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19-4594; Rev 0; 5/09
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
General Description
The MAX11359A smart data-acquisition system (DAS) is based on a 16-bit, sigma-delta analog-to-digital converter (ADC) and system-support functionality for a microprocessor (P)-based system. The device integrates an ADC, DAC, operational amplifiers, internal selectable reference, temperature sensors, analog switches, a 32kHz oscillator, a real-time clock (RTC) with alarm, a high-frequency-locked loop (FLL) clock, four user-programmable I/Os, an interrupt generator, and 1.8V and 2.7V voltage monitors in a single chip. The MAX11359A has dual 10:1 differential input multiplexers (muxes) that accept signal levels from 0 to AVDD. An on-chip 1x to 8x programmable-gain amplifier (PGA) measures low-level signals and reduces external circuitry required. The MAX11359A operates from a single +1.8V to +3.6V supply and consumes only 1.4mA in normal mode and only 6.1A in sleep mode. The MAX11359A has one DAC with two uncommitted op amps. The serial interface is compatible with either SPITM/QSPITM or MICROWIRETM, and is used to power up, configure, and check the status of all functional blocks. The MAX11359A is available in a space-saving 40-pin TQFN package and is specified over the commercial (0C to +70C) and the extended (-40C to +85C) temperature ranges.
Features
o +1.8V to +3.6V Single-Supply Operation o Multichannel 16-Bit Sigma-Delta ADC 10sps to 512sps Programmable Conversion Rate Self and System Offset and Gain Calibration PGA with Gains of 1, 2, 4, or 8 Unipolar and Bipolar Modes 10-Input Differential Multiplexer o 10-Bit Force-Sense DAC o Uncommitted Op Amps o Dual SPDT Analog Switches o Selectable References 1.251V, 1.996V, and 2.422V o Internal Charge Pump o System Support Real-Time Clock and Alarm Register Internal/External Temperature Sensor Internal Oscillator with Clock Output User-Programmable I/O and Interrupt Generator VDD Monitors o SPI/QSPI/MICROWIRE, 4-Wire Serial Interface o Space-Saving (6mm x 6mm x 0.8mm) 40-Pin TQFN Package
MAX11359A
Ordering Information
PART MAX11359AETL+ MAX11359ACTL+* TEMP RANGE -40C to +85C 0C to +70C PIN-PACKAGE 40 TQFN-EP** 40 TQFN-EP**
Applications
Battery-Powered and Portable Devices Electrochemical and Optical Sensors Medical Instruments Industrial Control Data-Acquisition Systems
+Denotes a lead(Pb)-free/RoHS-compliant package. *Future product--contact factory for availability. **EP = Exposed pad.
Pin Configuration
AGND SWA IN2+ IN1+ IN2IN120 OUT1 19 SNC2 18 SCM2 17 SNO2 16 SNC1 15 SCM1 14 SNO1 13 32KIN 12 32KOUT 11 RESET 10 CLK32K FBA 7 DIN
TOP VIEW
30 29 28 27 26 25 24 23 22 21
AIN2 AIN1
31 32 33 34 35 36 37 38 39 40
SPI/QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp.
REF REG CFCF+ CPOUT DVDD DGND UPIO1
MAX11359A
+
1 CLK 2 UPIO2 3 UPIO3 4 UPIO4 5 DOUT 6 SCLK 8 CS 9 INT
TQFN
________________________________________________________________ Maxim Integrated Products
OUTA
OUT2
AVDD
1
For pricing delivery, and ordering information please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND .........................................................-0.3V to +4V DVDD to DGND.........................................................-0.3V to +4V AVDD to DVDD ............................................................-4V to +4V AGND to DGND.....................................................-0.3V to +0.3V CLK32K to DGND ....................................-0.3V to (DVDD + 0.3V) UPIO_ to DGND........................................................-0.3V to +4V Digital Inputs to DGND ............................................-0.3V to +4V Analog Inputs to AGND ...........................-0.3V to (AVDD + 0.3V) Digital Output to DGND...........................-0.3V to (DVDD + 0.3V) Analog Outputs to AGND.........................-0.3V to (AVDD + 0.3V) Continuous Current Into Any Pin.........................................50mA Continuous Power Dissipation (TA = +70C) 40-Pin TQFN (derate 25.6mW/C above +70C) ....2051.3mW Operating Temperature Range MAX11359ACTL .................................................0C to +70C MAX11359AETL...............................................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER ADC DC ACCURACY Noise-Free Resolution Conversion Rate Output Noise Integral Nonlinearity Unipolar Offset Error or Bipolar Zero Error (Note 3) Unipolar Offset-Error or Bipolar Zero-Error Temperature Drift (Note 4) Gain Error (Notes 3, 5) Gain-Error Temperature Coefficient DC Positive Power-Supply Rejection Ratio PSRR INL SYMBOL CONDITIONS Data rate = 10sps, PGA gain = 2; data rate = 10sps to 60sps, PGA gain = 1; no missing codes, Table 1 (Note 2) No missing codes, Table 1 No missing codes Unipolar mode, AVDD = 3V, PGA gain = 1, TA = +25C, data rate = 50sps Uncalibrated PGA gain = 1, calibrated, TA = +25C, data rate = 50sps Bipolar Unipolar Uncalibrated PGA = 1, calibrated, data rate = 50sps (Notes 4, 6) PGA gain = 1, unipolar mode, measured by full-scale error with AVDD = 1.8V to 3.6V 2.0 10 0.6 0.003 1.0 73 V/C MIN TYP MAX UNITS
16 10 Table 1 0.004 1.0 0.003 512
Bits sps VRMS %FSR
%FSR
%FSR ppm/ C dB
ADC ANALOG INPUTS (AIN1, AIN2) DC Input Common-Mode CMRR Rejection Ratio
PGA gain = 1, unipolar mode
85
dB
2
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Normal-Mode 60Hz Rejection Ratio Normal-Mode 50Hz Rejection Ratio Absolute Input Range SYMBOL CONDITIONS PGA gain = 1, unipolar mode, data rate = 50sps (Note 2) Data rate = 10sps or 50sps, PGA gain = 1, unipolar mode (Note 2) Internal temperature sensor disabled (see Figure 26) Unipolar mode Differential Input Range Bipolar mode ADC not in measurement mode, mux enabled, TA +55C, inputs = +0.1V to (AVDD - 0.1V) TA = +85C Input Sampling Capacitance Input Sampling Rate External Source Impedance at Input Resolution Differential Nonlinearity Integral Nonlinearity Offset Error Offset-Error Tempco Gain Error Gain-Error Tempco Input Leakage Current at SWA/B Input Leakage Current at FBA/B DAC Output Buffer Leakage Current Input Common-Mode Voltage Line Regulation Load Regulation Output Voltage Range Excludes offset and voltage reference error Excludes offset and reference drift SWA switches open (Notes 7, 8) VFBA = +0.3V to (AVDD - 0.3V) (Note 7) TA = -40C to +85C TA = 0C to +70C TA = 0C to +50C 1 1 1 600 400 75 0 40 VAGND AVDD 0.35 175 0.5 AVDD DNL INL CIN fSAMPLE See Table 3 Guaranteed monotonic Code 3Dhex to 3FF hex Code 3Dhex to 3FF hex Reference to code 52 hex 4.4 5 10 1 4 20 5 21.84 Table 3 -VREF/ Gain VREF/ Gain 1 5 pF kHz k Bits LSB LSB mV V/C LSB ppm/C nA nA pA nA V V/V V/A V MIN 100 100 VAGND -0.05/ Gain AVDD VREF/ Gain V TYP MAX UNITS dB dB V
MAX11359A
DC Input Current (Note 7)
nA
FORCE-SENSE DAC (RL = 10k and CL = 200pF, FBA = OUTA, unless otherwise noted)
DAC buffer disabled (Note 7) At FBA AVDD = +1.8V to +3.6V, TA = +25C IOUT = 2mA, CL = 1000pF (Note 2)
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Output Slew Rate Output-Voltage Settling Time SYMBOL CONDITIONS 52 hex to 3FF hex code swing rising or falling, RL = 10k, CL = 100pF 10% to 90% rising or falling to 0.5 LSB Referred to FBA, excludes reference noise OUTA shorted to AGND OUTA shorted to AVDD Between SWA and OUTA, HFCK enabled HFCK enabled Excluding reference VAGND DAC on, internal REF and ADC off Internal REF, DAC, and ADC off (Note 7) AVDD +1.8V, TA = +25C Reference Output Voltage Output-Voltage Temperature Coefficient (Note 7) Output Short-Circuit Current Line Regulation VREF AVDD +2.2V, TA = +25C AVDD +2.7V, TA = +25C TC IRSC VREF = 1.251V VREF = 1.996V, 2.422V REF shorted to AGND REF shorted to AVDD TA = +25C TA = +25C, VREF = 1.25V ISOURCE = 0 to 500A ISINK = 0 to 50A 18 90 100 1.2 V/A 1.7 1.238 1.976 2.349 1.251 1.996 2.422 15 2.5 100 1.264 2.016 2.495 50 65 ppm/oC mA A V/V V 100 18 AVDD f = 0.1Hz to 10Hz f = 10Hz to 10kHz MIN TYP 40 65 80 VP-P 200 20 15 150 mA ns s V M nA MAX UNITS V/ms s
Input Voltage Noise
Output Short-Circuit Current Input-Output SWA/SWB Switch Resistance SWA/SWB Switch Turn-On/Off Time Power-On Time EXTERNAL REFERENCE (REF) Input Voltage Range Input Resistance DC Input Leakage Current
INTERNAL VOLTAGE REFERENCE (CREF = 4.7F)
Load Regulation
4
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Long-Term Stability Output Noise Voltage Turn-On Settling Time TEMPERATURE SENSOR Temperature Measurement Resolution ADC resolution is 16-bit, 10sps Internal voltage reference, fourcurrent calibration, and stored calibration coefficients TA = +25C TA = 0C to +50C TA = -40C to +85C Temperature Measurement Noise Temperature Measurement Power-Supply Rejection Ratio OP AMP (RL = 10k connected to AVDD/2) Input Offset Voltage Offset-Error Tempco TA = -40C to +85C IN1+, IN2+, IN3+ Input Bias Current (Note 7) IBIAS IN1-, IN2-, IN3Input Offset Current Input Common-Mode Voltage Range Common-Mode Rejection Ratio IOS CMVR CMRR 0 VCM 75mV 75mV < VCM AVDD - 0.35V, TA = +25C 60 TA = 0C to +70C TA = 0C to +50C TA = -40C to +85C TA = 0C to +70C TA = 0C to +50C VIN1_, VIN2_ = +0.3V to (AVDD - 0.3V) (Note 7) 0 60 75 VOS VCM = 0.5V 3 0.006 4 2 0.025 20 1 300 200 1 600 400 1 AVDD 0.35 15 mV V/oC nA pA nA pA nA V dB 0.11 0.5 C TA = -40 C to +85C
o
MAX11359A
SYMBOL (Note 9)
CONDITIONS
MIN
TYP 35 50 400 100
MAX
UNITS ppm/ 1000hrs VP-P s
f = 0.1Hz to 10Hz, AVDD = 3V f = 10Hz to 10kHz, AVDD = 3V Buffer only, settle to 0.1% of final value
C/LSB
TA = 0C to +50C
Internal Temperature-Sensor Measurement Error
1 0.50 0.5 1.0 0.18 0.2 CRMS C/V C
External Temperature-Sensor Measurement Error (Note 10)
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Power-Supply Rejection Ratio Large-Signal Voltage Gain SYMBOL PSRR AVOL CONDITIONS AVDD = +1.8V to +3.6V, TA = +25C 100mV VOUT_ AVDD - 100mV (Note 11) ISOURCE = 10A ISOURCE = 50A Sourcing ISOURCE = 100A ISOURCE = 500A Maximum Current Drive VOUT ISOURCE = 2mA ISINK = 10A ISINK = 50A Sinking ISINK = 100A ISINK = 500A ISINK = 2mA Gain Bandwidth Product Phase Margin Output Slew Rate Input Voltage Noise Output Short-Circuit Current Power-On Time SPDT SWITCHES (SNO_, SNC_, SCM_, HFCK enabled) VSCM_ = 0V On-Resistance RON VSCM_ = 0.5V VSCM_ = 0.5V to AVDD SNO_, SNC_ Off-Leakage Current VSNO_, VSNC_ = +0.5V, TA = -40C to +85C ISNO_(OFF) +1.5V; VSCM_ = +1.5V, TA = 0C to +70C ISNC_(OFF) +0.5V (Note 7) TA = 0C to +50C VSNO_, VSNC_ = +0.5V, TA = -40C to +85C ISCM_(OFF) +1.5V; VSCM_ = +1.5V, TA = 0C to +70C +0.5V (Note 7) TA = 0C to +50C ISCM_(ON) VSNO_, VSNC_ = +0.5V, TA = -40C to +85C +1.5V, or unconnected; TA = 0C to +70C VSCM_ = +1.5V, +0.5V TA = 0C to +50C (Note 7) VAGND tON/tOFF Break-before-make 100 TA = 0C to +50C TA = 0C to +50C 45 50 150 1 600 400 2 1.2 0.8 2 1.2 0.8 AVDD V ns nA nA nA pA SR GBW Unity-gain configuration, CL = 1nF Unity-gain configuration, CL = 1nF (Note 11) CL = 200pF Unity-gain configuration VOUT_ shorted to AGND VOUT_ shorted to AVDD f = 0.1Hz to 10Hz f = 10Hz to 10kHz 80 60 0.04 80 200 20 15 15 MIN 76.5 90 TYP 100 116 0.005 0.025 0.05 0.25 0.5 0.005 0.025 0.05 0.25 0.5 kHz Degrees V/s VP-P mA s V MAX UNITS dB dB
SCM_ Off-Leakage Current
SCM_ On-Leakage Current
Input Voltage Range Turn-On/Off Time
6
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Input Capacitance SYMBOL CONDITIONS SNO_, SNC_, or SCM_ = AVDD or AGND; switch connected to enabled mux input IOUT No load IOUT = 10mA 10F external capacitor between CPOUT and DGND, IOUT = 10mA, excluding ESR of external capacitor IOUT = 10mA, excluding ESR of external capacitor Internal linear regulator disabled Linear regulator off, charge pump off Charge pump disabled Charge pump disabled TSEL[2:0] = 0 hex TSEL[2:0] = 4 hex Differential Input-Detection Threshold Voltage TSEL[2:0] = 5 hex TSEL[2:0] = 6 hex TSEL[2:0] = 7 hex Differential Input-Detection Threshold Error Common-Mode Input Voltage Range Turn-On Time VOLTAGE MONITORS DVDD Monitor Supply Voltage Range Trip Threshold (DVDD Falling) DVDD Monitor Timeout Reset Period DVDD Monitor Hysteresis HYSE bit set to logic 1 HYSE bit set to logic 0 For valid reset 1.0 1.80 1.85 1.5 200 35 3.6 1.90 V V s mV VAGND 50 1.8 2 0 50 100 150 200 10 AVDD mV V s mV 1.6 3 3.6 15 10 3.2 3.0 50 3.3 3.6 MIN TYP 5 MAX UNITS pF
MAX11359A
CHARGE PUMP (10F at REG and 10F external capacitor between CF+ and CF-) Maximum Output Current Output Voltage mA V
Output Voltage Ripple
mV
Load Regulation REG Input Voltage Range REG Input Current CPOUT Input Voltage Range CPOUT Input Leakage Current SIGNAL-DETECT COMPARATOR
20 1.8
mV/mA V nA V nA
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER DVDD Monitor Turn-On Time CPOUT Monitor Supply Voltage Range CPOUT Monitor Trip Threshold CPOUT Monitor Hysteresis CPOUT Monitor Turn-On Time Internal Power-On Reset Voltage 32kHz Oscillator (32KIN, 32KOUT) Clock Frequency Stability Oscillator Startup Time Crystal Load Capacitance LOW-FREQUENCY CLOCK INPUT/OUTPUT (CLK32K) Output Clock Frequency Absolute Input to Output Clock Jitter Input to Output Rise/Fall Time Input Duty Cycle Output Duty Cycle HIGH-FREQUENCY CLOCK OUTPUT (CLK) fOUT = fFLL FLL Output Clock Frequency fOUT = fFLL/2, power-up default fOUT = fFLL/4 fOUT = fFLL/8 Absolute Clock Jitter Rise and Fall Time Duty Cycle Uncalibrated CLK Frequency Error tR/tF Cycle to cycle, FLL off Cycle to cycle, FLL on 10% to 90%, 30pF load fOUT = 4.9152MHz fOUT = 2.4576MHz, 1.2288MHz, 614.4kHz FLL calibration not performed 40 45 4.8660 2.4330 1.2165 608.25 4.9152 2.4576 1.2288 614.4 0.15 1 10 60 55 35 4.9644 2.4822 1.2411 620.54 kHz ns ns % % MHz Cycle to cycle 10% to 90%, 30pF load 40 43 32.768 5 5 60 kHz ns ns % % DVDD = 2.7V DVDD = 1.8V to 3.6V, excluding crystal 32.768 25 1500 6 kHz ppm ms pF 1.0 2.7 2.8 35 5 1.7 SYMBOL CONDITIONS MIN TYP 5 3.6 2.9 MAX UNITS ms V V mV ms V
DIGITAL INPUTS (SCLK, DIN, CS, UPIO_, CLK32K) Input High Voltage Input Low Voltage VIH VIL 0.7 x DVDD 0.3 x DVDD V V
8
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER SYMBOL CONDITIONS DVDD supply voltage UPIO_ Input High Voltage CPOUT supply voltage DVDD supply voltage UPIO_ Input Low Voltage CPOUT supply voltage Input Hysteresis Input Current Input Capacitance UPIO_ Input Current VHYS IIN DVDD = 3.0V VIN = VDGND or DVDD (Note 7) VIN = VDGND or DVDD VIN = DVDD or VCPOUT, pullup enabled VIN = DVDD or VCPOUT or 0V, pullup disabled VIN = 0, pullup enabled, unconnected UPIO inputs are pulled up to DVDD or CPOUT with pullup enabled VOL VOH IL COUT VOL ISINK = 1mA Open-drain output, RESET deasserted VOL ISINK = 1mA, UPIO_ referenced to DVDD ISINK = 4mA, UPIO_ referenced to CPOUT ISOURCE = 500A, UPIO_ referenced to DVDD ISOURCE = 4mA, UPIO_ referenced to CPOUT 0.8 x DVDD VCPOUT - 0.4 1.8 1.8 3.6 3.6 V V ISINK = 1mA ISOURCE = 500A 0.8 x DVDD 0.01 15 0.4 0.1 0.4 0.4 1 0.5 2 200 0.01 10 0.01 1 1 A 100 MIN 0.7 x DVDD 0.7 x VCPOUT 0.3 x DVDD 0.3 x VCPOUT mV nA pF TYP MAX UNITS
MAX11359A
V
V
UPIO_ Pullup Current
5
A
DIGITAL OUTPUTS (DOUT, RESET, UPIO_, CLK32K, INT, CLK) Output Low Voltage Output High Voltage DOUT Three-State Leakage Current DOUT Three-State Output Capacitance RESET Output Low Voltage RESET Output Leakage Current UPIO_ Output Low Voltage 0.4 V V A pF V A V
UPIO_ Output High Voltage
VOH
V
POWER REQUIREMENT Analog Supply Voltage Range Digital Supply Voltage Range AVDD DVDD
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
ELECTRICAL CHARACTERISTICS (continued)
(AVDD = DVDD = +1.8V to +3.6V, VREF = +1.25V, external reference, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER SYMBOL CONDITIONS Everything on, charge pump unloaded, no digital pins, sinking/sourcing current, e.g., RST, UPIO, and CLK32K, max internal tempsensor current, clock output buffers unloaded, ADC at 512sps MIN TYP MAX UNITS
AVDD = DVDD = 3.6V
1.36
2.0
IMAX Total Supply Current
mA AVDD = DVDD = 3.3V 1.15 1.7
INORMAL
All on except charge pump and temp sensor, ADC at 512sps, CLK output buffer enabled, clock output buffers unloaded TA = -45C to +85C AVDD = DVDD = 3.0V AVDD = DVDD = 3.6V AVDD = DVDD = 3.0V AVDD = DVDD = 3.6V TA = -40C to +85C TA = +25C
1.17
1.3 6.5 9
Sleep-Mode Supply Current
ISLEEP TA = +25C
4.42 5.56 4 1.6
A
Shutdown Supply Current
ISHDN
All off
A
Note 1: Devices are production tested at TA = +25C and TA = +85C. Specifications to TA = -40C are guaranteed by design. Note 2: Guaranteed by design or characterization. Note 3: The offset and gain errors are corrected by self-calibration. For accurate calibrations, perform calibration at the lowest rate. The calibration error is therefore in the order of peak-to-peak noise for the selected rate. Note 4: Eliminate drift errors by recalibration at the new temperature. Note 5: The gain error excludes reference error, offset error (unipolar), and zero error (bipolar). Note 6: Gain-error drift does not include unipolar offset drift or bipolar zero-error drift. It is effectively the drift of the part if zeroscale error is removed. Note 7: These specifications are obtained from characterization during design or from initial product evaluation. Not production tested or guaranteed. Note 8: VOUTA = +0.5V or +1.5V, VSWA = +1.5V or +0.5V, TA = 0C to +50C. Note 9: Long-term stability is characterized using five to six parts. The bandgaps are turned on for 1000hrs at room temperature with the parts running continuously. Daily measurements are taken and any obvious outlying data points are discarded. Note 10: All of the stated temperature accuracies assume that 1) the external diode characteristic is precisely known (i.e., ideal) and 2) the ADC reference voltage is exactly equal to 1.25V. Any variations to this known reference characteristic and voltage caused by temperature, loading, or power supply results in errors in the temperature measurement. The actual temperature calculation is performed externally by the microcontroller (C). Note 11: Values based on simulation results and are not production tested or guaranteed.
10
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Table 1. Output Noise (Notes 12, 13, and 14)
RATE (sps) 10 40 50 60 200 240 400 512 OUTPUT NOISE (VRMS) GAIN = 1 1.684 3.178 3.234 3.307 55.336 104.596 587.138 983.979 GAIN = 2 1.684 3.178 3.234 3.307 55.336 104.596 587.138 983.979 GAIN = 4 1.684 3.178 3.234 3.307 55.336 104.596 587.138 983.979 GAIN = 8 1.684 3.178 3.234 3.307 55.336 104.596 587.138 983.979
Note 12: VREF = 1.25V, bipolar mode, VIN = 1.24912V, PGA gain = 1, TA = +85C. Note 13: CIN = 5pF, op-amp noise is considered to be the same as the switching noise. The increase of the op amp's noise contribution is due to a large input swing (0 to 3.6V). Note 14: Assume 3 sigma peak-to-peak variation; noise-free resolution means no code flicker at given bits' LSB.
Table 2. Peak-to-Peak Resolution
RATE (sps) 10 40 50 60 200 240 400 512 PEAK-TO-PEAK RESOLUTION (BITS) GAIN = 1 17.49 16.57 16.55 16.51 12.45 11.53 9.04 8.30 GAIN = 2 17.49 16.57 16.55 16.51 12.45 11.53 9.04 8.30 GAIN = 4 17.49 16.57 16.55 16.51 12.45 11.53 9.04 8.30 GAIN = 8 17.49 16.57 16.55 16.51 12.45 11.53 9.04 8.30
Table 3. Maximum External Source Impedance Without 16-Bit Gain Error
PARAMETER Resistance (k) EXTERNAL CAPACITANCE (pF) 0 (Note 15) 350 50 60 100 30 500 10 1000 4 5000 1
Note 15: 2pF parasitic capacitance is assumed, which represents pad and any other parasitic capacitance.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
TIMING CHARACTERISTICS (Figures 1 and 19)
(AVDD = DVDD = +1.8V to +3.6V, external VREF = +1.25V, CLK32K = 32.768kHz (external clock), CREG = 10F, CCPOUT = 10F, 10F between CF+ and CF-, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER SCLK Operating Frequency SCLK Cycle Time SCLK Pulse-Width High SCLK Pulse-Width Low DIN to SCLK Setup DIN to SCLK Hold SCLK Fall to DOUT Valid CS Fall to Output Enable CS Rise to DOUT Disable CS to SCLK Rise Setup CS to SCLK Rise Hold DVDD Monitor Timeout Period Wake-Up (WU) Pulse Width Shutdown Delay SYMBOL fSCLK tCYC tCH tCL tDS tDH tDO tDV tTR tCSS tCSH tDSLP tWU tDPU (Note 16) Minimum pulse width required to detect a wake-up event The delay for SHDN to go high after a valid wake-up event The turn-on time for the high-frequency clock and FLL (FLLE = 1) (Note 17) HFCK Turn-On Time tDFON If FLLE = 0, the turn-on time for the highfrequency clock (Note 18) The delay for CRDY to go low after the HFCK clock output has been enabled (Note 19) The delay after a shutdown command has asserted and before HFCK is disabled (Note 20) (Note 21) 7.82 CL = 50pF, Figure 2 CL = 50pF, Figure 2 CL = 50pF, Figure 2 20 0 1.5 1 1 10 10 CONDITIONS MIN 0 100 40 40 30 0 40 48 48 TYP MAX 10 UNITS MHz ns ns ns ns ns ns ns ns ns ns s s s ms s
CRDY to INT Delay
tDFI
ms
HFCK Disable Delay SHDN Assertion Delay
tDFOF tDPD
1.95 2.93
ms ms
Note 16: The delay for the sleep voltage monitor output, RESET, to go high after VDD rises above the reset threshold. This is largely driven by the startup of the 32kHz oscillator. Note 17: It is gated by an AND function with three inputs--the external RESET signal, the internal DVDD monitor output, and the external SHDN signal. The time delay is timed from the internal LOVDD going high or the external RESET going high, whichever happens later. HFCK always starts in the low state. Note 18: If FLLE = 0, the internal signal CRDY is not generated by the FLL block and INT or INT are deasserted. Note 19: CRDY is used as an interrupt signal to inform the C that the high-frequency clock has started. Only valid if FLLE = 1. Note 20: tDFOF gives the C time to clean up and go into sleep-override mode properly. Note 21: tDPD is greater than the HFCK delay for the MAX11359A chip to clean up before losing power.
12
______________________________________________________________________________________
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
CS tCSH tCSS SCLK tCL tCYC tCH tCSH
tDS DIN
tDH
tDV DOUT
tDO
tTR
Figure 1. Detailed Serial-Interface Timing
DVDD
6k DOUT 6k DOUT
CLOAD = 50pF
CLOAD = 50pF
a) FOR ENABLE, HIGH IMPEDANCE b) FOR ENABLE, HIGH IMPEDANCE TO VOH AND VOL TO VOH TO VOL AND VOH TO VOL FOR DISABLE, VOH TO HIGH IMPEDANCE FOR DISABLE, VOL TO HIGH IMPEDANCE
Figure 2. DOUT Enable and Disable Time Load Circuits
Typical Operating Characteristics
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
DVDD SUPPLY CURRENT vs. DVDD SUPPLY VOLTAGE
MAX11359A toc01
DVDD SUPPLY CURRENT vs. DVDD SUPPLY VOLTAGE
MAX11359A toc02
DVDD SUPPLY CURRENT vs. DVDD SUPPLY VOLTAGE
SLEEP MODE, ALL FUNCTIONS DISABLED 0.8 SUPPLY CURRENT (A)
MAX11359A toc03
700 NORMAL MODE CLK BUFFER DISABLED 600 SUPPLY CURRENT (A)
4.0 3.5 SUPPLY CURRENT (A) 3.0 2.5 2.0 1.5 1.0 0.5 SLEEP MODE, CLK BUFFER DISABLED 32kHz OSC, RTC, DVDD MONITOR ENABLED
1.0
500
0.6
400
0.4
300
0.2
200 1.8 2.1 2.4 2.7 DVDD (V) 3.0 3.3 3.6
0 1.8 2.1 2.4 2.7 DVDD (V) 3.0 3.3 3.6
0 1.8 2.1 2.4 2.7 DVDD (V) 3.0 3.3 3.6
______________________________________________________________________________________
13
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
DVDD SUPPLY CURRENT vs. TEMPERATURE
MAX11359A toc04
DVDD SUPPLY CURRENT vs. TEMPERATURE
SLEEP MODE, CLK BUFFER DISABLED 32kHz OSC, RTC, DVDD MONITOR ENABLED
MAX11359A toc05
DVDD SUPPLY CURRENT vs. TEMPERATURE
SLEEP MODE, ALL FUNCTIONS DISABLED 0.8 SUPPLY CURRENT (A) DVDD = 3.0V 0.6 DVDD = 1.8V 0.4
MAX11359A toc06
700 NORMAL MODE CLK BUFFER DISABLED 600 SUPPLY CURRENT (A) DVDD = 3.0V DVDD = 1.8V
3.0 2.5 SUPPLY CURRENT (A) 2.0 1.5 1.0 0.5 0
1.0
500
DVDD = 3.0V
400
DVDD = 1.8V
300
0.2
200 -40 -15 10 35 60 85 TEMPERATURE (C)
0 -40 -15 10 35 60 85 -40 -15 10 35 60 85 TEMPERATURE (C) TEMPERATURE (C)
AVDD SUPPLY CURRENT vs. AVDD SUPPLY VOLTAGE
MAX11359A toc07
AVDD SUPPLY CURRENT vs. AVDD SUPPLY VOLTAGE
MAX11359A toc08
AVDD SUPPLY CURRENT vs. AVDD SUPPLY VOLTAGE
SLEEP MODE, ALL FUNCTIONS DISABLED 1.8 SUPPLY CURRENT (A)
MAX11359A toc09
450 NORMAL MODE 425 SUPPLY CURRENT (A) 400 375 350 325 300 275 250 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3
4.0 SLEEP MODE, 32kHz OSC, RTC, DVDD MONITOR ENABLED 3.5 SUPPLY CURRENT (A)
2.0
3.0
1.6
2.5
1.4
2.0
1.2
1.5 3.6 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6
1.0 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6
AVDD SUPPLY CURRENT vs. TEMPERATURE
MAX11359A toc10
AVDD SUPPLY CURRENT vs. TEMPERATURE
MAX11359A toc11
AVDD SUPPLY CURRENT vs. TEMPERATURE
SLEEP MODE, ALL FUNCTIONS DISABLED 1.8 SUPPLY CURRENT (A)
MAX11359A toc12
400 NORMAL MODE 375 SUPPLY CURRENT (A) 350 325 300 AVDD = 1.8V 275 250 225 200 -40 -15 10 35 60 AVDD = 3.0V
4.0 3.5 SUPPLY CURRENT (A) 3.0 2.5 2.0 1.5 1.0 AVDD = 1.8V SLEEP MODE, 32kHz OSC, RTC, DVDD MONITOR ENABLED AVDD = 3.0V
2.0
1.6
AVDD = 3.0V
1.4 AVDD = 1.8V
1.2
1.0 -40 -15 10 35 60 85 -40 -15 10 35 60 85 TEMPERATURE (C) TEMPERATURE (C)
85
TEMPERATURE (C)
14
______________________________________________________________________________________
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
INTERNAL OSCILLATOR FREQUENCY vs. TEMPERATURE
MAX11359A toc13
MAX11359A
INTERNAL OSCILLATOR FREQUENCY vs. SUPPLY VOLTAGE
MAX11359A toc14
REFERENCE OUTPUT VOLTAGE vs. SUPPLY VOLTAGE
A: VREF = 1.25V B: VREF = 2.048V C: VREF = 2.5V C 2.0 B 1.5
MAX11359A toc15
2.8 INTERNAL OSCILLATOR FREQUENCY (MHz) 2.7 2.6 2.5 2.4 A 2.3 2.2 CLK = 2.4576MHz 2.1 -40 -15 10 35 60 B C
2.60 INTERNAL OSCILLATOR FREQUENCY (MHz) 2.55 2.50 2.45 2.40 2.35 2.30 2.25 2.20 1.8 2.1 2.4 2.7 CLK = 2.4576MHz FLL ENABLED FLL DISABLED
3.0 REFERENCE OUTPUT VOLTAGE (V)
2.5
A
1.0 3.0 3.3 3.6 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6 AVDD, DVDD (V)
85
TEMPERATURE (C) A: FLL DISABLED; AVDD, DVDD = 1.8V B: FLL ENABLED C: FLL DISABLED; AVDD, DVDD = 3.0V
REFERENCE OUTPUT VOLTAGE vs. OUTPUT CURRENT
MAX11359A toc16
REFERENCE OUTPUT VOLTAGE vs. OUTPUT CURRENT
MAX11359A toc17
REFERENCE OUTPUT VOLTAGE vs. OUTPUT CURRENT
2.5048 2.5046 2.5044 VREF (V) 2.5042 2.5040 2.5038 2.5036
MAX11359A toc18
1.2510
2.0486 2.0484 2.0482 VREF (V) 2.0480 2.0478 2.0476
2.5050
1.2505 VREF (V)
1.2500
1.2495 AVDD = 1.8V VREF = 1.25V 1.2490 -50 50 150 250 350 450 OUTPUT CURRENT (A)
2.0474 2.0472 -50
AVDD = 2.5V VREF = 2.048V 50 150 250 350 450
2.5034 2.5032 2.5030 -50 50 150 250 350 450 AVDD = 3.0V VREF = 2.5V
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
NORMALIZED REFERENCE OUTPUT VOLTAGE vs. TEMPERATURE
MAX11359A toc19
NORMALIZED REFERENCE OUTPUT VOLTAGE vs. TEMPERATURE
MAX11359A toc20
NORMALIZED REFERENCE OUTPUT VOLTAGE vs. TEMPERATURE
NORMALIZED REFERENCE VOLTAGE (V) 1.0005 1.0000 0.9995 0.9990 0.9985 0.9980 0.9975 0.9970 -40 VREF = 2.5V -15 10 35 60 85
MAX11359A toc21
1.0010 NORMALIZED REFERENCE VOLTAGE (V) 1.0005 1.0000 0.9995 0.9990 0.9985 0.9980 0.9975 0.9970 -40 -15 10 35 60 VREF = 1.25V
1.0010 NORMALIZED REFERENCE VOLTAGE (V) 1.0005 1.0000 0.9995 0.9990 0.9985 0.9980 0.9975 0.9970 -40 VREF = 2.048V -15 10 35 60
1.0010
85
85
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
______________________________________________________________________________________
15
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
REFERENCE VOLTAGE OUTPUT NOISE (0.1Hz TO 10Hz)
MAX11359A toc22
REFERENCE VOLTAGE OUTPUT NOISE vs. FREQUENCY
MAX11359A toc23
REFERENCE VOLTAGE OUTPUT NOISE vs. FREQUENCY
VREF = 2.048V
MAX11359A toc24 MAX11359A toc30 MAX11359A toc27
10,000
VREF = 1.25V
10,000
NOISE (nV/Hz)
NOISE (nV/Hz)
50V/div
1000
1000
VREF = +1.25V AVDD = +1.8V 100 1s/div 1 10 100 FREQUENCY (Hz) 1k 10k 100 1 10 100 FREQUENCY (Hz) 1k 10k
REFERENCE VOLTAGE OUTPUT NOISE vs. FREQUENCY
VREF = 2.5V
MAX11359A toc25
ADC MUX INPUT DC CURRENT vs. TEMPERATURE
MAX11359A toc26
DAC INL vs. OUTPUT CODE
0.25 AVDD = 1.8V VREF = 1.25V
10,000
2 0 INPUT CURRENT (A) -2 -4 -6 -8 AVDD = 1.8V VAIN = 0.5V
0.15
NOISE (nV/Hz)
1000
INL (LSB) -40 -15 10 35 60 85
0.05
-0.05
-0.15 -10 100 1 10 100 FREQUENCY (Hz) 1k 10k -12 TEMPERATURE (C) -0.25 0 200 400 600 800 1000 OUTPUT CODE
DAC INL vs. OUTPUT CODE
MAX11359A toc28
DAC INL vs. OUTPUT CODE
AVDD = 3.0V VREF = 2.5V 0.15
MAX11359A toc29
DAC DNL vs. OUTPUT CODE
0.20 0.15 0.10 DNL (LSB) 0.05 0 -0.05 -0.10 -0.15 AVDD = 1.8V VREF = 1.25V 0 200 400 600 800 1000
0.25 AVDD = 2.5V VREF = 2.048V 0.15
0.25
INL (LSB)
-0.05
INL (LSB)
0.05
0.05
-0.05
-0.15
-0.15
-0.25 0 200 400 600 800 1000 OUTPUT CODE
-0.25 0 200 400 600 800 1000 OUTPUT CODE
-0.20 OUTPUT CODE
16
______________________________________________________________________________________
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
DAC DNL vs. OUTPUT CODE
MAX11359A toc31
MAX11359A
DAC DNL vs. OUTPUT CODE
0.15 0.10 DNL (LSB) 0.05 0 -0.05 -0.10
MAX11359A toc32
DAC OUTPUT VOLTAGE vs. OUTPUT SOURCE CURRENT
MAX11359A toc33
0.20 0.15 0.10 DNL (LSB) 0.05 0 -0.05 -0.10 -0.15 -0.20 0 200 400 600 800 1000 OUTPUT CODE AVDD = 2.5V VREF = 2.048V
0.20
1.248
DAC OUTPUT VOLTAGE (V)
1.246
1.244
1.242 CODE = 3FF hex AVDD = 1.8V, 3.0V 1.240
-0.15 -0.20 0
AVDD = 3.0V VREF = 2.5V 200 400 600 800 1000 0
0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 SOURCE CURRENT (mA)
OUTPUT CODE
DAC OUTPUT VOLTAGE vs. OUTPUT SINK CURRENT
MAX11359A toc34
DAC OUTPUT VOLTAGE vs. ANALOG SUPPLY VOLTAGE
MAX11359A toc35
DAC OUTPUT VOLTAGE vs. TEMPERATURE
MAX11359A toc36
0.30 0.25 DAC OUTPUT VOLTAGE (V) 0.20 0.15 0.10 0.05 CODE = 020 hex 0 0 AVDD = 1.8V
650
630
DAC OUTPUT VOLTAGE (mV)
DAC OUTPUT VOLTAGE (mV)
640
628 AVDD = 1.8V 626 AVDD = 3.0V
630
620
624
AVDD = 3.0V
610 CODE = 200 hex 600 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 SOURCE CURRENT (mA) 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6
622 VREF = 1.25V CODE = 200 hex 620 -40 -15 10 35 60 85 TEMPERATURE (C)
DAC FBA/B INPUT BIAS CURRENT vs. TEMPERATURE
MAX11359A toc37
DAC OUTPUT NOISE (0.1Hz TO 10Hz)
MAX11359A toc38
DAC OUTPUT NOISE vs. FREQUENCY
DAC CODE = 3FF hex VREF = 2.5V
MAX11359A toc39
2 1 INPUT BIAS CURRENT (A) 0 -1 AVDD = 1.8V VAIN = 0.5V
10,000
NOISE (nV/Hz)
50V/div -2 -3 -4 -5 -40 -15 10 35 60 85 1s/div TEMPERATURE (C) AVDD = +1.8V VREF = +1.25V DAC CODE = 3FF hex
1000
100 1 10 100 FREQUENCY (Hz) 1k 10k
______________________________________________________________________________________
17
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
DAC LARGE-SIGNAL OUTPUT STEP RESPONSE
MAX11359A toc40
OP-AMP INPUT OFFSET VOLTAGE vs. TEMPERATURE
VCM = 0.5V CS 2V/div INPUT OFFSET VOLTAGE (mV) 7.2
MAX11359A toc41
7.5
6.9
AVDD = 3.0V
6.6 AVDD = 1.8V 6.3
OUT_ 1V/div VREF = +1.25V AVDD = +3.0V
6.0 40s/div -40 -15 10 35 60 85 TEMPERATURE (C)
OP-AMP INPUT BIAS CURRENT vs. TEMPERATURE
MAX11359A toc42
OP-AMP INPUT BIAS CURRENT vs. TEMPERATURE
12 INPUT BIAS CURRENT (pA) 10 8 6 4 2 0 -2 AVDD = 3.0V VCM = 0.5V
MAX11359A toc43
12 10 INPUT BIAS CURRENT (pA) 8 6 4 2 0 -40 -15 10 35
AVDD = 1.8V VCM = 0.5V
14
60
85
-40
-15
10
35
60
85
TEMPERATURE (C)
TEMPERATURE (C)
OP-AMP OUTPUT VOLTAGE vs. OUTPUT SINK CURRENT
MAX11359A toc44
OP-AMP OUTPUT VOLTAGE vs. OUTPUT SOURCE CURRENT
MAX11359A toc45
250
3.00
200 OUTPUT VOLTAGE (mV)
OUTPUT VOLTAGE (V)
AVDD = 3.0V
2.96
150 AVDD = 1.8V 100
2.92
2.88
50 UNITY GAIN, VIN_+ = 0V 0 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 SINK CURRENT (mA)
2.84 AVDD = 3.0V UNITY GAIN, VIN_+ = AVDD 2.80 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 SOURCE CURRENT (mA)
18
______________________________________________________________________________________
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
OP-AMP OUTPUT VOLTAGE vs. OUTPUT SOURCE CURRENT
MAX11359A toc46
MAX11359A
OP-AMP OUTPUT VOLTAGE vs. TEMPERATURE
UNITY GAIN, VIN_+ = 0.5V RL = 10k 500.8 OUTPUT VOLTAGE (mV) AVDD = 3.0V 500.6
MAX11359A toc47
1.80
501.0
OUTPUT VOLTAGE (V)
1.75
1.70
500.4 AVDD = 1.8V 500.2
1.65 UNITY GAIN, VIN_+ = AVDD AVDD = 1.8V 1.60 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 SOURCE CURRENT (mA)
500.0 -40 -15 10 35 60 85 TEMPERATURE (C)
OP-AMP OUTPUT VOLTAGE vs. AVDD SUPPLY VOLTAGE
MAX11359A toc48
OP-AMP OUTPUT NOISE vs. FREQUENCY
UNITY GAIN, VIN_+ = 0.5V
MAX11359A toc49
501.0 UNITY GAIN, VIN_+ = 0.5V RL = 10k 500.8 OUTPUT VOLTAGE (mV)
10,000
500.6
NOISE (nV/Hz)
1000
500.4
500.2
500.0 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6
100 1 10 100 FREQUENCY (Hz) 1k 10k
SPDT ON-RESISTANCE vs. VCOM VOLTAGE
MAX11359A toc50
SPST ON-RESISTANCE vs. VCOM VOLTAGE
MAX11359A toc51
75
150
65
130
RON ()
RON ()
55 AVDD = 3.0V
110
AVDD = 3.0V
45
90 AVDD = 1.8V
35 AVDD = 1.8V 25 0 0.5 1.0 1.5 VCOM (V) 2.0 2.5 3.0
70
50 0 0.5 1.0 1.5 VCOM (V) 2.0 2.5 3.0
______________________________________________________________________________________
19
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
SPDT ON-RESISTANCE vs. TEMPERATURE
MAX11359A toc52
SPST ON-RESISTANCE vs. TEMPERATURE
AVDD = 1.8V, 3.0V ICOM = 1mA
MAX11359A toc53
45 ICOM = 1mA 42
100 97 94
RON ()
RON () 35 60 85
39 AVDD = 3.0V 36
91 88
33 AVDD = 1.8V 30 -40 -15 10 TEMPERATURE (C)
85 82 -40 -15 10 35 60 85 TEMPERATURE (C)
SPDT/SPST ON-/OFF-LEAKAGE CURRENT vs. TEMPERATURE
AVDD = 1.8V VCM = 0V LEAKAGE CURRENT (pA)
MAX11359A toc54
SPDT/SPST SWITCHING TIME vs. AVDD SUPPLY VOLTAGE
MAX11359A toc55
100
45 40 SWITCHING TIMES (ns) 35 tON 30 25 20 tOFF
10
ON-LEAKAGE
1
OFF-LEAKAGE
0.1 -40 -15 10 35 60 85 TEMPERATURE (C)
15 1.8 2.1 2.4 2.7 AVDD (V) 3.0 3.3 3.6
SPDT/SPST SWITCHING TIME vs. TEMPERATURE
MAX11359A toc56
SPDT/SPST SWITCHING TIME vs. TEMPERATURE
AVDD = 3.0V 31 SWITCHING TIMES (ns) tON 27
MAX11359A toc57
50 AVDD = 1.8V 46 SWITCHING TIMES (ns) tON
35
42 tOFF
38
23 tOFF 19
34
30 -40 -15 10 35 60 85 TEMPERATURE (C)
15 -40 -15 10 35 60 85 TEMPERATURE (C)
20
______________________________________________________________________________________
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Typical Operating Characteristics (continued)
(DVDD = AVDD = 1.8V, VREF = +1.25V, CCPOUT = 10F, TA = +25C, unless otherwise noted.)
VOLTAGE SUPERVISOR THRESHOLD vs. TEMPERATURE
MAX11359A toc58
MAX11359A
CHARGE-PUMP OUTPUT VOLTAGE vs. OUTPUT CURRENT
MAX11359A toc59
0.10 0.05 DVDD SUPERVISOR % DEVIATION 0 -0.05 -0.10 -0.15 -0.20 -40 -15 10 35 60
3.6 3.5 CPOUT VOLTAGE (V) 3.4 3.3 3.2 3.1 DVDD = 1.8V 3.0
CPOUT SUPERVISOR
85
0
2
4
6
8
10
TEMPERATURE (C)
OUTPUT CURRENT (mA)
CHARGE-PUMP OUTPUT VOLTAGE vs. TEMPERATURE
MAX11359A toc60
CHARGE-PUMP OUTPUT RESISTANCE vs. CAPACITANCE
MAX11359A toc61
3.30
100
CPOUT VOLTAGE (V)
DVDD = 3.0V
OUTPUT RESISTANCE ()
3.26
80
3.22 DVDD = 1.8V
60
3.18
40
3.14 IOUT = 10mA 3.10 -40 -15 10 35 60 85 TEMPERATURE (C)
20 DVDD = 1.8V IOUT = 10mA 0 0 4 8 12 CF (F) 16 20
CHARGE-PUMP OUTPUT VOLTAGE RIPPLE vs. OUTPUT CURRENT
DVDD = 1.8V OUTPUT VOLTAGE RIPPLE (mV) 40
MAX11359A toc62
CHARGE-PUMP OUTPUT VOLTAGE RIPPLE
MAX11359A toc63
50
30
20
CPOUT 20mV/div AC-COUPLED
10 DVDD = +1.8V ILOAD = 10mA 0 0 2 4 6 8 10 20s/div OUTPUT CURRENT (mA)
______________________________________________________________________________________
21
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Pin Description
PIN 1 2 3 4 5 6 7 8 9 10 NAME CLK UPIO2 UPIO3 UPIO4 DOUT SCLK DIN CS INT CLK32K FUNCTION Clock Output. Default is 2.457MHz output clock for C. User-Programmable Input/Output 2. See the UPIO2_CTRL Register section for functionality. User-Programmable Input/Output 3. See the UPIO3_CTRL Register section for functionality. User-Programmable Input/Output 4. See the UPIO4_CTRL Register section for functionality. Serial-Data Output. Data is clocked out on SCLK's falling edge. High impedance when CS is high. When UPIO/SPI passthrough mode is enabled, DOUT mirrors the state of UPIO1. Serial-Clock Input. Clocks data in and out of the serial interface. Serial-Data Input. Data is clocked in on SCLK's rising edge. Active-Low Chip-Select Input. Data is not clocked into DIN unless CS is low. When CS is high, DOUT is high impedance. High impedance when CS is high. When UPIO/SPI passthrough mode is enabled, DOUT mirrors the state of UPIO1. Programmable Active-High/Low Interrupt Output. ADC, UPIO wake-up, alarm, and voltage-monitor events. 32kHz Clock Input/Output. Outputs 32kHz clock for C. Can be programmed as an input by enabling the IO32E bit to accept an external 32kHz input clock. The RTC, PWM, and watchdog timer always use the internal 32kHz clock derived from the 32kHz crystal. Active-Low Open-Drain Reset Output. Remains low while DVDD is below the 1.8V voltage threshold, and stays low for a timeout period (tDSLP) after DVDD rises above the 1.8V threshold. RESET also pulses low when the watchdog timer times out and holds low during POR until the 32kHz oscillator stabilizes. 32kHz Crystal Input. Connect external 32kHz watch crystal between 32KIN and 32KOUT or drive with CMOS level as shown in Figure 25. Analog Switch 1 Normally Open Terminal. Analog input to mux. Analog Switch 1 Common Terminal. Analog input to mux. Analog Switch 1 Normally Closed Terminal. Analog input to mux (open on POR). Analog Switch 2 Normally Open Terminal. Analog input to mux. Analog Switch 2 Common Terminal. Analog input to mux (open on POR). Analog Switch 2 Normally Closed Terminal. Analog input to mux. Amplifier 1 Output. Analog input to mux. Amplifier 1 Inverting Input. Analog input to mux. Amplifier 1 Noninverting Input DACA SPST Shunt Switch Input. Connects to OUTA through a SPST switch. DACA Force-Sense Feedback Input. Analog input to mux.
11 12 13 14 15 16 17 18 19 20 21 22 23 24
RESET
32KOUT 32kHz Crystal Output. Connect external 32kHz watch crystal between 32KIN and 32KOUT. 32KIN SNO1 SCM1 SNC1 SNO2 SCM2 SNC2 OUT1 IN1IN1+ SWA FBA
22
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Pin Description (continued)
PIN 25 26 27 28 29 30 31 32 33 34 35 36 37 NAME OUTA AGND AVDD IN2+ IN2OUT2 AIN2 AIN1 REF REG CFCF+ CPOUT FUNCTION DACA Force-Sense Output. Analog input to mux. Analog Ground Analog Supply Voltage. Also ADC reference voltage during AVDD measurement. Bypass to AGND with 10F and 0.1F capacitors in parallel as close to the pin as possible. Amplifier 2 Noninverting Input Amplifier 2 Inverting Input. Analog input to mux. Amplifier 2 Output. Analog input to mux. Analog Input 2. Analog input to mux. Inputs have internal programmable current source for external temperature measurement. Analog Input 1. Analog input to mux. Inputs have internal programmable current source for external temperature measurement. Reference Input/Output. Output of the reference buffer amplifier or external reference input. Disabled at power-up to allow external reference. Reference voltage for ADC and DAC. Linear Voltage-Regulator Output. Charge-pump-doubler input voltage. Bypass REG with a 10F capacitor to DGND for charge-pump regulation. Charge-Pump Flying Capacitor Terminals. Connect an external 10F (typ) capacitor between CF+ and CF-. Charge-Pump Output. Connect an external 10F (typ) reservoir capacitor between CPOUT and DGND. There is a low threshold diode between DVDD and CPOUT. When the charge pump is disabled, CPOUT is pulled up within 300mV (typ) of DVDD. Digital Supply Voltage. Bypass to DGND with 10F and 0.1F capacitors in parallel as close to the pin as possible. Digital Ground. Also ground for cascaded linear voltage regulator and charge-pump doubler. User-Programmable Input/Output 1. See the UPIO1_CTRL Register for functionality. Exposed Pad. Leave unconnected or connect to AGND.
MAX11359A
38 39 40 --
DVDD DGND UPIO1 EP
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23
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Detailed Description
The MAX11359A DAS features a multiplexed differential 16-bit ADC, 10-bit force-sense DAC, an RTC with an alarm, a selectable bandgap voltage reference, a signaldetect comparator, 1.8V and 2.7V voltage monitors, and wake-up control circuitry, all controlled by a 4-wire serial interface. (See Figure 3 for the functional diagram.) The DAS directly interfaces to various sensor outputs and, once configured, provides the stimulus, signal conditioning, and data conversion, as well as P support. See the Applications section for sample MAX11359A applications. The 16-bit ADC features programmable continuous conversion rates as shown in Table 4, and gains of 1, 2, 4, and 8 (Table 5) to suit applications with different power
DVDD
32KIN
32KOUT
CLK32K
CLK
INT
AVDD
CS SCLK DIN DOUT SERIAL INTERFACE
32.768kHz OSCILLATOR
CLK32K M32K INPUT/OUTPUT CONTROL
4.9152MHz HF OSCILLATOR AND FLL HFCLK
INTERRUPT 16 CRDY UPR<4:1> UPF<4:1> STATUS ALD SDC ADD ADOU LDVD LCPD 4 4 UPIO
UPIO1 UPIO2 UPIO3 UPIO4
CONTROL LOGIC
32K RTC AND ALARM
PWM
WATCHDOG TIMER AIN1 PROG CURRENT SOURCE AIN2 TEMP SENSOR TEMP+ TEMPWDTO
DVDD (1.8V) VOLTAGE MONITOR
RESET
CPOUT (2.7V) VOLTAGE MONITOR
CPOUT CHARGEPUMP DOUBLER CF+ CFREG
MAX11359A
DVDD M32K LINEAR 1.65V VOLTAGE REGULATOR 1.25V BANDGAP
AIN1 AIN2
SNO1 SNC1 SCM1 SPDT1
AIN1 SNO1 FBA SCM1 IN2SNC1 INM1 TEMP+ REF AGND TEMPSNO2 OUTA SCM2 OUT2 SNC2 OUT1 AIN2 REF AGND
M32K PROG. Vos 10:1 MUX POS
PGA Av = 1, 1.6384, 2 V/V
REF
CMP REF REF IN+ 16-BIT ADC IN10-BIT DAC HFCLK BUF OUTA SWA FBA
PGA POLARITY FLIPPER 10:1 MUX NEG Av = 1, 2, 4, 8 V/V
SNO2 SNC2 SCM2 SPDT2
OP2 OP1
OUT2
DGND
IN1+
IN1-
OUT1
IN2+
IN2-
AGND
Figure 3. MAX11359A Functional Diagram
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
and dynamic range constraints. The force-sense DAC provides 10-bit resolution for precise sensor applications. The ADC and DAC both utilize a low-drift 1.25V internal bandgap reference for conversions and fullscale range setting. The RTC has a 138-year range and provides an alarm function that can be used to wake up the system or cause an interrupt at a predefined time. The power-supply voltage monitor detects when DVDD falls below a trip threshold voltage of +1.8V, asserting RESET. The MAX11359A uses a 4-wire serial interface to communicate directly between SPI, QSPI, or MICROWIRE devices for system configuration and readback functions.
ADC Modulator The MAX11359A performs analog-to-digital conversions using a single-bit, 3rd-order, switched-capacitor sigmadelta modulator. The sigma-delta modulation converts the input signal into a digital pulse train whose average duty cycle represents the digitized signal information. The pulse train is then processed by a digital decimation filter. The modulator provides 2nd-order frequency shaping of the quantization noise resulting from the single-bit quantizer. The modulator is fully differential for maximum signal-to-noise ratio and minimum susceptibility to power-supply noise.
MAX11359A
Signal-Detect Comparator
INT asserts (and remains asserted) within 30s when the differential voltage on the selected analog inputs exceeds the signal-detect comparator trip threshold. The signal-detect comparator's differential input trip threshold (i.e., offset) is user selectable and can be programmed to the following values: 0mV, 50mV, 100mV, 150mV, or 200mV.
Analog-to-Digital Converter (ADC)
The MAX11359A includes a sigma-delta ADC with programmable conversion rate, a PGA, and a dual 10:1 input mux. When performing continuous conversions at 10sps or single conversions at the 40sps setting (effectively 10sps due to four sample sigma-delta settling), the ADC has 16-bit noise-free resolution. The noise-free resolution drops to 10 bits at the maximum sampling rate of 512sps. Differential inputs support unipolar (between 0 and VREF) and bipolar (between VREF) modes of operation. Note: Avoid combinations of input signal and PGA gains that exceed the reference range at the ADC input. The ADOU bit in the status register indicates if the ADC has overranged or underranged. Zero-scale and full-scale calibrations remove offset and gain errors. Direct access to gain and zero-scale calibration registers allows system-level offset and gain calibration. The zero-scale adjustment register allows intentional positive offset skewing to preserve unipolarmode resolution for signals that have a slight negative offset (i.e., unipolar clipping near zero can be removed). Perform ADC calibration whenever the ADC configuration, temperature, or AVDD changes. The ADC-done status can be programmed to provide an interrupt on INT or on any UPIO_.
Analog Inputs
The ADC provides two external analog inputs: AIN1 and AIN2. The rail-to-rail inputs accept differential or single-ended voltages, or external temperature-sensing diodes. The unused op amps, switches, or DAC inputs and output pins can also be used as rail-to-rail analog inputs if the associated function is disabled.
Analog Input Protection Internal protection diodes clamp the analog inputs to AVDD and AGND, and allow the channel input to swing from (AGND - 0.3V) to (AVDD + 0.3V). For accurate conversions near full scale, the inputs must not exceed AVDD by more than 50mV or be lower than AGND by 50mV. If the inputs exceed (AGND - 0.3V) to (AVDD + 0.3V), limit the current to 50mA.
Analog Mux
The MAX11359A includes a dual 10:1 mux for the positive and negative inputs of the ADC. Figure 3 illustrates which signals are present at the inputs of each mux for the MAX11359A. The MUXP[3:0] and MUXN[3:0] bits of the mux register select the input to the ADC and the signaldetect comparator (Tables 8 and 9). See the mux register description in the Register Definitions section for multiplexer functionality. The POL bit of the ADC register swaps the polarity of mux output signals to the ADC.
PGA Gain An integrated PGA provides four selectable gains: +1V/V, +2V/V, +4V/V, and +8V/V to maximize the dynamic range of the ADC. Bits GAIN1 and GAIN0 set the gain (see the ADC Register for more information). The PGA gain is implemented in the digital filter of the ADC.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Digital Filtering
The MAX11359A contains an on-chip digital lowpass filter that processes the data stream from the modulator using a SINC4 (sinx/x)4 response. The SINC4 filter has a settling time of four output data periods (4 x 200ms). The MAX11359A has 25% overrange capability built into the modulator and digital filter:
4 f SIN N fm 1 H(f) = N SIN f fm
Force-Sense DAC
The MAX11359A incorporates a 10-bit force-sensing DAC. The DAC's reference voltage sets the full-scale range. Program the DACA_OP register using the serial interface to set the output voltages of the DAC at OUTA. Connecting resistors in a voltage-divider configuration between OUTA, FBA, and GND sets a different closed-loop gain for the output amplifier (see the Applications Information section). The DAC output amplifier typically settles to 0.5 LSB from a full-scale transition within 50s (unity gain and loaded with 10k in parallel with 200pF). Loads of less than 1k may degrade performance. See the Typical Operating Characteristics for the source-and-sink capability of the DAC output. The MAX11359A features a software-programmable shutdown mode for the DAC. Power down DACA by clearing the DAE bits (see the DACA_OP Register section). DAC output OUTA goes high impedance when powered down. The DAC is normally powered down at power-on reset.
Figure 4 shows the filter frequency response. The SINC4 characteristic -3dB cutoff frequency is 0.228 times the first notch frequency. The output data rate for the digital filter corresponds with the positioning of the first notch of the filter's frequency response. The notches of the SINC4 filter are repeated at multiples of the first notch frequency. The SINC 4 filter provides an attenuation of better than 100dB at these notches. For example, 50Hz is equal to five times the first notch frequency and 60Hz is equal to six times the first notch frequency.
Charge Pump
The charge pump provides > 3V at CPOUT with a maximum 10mA load. Enable the charge pump through the PS_VMONS register. The charge pump is powered from DVDD. See Figures 5 and 6 for block diagrams of the charge pump and linear regulator. The charge pump is disabled at power-on reset. An internal clock drives the charge-pump clock and ADC clock. The charge pump delivers a maximum 10mA of current to external devices. The droop and the ripple depend on the clock frequency (f CLK = 32.768kHz/2), switch resistances (RSWITCH = 5), and the external capacitors (10F) along with their respective ESRs, as shown below.
VDROOP = IOUTROUT
0
-40
GAIN (dB)
-80
-120
-160
ROUT =
0 20 40 60 80 100 120
-200 FREQUENCY (Hz)
1 + 2RSWITCH + 4ESRCF + ESRCCPOUT fCLKCF IOUT VRIPPLE = + 2IOUTESRCCPOUT fCLKCCPOUT
Figure 4. Filter Frequency Response
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
DVDD LDOE 1.22V OP M32K 1.65V REG NONOVERLAP CLOCK GENERATOR CF+ CPE CPOUT
REG
CF-
LDOE CHARGE-PUMP DOUBLER LINEAR 1.65V VOLTAGE REGULATOR
Figure 5. Linear-Regulator Block Diagram
Figure 6. Charge-Pump Block Diagram
Voltage Supervisors
The MAX11359A provides voltage supervisors to monitor DVDD and CPOUT. The first supervisor monitors the DVDD supply voltage. RESET asserts and sets the corresponding LDVD status bit when DVDD falls below the 1.8V threshold voltage. When the DVDD supply voltage rises above the threshold during power-up, RESET deasserts after a nominal 1.5s timeout period to give the crystal oscillator time to stabilize. Set the threshold hysteresis using the HYSE bit of the PS_VMONS register. See the PS_VMONS Register section for configuring hysteresis. There is no separate voltage monitor for AVDD, but the analog supply is covered by the DVDD monitor in many applications where DVDD and AVDD are externally connected together. Multiple supply applications where AVDD and DVDD are not connected together require a separate external voltage monitor for AVDD. See Figure 7 for a block diagram of the DVDD voltage supervisor. The second voltage monitor tracks the charge-pump output voltage, CPOUT. If CPOUT falls below the 2.7V
threshold, a corresponding register status bit (LCPD) is set to flag the condition. The CPOUT monitor output can also be mapped to the interrupt generator and output on INT. The CPOUT monitor can be used as a 3V AVDD monitor in applications where the charge pump is disabled and CPOUT is connected to AV DD . AV DD must be greater or equal to DVDD when CPOUT is used to monitor AVDD. See Figure 8 for a block diagram of the CPOUT voltage supervisor.
Interrupt Generator (INT)
The interrupt generator provides an interrupt to an external C. The source of the interrupt is generated by the status register and can be masked and unmasked through the IMSK register. CRDY is unmasked by default, and INT is active-high at power-on reset. INT is programmable as active-high and active-low. Possible sources include a rising or falling edge of UPIO_, an RTC alarm, an ADC conversion completion, or the voltage-supervisor outputs. The interrupt causes INT to assert when configured as an interrupt output.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
WDTO DVDD HYSE POR 1.8VTH ANALOG 2:1 MUX 2.0VTH 1.25V CMP LSDE
RSTE
RESET
CONTROL LOGIC
LSDE
LDVD
DVDD (1.8V) VOLTAGE MONITOR
Figure 7. DVDD Voltage-Supervisor Block Diagram
CPOUT CPDE 2.7VTH CMP 1.25V LCPD
as the C-002RX32-E from Epson Crystal. Using a crystal with a CL that is larger than the load capacitance of the oscillator circuit causes the oscillator to run faster than the specified nominal frequency of the crystal or to not start up. See Figures 9 and 10 for block diagrams of the crystal oscillator and the CLK32K I/O.
Real-Time Clock (RTC)
The integrated RTC provides the current time information from a 32-bit counter and subsecond counts from an 8bit ripple counter. An internally generated reference clock of 256Hz (derived from the 32.768kHz crystal) drives the 8-bit subsecond counter. An overflow of the 8-bit subsecond counter inputs a 1Hz clock to increment the 32-bit second counter. The RTC 32-bit second counter is translatable to calendar format with firmware. All 40 bits (32-bit second counter and 8-bit subsecond counter) must be clocked in or out for valid data. The RTC and the 32.768kHz crystal oscillator consume less than 1A when the rest of the IC is powered down.
CPDE
CPOUT (2.7V) VOLTAGE MONITOR
Figure 8. CPOUT Voltage-Supervisor Block Diagram
Crystal Oscillator
The on-chip oscillator requires an external crystal (or resonator) connected between 32KIN and 32KOUT with a 32.768kHz operating frequency. This oscillator is used for the RTC, alarm, PWM, watchdog, charge pump, and FLL. In any crystal-based oscillator circuit, the oscillator frequency is sensitive to the capacitive load (CL). CL is the capacitance that the crystal needs from the oscillator circuit and not the capacitance of the crystal. The input capacitance across 32KIN and 32KOUT is 6pF. Choose a crystal with a 32.768kHz oscillation frequency and a 6pF capacitive load such
Time-of-Day Alarm
Program the AL_DAY register with a 20-bit value, which corresponds to a time 1s to 12 days later than the current time with a 1s resolution. The alarm status bit, ALD, asserts when the 20 bits of the AL_DAY register matches the 20 LSBs of the 32-bit second counter. The ADE bit automatically clears when the time-of-day alarm trips. The time-of-day alarm causes the device to exit sleep mode.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Watchdog
Enable the watchdog timer by writing a 1 to the WDE bit in the CLK_CTRL register. After enabling the watchdog timer, the device asserts RESET for 250ms, if the watchdog address register is not written every 500ms. Due to the asynchronous nature of the watchdog timer, the watchdog timeout period varies between 500ms and 750ms. Write a 0 to the WDE bit to disable the watchdog timer. See Figure 11 for a block diagram of the watchdog timer. frequency clock is locked to the 32.768kHz reference. If the FLL is disabled, the high-frequency clock is freerunning. At power-up, the CLK pin defaults to a 2.4576MHz clock output, which is compatible with most Cs. See Figure 12 for a block diagram of the high-frequency clock.
MAX11359A
User-Programmable I/Os
The MAX11359A provides four digital programmable I/Os (UPIO1-UPIO4). Configure UPIOs as logic inputs or outputs using the UPIO control register. Configure the internal pullups using the UPIO setup register, if required. At power-up, the UPIOs are internally pulled up to DVDD. UPIO_ outputs can be referenced to DVDD or CPOUT. See the UPIO__CTRL Register and UPIO_SPI Register sections for more details on configuring the UPIO_ pins.
High-Frequency Clock
An internal oscillator and a frequency-locked loop (FLL) are used to generate a 4.9152MHz 1% high-frequency clock. This clock and derivatives are used internally by the ADC, analog switches, and PWM. This clock signal outputs to CLK. When the FLL is enabled, the high-
OSCE 32KOUT 32kHz OSCILLATOR 32K
32K OSCE CK32E IO32E IO32E
0 IO32E 2:1 MUX 1 CLK32K I/O CONTROL M32K
32KIN 32.768kHz OSCILLATOR
CLK32K
Figure 9. 32kHz Crystal-Oscillator Block Diagram
Figure 10. CLK32K I/O Block Diagram
POR PULSES HIGH DURING POWER-UP. WDW PULSES HIGH DURING WATCHDOG REGISTER WRITE. WDTO
D 32K WDE DIVIDEBY-8192 4Hz CK R
Q
D
Q
Q
CK R
Q
POR WDW WATCHDOG TIMER
Figure 11. Watchdog Timer Block Diagram
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
32.768kHz HFCE FREQ ERROR CKSEL2 CKSEL<1:0> FLLE M32K TUNE<8:0> 0 2:1 MUX 1 1, 2, 4, 8 DIVIDER CLKE CLK
FREQUENCY COMPARE
FREQUENCY INTEGRATOR
DIGITALLY CONTROLLED OSCILLATOR
4.9152MHz
HFCLK CRDY
4.9152MHz HF OSCILLATOR AND FLL
Figure 12. High-Frequency Clock and FLL Block Diagram
Program each UPIO1-UPIO4 as one of the following: * General-purpose input * Power-mode control * Analog switch (SPST) and SPDT control input * ADC data-ready output * General-purpose output * PWM output * Alarm output * SPI passthrough
AIN2 AIN1 IMUX<1:0> PROGRAMMABLE CURRENT SOURCE IVAL<1:0> CURRENT SOURCE 1:3 DEMUX AIN1 AIN2
Temperature Sensor
The internal temperature sensor measures die temperature, and the external temperature sensor measures remote temperatures. Use the internal temperature sensor or external temperature sensor (remote transistor/ diode) with the ADC and internal current sources to measure the temperature. For either method, two to four currents are passed through a p-n junction and sense resistor, and its temperature is calculated by a C using the diode equation and the forward-biased junction voltage drops measured by the ADC. The temperature offset between the internal p-n junction and ambient is negligible. For the four and eight measurement methods, the ratio of currents used in the diode calculations is precisely known since the ADC measures the resulting voltage across the same sense resistor. See Figure 13 for a block diagram of the temperature sensor.
TEMP+
TEMP-
TEMP SENSOR
Figure 13. Temperature-Sensor Measurement Block Diagram
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Two-Current Method For the two-current method, currents I 1 and I 2 are passed through a p-n junction. This requires two VBE measurements. Temperature measurements can be performed using I1 and I2.
TMEAS = q(VBE2 - VBE1) I nk ln 2 I1 used to improve accuracy by precisely measuring the values of the currents. 1) Current I1 is driven through the diode and the series resistor R, and the voltage is measured across the diode using the ADC as NVBE1. 2) For the same current, the voltage across the diode and the series resistor is measured by the ADC as NV1. 3) Repeat steps 1 and 2 with I2, I3, and I4. The measured temperature is defined as follows: TMEAS = q(NVBE3 - NVBE1) - q(NVBE4 - NVBE2 ) M nkIn 1 M2 V x REF 216
MAX11359A
where k is Boltzman's constant and q is the absolute value of the charge on electron. A four-measurement procedure is adopted to improve accuracy by precisely measuring the ratio of I1 and I2: 1) Current I1 is driven through the diode and the series resistor R, and the voltage across the diode is measured as VBE1. 2) For the same current, the voltage across the diode and R is measured as V1. 3) Repeat steps 1 and 2 with I2. I1 is typically 4A, and I2 is typically 60A (see Table 21). Since only four integer numbers are accessible from the ADC conversions at a certain voltage reference, the previous equation can be represented in the following manner: TMEAS = V q(NVBE2 - NVBE1) x REF NV 2 - NVBE2 216 nk ln NV1 - NVBE1
where VREF is the reference voltage used and: M1 NV 3 - NVBE3 NV 2 - NVBE2 = M2 NV1 - NVBE1 NV 4 - NVBE4
where NV1, NV2, NVBE1, and NVBE2 are the measurement results in integer format and VREF is the reference voltage used in the ADC measurements.
External Temperature Sensor For an external temperature sensor, either the two-current or four-current method can be used. Connect an external diode (such as 2N3904 or 2N3906) between pins AIN1 and AGND (or AIN2 and AGND). Connect a sense resistor R between AIN1 and AIN2. Maximize R so the IR drop plus V BE of the p-n junction [(R x IMAX)+VBE] is the smaller of the ADC reference voltage or (AVDD - 400mV). The same procedure as the internal temperature sensor can be used for the external temperature sensor, by routing the currents to AIN1 (or AIN2) (see Table 20).
For the two-current method, if the external diode's series resistance (RS) is known, then the temperature measurement can be corrected as shown below:
q(NV 2 - NVBE2 ) - q(NV1 - NVBE1) VREF RS x x TACTUAL = TMEAS - 16 R N - NVBE2 2 nkIn V 2 NV1 - NVBE1
Four-Current Method The four-current method is used to account for the diode series resistance and trace resistance. The four currents are defined as follows; I1, I2, M1I1, and M2I2. If the currents are selected so (M1 - 1)I1 = (M2 - 1)I2, the effect of the series resistance is eliminated from the temperature measurements. For the currents I1 = 4A and I2 = 60A, the factors are selected as M1 = 16 and M2 = 2. This results in the currents I3 = M1I1 = 64A and I4 = M2I2 = 120A (typ). As in the case of the twocurrent method, two measurements per current are
Temperature-Sensor Calibration To account for various error sources during the temperature measurement, the internal temperature sensor is calibrated at the factory. The calibrated temperature equation is:
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
TA = g x TMEAS + b where g and b are the gain and offset calibration values, respectively. These calibration values are available for reading from the TEMP_CAL register.
Pulse-Width Modulator (PWM)
A single 8-bit PWM is available for various system tasks such as LCD bias control, sensor bias voltage trim, buzzer drive, and duty-cycled sleep-mode power-control schemes. PWM input clock sources include the 4.9512MHz FLL output, the 32kHz clock, and frequency-divided versions of each. Although most Cs have built-in PWM functions, the MAX11359A PWM is more flexible by allowing the UPIO outputs to be driven to DVDD or regulated CPOUT logic-high voltage levels. For duty-cycled power-control schemes, use the 32kHz-derived input clock. The PWM output is available independent of C power state. The FLL is typically disabled in sleep-override mode.
Voltage Reference and Buffer
An internal 1.25V bandgap reference has a buffer with a selectable 1.0V/V, 1.638V/V, or 2.0V/V gain, resulting in nominally 1.25V, 2.048V, or 2.5V reference voltage at REF. The ADC and DAC use this reference voltage. The state of the internal voltage reference output buffer at POR is disabled so it can be driven, at REF, with an external reference between AGND and AV DD . The MAX11359A reference has an initial tolerance of 1%. Program the reference buffer through the serial interface. Bypass REF with a 4.7F capacitor to AGND.
Serial Interface
The MAX11359A features a 4-wire serial interface consisting of a chip select (CS), serial clock (SCLK), data in (DIN), and data out (DOUT). CS must be low to allow data to be clocked into or out of the device. DOUT is high impedance while CS is high. The data is clocked in at DIN on the rising edge of SCLK. Data is clocked out at DOUT on the falling edge of SCLK. The serial interface is compatible with SPI modes CPOL = 0, CPHA = 0 and CPOL = 1, CPHA = 1. A write operation to the MAX11359A takes effect on the last rising edge of SCLK. If CS goes high before the complete transfer, the write is ignored. Every data transfer is initiated by the command byte. The command byte consists of a start bit (MSB), R/W bit, and 6 address bits. The start bit must be 1 to perform data transfers to the device. Zeros clocked in are ignored. For SPI passthrough mode, see the UPIO_SPI Register section. An address byte identifies each register. Table 4 shows the complete register address map for this family of DAS. Figures 14, 15, and 16 provide timing diagrams for read and write commands.
Operational Amplifiers (Op Amps)
The MAX11359A includes two op amps. These op amps feature rail-to-rail outputs, near rail-to-rail inputs, and have an 80kHz (1nF load) input bandwidth. The DACA_OP (DACB_OP) register controls the power state of the op amps. When powered down, the outputs of the op amps are high impedance.
Single-Pole/Double-Throw (SPDT) Switches
The MAX11359A provides two uncommitted SPDT switches. Each switch has a typical on-resistance of 35. Control the switches through the SW_CTRL register, the PWM output, and/or a UPIO port configured to control the switches (UPIO1-UPIO4_CTRL register).
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
CS
SCLK
DIN DOUT
X
1
0
A5
A4
A3
A2
A1
A0
DN
DN -1
DN-2
DN-3
D2
D1
D0
X
X = DON'T CARE.
Figure 14. Serial-Interface Register Write with 8-Bit Control Word, Followed by a Variable Length Data Write
CS
SCLK
DIN
X
1
1
A5
A4
A3
A2
A1
A0
X
X
X
X
X
X
X
X
DOUT X = DON'T CARE.
DN
DN-1
DN-2
DN-3
D2
D1
D0
Figure 15. Serial-Interface Register Read with 8-Bit Control Word Followed by a Variable Length Data Read
CS SCLK DIN 1 0 A4 A3 A2 A1 A0 X D7 D6 D5 D4 D3 D2 D1 D0 1 ADC CONV 1 A4 A3 A2 A1 A0 X
DOUT DRDY X = DON'T CARE.
D15D14 D13D12 D11D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 CHANGES
Figure 16. Performing an ADC Conversion (DRDY Function can be Accessed at UPIO Pins)
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Register Definitions
Table 4. Register Address Map
REGISTER NAME ADC MUX DATA OFFSET CAL GAIN CAL RESERVED DACA_OP RESERVED REF_SDC AL_DAY RESERVED CLK_CTRL RTC PWM_CTRL PWM_THTP WATCHDOG NORM_MD SLEEP SLEEP_CFG UPIO4_CTRL UPIO3_CTRL UPIO2_CTRL UPIO1_CTRL UPIO_SPI SW_CTRL TEMP_CTRL TEMP_CAL IMSK RESERVED PS_VMONS RESERVED STATUS START 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 CTL (R/W) R/W R/W R R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W W W W R/W R/W R/W R/W R/W R/W R/W R/W R R/W R/W R/W R/W R 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 ADR<5:0> (ADDRESS) 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X S X X X X X X X D<39:0>, D<23:0>, D<15:0> OR D<7:0> (DATA) ADCE STRT BIP POL CONT ADCREF GAIN<1:0> RATE<2:0> MODE<2:0> X X MUXP<3:0> MUXN<3:0> ADC<15:0> OFFSET<23:0> GAIN<23:0> Reserved. Do not use. DAE/ DBE/ OP1E X X X DACA<9:8> OP3E OP2E DACA<7:0> Reserved. Do not use. REFV<1:0> AOFF
AON SDCE TSEL<2:0> ASEC<19:4> X ASEC<3:0> X X X X Reserved. Do not use. AWE ADE X RWE RTCE OSCE FLLE X CKSEL<2:0> IO32E CK32E CLKE INTP SEC<31:0> X SUB<7:0> PWME FSEL<2:0> SWAH SWAL X X SPD1 SPD2 X X X X X PWMTH<7:0> X PWMTP<7:0> X X X X X X X X X X X X X X X X X X X X X X X X SLP SOSCE SCK32E SPWME SHDN X X X X UP4MD<3:0> PUP4 SV4 ALH4 X UP3MD<3:0> PUP3 SV3 ALH3 X UP2MD<3:0> PUP2 SV2 ALH2 X UP1MD<3:0> PUP1 SV1 ALH1 X UP4S UP3S UP2S UP1S X X X X SWA X SPDT1<1:0> SPDT2<1:0> X X IMUX<1:0> IVAL<1:0> X X X X TGAIN<7:0> TOFFS<5:0> X MLDVD MLCPD MADO MSDC MCRDY MADD MALD X MUPR<4:1> MUPF<4:1> X Reserved. Do not use. X LDOE CPE LSDE CPDE HYSE RSTE X X Reserved. Do not use. LDVD LCPD ADOU SDC CRDY ADD ALD X UPR<4:1> UPF<4:1>
X HFCE WDE
X X
X X X X LL4 LL3 LL2 LL1 X X X X X
X X
X = Don't care.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
Register Bit Descriptions ADC Register (Power-On State: 0000 0000 0000 00XX)
MSB ADCE STRT RATE<2:0> BIP POL CONT MODE<2:0> ADCREF X LSB GAIN<1:0> X
MAX11359A
The ADC register configures the ADC and starts a conversion. ADCE: ADC power-enable bit. ADCE = 1 powers up the ADC, and ADCE = 0 powers down the ADC. STRT: ADC start bit. STRT = 1 resets the registers inside the ADC filter and initiates a conversion or calibration. The conversion begins immediately after the 16th ADC control bit is clocked by the rising edge of SCLK. The initial conversion requires four conversion cycles for valid output data. If CONT = 0 when STRT is asserted, the ADC stops after a single conversion and holds the result in the DATA register. If CONT = 1 when STRT is asserted, the ADC performs continuous conversions at the rate specified by the RATE<2:0> bits until CONT is deasserted or ADCE is deasserted, powering down the ADC. The STRT bit is automatically deasserted after the initial conversion is complete (four conversion cycles; the ADC status bit ADD in the STATUS register asserts.) The current ADC configurations are not affected if the ADC register is written with STRT = 0. This allows the ADC and mux configurations to be updated simultaneously with the S bit in the MUX register. BIP: Unipolar/bipolar bit. Set BIP = 0 for unipolar mode and BIP = 1 for bipolar mode. Unipolar-mode data is unsigned binary format and bipolar is two's complement. See the ADC Transfer Functions section for more details. POL: Polarity flipper bit. POL = 1 flips the polarity of the differential signal to the ADC and the input to the signaldetect comparator (SDC). POL = 0 sets the positive mux output to the positive ADC and SDC inputs, and the negative mux output to the negative ADC and SDC inputs. POL = 1 sets the positive mux output to the negative ADC and SDC inputs, and the negative mux output to the positive ADC and SDC inputs.
CONT: Continuous conversion bit. CONT = 1 enables continuous conversions following completion of the first conversion or calibration(s) initiated by the STRT or S bit. Set CONT = 0 while asserting the STRT bit, or prior to asserting the S bit to perform a single conversion or to prevent conversions following a calibration. Set CONT = 0 to abort continuous conversions already in progress. When the ADC is stopped in this way, the last complete conversion result remains in the DATA register and the internal ADC state information is lost. Asserting the CONT bit does not restart the ADC, but results in continuous conversions once the ADC is restarted with the STRT or S bit. ADCREF: ADC reference source bit. Set ADCREF = 0 to select REF as the ADC reference. Set ADCREF = 1 to select AVDD as the ADC reference. To measure the AVDD voltage without having to attenuate the supply voltage, select REF and AGND as the differential inputs to the ADC, with POL = 0 and while ADCREF = 1. GAIN<1:0>: ADC gain-setting bits. These two bits select the gain of the ADC as shown in Table 5.
Table 5. Setting the Gain of the ADC
GAIN SETTING (V/V) 1 2 4 8 GAIN1 0 0 1 1 GAIN0 0 1 0 1
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Table 6. Setting the ADC Conversion Rate*
CONTINUOUS CONVERSION RATE (sps) 10 40 50 60 200 240 400 512 SINGLE CONVERSION RATE (sps) 2.5 10 12.5 15 50 60 100 128 RATE2 0 0 0 0 1 1 1 1 RATE1 0 0 1 1 0 0 1 1 RATE0 0 1 0 1 0 1 0 1
RATE<2:0>: ADC conversion-rate-setting bits. These three bits set the conversion rate of the ADC as shown in Table 6. The initial conversion requires four conversion cycles for valid data, and subsequent conversions require only one cycle (if CONT = 1). A full-scale input change can require up to five cycles for valid data if the digital filter is not reset with the STRT or S bit. MODE<2:0>: Conversion-mode bits. These three bits determine the type of conversion for the ADC as shown in Table 7. When the ADC finishes an offset calibration and/or gain calibration, the MODE<2:0> bits clear to 0 hex, the ADD bit in the STATUS register asserts, and an interrupt asserts on INT (or UPIO_ if programmed as DRDY) if MADD is unmasked. Perform a gain calibration after achieving the desired offset (calibrated or not). If an offset and gain calibration are performed together (MODE<2:0> = 7 hex), the offset calibration is performed first followed by the gain calibration, and the C is interrupted by INT (or UPIO_ if programmed as DRDY) if MADD is unmasked only upon completion of both offset and gain calibration. After power-on or calibration, the ADC does not begin conversions until initiated by the user (see the ADCE and STRT bit descriptions in this section and see the S bit descriptions in the MUX Register section). See the GAIN CAL Register and OFFSET CAL Register sections for details on system calibration.
The actual rates are:
NOMINAL CONTINUOUS CONVERSION RATE (sps) 10 40 50 60 200 240 400 512 DECIMATION RATIO 1096 274 220 183 55 46 27 23 ACTUAL CONTINUOUS CONVERSION RATE (sps) 10.01042142 40.04168568 49.87009943 59.953125 199.4803977 238.5091712 406.3489583 477.0183424
Table 7. Setting the ADC Conversion Mode
CONVERSION MODE Normal System Offset Calibration System Gain Calibration Normal Normal Self Offset Calibration Self Gain Calibration Self Offset and Gain Calibration MODE2 0 0 0 0 1 1 1 1 MODE1 0 0 1 1 0 0 1 1 MODE0 0 1 0 1 0 1 0 1
*Calculate the ADC sampling rate using the following equation: fS = fHFCLK 448 x decimation ratio
where fHFCLK = 4.9152MHz nominally.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
MUX Register (Power-On State: 0000 0000)
MSB S (ADR0) MUXP3 MUXP2 MUXP1 MUXP0 MUXN3 MUXN2 MUXN1 LSB MUXN0
MAX11359A
The MUX register configures the positive and negative mux inputs and can start an ADC conversion. S (ADR0): Conversion start bit. The S bit is the LSB of the MUX register address byte. S = 1 resets the registers inside the ADC filter and initiates a conversion or calibration. The conversion begins immediately after the eighth MUX register data bit, when S = 1 and when writing to the MUX register. This allows the new MUX and ADC register settings to take effect simultaneously for a new conversion, if STRT = 0 during the last write to the ADC register. If the S bit is asserted and the command is a read from the MUX register, the conversion starts immediately after the S bit (ADR0) is clocked in by the rising edge of SCLK. Read the MUX register with S = 1 for the fastest method of initiating a conversion because only 8 bits are required. The subsequent MUX register read is valid, but can be aborted by raising CS with no harmful side effects. The initial conversion requires four conversion cycles for valid output data. If CONT = 0 and S = 1, the ADC stops after a single conversion and holds the result in the DATA register. If CONT = 1 and S = 1, the ADC performs continuous conversions at the rate
specified by the RATE<2:0> bits until CONT deasserts or ADCE deasserts, powering down the ADC. When a conversion initiates using the S bit, the STRT bit asserts and deasserts automatically after the initial conversion completes. Writing to the MUX register with S = 0 causes the MUX settings to change immediately and the ADC continues in its prior state with its settings unaffected. When the ADC is powered down, MUX inputs are open. MUXP<3:0>: MUX positive input bits. These four bits select one of ten inputs from the positive MUX to go to the positive output of the MUX as shown in Table 8. Any writes to the MUX register take effect immediately once the LSB (MUXN0) is clocked by the rising edge of SCLK. MUXN<3:0> MUX negative input bits. These four bits select one of ten inputs from the negative MUX to go to the negative output of the MUX as shown in Table 9. Any writes to the MUX register take effect immediately once the LSB (MUXN0) is clocked by the rising edge of SCLK. The DATA register contains the data from the most recently completed conversion. The OFFSET CAL register contains the 24-bit data of the most recently completed offset calibration.
Table 8. Selecting the Positive MUX Inputs
POSITIVE MUX INPUT AIN1 SNO1 FBA SCM1 IN2SNC1 IN1TEMP+ REF AGND Open MUXP3 0 0 0 0 0 0 0 0 1 1 1 1 MUXP2 0 0 0 0 1 1 1 1 0 0 0 1 MUXP1 0 0 1 1 0 0 1 1 0 0 1 X MUXP0 0 1 0 1 0 1 0 1 0 1 X X
Table 9. Selecting the Negative MUX Inputs
NEGATIVE MUX INPUT TEMPSNO2 OUTA SCM2 OUT2 SNC2 OUT1 AIN2 REF AGND Open MUXN3 0 0 0 0 0 0 0 0 1 1 1 1 MUXN2 0 0 0 0 1 1 1 1 0 0 0 1 MUXN1 0 0 1 1 0 0 1 1 0 0 1 X MUXN0 0 1 0 1 0 1 0 1 0 1 X X
X = Don't care.
X = Don't care.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
DATA Register (Power-On State: 0000 0000 0000 0000)
MSB ADC15 ADC7 ADC14 ADC6 ADC13 ADC5 ADC12 ADC4 ADC11 ADC3 ADC10 ADC2 ADC9 LSB ADC1 ADC0 ADC8
ADC<15:0> Analog-to-digital conversion data bits. These 16 bits are the results from the most recently completed conversion. The data format is unsigned;
binary for unipolar mode, and two's complement for bipolar mode.
OFFSET CAL Register (Power-On State: 0000 0000 0000 0000 0000 0000)
MSB OFFSET23 OFFSET15 OFFSET7 OFFSET22 OFFSET14 OFFSET6 OFFSET21 OFFSET13 OFFSET5 OFFSET20 OFFSET12 OFFSET4 OFFSET19 OFFSET11 OFFSET3 OFFSET18 OFFSET10 OFFSET2 OFFSET17 OFFSET9 OFFSET1 OFFSET16 OFFSET8 LSB OFFSET0
OFFSET<23:0>: Offset-calibration bits. The data format is two's complement and is subtracted from the ADC output before being written to the DATA register. The offset calibration allows input offset errors between VREF 50% to be corrected in unipolar or bipolar mode. The MAX11359A can perform system offset calibration or self offset calibration. Self-calibration performs a
calibration for the entire signal path. See the ADC Calibration section for more details. The ADC input voltage range specifications must always be obeyed, and the OFFSET CAL register effectively offsets the ADC digital scale to a "zero" value determined by the calibration.
GAIN CAL Register (Power-On State: 1000 0000 0000 0000 0000 0000)
MSB GAIN23 GAIN15 GAIN7 GAIN22 GAIN14 GAIN6 GAIN21 GAIN13 GAIN5 GAIN20 GAIN12 GAIN4 GAIN19 GAIN11 GAIN3 GAIN18 GAIN10 GAIN2 GAIN17 GAIN9 GAIN1 GAIN16 GAIN8 LSB GAIN0
GAIN<23:0>: Gain-calibration bits. The data format is unsigned binary with 23 bits to the right of the decimal point and scales the ADC output before being written to the DATA register. The gain calibration allows full-scale errors between -VREF/2 and +VREF/2 to be corrected in unipolar mode, and full-scale errors between (+50% x VREF) and (+200% x VREF) in unipolar or bipolar mode. The MAX11359A can perform system gain calibration or self gain calibration. Self-calibration performs a
calibration for offsets in the ADC, and system calibration performs a calibration for the entire signal path. See the ADC Calibration section for more details. The ADC input voltage range specifications must always be obeyed, and the GAIN CAL register effectively scales the ADC digital output to a full-scale value determined by the calibration. The usable gain-calibration range is limited to less than the full GAIN CAL register digitalscaling range by the internal noise of the ADC.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
DACA_OP Register (Power-On State: 000X XX00 0000 0000)
MSB DAE DACA7 OP2E DACA6 OP1E DACA5 X DACA4 X DACA3 X DACA2 DACA9 DACA1 DACA8 LSB DACA0
MAX11359A
DACA_OP Register Writing to the DACA_OP output register updates DACA on the rising SCLK edge of the LSB data bit. The output voltage can be calculated as follows: VOUTA = VREF x N/210 where: VREF is the reference voltage for the DAC. N is the integer value of the DACA<9:0> output register. The output buffer is in unity gain. The DACA data is 10 bits long and right justified.
DAE: DACA enable bit. Set DAE = 1 to power up the DACA and the DACA output buffer in the MAX11359A. OP2E: OP2 power-enable bit. Set OP2E = 1 to power up OP2 in the MAX11359A. OP1E: OP1 power-enable bit. Set OP1E = 1 to power up OP1 in the MAX11359A. This bit is mirrored in the DACB_OP register. DACA<9:0>: DACA data bits.
REF_SDC Register (Power-On State: 0000 0000)
MSB REFV1 REFV0 AOFF AON SDCE TSEL2 TSEL1 LSB TSEL0
The REF_SDC register contains bits to control the reference voltage and signal-detect comparator. REFV<1:0>: Reference buffer voltage gain and enable bits. Enables the output buffer, sets the gain and the voltage at the REF pin as shown in Table 10. Power-on state is off to enable an external reference to drive the REF pin without contention. AOFF: ADC and DAC/op-amp power-off bit. This bit provides a method for turning off several analog functions with a single write. Setting AOFF = 1 deasserts the ADCE in the ADC register and DAE/OP3E, OP2E, and OP1E bits in the DACA_OP register, powering down these analog blocks. Setting AOFF = 0 has no effect. The AON bit has priority when both AON and AOFF bits are asserted.
Most of the analog functions can be disabled with a single write to the REF_SDC register by using AOFF, REFV<1:0>, and SDCE.
Table 10. Setting the Reference Output Voltage
REFERENCE BUFFER GAIN (V/V) REF OUTPUT VOLTAGE (V) Off (High Impedance at REF) 1.251 1.996 2.422 REFV1 REFV0
Disabled 1.0 1.638 2.0
0 0 1 1
0 1 0 1
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
AON: ADC and DAC/op-amp power-on bit. This bit provides a method of turning on several analog functions with a single write. Setting AON = 1 asserts the ADCE bit in the ADC register and DAE/OP3E, OP2E, and OP1E bits in the DACA_OP register, powering up these blocks. Setting AON = 0 has no effect. The AON bit has priority when both AON and AOFF bits are asserted. Most of the analog functions can be enabled with a single write to the REF_SDC register using AON, REFV<1:0>, and SDCE. SDCE: Signal-detect comparator power-enable bit. Set SDCE = 1 to power up the signal-detect comparator, and set SDCE = 0 to power down the signal-detect comparator. The ADCE bit in the ADC register must be set to 1 to use the signal-detect comparator. TSEL<2:0>: Threshold-select bits. These bits select the threshold for the signal-detect comparator as shown in Table 11.
Table 11. Setting the Signal-Detect Comparator Threshold
NOMINAL THRESHOLD (mV) 0 50 100 150 200 TSEL2 0 1 1 1 1 TSEL1 X 0 0 1 1 TSEL0 X 0 1 0 1
X = Don't care.
AL_DAY Register (Power-On State: 0000 0000 0000 0000 0000 XXXX)
MSB ASEC19 ASEC11 ASEC3 ASEC18 ASEC10 ASEC2 ASEC17 ASEC9 ASEC1 ASEC16 ASEC8 ASEC0 ASEC15 ASEC7 X ASEC14 ASEC6 X ASEC13 ASEC5 X ASEC12 ASEC4 LSB X
The AL_DAY register stores the second information of the time-of-day alarm. ASEC<19:0>: Alarm-second bits. These 20 bits store the time-of-day alarm, which corresponds to the lower 20 bits of the RTC second counter or SEC<19:0>. Program the time-of-day alarm trigger between 1s to just over 12 days beyond the current RTC second counter value in increments of 1s. Assert the AWE bit in the CLK_CTRL register (see the CLK_CTRL Register section) to enable writing to the AL_DAY register. Enabling the time-of-day alarm requires two writes to the CLK_CTRL register. Write the 20 alarmsecond bits in 3 bytes, MSB first. If CS is raised before the LSB is written, the alarm write is aborted, and the existing value remains. When the lower 20 bits in the RTC
second counter match the contents of this register, the alarm triggers and asserts ALD in the STATUS register. It also asserts an interrupt on the INT pin unless masked by the MALD bit in the IMSK register. The part enters normal mode if an alarm triggers while in sleep mode. The timeof-day alarm is intended to trigger single events. Therefore, once it triggers, in the CLK_CTRL register, the ADE bit is automatically cleared, disabling the time-ofday alarm. Implement a recurring alarm with repeated software writes over the serial interface each time the time-of-day alarm triggers. The time-of-day alarm can also be programmed to output at the UPIO pins. When configured this way the MALD bit does not mask the UPIO alarm output.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
CLK_CTRL Register (Power-On State: 00X0 1111 0010 1110)
MSB AWE CKSEL2 ADE CKSEL1 X CKSEL0 RWE IO32E RTCE CK32E OSCE CLKE FLLE INTP HFCE LSB WDE
MAX11359A
The CLK_CTR register contains the control bits for the RTC alarms and clocks. AWE: Alarm write-enable bit. Set AWE = 1 to write data to the AL_DAY register as well as the ADE bit in this register. When AWE = 0, all writes are prevented to the AL_DAY register and the ADE bit in this register. A second write to this register is required to change the value of the ADE bit. The power-on default state is 0. ADE: Alarm (time-of-day) enable bit. Set ADE = 1 to enable the time-of-day alarm, and set ADE = 0 to disable the time-of-day alarm. When enabled, the ALD bit in the STATUS register asserts when the RTC second counter time matches AL_DAY register. The device wakes up from sleep to normal mode if not already awake. The ADE bit can only be written if the AWE = 1 from a previous write. The power-on default state is 0. RWE: RTC write-enable bit. Set RWE = 1 prior to writing to the RTC register and the RTCE bit in this register. If RWE = 0, all writes are prevented to the RTC register as well as the RTCE bit in this register. The RWE signal takes effect after the rising edge of the 16th clock;
therefore, a second write to this register is required to change the value of the RTCE bit. The power-on default state is 0. RTCE: Real-time-clock enable bit. Set RTCE = 1 to enable the RTC, and set RTCE = 0 to disable the RTC. The RTC has a 32-bit second and an 8-bit subsecond counter. The power-on default state is 1. OSCE: 32kHz crystal-oscillator enable bit. Set OSCE = 1 to power up the 32kHz oscillator, and set OSCE = 0 to power down the oscillator. The power-on default state is 1. FLLE: Frequency-locked-loop enable bit. Set FLLE = 1 to enable the FLL, and set FLLE = 0 to disable the FLL. If HFCE = 1 and FLLE = 0, the internal high-frequency oscillator is enabled, but it is not frequency-locked to the 32kHz clock. When FLLE is asserted, it typically takes 3.5ms for the high-frequency clock to settle to within 1% of the 32kHz reference clock frequency. Switching the FLL on or off with this bit does not cause high-frequency clock glitching. The power-on default state is 1.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
HFCE: High-frequency-clock enable bit. Set HFCE = 1 to enable the internal high-frequency clock source, and set HFCE = 0 to disable the high-frequency clock source. If HFCE = 1 and CLKE = 1, the internal high-frequency oscillator is enabled and is present at CLK. The poweron default state is 1. CKSEL<2:0>: Clock selection bits. These bits select the FLL-based output clock frequency at the high-frequency CLK pin as shown in Table 12. The power-on default state is 001. IO32E: Input/output 32kHz clock select bit. Set IO32E = 0 to configure the CLK32K pin as an output, and set IO32E = 1 to configure the CLK32K pin as an input, regardless of the signal on the 32KIN pin as shown in Table 13. External clock frequencies applied to CLK32K are clock sources to the FLL, charge pump, and the signaldetect comparator. The default power-on state is 0. CK32E: CLK32K output-buffer enable bit. Set CK32E = 1 to enable the CLK32K output buffer as long as OSCE = 1 and IO32E = 0; otherwise the CK32E bit will not be asserted. Set CK32E = 0 to disable the CLK32K output buffer. The power-on default state is 1. CLKE: CLK output-buffer enable bit. Set CLKE = 1 to enable the CLK output buffer. Set CLKE = 0 to disable the buffer. Disabling the buffer is useful for saving
MAX11359A
power in cases where the high-frequency clock is used internally but is not needed externally. If HFCE = 0, or if CLKE = 0, CLK remains low. The power-on default state is 1. INTP: Interrupt pin polarity bit. Set INTP = 1 to make INT an active-high output when asserted, and set INTP = 0 to make INT an active-low output when asserted. The power-on default state is 1. WDE: Watchdog-enable bit. Set WDE = 1 to enable the watchdog timer, which asserts RESET low within 500ms if the WATCHDOG register is not written. Set WDE = 0 to disable the watchdog timer. The power-on default state is 0.
Table 12. Setting the CLK Frequency
CLOCK FREQUENCY (kHz) 4915.2 2457.6 1228.8 614.4 32.768 16.384 8.192 4.096 CKSEL2 0 0 0 0 1 1 1 1 CKSEL1 0 0 1 1 0 0 1 1 CKSEL0 0 1 0 1 0 1 0 1
Table 13. Configuring the CLK32K as an Input or Output
CLK32K Output Input CLK32K 1 0 IO32E 0 1 32KIN, 32KOUT XTAL attached XTAL attached RTC, PWM, WDT CLOCK SOURCE XTAL XTAL FLL, C/P, SDC INPUT SOURCE XTAL CLK32K ADC CLOCK SOURCE FLL/HFCLK FLL/HFCLK
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
RTC Register (Power-On State: 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000)
MSB SEC31 SEC23 SEC15 SEC7 SUB7 SEC30 SEC22 SEC14 SEC6 SUB6 SEC29 SEC21 SEC13 SEC5 SUB5 SEC28 SEC20 SEC12 SEC4 SUB4 SEC27 SEC19 SEC11 SEC3 SUB3 SEC26 SEC18 SEC10 SEC2 SUB2 SEC25 SEC17 SEC9 SEC1 SUB1 SEC24 SEC16 SEC8 SEC0 LSB SUB0
MAX11359A
The RTC register stores the 40-bit second and subsecond count of the respective time-of-day and system clocks. SEC<31:0>: The second bits store the time-of-day clock settings. It is a 32-bit binary counter with 1s resolution that can keep time for a span of over 136 years. Firmware in the C can translate this time count to units that are meaningful to the system (i.e., translate to calendar time or as an elapsed time from some predefined time = 0, such as January 1, 2000). The RTC runs continuously as long as RTCE = 1 (see the CLK_CNTL Register section) and does not stop for reads or writes. The counter increments when the subsecond counter overflows. Set RWE = 1 to enable writing to the RTC register. After writing to RWE, perform another write and set RTCE = 1 to enable the RTC. A 40-bit burst write operation, starting with SEC31 and finishing with SUB0 is required to set the RTC second and subsecond bits. If CS is brought high before the 40th rising SCLK edge, the write is aborted and the RTC contents are unchanged. The RTC register is loaded on the rising SCLK edge of the 40th bit (SUB0). A 40-bit burst read operation, starting with SEC31 and finishing with SUB0, is required to retrieve the current RTC second and subsecond counts. The read command can be aborted prior to receiving the 40th bit (SUB0) by raising CS and any RTC data read to that point is valid. When the read command is received, a snapshot of a valid RTC second count is latched to avoid reading an erroneous, transitioning RTC value. Due to the asynchronous nature of RTC reads, it is possible to have a maximum 1s error between the actual and reported times from the time-of-day clock. To prevent the data from changing during a read operation, complete reads
of the RTC register in less than 1ms. The power-on default state is 0000 0000 hex. SUB<7:0>: The subsecond bits store the system clock. This 8-bit binary counter has 3.9ms resolution (1/256Hz) and a span of 1s. The subsecond counter increments in single counts from 00 hex to FF hex before rolling over again to 00 hex, at which time the RTC second counter (SEC<31:0>) increments. The RTC runs continuously (as long as RTCE = 1) and does not stop for reads or writes. A 256Hz clock, derived from the 32kHz crystal, increments this counter. Set the RWE = 1 bit to enable writing to the RTC register. After writing to RWE, perform another write, setting RTCE = 1, to enable the RTC. A 40-bit burst write operation, starting with SEC31 and finishing with SUB0, is required to set the RTC second and subsecond bits. If CS is brought high before the 40th rising SCLK edge, the write is aborted and the RTC contents are unchanged. The RTC register is loaded on the rising SCLK edge of the 40th bit (SUB0). A 40-bit burst read operation, starting with SEC31 and finishing with SUB0, is required to retrieve the current RTC second and subsecond counts. The read command can be aborted prior to receiving the 40th bit (SUB0) by raising CS, and any RTC data read to that point is valid. When the read command is received, a snapshot of a valid RTC second count is latched to avoid reading an erroneous, transitioning RTC value. Due to the asynchronous nature of RTC reads, it is possible to have a maximum 1s error between the actual and reported times from the time-of-day clock. To prevent the data from changing during a read operation, complete reads of the RTC registers occur in less than 1ms. The poweron default state is 00 hex.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
PWM_CTRL Register (Power-On State: 0000 0000 00XX XXXX)
MSB PWME SPD1 FSEL2 SPD2 FSEL1 X FSEL0 X SWAH X SWAL X X X X LSB X
The PWM_CTRL register contains control bits for the 8bit PWM. PWME: PWM-enable bit. Set PWME = 1 to enable the internal PWM, and set PWME = 0 to disable the internal PWM. Enable the high-frequency clock before enabling the PWM when using input clock frequencies above 32.768kHz. The power-on default state is 0. FSEL<2:0>: Frequency selection bits. Selects the PWM input clock frequency as shown in Table 14. The power-on default is 000.
SWAH: SWA-switch PWM-high control bit. Set SWAH = 1 to enable the PWM output to directly control the SWA switch. When SWAH = SWAL, the PWM output is disabled from controlling the SWA switch. When SWAH = 1, a PWM high output closes the SWA switch and a PWM low output opens the SWA switch. The PWM high output refers to the beginning of the period when the output is logic-high. See Table 17 for more details. The power-on default is 0. SWAL: SWA-switch PWM-low control bit. Set SWAL = 1 to enable the inverted PWM output to directly control the SWA switch. When SWAH = SWAL, the PWM output is disabled from controlling the SWA switch. When SWAL = 1, a PWM low output closes the SWA switch and a PWM high output opens the SWA switch. The PWM low output refers to the end of the period when the output is logic-low. See Table 17 for more details. The power-on default is 0. SPD1: SPDT1-switch PWM drive control bit. Set SPD1 = 1 to enable the PWM output to directly control the SPDT1 switch, and set SPD1 = 0 to disable the PWM output controlling the SPDT1 switch. The SPDT1<1:0> bits, the UPIO pins (if programmed), and the PWM output (if enabled), determine the SPDT1-switch state. See Table 18 for more details. The power-on default is 0. SPD2: SPDT2-switch PWM drive control bit. Set SPD2 = 1 to enable the PWM output to directly control the SPDT2 switch, and set SPD2 = 0 to disable the PWM output controlling the SPDT2 switch. The SPDT2<1:0> bits, the UPIO pins (if programmed), and the PWM output (if enabled), determine the SPDT2-switch state. See Table 19 for more details. The power-on default is 0.
Table 14. Setting the PWM Frequency
PWM INPUT FREQUENCY* FSEL2 FSEL1 FSEL0 (kHz) 4915.2** 0 0 0 2457.6** 0 0 1 1228.8** 0 1 0 32.768 0 1 1 8.192 1 0 0 1.024 1 0 1 0.256 1 1 0 0.032 1 1 1 *The lower PWM frequencies are useful for power-supply duty cycling to conserve battery life and enable a single-battery cellpowered system. The higher frequencies allow reasonably small, external components for RC filtering when used as a DAC for bias adjustments. **When the part is in sleep mode, the HFCK is shut down. In this case, PWM frequencies above 32kHz are not available (see SPWME in the SLEEP_CFG Register section).
44
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
PWM_THTP Register (Power-On State: 0000 0000 0000 0000)
MSB PWMTH7 PWMTP7 PWMTH6 PWMTP6 PWMTH5 PWMTP5 PWMTH4 PWMTP4 PWMTH3 PWMTP3 PWMTH2 PWMTP2 PWMTH1 PWMTP1 PWMTH0 LSB PWMTP0
MAX11359A
The PWM_THTP register contains the bits that set the PWM on-time and period. PWMTH<7:0>: PWM time high bits. These bits define the PWM on (or high) time and when combined with the PWMTP<7:0> bits, they determine the duty cycle and period. The on-time duty cycle is defined as: (PWMTH<7:0> + 1)/(PWMTP<7:0> + 1) To get 50% duty cycle, set PWMTH<7:0> to 127 decimal and PWMTP<7:0> to 255 decimal. A 100% duty cycle (i.e., always on) is possible with a value of PWMTH<7:0> PWMTP<7:0> > 0. A 0% duty cycle is possible by setting PWMTH<7:0> = 0 or PWME = 0 in the PWM_CTRL register. If the PWM is selected to drive the UPIO_ pin(s), the ALH_ bit(s) (UPIO_CTRL register) determine the on-time polarity at the beginning of the PWM cycle. If ALH_ = 1, the on-time at the start of the PWM period causes a logic-high level (DV DD or CPOUT) at the UPIO_ pin. When ALH_ = 0, it causes a logic-low level (DGND) during the on-time. When the PWM output drives the SWA/B switches, the SWA(B)H or SWA(B)L bits in the PWM_CTRL register determine which PWM phase closes these switches. The SPDT1 and SPDT2 switches do not have PWM polarity inversion bits (see the SPDT1<1:0> and SPDT2<1:0> bit descriptions in the SW_CTRL Register section), but their effective polarity is set by how the switches are connected externally. The power-on default is 00 hex. PWMTP<7:0>: PWM time period bits. These bits control the PWM output period defined. The PWM output period is defined as: (PWMTP<7:0> + 1)/(PWM input frequency) Set the PWM input frequency by selecting the FSEL<2:0> bits as described in Table 14. The poweron default is 00 hex.
WATCHDOG Register (Power-On State: N/A) Writing to the WATCHDOG register address sets the watchdog timer to 0ms. If the watchdog is enabled (WDE = 1) and the WATCHDOG register is not written to before the 750ms expiration, RESET asserts low for 250ms and the watchdog timer restarts at 0ms when the watchdog timer is enabled. There are no data bits for this register, and the watchdog timer is reset on the rising edge of SCLK during the ADR0 bit in the WATCHDOG register address control byte. Figure 17 shows an example of watchdog timing. NORM_MD Register (Power-On State: N/A) Exit sleep mode and enter normal mode by writing to the NORM_MD register. The specific normal-mode state of all circuit blocks is set by the user, who must configure the individual power-enable bits before entering sleep mode (Table 15). There are no data bits for this register, and normal mode begins on the rising edge of SCLK during the ADR0 bit in the NORM_MD register address control byte. SLEEP Register (Power-On State: N/A) Enter sleep mode by writing to the SLEEP register. This low-power state overrides most of the normal powercontrol bits. Table 15 shows which functions are off, which functions are unaffected (ADE, RTCE, LSDE, and HYSE), and which functions are controlled by special sleep-mode bits (SOSCE, SCK32E, and SPWME) while in sleep mode. There are no data bits for this register, and sleep mode begins on the rising edge of SCLK during the ADR0 bit in the SLEEP register address control byte.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Table 15. Normal-Mode and Sleep-Register Summary
REGISTER NAME ADC DACA_OP CIRCUIT BLOCK DESCRIPTION ADC DACA/OP3 OP1 Reference Buffer Gain and Enable Signal-Detect Comparator Time-of-Day Alarm Enable RTC POR DEFAULT ADCE = 0 DAE/OP3E = 0 OP1E = 0 REFV<1:0> = 00 SDCE = 0 ADE = 0 RTCE = 1 NORMAL MODE ADCE DAE/OP3E OP1E REFV<1:0> SDCE ADE RTCE SLEEP Off Off Off Off Off ADE RTCE
REF_SDC
CK32 Xtal Oscillator CLK_CTRL CK32 Output Buffer High-Frequency Clock High-Frequency Clock Output Buffer FLL Enable Watchdog Timer PWM_CTRL PWM Linear Regulator Charge-Pump Doubler CPOUT Voltage Monitor 1.8V DVDD Monitor 1.8V Monitor Hysteresis Temperature Sense Source UPIO_ Function UPIO_ Pullup UPIO_ Supply Voltage UPIO_ Assertion Level
OSCE = 1
OSCE
SOSCE
CK32E = 1 HFCE = 1 CLKE = 1 FLLE = 1 WDE = 0 PWME = 0 LDOE = 0 CPE = 0 CPDE = 0 LSDE = 1 HYSE = 0 IMUX<1:0> = 00 UP_MD<3:0> = 0 hex PUP_ = 1 SV_ = 0 ALH_ = 0
CK32E HFCE CLKE FLLE WDE PWME LDOE CPE CPDE LSDE HYSE IMUX<1:0> UP_MD<3:0> PUP_ SV_ ALH_
SCK32E Off Off Off Off SPWME Off Off Off LSDE HYSE Off UP_MD<3:0> PUP_ SV_ ALH_
PS_VMONS
TEMP_CTRL
UPIO_CTRL
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
SLEEP_CFG Register (Power-On State: 1100 XXXX)
MSB SLP (ADR0) SOSCE SCK32E SPWME SHDN X X X LSB X
MAX11359A
The SLEEP_CFG register allows users to program specific behavior for the 32kHz oscillator, buffer, and PWM in sleep mode. It also contains a sleep-control bit (SLP) to enable sleep mode. SLP (ADR0): Sleep bit. The SLP bit is the LSB in the SLEEP_CFG address control byte. Set SLP = 1 to assert the SHDN bit and enter sleep mode. Writing the register with SLP = 0 or reading with SLP = 0 or SLP = 1 has no effect on the SHDN bit. SOSCE: Sleep-mode 32kHz crystal oscillator enable bit. SOSCE = 1 enables the 32kHz oscillator in sleep mode, and SOSCE = 0 disables it in sleep mode, regardless of the state of the OSCE bit. The power-on default is 1. SCK32E: Sleep-mode CK32K-pin output-buffer enable bit. SCK32E = 1 enables the 32kHz output buffer in sleep mode, and SCK32E = 0 disables it in sleep mode, regardless of the state of the CK32E bit. The power-on default is 1.
SPWME: Sleep-mode PWM enable bit. SPWME = 1 enables the internal PWM in sleep mode, and SPWME = 0 disables it in sleep mode, regardless of the state of the PWME bit. Input frequencies are limited to 32.768kHz or lower since the high-frequency clock is disabled in sleep mode. SOSCE must be asserted to have 32kHz available as an input to the PWM. The power-on default is 0. SHDN: Shutdown bit. This bit is read only. SHDN is asserted by writing to the SLEEP register address or by writing to the SLEEP_CFG register with SLP = 1. When SHDN is asserted, the device is in sleep mode even if the SLEEP or SLEEP function on the UPIO is deasserted. The SHDN bit is deasserted by writing to the NORM_MD register or by other defined events. Events that cause SHDN to be deasserted are a day alarm or an edge on the UPIO wake-up pin causing wake-up to be asserted. The power-on default is 0.
RESET
D 32K WDE DIVIDEBY-8192 4Hz CK R
Q
D
Q
Q
CK R
Q
POR WDW
WATCHDOG TIMER
750ms 4Hz CLOCK 2-BIT COUNTER SPI WRITES RESET WDE = 1 WATCHDOG ADDRESS WATCHDOG ADDRESS 250ms WATCHDOG ADDRESS X 0 1 2 0 1 0 1 2 3 0 1 2 0
Figure 17. Watchdog Timer Architecture
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
UPIO4_CTRL Register (Power-On State: 0000 1000)
MSB UP4MD3 UP4MD2 UP4MD1 UP4MD0 PUP4 SV4 ALH4 LSB LL4
UPIO4_CTRL register. This register configures the UPIO4 pin functionality. UP4MD<3:0>: UPIO4-mode selection bits. These bits configure the mode for the UPIO4 pin. See Table 16 for a detailed description. The power-on default is 0 hex. PUP4: Pullup UPIO4 control bit. Set PUP4 = 1 to enable a weak pullup resistor on the UPIO4 pin, and set PUP4 = 0 to disable it. The pullup resistor is connected to either DVDD or CPOUT as programmed by the SV4 bit. The pullup is enabled only when UPIO4 is configured as an input. Open-drain behavior can be simulated at UPIO4 by setting the mode to GPO with LL4 = 0 and by changing the mode to GPI with PUP4 = 0, allowing external high pullup. The power-on default is 1. SV4: Supply-voltage UPIO4 selection bit. Set SV4 = 0 to select DVDD as the supply voltage for the UPIO4 pin, and set SV4 = 1 to select CPOUT as the supply voltage. The selected supply voltage applies to all modes for the UPIO4 pin. The power-on default is 0.
ALH4: Active logic-level assertion high UPIO4 bit. Set ALH4 = 0 to define the input or output assertion level for UPIO4 as low except when in GPI and GPO modes. Set ALH4 = 1 to define the input or output assertion level as high. For example, asserting ALH4 defines the UPIO4 output signal as ALARM, while deasserting ALH4 defines it as ALARM. Similarly, asserting ALH4 defines the UPIO4 input signal as WU, while deasserting ALH4 defines it as WU. The power-on default is 0. LL4: Logic-level UPIO4 bit. When UPIO4 is configured as GPO, LL4 = 0 sets the output to a logic-low and LL4 = 1 sets the output to a logic-high. A read of LL4 returns the voltage level at the UPIO4 pin at the time of the read, regardless of how it is programmed. The power-on default is 0.
UPIO3_CTRL Register (Power-On State: 0000 1000)
MSB UP3MD3 UP3MD2 UP3MD1 UP3MD0 PUP3 SV3 ALH3 LSB LL3
UPIO3_CTRL register. This register configures the UPIO3 pin functionality. UP3MD<3:0>: UPIO3-mode selection bits. These bits configure the mode for the UPIO3 pin. See Table 16 for a detailed description. The power-on default is 0 hex. PUP3: Pullup UPIO3 control bit. Set PUP3 = 1 to enable a weak pullup resistor on the UPIO3 pin, and set PUP3 = 0 to disable it. The pullup resistor is connected to either DVDD or CPOUT as programmed by the SV3 bit. The pullup is enabled only when UPIO3 is configured as an input. Open-drain behavior can be simulated at UPIO3 by setting the mode to GPO with LL3 = 0 and by changing the mode to GPI with PUP3 = 0, allowing external high pullup. The power-on default is 1. SV3: Supply-voltage UPIO3 selection bit. Set SV3 = 0 to select DVDD as the supply voltage for the UPIO3 pin, and set SV3 = 1 to select CPOUT as the supply voltage. The selected supply voltage applies to all modes for the UPIO3 pin. The power-on default is 0.
48
ALH3: Active logic-level assertion high UPIO3 bit. Set ALH3 = 0 to define the input or output assertion level for UPIO3 as low except when in GPI and GPO modes. Set ALH3 = 1 to define the input or output assertion level as high. For example, asserting ALH3 defines the UPIO3 output signal as ALARM, while deasserting ALH3 defines it as ALARM. Similarly, asserting ALH3 defines the UPIO3 input signal as WU, while deasserting ALH3 defines it as WU. The power-on default is 0. LL3: Logic-level UPIO3 bit. When UPIO3 is configured as GPO, LL3 = 0 sets the output to a logic-low and LL3 = 1 sets the output to a logic-high. A read of LL3 returns the voltage level at the UPIO3 pin at the time of the read, regardless of how it is programmed. The power-on default is 0.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
UPIO2_CTRL Register (Power-On State: 0000 1000)
MSB UP2MD3 UP2MD2 UP2MD1 UP2MD0 PUP2 SV2 ALH2 LSB LL2
MAX11359A
UPIO2_CTRL register. This register configures the UPIO2 pin functionality. UP2MD<3:0>: UPIO2-mode selection bits. These bits configure the mode for the UPIO2 pin. See Table 16 for a detailed description. The power-on default is 0 hex. PUP2: Pullup UPIO2 control bit. Set PUP2 = 1 to enable a weak pullup resistor on the UPIO2 pin, and set PUP2 = 0 to disable it. The pullup resistor is connected to either DVDD or CPOUT as programmed by the SV2 bit. The pullup is enabled only when UPIO2 is configured as an input. Open-drain behavior can be simulated at UPIO2 by setting the mode to GPO with LL2 = 0 and by changing the mode to GPI with PUP2 = 0, allowing external high pullup. The power-on default is 1. SV2: Supply-voltage UPIO2 selection bit. Set SV2 = 0 to select DVDD as the supply voltage for the UPIO2 pin, and set SV2 = 1 to select CPOUT as the supply voltage. The selected supply voltage applies to all modes for the UPIO2 pin. The power-on default is 0.
ALH2: Active logic-level assertion high UPIO2 bit. Set ALH2 = 0 to define the input or output assertion level for UPIO2 as low except when in GPI and GPO modes. Set ALH2 = 1 to define the input or output assertion level as high. For example, asserting ALH2 defines the UPIO2 output signal as ALARM, while deasserting ALH2 defines it as ALARM. Similarly, asserting ALH2 defines the UPIO2 input signal as WU, while deasserting ALH2 defines it as WU. The power-on default is 0. LL2: Logic-level UPIO2 bit. When UPIO2 is configured as GPO, LL2 = 0 sets the output to a logic-low and LL2 = 1 sets the output to a logic-high. A read of LL2 returns the voltage level at the UPIO2 pin at the time of the read, regardless of how it is programmed. The power-on default is 0.
UPIO1_CTRL Register (Power-On State: 0000 1000)
MSB UP1MD3 UP1MD2 UP1MD1 UP1MD0 PUP1 SV1 ALH1 LSB LL1
UPIO1_CTRL register. This register configures the UPIO1 pin functionality. UP1MD<3:0>: UPIO1-mode selection bits. These bits configure the mode for the UPIO1 pin. See Table 16 for a detailed description. The power-on default is 0 hex. PUP1: Pullup UPIO1 control bit. Set PUP1 = 1 to enable a weak pullup resistor on the UPIO1 pin, and set PUP1 = 0 to disable it. The pullup resistor is connected to either DVDD or CPOUT as programmed by the SV1 bit. The pullup is enabled only when UPIO1 is configured as an input. Open-drain behavior can be simulated at UPIO1 by setting the mode to GPO with LL1 = 0 and by changing the mode to GPI with PUP1 = 0, allowing external high pullup. The power-on default is 1. SV1: Supply-voltage UPIO1 selection bit. Set SV1 = 0 to select DVDD as the supply voltage for the UPIO1 pin, and set SV1 = 1 to select CPOUT as the supply voltage. The selected supply voltage applies to all modes for the UPIO1 pin. The power-on default is 0.
ALH1: Active logic-level assertion high UPIO1 bit. Set ALH1 = 0 to define the input or output assertion level for UPIO1 as low except when in GPI and GPO modes. Set ALH1 = 1 to define the input or output assertion level as high. For example, asserting ALH1 defines the UPIO1 output signal as ALARM, while deasserting ALH1 defines it as ALARM. Similarly, asserting ALH1 defines the UPIO1 input signal as WU, while deasserting ALH1 defines it as WU. The power-on default is 0. LL1: Logic-level UPIO1 bit. When UPIO1 is configured as GPO, LL1 = 0 sets the output to a logic-low and LL1 = 1 sets the output to a logic-high. A read of LL1 returns the voltage level at the UPIO1 pin at the time of the read, regardless of how it is programmed. The power-on default is 0.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Table 16. UPIO Mode Configuration
UP4MD<3:0>, UP3MD<3:0>, UP2MD<3:0>, UP1MD<3:0> 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 1 0 0 0 1 0 1 0 1 MODE MAX11359A GPI GPO SWA or SWA Reserved SPDT1 or SPDT1 SPDT2 or SPDT2 SLEEP or SLEEP WU or WU Reserved DESCRIPTION General-purpose digital input. Active edges detected by UPR_ or UPF_ status register bits. ALH_ has no effect with this setting. General-purpose digital output. Logic level set by LL_ bit. ALH_ has no effect with this setting. Digital input. DAC A buffer switch control. See the SWA bit description in the SW_CTRL Register section. Reserved. Do not use these settings. Digital input. SPDT1 switch control. See the SPDT1<1:0> bit description in the SW_CTRL Register section. Digital input. SPDT2 switch control. See the SPDT2<1:0> bit description in the SW_CTRL Register section. Sleep-mode digital input. Overrides power-control register and puts the part into sleep mode when asserted. When deasserted, power mode is determined by the SHDN bit. Wake-up digital input. Asserted edge clears SHDN bit. Reserved. Do not use these settings.
0 0 1 1 1 1
1 1 0 0 0 0
1 1 0 0 1 1
0 1 0 1 0 1
PWM or PWM
PWM digital output. Signal defined by the PWM_CTRL register. PWM on (or high or "1"); assertion level defined by the ALH_ bit. When PWM is disabled (PWME = 0), the UPIO pin idles high (DVDD or CPOUT) if ALH = 1, and low (DGND) if ALH = 0. Power-supply shutdown digital output. Equivalent to SHDN bit. Power-on default of GPI with pullup ensures initial power-supply turn-on when UPIO is connected to a power supply with a SHDN input. RTC alarm digital output. Asserts for time-of-day alarm events; equivalent to ALD in STATUS register. Reserved. Do not use these settings.
1
1
0
0
SHDN or SHDN AL_DAY or AL_DAY Reserved DRDY or DRDY
1 1 1
1 1 1
0 1 1
1 0 1
ADC data-ready digital output. Asserts when analog-to-digital conversion or calibration completes. Not masked by MADD bit. Note: When multiple UPIO inputs are configured for the same input function, the inputs are OR'ed together.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
UPIO_SPI Register (Power-On State: 0000 XXXX)
MSB UP4S UP3S UP2S UP1S X X X LSB X
MAX11359A
UPIO_SPI pass-through control register. These bits map the serial interface signals to the UPIO pins, allowing the DAS to drive other devices at CPOUT or DVDD voltage levels, depending on the SV_ bit setting found in the UPIO_CTRL register. Individual bits are provided to set only the desired UPIO inputs to the SPI passthrough mode. This mode becomes active when CS is driven high to complete the write to this register, and remains active as long as CS stays high (i.e., multiple pass-through writes are possible). The SPI passthrough mode is deactivated immediately when CS is pulled low for the next DAS write. The UPIO_ state (both before and after the SPI passthrough mode) is set by the UP_MD<3:0> and LL_ bits. When a UPIO is configured for SPI pass-through mode and the CS is high, UPR_, UPF_, and LL_ continue to detect UPIO_ edges, which can still generate interrupts. See Figure 18 for an SPI pass-through timing diagram.
UP4S: UPIO4 SPI pass-through-mode enable bit. A logic 1 maps the inverted CS signal to the UPIO4 pin. Therefore, UPIO4 is low (near DGND) when SPI passthrough mode is active, and is high (near DV DD or CPOUT) when the mode is inactive. A logic 0 disables the UPIO4 SPI pass-through mode. The power-on default is 0. UP3S: UPIO3 SPI pass-through-mode enable bit. A logic 1 maps the SCLK signal to UPIO3 (directly with no inversion), while a logic 0 disables the UPIO3 SPI passthrough mode. The power-on default is 0. UP2S: UPIO2 SPI pass-through-mode enable bit. A logic 1 maps the DIN signal to UPIO2 (directly with no inversion), while a logic 0 disables the UPIO2 SPI passthrough mode. The power-on default is 0. UP1S: UPIO1 SPI pass-through-mode enable bit. A logic 1 maps the UPIO1 input signal to DOUT (directly with no inversion), while a logic 0 disables the UPIO1 SPI pass-through mode. The power-on default is 0.
CS
WRITE TO DAS TO ENABLE SPI MODE
WRITE THROUGH DAS TO UPIO DEVICE
NORMAL WRITE TO DAS
SCLK
DIN
DN
DN-1 DN-2 DN-3
D3
D2
D1
D0
EN
EN-1
EN-2
EN-3
X
X
X
X
D7
D6
D5
D4
D3
D2
D1
D0
DOUT
E3
E2
E1
E0
UPIO4
SET BY UPIO4_CTRL REGISTER
SET BY UPIO4_CTRL REGISTER
UPIO3
SET BY UPIO3_CTRL REGISTER
SET BY UPIO3_CTRL REGISTER
UPIO2
SET BY UPIO2_CTRL REGISTER
EN
EN-1
EN-2
EN-3
X
X
X
X
SET BY UPIO2_CTRL REGISTER
UPIO1
SET BY UPIO1_CTRL REGISTER
E3
E2
E1
E0
SET BY UPIO1_CTRL REGISTER
Figure 18. SPI Pass-Through Timing Diagram
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
SW_CTRL Register (Power-On State: 0000 00XX)
MSB SWA X SPDT11 SPDT10 SPDT21 SPDT20 X LSB X
The switch-control register controls the two SPDT switches (SPDT1 and SPDT2) and the DACA output buffer SPST switch (SWA). Control this switch by the serial bits in this register, by any of the UPIO pins that are enabled for that function, or by the PWM. SWA: DACA output buffer SPST-switch A control bit. The SWA bit, the UPIO inputs (if configured), and the PWM (if configured) control the state of the SWA switch as shown in Table 17. The UPIO_ states of 0 and 1 in the table correspond to respective deasserted and asserted logic states as defined by the ALH_ bit of the UPIO_CTRL register. If a UPIO is not configured for this mode, its value applied to the table is 0. The PWM states of 0 and 1 in the table correspond to the respective PWM off (or low) and on (or high) states defined by the SWAH and SWAL bits (see the PWM_CTRL Register section). If the PWM is not configured for this mode, its value applied to the table is 0. The power-on default is 0. SPDT1<1:0>: Single-pole double-throw switch 1 control bits. The SPDT1<1:0> bits, the UPIO pins (if configured), and the PWM (if configured) control the state of the switch as shown in Table 18. The UPIO_ states of 0 and 1 in the table correspond to respective deasserted and asserted logic states as defined by the ALH_ bit of the UPIO_CTRL register. If a UPIO is not configured for this mode, its value applied to Table 18 is 0. The PWM states of 0 and 1 in Table 18 correspond to the respective PWM off (low) and on (high) states defined by the SPD1 bit in the PWM_CTRL register. If the PWM is not configured for this mode, its value applied to Table 18 is 0. The power-on default is 00. SPDT2<1:0>: Single-pole double-throw switch 2 control bits. The SPDT2<1:0> bits, the UPIO pins (if configured), and the PWM (if configured) control the state of the switch as shown in Table 19. The UPIO_ states of 0 and 1 in the table correspond to respective deasserted and asserted logic states as defined by the ALH_ bit in the UPIO_CTRL register. If a UPIO is not configured for this mode, its value applied to Table 19 is 0. The PWM states of 0 and 1 in Table 19 correspond to the respective PWM off (low) and on (high) states defined by the SPD2 bit in the PWM_CTRL register. If the PWM is not configured for this mode, its value applied to Table 19 is 0. The power-on default is 00.
Table 17. SWA States
SWA BIT* 0 X X 1 UPIO_* 0 X 1 X PWM* 0 1 X X SWA SWITCH STATE Switch open Switch closed Switch closed Switch closed
X = Don't care. *Switch SWA control is effectively an OR of the SWA bit, UPIO pins, and PWM.
Table 18. SPDT Switch 1 States
SPDT1<1:0> 0 0 0 0 1 1 1 1 0 X X 1 0 X X 1 UPIO_* PWM* SPDT1 SWITCH STATE 0 X 1 X 0 X 1 X 0 1 X X 0 1 X X SNO1 open, SNC1 open SNO1 closed, SNC1 closed SNO1 closed, SNC1 closed SNO1 closed, SNC1 closed SNC1 closed, SNO1 open SNC1 open, SNO1 closed SNC1 open, SNO1 closed SNC1 open, SNO1 closed
X = Don't care. *Switch SPDT1 control is effectively an OR of the SPDT10 bit, the UPIO pins, and the PWM output. The SPDT11 bit determines if the switches open and close together or if they toggle.
Table 19. SPDT Switch 2 States
SPDT2<1:0> UPIO_* PWM* SPDT2 SWITCH STATE 0 0 0 0 SNO2 open, SNC2 open 0 X X 1 SNO2 closed, SNC2 closed 0 X 1 X SNO2 closed, SNC2 closed 0 1 X X SNO2 closed, SNC2 closed 1 0 0 0 SNC2 closed, SNO2 open 1 X X 1 SNC2 open, SNO2 closed 1 X 1 X SNC2 open, SNO2 closed 1 1 X X SNC2 open, SNO2 closed X = Don't care. *Switch SPDT2 control is effectively an OR of the SPDT20 bit, the UPIO pins, and the PWM output. The SPDT21 bit determines if the switches open and close together or if they toggle.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
TEMP_CTRL Register (Power-On State: 0000 XXXX)
MSB IMUX1 IMUX0 IVAL1 IVAL0 X X X LSB X
MAX11359A
The temperature-sensor control register controls the internal and external temperature measurement. IMUX<1:0>: Internal current-source MUX bits. Selects the pin to be driven by the internal current sources as shown in Table 20. The power-on default is 00.
IVAL<1:0>: Internal current-source value bits. Selects the value of the internal current source as shown in Table 21. The power-on default is 00.
Table 20. Selecting Internal Current Source
CURRENT SOURCE Disabled Internal temperature sensor AIN1 AIN2 IMUX1 0 0 1 1 IMUX0 0 1 0 1
Table 21. Setting the Current Level
CURRENT I1 I2 I3 I4 TYPICAL CURRENT (A) 4 60 64 120 IVAL1 0 0 1 1 IVAL0 0 1 0 1
TEMP_CAL Register (Power-On State: Varies By Factory Calibration)
MSB TGAIN7 TOFFS5 TGAIN6 TOFFS4 TGAIN5 TOFFS3 TGAIN4 TOFFS2 TGAIN3 TOFFS1 TGAIN2 TOFFS0 TGAIN1 X TGAIN0 LSB X
This register is the internal temperature sensor calibration register. TGAIN<7:0>: Factory-preset temperature gain correction coefficient bits. This is the linear scaling factor used to derive absolute temperature values from temperature values measured with the internal temperature sensor (TACTUAL = TMEAS x TGAIN + TOFFS). The coefficients are optimized for an internal voltage reference of 1.25V using the four-current method. The power-on default varies.
TOFFS<5:0>: Factory-preset temperature offset correction coefficient bits. This is the linear offset factor used to derive absolute temperature values from temperature values measured with the internal temperature sensor (TACTUAL = TMEAS x TGAIN + TOFFS). The coefficients are optimized for an internal voltage reference of 1.25V using the four-current method. The power-on default varies.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
IMSK Register (Power-On State: 1111 011X 1111 1111)
MSB MLDVD MUPR4 MLCPD MUPR3 MADO MUPR2 MSDC MUPR1 MCRDY MUPF4 MADD MUPF3 MALD MUPF2 X LSB MUPF1
The IMSK register determines which bits of the STATUS register generate an interrupt on INT. The bits in this register do not mask output signals routed to UPIO since the output signals are masked by disabling that UPIO function. MLDVD: LDVD status bit mask. Set MLDVD = 0 to enable the LDVD status bit interrupt to INT, and set MLDVD = 1 to mask the LDVD status bit interrupt. The power-on default value is 1. MLCPD: LCP status bit mask. Set MLCPD = 0 to enable the LCP status bit interrupt to INT, and set MLCPD = 1 to mask the LCP status bit interrupt. The power-on default value is 1. MADO: ADO status bit mask. Set MADO = 0 to enable the ADO status bit interrupt to INT, and set MADO = 1 to mask the ADO status bit interrupt. The power-on default value is 1. MSDC: SDC status bit mask. Set MSDC = 0 to enable the SDC status bit interrupt to INT, and set MSDC = 1 to mask the SDC status bit interrupt. The power-on default value is 1. MCRDY: CRD status bit mask. Set MCRDY = 0 to enable the CRDY status bit interrupt to INT, and set
MCRDY = 1 to mask the CRDY status bit interrupt. The power-on default value is 0. MADD: ADD status bit mask. Set MADD = 0 to enable the ADD status bit interrupt to INT, and set MADD = 1 to mask the ADD status bit interrupt. The power-on default value is 1. MALD: ALD status bit mask. Set MALD = 0 to enable the ALD status bit interrupt to INT, and set MALD = 1 to mask the ALD status bit interrupt. The power-on default value is 1. MUPR<4:1>: UPR<4:1> status bits mask. Set MUPR_ = 0 to enable the UPR_ status bit interrupt to INT, and set MUPR_ = 1 to mask the UPR_ status bit interrupt. (_ = 1, 2, 3, or 4 and corresponds to the UPIO1, UPIO2, UPIO3, or UPIO4 pins, respectively.) The power-on default value is F hex. MUPF<4:1>: UPF<4:1> status bits mask. Set MUPF_ = 0 to enable the UPF_ status bit interrupt to INT, and set MUPF_ = 1 to mask the UPF_ status bit interrupt. (_ = 1, 2, 3, or 4 and corresponds to the UPIO1, UPIO2, UPIO3, or UPIO4 pins, respectively.) The power-on default value is F hex.
PS_VMONS Register (Power-On State: 0010 01XX)
MSB LDOE CPE LSDE CPDE HYSE RSTE X LSB X
This register is the power-supply and voltage monitors control register. LDOE: Low-dropout linear-regulator enable bit. Set LDOE = 1 to enable the low-dropout linear regulator to provide the internal source voltage for the charge pump. Set LDOE = 0 to disable the LDO, allowing an external drive to the charge-pump input through REG. The power-on default value is 0. CPE: Charge-pump enable bit. Set CPE = 1 to enable the charge-pump doubler, and set CPE = 0 to disable the charge-pump doubler. The power-on default value is 0. LSDE: DV DD low-supply voltage-detector powerenable bit. Set LSDE = 1 to enable the +1.8V (DVDD) low-supply-voltage detector, and set LSDE = 0 to
54
disable the DV DD low-supply-voltage detector. The power-on default value is 1. CPDE: CPOUT low-supply voltage-detector powerenable bit. Set CPDE = 1 to enable the +2.7V CPOUT low-supply voltage-detector comparator, and set CPDE = 0 to disable the CPOUT low-supply voltage-detector comparator. The power-on default value is 0. HYSE: DVDD low-supply voltage-detector hysteresisenable bit. Set HYSE = 1 to set the hysteresis for the +1.8V (DVDD) low-supply-voltage detector to +200mV, and set HYSE = 0 to set the hysteresis to +20mV. On initial power-up, the hysteresis is +20mV and can be programmed to 200mV once RESET goes high. Once programmed to +200mV, the DVDD falling threshold is +1.8V nominally and the rising threshold is +2.0V nominally. The
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
hysteresis helps eliminate chatter when running directly off unregulated batteries. If DVDD falls below +1.3V (typ), the power-on reset circuitry is enabled and the HYSE bit is deasserted setting the hysteresis back to +20mV. The power-on default is 0. RSTE: RESET output enable bit. Set RSTE = 1 to enable RESET to be controlled by the +1.8V DVDD lowsupply-voltage detector, and set RSTE = 0 to disable this control. The power-on default is 1.
MAX11359A
STATUS Register (Power-On State: 0000 000X 0000 0000)
MSB LDVD UPR4 LCPD UPR3 ADOU UPR2 SDC UPR1 CRDY UPF4 ADD UPF3 ALD UPF2 X LSB UPF1
The STATUS register contains the status bits of events in various system blocks. Any status bits not masked in the IMSK register cause an interrupt on INT. Some of the status bit setting events (GPI, WAKEUP, ALARM, DRDY) can be directed to UPIO_ to provide multiple C interrupt inputs. There are no specific mask bits for the UPIO interrupt signals since the bits are effectively masked by selecting a different function for UPIO. The STATUS bits always record the triggering event(s), even for masked bits, which do not generate an interrupt on INT. It is possible to set multiple STATUS bits during a single INT interrupt event. Clear all STATUS bits except for ADD and ADOU by reading the STATUS register. During a STATUS register read, INT deasserts when the first STATUS data bit (LDVD) reads out (9th rising SCLK) and remains deasserted until shortly after the last STATUS data bit (~15ns). At this point, INT reasserts if any STATUS bit is set during the STATUS register read. If the STATUS register is partially read (i.e., the read is aborted midway), none of the STATUS bits are cleared. New events occurring during a STATUS register read, or events that persist after reading the STATUS bits result in another interrupt immediately after the STATUS register read finishes. This is a read-only register. LDVD: Low DVDD voltage-detector status bit. LDVD = 1 indicates DVDD is below the +1.8V threshold; otherwise LDVD = 0. LDVD clears during the STATUS register read as long as the condition does not persist. Otherwise, the LDVD bit reasserts immediately. If the DVDD low voltage detector is disabled, LDVD = 0. The power-on default is 0. LCPD: Low CPOUT voltage-detector status bit. LCPD = 1 indicates CPOUT is below the +2.7V threshold; otherwise LCPD = 0. LCPD clears during the STATUS register read as long as the condition does not persist. Otherwise the LCPD bit reasserts immediately. LCPD = 0 when the CPOUT low voltage detector is disabled. The power-on default is 0.
ADOU: ADC overflow/underflow status bit. ADOU = 1 indicates an ADC underflow or overflow condition in the current ADC result. New conversions that are valid clear the ADOU bit. ADOU = 0 when the ADC data is valid or the ADC is disabled (ADCE = 0). An underflow condition occurs when the ADC data is theoretically less than 0000 hex in unipolar mode and less than 8000 hex in bipolar mode. An overflow condition occurs when the ADC data is theoretically greater than FFFF hex in unipolar mode and greater than 7FFF hex in bipolar mode. Use this bit to determine the validity of an ADC result at the maximum or minimum code values (i.e., 0000 hex or FFFF hex for unipolar mode and 8000 hex and 7FFF hex for bipolar mode). The power-on default is 0. Reading the STATUS register does not clear the ADOU bit. SDC: Signal-detect comparator status bit. When SDC = 1, the positive input to the signal-detect comparator exceeds the negative input plus the programmed threshold voltage. The SDC bit clears during the STATUS register read unless the condition remains true. The SDC bit also deasserts when the signal-detect comparator powers down (SDCE = 0). The power-on default is 0. CRDY: High-frequency-clock ready status bit. CRDY = 1 indicates a locked high-frequency clock to the 32kHz reference frequency by the FLL. The CRDY bit clears during the STATUS register read. This bit only asserts after power-up or after enabling the FLL using the FLLE bit. The power-on default is 0. ADD: ADC-done status bit. ADD = 1 indicates a completed ADC conversion or calibration. Clear the ADD bit by reading the appropriate ADC data, offset, or gain-calibration registers. The ADC status bit also clears when a new ADC result updates to the data or calibration registers (i.e., it follows the assertion level of the UPIO = DRDY signal). Reading the STATUS register does not clear this bit. This bit is equivalent to the DRDY signal available through UPIO_. The power-on default is 0.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
ALD: Alarm (day) status bit. ALD = 1 when the value programmed in ASEC<19:0> in the AL_DAY register matches SEC<19:0> in the RTC register. Clear the ALD bit by reading the STATUS register or by disabling the day alarm (ADE = 0). The power-on default is 0. UPR<4:1>: User-programmable I/O rising-edge status bits. UPR_ = 1 indicates a rising edge on the respective UPIO_ pin has occurred. Clear UPR_ by reading the STATUS register. Rising edges are detected independent of UPIO_ configuration, providing the ability to capture and record rising input (e.g., WU) or output (e.g., PWM) edge events on the UPIO_. Set the appropriate mask to determine if the edge will generate an interrupt on INT. If the UPIO_ is configured as an output, INT provides confirmation that an intended rising edge output occurred and has reached the desired DVDD or CPOUT level (i.e., was not loaded down externally). The power-on default is 0. UPF<4:1>: User-programmable I/O falling-edge status bit. UPF_ = 1 indicates a falling edge on the respective UPIO_ has occurred. Clear UPF_ by reading the STATUS register. Falling edges are detected independent of UPIO_ configuration, providing the ability to capture and record falling input (e.g., WU) or output (e.g., PWM) edge events on the UPIO_. Set the appropriate mask to determine if that edge should generate an interrupt on the INT pin. If the UPIO is configured as an output, INT provides confirmation that an intended falling edge output occurred at the pin and it reached the desired DGND level. The power-on default is 0.
MAX11359A
When placing passive components in front of the MAX11359A, ensure a low enough source impedance to prevent introducing gain errors to the system. This configuration significantly limits the amount of passive anti-aliasing filtering that can be applied in front of the MAX11359A. See Table 3 for acceptable source impedances.
Power-On Reset or Power-Up
After a power-on reset, the DVDD voltage supervisor is enabled and all UPIOs are configured as inputs with pullups enabled. The internal oscillators are enabled and are output at CLK and CLK32K once the DVDD voltage supervisor is cleared and the subsequent timeout period has expired. All interrupts are masked except CRDY. Figure 19 illustrates the timing of various signals during initial power-up, sleep mode, and wake-up events. The ADC, charge pump, internal reference, op amp(s), DAC, and switches are disabled after power-up.
Power Modes
Two power modes are available for the MAX11359A: sleep and normal mode. In sleep mode, all functional blocks are powered down except the serial interface, data registers, internal bandgap, wake-up circuitry (if enabled), DVDD voltage supervisor (if enabled), and the 32kHz oscillator (if enabled), which remain active. See Table 15 for details of the sleep-mode and normalmode power states of the various internal blocks. Each analog block can be shut down individually through its respective control register with the exception of the bandgap reference.
Applications Information
Analog Filtering
The internal digital filter does not provide rejection close to the harmonics of the modulator sample frequency. However, due to high oversampling ratios in the MAX11359A, these bands typically occupy a small fraction of the spectrum and most broadband noise is filtered. Therefore, the analog filtering requirements in front of the MAX11359A are considerably reduced compared to a conventional converter with no on-chip filtering. In addition, because the device's commonmode rejection (60dB) extends out to several kHz, the common-mode noise susceptibility in this frequency range is substantially reduced. Depending on the application, provide filtering prior to the MAX11359A to eliminate unwanted frequencies the digital filter does not reject. Providing additional filtering in some applications ensures that differential noise signals outside the frequency band of interest do not saturate the analog modulator.
Sleep Mode Sleep mode is entered one of three ways: * Writing to the SLEEP register address. The result is the SHDN bit is set to 1.
* Asserting the SLEEP or SLEEP function on a UPIO (SLEEP takes precedence over software writes or wake-up events). The SHDN bit is unaffected. * Asserting the SHDN bit by writing SLP = 1 in the SLEEP_CFG register. Entering sleep mode is an OR function of the UPIO or SHDN bit. Before entering sleep mode, configure the normal mode conditions. Exit sleep mode and enter normal mode by one of the following methods: * With the SHDN bit = 0, deassert the SLEEP or SLEEP function on UPIO, only if SLEEP or SLEEP function is used for entering sleep mode.
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
2 AVDD 1 0V 2 DVDD 1 0V POR HI LO OSCE = 1 XIN, XOUT HI (32kHz) LO CK32E = 1 HI CK32K (32kHz) LO RESET HI (OPEN-DRAIN) LO HI INTERNAL LOW DVDD DETECTOR LO UPIO(WU) HI (INT. PULLUP) LO HI UPIO(SHDN) LO tDPD CLK HI LO INTERNAL HI CRDY HFCE = 1, FLLE = 1 LO HI LO PWME = 0 UPIO(PWM) HI CONNECTED TO POWER SUPPLY SHDN PIN LO INTERNAL DRDY HI LO HI LO CS HI LO HI SCLK, DIN LO THREE-STATED SLEEP WRITE POWER SUPPLY OFF SPWME = 1 PWME = 0 POWER SUPPLY OFF tDFON tDFOF INTERNAL tDFON
IF FLLE = 0, CRDY WILL STAY LOW, DFON = 0 )
1.8V
INITIAL POWER, WAKE-UP, AND SLEEP XTAL B/W 32KIN AND 32KOUT PIN
1.8V
SOSCE = 1
OSCE = 1
SCK32E = 0 BUFFER DISABLED
CK32E = 1
INTERNAL OUTPUT DISABLED, BUT PULLED LOW
EXTERNAL
OUTPUT ENABLED
tWU tDPU INTERNAL
tDFI INT
tDFI
DOUT
Figure 19. Initial Power-Up, Sleep Mode, and Wake-Up Timing Diagram with AVDD > 1.8V
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
VREF/GAIN 1111 1111 1111 1111 1111 1111 1111 1110 1111 1111 1111 1101 1111 1111 1111 1100 BINARY OUTPUT CODE 1 LSB = VREF (GAIN x 65,536) VREF/GAIN FULL-SCALE TRANSITION 0111 1111 1111 1111 0111 1111 1111 1110 0111 1111 1111 1101 VREF x2 (GAIN x 65,536) VREF/GAIN 0 +1 +32,765 +32,767 VREF/GAIN VREF/GAIN
BINARY OUTPUT CODE
1 LSB = 0000 0000 0000 0001 0000 0000 0000 0000 1111 1111 1111 1111
0000 0000 0000 0011 0000 0000 0000 0010 0000 0000 0000 0001 0000 0000 0000 0000 0 1 2 3 INPUT VOLTAGE (LSB) 65,533 65,535 1000 0000 0000 0010 1000 0000 0000 0001 1000 0000 0000 0000 -32,768 -32,766 -1
INPUT VOLTAGE (LSB)
Figure 20. ADC Unipolar Transfer Function
Figure 21. ADC Bipolar Transfer Function
* With the SLEEP or SLEEP function deasserted on UPIO, clear the SHDN bit by writing to the normalmode register address control byte. * With the SLEEP or SLEEP function deasserted, assert WU or WU (wake-up) function on UPIO. * With the SLEEP or SLEEP function deasserted, the day alarm triggers.
MAX11359A FBA
DAC A
OUTA
Wake-Up
A wake-up event, such as an assertion of a UPIO configured as WU or a time-of-day alarm causes the MAX11359A to exit sleep mode, if in sleep mode. A wake-up event in normal mode results only in a wakeup event being recorded in the STATUS register. RESET The RESET output pulls low for any one of the following cases: power-on reset, DVDD monitor trips and RSTE = 0, watchdog timer expires, crystal oscillator is attached, and 32kHz clock not ready. The RESET output can be turned off through the RSTE bit in the PS_VMONS register, causing DVDD low supply voltage events to issue an interrupt or poll through the LDVD status bit. This allows brownout detection Cs that operate with DVDD < 1.8V.
Figure 22. DAC Unipolar Output Circuit
supply to AVDD and CPOUT. Setting UPIO outputs to drive to CPOUT results in AVDD-referenced logic levels.
Supply Voltage Measurement
The AVDD supply voltage can be measured with the ADC by reversing the normal input and reference signals. The REF voltage is applied to one multiplexer input, and AGND is selected in the other. The AVDD signal is then switched in as the ADC reference voltage and a conversion is performed. The AVDD value can then be calculated directly as: VAVDD = (VREF x Gain x 65536)/N where VREF is the reference voltage for the ADC, Gain is the PGA gain before the ADC, and N is the ADC result. Note the AVDD voltage must be greater than the gained-up REF voltage (AVDD > VREF x Gain). This measurement must be done in unipolar mode.
Driving UPIO Outputs to AVDD Levels UPIO outputs can be driven to AVDD levels in systems with separate AVDD and DVDD supplies. Disable the charge-pump doubler by setting CPE = 0 in the PS_VMONS register, and connect the system's analog
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VREF/GAIN
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
VREF R1 FB_ R2 +3.3V VOUT DAC_ OUT_ -3.3V R2 = R1 VREF = 1.25V
MAX11359A FBA
10k
10k DAC A OUTA
MAX11359A
Figure 24. DAC Bipolar Output Circuit
VREF = 1.25V
Figure 23. DAC Unipolar Rail-to-Rail Output Circuit
In unipolar mode, the output code ranges from 0 to 65,535 for inputs from zero to full-scale. In bipolar mode, the output code ranges from -32,768 to +32,767 for inputs from negative full-scale to positive full-scale.
Power Supplies
AVDD and DVDD provide power to the MAX11359A. The AVDD powers up the analog section, while the DVDD powers up the digital section. The power supply for both AVDD and DVDD ranges from +1.8V to +3.6V. Both AVDD and DVDD must be greater than +1.8V for device operation. AVDD and DVDD can connect to the same power supply. Bypass AVDD to AGND with a 10F electrolytic capacitor in parallel with a 0.1F ceramic capacitor, and bypass DVDD to DGND with a 10F electrolytic capacitor in parallel with a 0.1F ceramic capacitor. For improved performance, place the bypass capacitors as close to the device as possible.
DAC Unipolar Output
For a unipolar output, the output voltages and the reference have the same polarity. Figure 22 shows the unipolar output circuit of the MAX11359A, which is also the typical operating circuit for the DAC. Table 22 lists some unipolar input codes and their corresponding output voltages. For larger output swing, see Figure 23. This circuit shows the output amplifiers configured with a closedloop gain of +2V/V to provide 0 to 2.5V full-scale range with the 1.25V reference.
DAC Bipolar Output
The MAX11359A DAC output can be configured for bipolar operation using the application circuit in Figure 24: 2N VOUT = VREF - 1 1024 where N is the decimal value of the DAC's binary input code. Table 23 shows digital codes (offset binary) and corresponding output voltages for Figure 24 assuming R1 = R2.
ADC Transfer Functions
Figures 20 and 21 provide the ADC transfer functions for unipolar and bipolar mode. The digital output code format is binary for unipolar mode and two's complement for bipolar mode. Calculate 1 LSB using the following equations: 1 LSB (Unipolar Mode) = VREF/(Gain x 65,536) 1 LSB (Bipolar Mode) = 2VREF/(Gain x 65,536) where VREF equals the reference voltage at REF and Gain equals the PGA gain.
Table 22. Unipolar Code
DAC CONTENTS MSB LSB 1111 1111 11 1000 0000 01 1000 0000 00 0111 1111 11 0000 0000 01 0000 0000 00 ANALOG OUTPUT +VREF (1023/1024) +VREF (513/1024) +VREF (512/1024) = +VREF/2 +VREF (511/1024) +VREF (1/1024) 0
Table 23. Bipolar Code
DAC CONTENTS MSB LSB 1111 1111 11 1000 0000 01 1000 0000 00 0111 1111 11 0000 0000 01 0000 0000 00 ANALOG OUTPUT +VREF (511/512) +VREF (1/512) 0 -VREF (1/512) -VREF (511/512) -VREF (512/512) = -VREF
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
Clocking with a CMOS Signal
A CMOS signal may be used to drive 32KIN if it is divided down. Figure 25 is an example circuit, which works well. directly across the external transimpedance resistor, RF, eliminating any errors due to voltages drifting over time, temperature, or supply voltage.
Input Multiplexer
The mux inputs can range between AGND to AVDD. However, when the internal temperature sensor is enabled, AIN1 and AIN2 cannot exceed 0.7V. This necessitates additional circuitry to divide down the input signal. See Figure 26 for an example circuit that divides down backlight VDD to work properly with the AIN1 pin.
Temperature Measurement with Two Remote Sensors
Use two diode-connected 2N3904 transistors for external temperature sensing in Figure 28. Select AIN1 and AIN2 through the positive and negative mux, respectively. For internal temperature sensor measurements, set MUXP<3:0> to 0111, and set MUXN<3:0> to 0000. The analog input signals feed through a PGA to the ADC for conversion.
Optical Reflectometry Application with Dual LED and Single Photodiode
Figure 27 illustrates the MAX11359A in a complete optical reflectometry application with two transmitting LEDs and one receiving photodiode. The LEDs transmit light at a specific wavelength onto the sample strip, and the photodiode receives the reflections from the strip. Set the DAC to provide appropriate bias currents for the LEDs. Always keep the photodiodes reverse-biased or zero-biased. SPDT1 and SPDT2 switch between the two LEDs.
Programmable-Gain Instrumentation Amplifier
Use two op amps and two SPDT switches to implement a programmable-gain instrumentation amplifier as shown in Figure 29.
PWM Applications
The MAX11359A integrated PWM is available for LCD bias control, sensor-bias voltage trimming, buzzer drive, and duty-cycled sleep-mode power-control schemes. Figure 30 shows the MAX11359A performing LCD bias control. A sensor-bias voltage trimming application is shown in Figure 31. Figures 33 and 34 show the PWM circuitry being used in a single-ended and differential piezoelectric buzzer-driving application.
Electrochemical Sensor Operation
The MAX11359A family interfaces with electrochemical sensors. The 10-bit DAC with the force-sense buffers have the flexibility to connect to many different types of sensors. An external precision resistor completes the transimpedance amplifier configuration to convert the current generated by the sensor to a voltage measurement using the ADC. The induced error from this source is negligible due to FBA's extremely low input bias current. Internally, the ADC can differentially measure
ADC Calibration
Internal to the MAX11359A, the ADC is 24 bits and is always in bipolar mode. The OFFSET CAL and GAIN CAL data are also 24 bits. The conversion to unipolar and the gain are performed digitally. The default values for the OFFSET CAL and GAIN CAL registers in the MAX11359A are 00 0000h and 80 0000h, respectively.
VBATT2 BACKLIGHT VDD
CMOS CLOCK (0 TO DVDD)
100k 32KIN
VBATT1 UPIO1 GPIOn NOTE: GPIOn IS LOW = LED ON, HIGH-Z = LED OFF
100k
MAX11359A
MAX11359A x2 AIN1 VREF = 1.25V
BATTVCHECK
< 0.6125V
P
Figure 25. Clocking with a CMOS Signal
Figure 26. Input Multiplexer
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
VCP TXD RXD VSS C VSS VBAT VCC SERIAL-PORT INTERFACE
VSS MOSI MISO SCK CS1 SI SO SCK CS
EEPROM
GND VSS
MAX11359A
DIN DOUT
VCP UPIO1 UPIO2 UPIO3 UPIO4 BDIN BDOUT BSCLK BCS2 VSS IN2IN2+ LCD MODULE
SCLK CS2 MEM UP DOWN VSS VBAT VDD INPUT INPUT INPUT RESET INPUT X2IN 32KIN HIGH-FREQUENCY MICRO CLOCK 32kHz MICRO CLOCK CS2 CS RESET INT CLK CLK32K AVDD DVDD 2 AAA OR 1 LITHIUM COIN CELL AGND VSS SNC2 DGND PWM AIN1 AIN2 DACA 32KIN SWA FBA SNO1 SCM1 SNC1 LED VCP LED 32KOUT DVDD LINEAR REG REG CF+ VSS VCP CFCPOUT VSS VSS VSS CHARGEPUMP DOUBLER BG OUTA VCP LED SOURCES VSS AMBIENT LIGHT IN1IN1+ OUT1 VSS 1nF TEST STRIP VSS OUT2
ADC
SNO2 SCM2
VSS
32.768kHz
REF
Figure 27. Optical Reflectometry Application with Dual LED and Single Photodiode
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor
The calibration works as follows: ADC = (RAW - OFFSET) x Gain x PGA where ADC is the conversion result in the DATA register, RAW is the output of the decimation filter internal to the MAX11359A, OFFSET is the value stored in the OFFSET CAL register, Gain is the value stored in the GAIN CAL register, and PGA is the selected PGA gain found in the ADC register as GAIN<1:0>. In unipolar mode, all negative values return a zero result and an additional gain of 2 is added. For self-calibration, the offset value is the RAW result when the inputs are shorted internally and the gain value is 1/(RAW - OFFSET) with the reference connected to the input. This is done automatically when these modes are selected. The self offset and gain calibration corrects for errors internal to the ADC and the results are stored and used automatically in the OFFSET CAL and GAIN CAL registers. For best results, use the ADC in the same configuration as the calibration. This pertains to conversion rate only because the PGA gain and unipolar/bipolar modes are performed digitally. For system calibration, the offset and gain values correct for errors in the whole signal path including the internal ADC and any external circuits in the signal path. For the system calibration, a user-provided zeroinput condition is required for the offset calibration and a user-provided full-scale input is required for the gain calibration. These values are automatically written to the OFFSET CAL and GAIN CAL registers. The order of the calibrations should be offset followed by gain. The offset correction value is in two's complement. The default value is 000000h, 00...00b, or 0 decimal. The gain correction value is an unsigned binary number with 23 bits to the right of the decimal point. The largest number is therefore 1.1111...1b = 2 - 2-23 and the smallest is 0.000...0b = 0, although it does not make sense to use a number smaller than 0.1000...0b = 0.5. The default value is 800000h, 1.000...0b or 1 decimal. Changing the offset or gain calibration values does not affect the value in the DATA register until a new conversion has completed. This applies to all the mode bits for PGA gain, unipolar/bipolar, etc. point. If the DAS is the only device requiring an AGND-toDGND connection, connect planes to the AGND pin of the DAS. In systems where multiple devices require AGND-toDGND connections, the connection should still be made at only one point. Make the star ground as close as possible to the MAX11359A. Avoid running digital lines under the device because these may couple noise onto the device. Run the analog ground plane under the MAX11359A to minimize coupling of digital noise. Make the power-supply lines to the MAX11359 as wide as possible to provide lowimpedance paths and reduce the effects of glitches on the power-supply line. Shield fast-switching signals such as clocks with digital ground to avoid radiating noise to other sections of the board. Avoid running clock signals near the analog inputs. Avoid crossover of digital and analog signals. Good decoupling is important when using high-resolution ADCs. Decouple all analog supplies with 10F capacitors in parallel with 0.1F HF ceramic capacitors to AGND. Place these components as close to the device as possible to achieve the best decoupling.
MAX11359A
Crystal Layout
Follow basic layout guidelines when placing a crystal on a PCB with a DAS to avoid coupled noise: 1) Place the crystal as close as possible to 32KIN and 32KOUT. Keeping the trace lengths between the crystal and inputs as short as possible reduces the probability of noise coupling by reducing the length of the "antennae". Keep the 32KIN and 32KOUT lines close to each other to minimize the loop area of the clock lines. Keeping the trace lengths short also decreases the amount of stray capacitance. 2) Keep the crystal solder pads and trace width to 32KIN and 32KOUT as small as possible. The larger these bond pads and traces are, the more likely it is that noise will couple from adjacent signals. 3) Place a guard ring (connect to ground) around the crystal to isolate the crystal from noise coupled from adjacent signals. 4) Ensure that no signals on other PCB layers run directly below the crystal or below the traces to 32KIN and 32KOUT. The more the crystal is isolated from other signals on the board, the less likely it is that noise will be coupled into the crystal. Maintain a minimum distance of 5mm between any digital signal and any trace connected to 32KIN or 32KOUT.
Grounding and Layout
For best performance, use PCB with separate analog and digital ground planes. Design the PCB so that the analog and digital sections are separated and confined to different areas of the board. Join the digital and analog ground planes at one
62
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
AIN1 MUX AGND 2N3904 AIN2 MUX AGND 2N3904 TEMP SENSOR 1.25V REF AV = 1, 2, 4, 8 MAX11359A PGA 16-BIT ADC REF
AV = 1, 1.638, 2 REF
CREF
Figure 28. Temperature Measurement with Two Remote Sensors
VIN+
IN1+ OUT1 IN1R3 SNO1 SCM1 SNC1 R1 OUT2 IN2R1 SNO2 SCM2 SNC2 R3 MAX11359A R2 VOUT
5) Place a local ground plane on the PCB layer immediately below the crystal guard ring. This helps to isolate the crystal from noise coupling from signals on other PCB layers. Note: The ground plane must be in the vicinity of the crystal only and not on the entire board.
Parameter Definitions
INL
Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a straight line. This straight line is either a best-straight-line fit or a line drawn between the end points of the transfer function, once offset and gain errors have been nulled. INL for the MAX11359A is measured using the end-point method.
VIN-
IN2+
DNL
R2
Differential nonlinearity (DNL) is the difference between an actual step width and the ideal value of 1 LSB. A DNL error specification of greater than -1 LSB guarantees no missing codes and a monotonic transfer function.
Gain Error
Gain error is the amount of deviation between the measured full-scale transition point and the ideal full-scale transition point.
Figure 29. Programmable-Gain Instrumentation Amplifier
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63
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
MAX11359A SV_ DVDD CPOUT MUX UPIO_ 200k 0.01F (1.8V TO 2.6V) CPOUT 100k C
PWM
EN_ ALH_
100k SEG 100k LCD DRIVERS n LCD COM m
100k
Figure 30. LCD Contrast-Adjustment Application
Common-Mode Rejection
Common-mode rejection (CMR) is the ability of a device to reject a signal that is common to both input terminals. The common-mode signal can be either an AC or a DC signal or a combination of the two. CMR is often expressed in decibels.
~1.25V REF
MAX11359A
SNO1 PWM SPDT1 AGND IN1+ OUT1 IN1IT SCM1 SNC1
~19kHz VOLTAGE RIPPLE < 1mV 350k
240k ~0.3V
Power-Supply Rejection Ratio (PSRR)
Power-supply rejection ratio (PSRR) is the ratio of the input supply change (in volts) to the change in the converter output (in volts). It is typically measured in decibels.
0.1F
60k
TRANSDUCER 0.300V (1mV)
Figure 31. Sensor-Bias Voltage Trim Application
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16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
AVDD VDD
MAX11359A
DVDD SV_
DVDD CPOUT VIN
MUX
< 10A VOUT 100F VDD C
VBATT 10M
POWER SUPPLY
UPIO_ PWM PSCTL SHDN ON-TIME <100ms TYP 10s PERIOD TYP EN_ ALH_ PSCTL +3.3V VDD +2.3V
Figure 32. Power-Supply Sleep-Mode Duty-Cycle Control
MAX11359A
SV_
DVDD
CPOUT
MUX
CPOUT(+3.2V) 0V 1kHz TO 8kHz TYP
UPIO_ PWM
1k
~10,000pF
ALH_
Figure 33. Single-Ended Piezoelectric Buzzer Drive
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65
16-Bit Data-Acquisition System with ADC, DAC, UPIOs, RTC, Voltage Monitors, and Temp Sensor MAX11359A
MAX11359A SV_
DVDD CPOUT MUX UPIO_
CPOUT(+3.2V) 0V 1k 1kHz TO 8kHz TYP
PWM
~10,000pF ALH_ DVDD CPOUT SV_ MUX UPIO_ 1k
CPOUT + 6.4V DIFF -CPOUT
CPOUT(~+3.2V) 0V 1kHz TO 8kHz TYP ALH_
Figure 34. Differential Piezoelectric Buzzer Drive
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. PACKAGE TYPE 40 TQFN PACKAGE CODE T4066-4 DOCUMENT NO. 21-0141
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
66 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.

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