95 Lp 0.7 0.4 v 0.1 w 0.1 y 0.1 Z (1) 0.67 0.34 6 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT552-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-07-29 03-02-18
Fig 13. Package outline SOT552-1 (TSSOP10)
IP4284CZ10-TB_TT_2 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
10 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
8. Abbreviations
Table 5. Acronym DVD eSATA ESD HBM HDMI LVDS NEXT RoHS TLP TMDS UTLP Abbreviations Description Digital Versatile Disc external Serial Advanced Technology Attachment ElectroStatic Discharge Human Body Model High-Definition Multimedia Interface Low Voltage Differential Signaling Near End Crosstalk Restriction of Hazardous Substances Transmission Line Pulse Transition Minimized Differential Signaling Ultra Thin Leadless Package
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
11 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
9. Revision history
Table 6. Revision history Release date 20100401 Data sheet status Product data sheet Preliminary data sheet Change notice Supersedes IP4284CZ10-TB_TT_1 Document ID IP4284CZ10-TB_TT_2 Modifications: IP4284CZ10-TB_TT_1
*
Data sheet status changed to 'Product data sheet'
20100304
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
12 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.
(c) NXP B.V. 2010. All rights reserved.
10.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
IP4284CZ10-TB_TT_2
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Product data sheet
Rev. 02 -- 1 April 2010
13 of 15
NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications.
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 -- 1 April 2010
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NXP Semiconductors
IP4284CZ10-TB/TT
ESD protection for ultra high-speed interfaces
12. Contents
1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 1 April 2010 Document identifier: IP4284CZ10-TB_TT_2

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