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TLP2105
TOSHIBA PHOTOCOUPLER GaAAs Ired & PHOTO-IC
TLP2105
Isolated Bus Drivers High Speed Line Receivers Microprocessor System Interfaces
The Toshiba TLP2105 consists of GaAAs light emitting diodes and integrated high gain, high-speed photodetectors. The TLP2105 is housed in the 8-pin SO package. The photodetector has totem-pole output stage that can source and sink current. The photodetector has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 10 kV/s. The TLP2105 provides noninverting logic output. An inverting logic version, the TLP2108, is also available. Buffer logic output (totem-pole output) Guaranteed performance over -40 to 100C Power supply voltage: 4.5 to 20 V Input threshold current: IFLH =1.6 mA(max) Switching time (tpLH / tpHL): 250 ns (max) Common mode transient immunity: 10 kV/s Isolation voltage: 2500 Vrms JEDEC JEITA TOSHIBA 11-5K1 Weight: 0.21 g (typ.)
8 7 6 5
Unit: mm
1
2
3
4 6.0 0.2 0.1 0.1 2.5 0.2
5.1 0.2
3.95 0.25 1.27 0.15 0.38 0.305 min
11-5K1
Truth Table
Input H L LED1(2) ON OFF Tr1(3) ON OFF Tr2(4) OFF ON Output 1(2) H L 1 2
8 VCC
Pin Configuration (Top View)
VCC
Schematic
IF1 1 VF1 2 LED1 Tr1 Tr2
ICC
3 4
SHIELD GND
IO1
7 VO1
8 1: ANODE 1 2: CATHODE 1 3: CATHODE 2 7 4: ANODE 2 5: GND 6 6: VO2(Output 2) 7: VO1(Output 1) 5 8: VCC
SHIELD
LED2 3 VF2 4 IF2 SHIELD A bypass capacitor of 0.1F must be connected between pins 8 and 5. Tr4 Tr3 IO2 6 VO2 5 GND
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TLP2105
Absolute Maximum Ratings (Ta=25C)
CHARACTERISTIC Forward Current LED Forward current derating (Note 1) (Ta75C) (Note 1,2) (Note 1) (Ta 25) (Ta = 100) (Note 1) (Note 1) (Note 1) SYMBOL IF IF/Ta IFPT VR IO1 IO2 VO VCC Topr Tstg (10 s) (Note 3) Tsol BVs RATING 20 -0.48 1 5 25/-15 5/-5 -0.5 to 20 -0.5 to 20 -40 to 100 -55 to 125 260 2500 UNIT mA mA/C A V mA mA V V C C C Vrms
Peak Transient Forward Current Reverse Voltage
DETECTOR
Output Current 1 Output Current 2 Output Voltage Supply Voltage
Operating Temperature Range Storage Temperature Range Lead Soldering Temperature Isolation Voltage (AC,1 min, R.H. 60%,Ta=25C)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Each Channel. Note 2: Pulse width 1s, 300 pps. Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together, as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
CHARACTERISTIC Input Current , ON Input Voltage , OFF Supply Voltage* Operating Temperature SYMBOL IF(ON) VF(OFF) VCC Topr MIN 2 0 4.5 -40 TYP. MAX 10 0.8 20 100 UNIT mA V V C

* This item denotes operating range, not meaning of recommended operating conditions. Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document.
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TLP2105
Electrical Characteristics (Unless otherwise specified, Ta=-40 to 100C, VCC=4.5 to 20 V)
CHARACTERISTIC Input Forward Voltage Temperature Coefficient of Forward Voltage Input Reverse Current Input Capacitance Logic Low Output Voltage Logic High Output Voltage SYMBOL VF VF/Ta IR CT VOL VOH TEST CIRCUIT TEST CONDITION IF=10 mA , Ta=25C IF=10 mA VR=5 V, Ta=25C V=0 , f=1 MHz, Ta=25C IOL=3.5 mA, VF=0.8 V IOH=-2.6 mA, VCC=4.5 V IF=5 mA VF=0 V VCC=20 V VCC=20 V VCC=5.5 V VCC=20 V VCC=5.5 V VCC=VO=5.5 V VCC=VO=20 V VCC=5.5 V VCC=20 V MIN 1.3 TYP. 1.65 -2.0 MAX 1.75 UNIT V mV/C A pF V V

1 2

2.7 17.4
10
45 0.2 4.0 18.1
0.6

6.0 6.0 6.0 6.0
Logic Low Supply Current
ICCL
3

15 20 -5 -10

80 90 -15 -20 0.4
mA
Logic High Supply Current Logic Low Short Circuit Output Current (Note 4)
ICCH IOSL IOSH IFLH VFHL IHYS
4
IF1=IF2=5 mA VF=0 V IF=5 mA VO=GND
mA
5

1.6
mA
Logic High Short Circuit Output Current (Note 4)
6
mA
Input Current Logic High Output Input Voltage Logic Low Output Input Current Hysteresis

IO=-2.6 mA, VO>2.4 V IO=3.5 mA, VO<0.6 V VCC=5 V
0.8
mA V mA
0.05

*All typical values are at Ta=25C, VCC=5 V unless otherwise specified
Note 4: Duration of output short circuit time should not exceed 10 ms.
Isolation Characteristics (Ta = 25)
CHARACTERISTIC Capacitance input to output Isolation resistance SYMBOL CS RS TEST CONDITION VS = 0, f = 1 MHz R.H. 60%, VS = 500 V AC,1 minute Isolation voltage BVS AC,1 second, in oil DC,1 minute, in oil (Note 3) (Note 3) MIN 1x10
12
TYP. 0.8 10
14
MAX
UNIT pF Vrms Vdc
2500
5000 5000
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TLP2105
Switching Characteristics (Unless otherwise specified, Ta=-40 to 100VCC=4.5 to 20 V)(Each Channel)
CHARACTERISTIC Propagation Delay Time to Logic High output Propagation Delay Time to Logic Low output Switching Time Dispersion between ON and OFF Rise Time (10 - 90 %) Fall Time (90 - 10 %) Common Mode transient Immunity at High Level Output Common Mode transient Immunity at Low Level Output *All typical values are at Ta=25C SYMBOL tpLH tpHL |tpHLtpLH| tr tf CMH 9 CML 7,8 IF=03 mA , VCC=5 V IF=30 mA , VCC=5 V VCM=1000 Vp-p, IF=5 mA, VCC=20 V, Ta=25C VCM=1000 Vp-p, IF=0 mA, VCC=20 V, Ta=25C TEST CIRCUIT TEST CONDITION IF=03 mA IF=30 mA MIN 30 30 TYP. 150 150 MAX 250 250 UNIT ns ns

-10000 10000
30 30
220 75 75
ns ns ns V/s V/s

Note 5: A ceramic capacitor (0.1 A) should be connected from pin 8 to pin 5 to stabilize the operation of the high gain linear amplifier. Failure to provide the bypassing may impair the switching property. The total lead length between capacitor and coupler should not exceed 1 cm.
TEST CIRCUIT 1: VOL Test Circuit
VF
1 2 3 4
GND SHIELD VCC
8 7 6 5
0.1 F IO VOL VCC V
TEST CIRCUIT 2: VOH Test Circuit 8 1 IF
VCC
2 3 4
GND SHIELD
7 6 5
0.1 F
IO V
VO VCC
TEST CIRCUIT 3: ICCL Test Circuit 1 2 3 4
GND SHIELD VCC
8 7 6 5
ICCL A
TEST CIRCUIT 4: ICCH Test Circuit
IF1
1
VCC
8 7 6
GND SHIELD
ICCH A
2
0.1 F VCC
3 4
IF2
0.1 F
VCC
5
TEST CIRCUIT 5: IOSL Test Circuit 1
VCC
TEST CIRCUIT 6: IOSH Test Circuit
IF
8 7 6
IOSL A VCC 0.1 F VO
1 2 3 4
VCC
8 7 6
IOSH A 0.1 F VO VCC
2 3 4
GND SHIELD
5
GND SHIELD
5
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TLP2105
TEST CIRCUIT 7: Switching Time Test Circuit
IF=3 mA(P.G.) VCC VO 5V
(f=50 kHz, duty =50%)
1 2 3 4
8
VCC
IF monitor
7 6
GND SHIELD
0.1 F
620
IF tpLH VOH tpHL
50%
90%
5
CL
5 k
VO
1.3 V
CL=15 pF
RIN=100 CL includes probe and stray capacitance. P.G.: Pulse generator
VOL
10% tr tf
TEST CIRCUIT 8: Switching Time Test Circuit
IF= 3 mA(P.G.)
(f=50 kHz, duty=50%)
1 2 3 4
IF monitor
VCC
8 7 6
0.1 F VCC CL VOH VO
1.3V
IF VO tpLH tpHL
50%
90%
GND SHIELD
5
CL=15 pF
RIN=100 CL includes probe and stray capacitance. P.G.: Pulse generator
VOL
10% tr tf
TEST CIRCUIT 9: Common-Mode Transient Immunity Test Circuit
SW A B
IF
1 2 3 4
SHIELD
VCC
8 7 6
0.1 F VO VCC
90%
1000 V
VCM
10%
tr
SW A : IF=5 mA
tf CMH 1V 17 V CML
GND
5
VO
SW B : IF=0 mA
+
VCM
CM
H
=
800(V ) t f ( s)
CM
L
=
800(V ) t r ( s)
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TLP2105
Specification for Embossed-Tape Packing (TP) for SO8 Coupler
1. Applicable Package
Package SO8 Product Type Photocoupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example)
TLP2105 (TP) Tape type Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation 3.2 Tape Packing Quantity: 2500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses
Standard Occurrences of 2 or more successive empty device recesses Single empty device recesses Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer
0
6 devices (max) per reel
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty turns only for a cover tape.
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3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics) (2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
+0.1 0.3 0.05 1.5 -0 F E D K0 1.6 0.1 A 3.3 0.1 Unit: mm Unless otherwise specified: 0.1 Symbol A B D E F G K0 Dimension 6.5 5.6 5.5 1.75 8.0 4.0 3.1 Remark Center line of indented square hole and sprocket hole Distance between tape edge and hole center +0.1 Cumulative error -0.3 (max) per 10 feed holes Cumulative error +0.1 (max) per 10 feed holes -0.3 Internal space 12.0 0.3 B G
Figure 2 Tape Forms Table 2 Tape Dimensions
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TLP2105
3.6 Reel
(1) Material: Plastic (2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
C
U E
B
W1 W2
Figure 3 Reel Form Table 3 Reel Dimensions
Unit: mm Symbol A B C E U W1 W2 Dimension 330 2 80 1 13 0.5 2.0 0.5 4.0 0.5 13.5 0.5 17.5 1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (Example)
TLP2105 (TP) 2500 pcs Quantity (must be a multiple of 2500) Tape type Device name
A
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TLP2105
Precautions Of Surface Mounting Type Photocoupler Soldering & General Storage (1) Precautions for Soldering
1) When Using Soldering Reflow
An example of a temperature profile when Sn-Pb eutectic solder is used:
An example of a temperature profile when lead(Pb)-free solder is used:
Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder) Apply preheating of 150 deg.C for 60 to 120 seconds. Mounting condition of 260 deg.C or less within 10 seconds is recommended. Flow soldering must be performed once 3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder) Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds not exceeding 350 deg.C. Heating by soldering iron must be only once per 1 lead
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(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) When transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 degree C to 35 degree C, and relative humidity should be maintained at between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices while they are in storage. 8) If devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used.
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RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
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