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| 3VD324500YL 3VD324500YL HIGH VOLTAGE MOSFET CHIPS DESCRIPTION 3VD324500YL is a High voltage N-Channel enhancement mode power MOS-FET chip fabricated in advanced silicon epitaxial planar technology; Advanced termination scheme to provide enhanced voltage-blocking capability; Avalanche Energy Specified; Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode; The chips may packaged in TO-220 type; The packaged product is widely used in AC-DC power suppliers, DC-DC converters and H-bridge PWM motor drivers; Die size: 3.78mm*2.78mm; Chip Thickness: 30020m; Top metal: Al, Backside Metal: Ag. 1-Gate PAD 3-Source PAD 1 3 CHIP TOPOGRAPHY ABSOLUTE MAXIMUM RATINGS (Tamb=25C) Parameter Drain-Source Voltage Gate-Source Voltage Drain Current Power Dissipation (TO-220 Package) Operation Junction Temperature Storage Temperature Symbol VDS VGS ID PD TJ Tstg Ratings 500 20 5.5 74 150 -55+150 Unit V V A W C C ELECTRICAL CHARACTERISTICS (Tamb=25C) Parameter Drain -Source Breakdown Voltage Gate Threshold Voltage Drain-Source Leakage Current Static Drain- Source On State Resistance Gate-Source Leakage Current Source-Drain Diode Forward on Voltage Symbol BVDSS VTH IDSS RDS(on) IGSS VFSD Test conditions VGS=0V, ID=250A VGS= VDS, ID=250A VDS=500V, VGS=0V VGS=10V, ID=2.7A VGS=20V, VDS=0V IS=5.5A, VGS=0V Min. 500 2 Typ. Max. 4 1 1.5 100 1.6 Unit V V A nA V HANGZHOU SILAN MICROELECTRONICS CO.,LTD Http: www.silan.com.cn REV:1.0 2008.10.15 Page 1 of 1 |
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