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NEW
High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
sFlexibility
Hirose's IT3 mezzanine connector system is as comfortable in today's data rates of PCIe and XAUI as it is in tomorrow's 10+Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 - 40mm, IT3 can solve your interface needs for both current and future generations.
sMechanical features
q Unique 3-piece structure for flexibility q Stacking heights from 15 to 40mm (*15mmH is 2-piece) q Staggered 1.5mm 1.75mm ball grid array q Number of Contacts: 100, 200, &300 signals + 90% additional grounds q Differential, single-ended, and power q Low mating/extracting forces q Wide misalignment tolerances for multiple connector use q Both of SnPb and Pb-free are available q Excellent reflow solderability
Interposer
Signal Ground
Signal / Ground Configuration
sSignal integrity features
q Insertion loss to Crosstalk Ratio (ICR)
The ICR performance meets the extrapolated IEEE 802.3ap specification for 6.25Gbps with fully-populated pin assignment, and 10+Gbps with skipped pin assignment.
q Return Loss
The differential return loss meets the extrapolated IEEE 802.3ap specification up to 12GHz.
sStacking height variations
Stacking Height Contact Position 100 200 300 17mm * 20mm 22mm * 25mm 26mm 28mm 30mm * 32mm * 38mm 40mm
* : Under planning
2010.02
1
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sProduct Specifications
Rating Current Rating: 1.0A / pin (note 1) Voltage Rating: 50Vrms Storage Temperature Range: -10C to +60C Operating Temperature Range: -55C to +85C Operating Humidity Range: For relative humidity, 90% max (no condensation is permitted) Conditions 100V DC 150V duty for 60 seconds (2mA max leak) 100mA Frequency: 20 to 500Hz; power spectrum density: 0.02G2/Hz Overall rms G: 3.1 Grms; for 15 minutes in three directions 25C, 80% RH: 60 min dwell time, 30 min ramp time 65C, 50% RH: 60 min dwell time under 24 cycles 100 cycles
Item Specification 1. Insulation Resistance 1000Mo min. 2. Withstanding Voltage No flashover or insulation breakdown 50mo max. (height 15-24mm) (note 2) 3. Contact Resistance 55mo max. (height 25-32mm) 60mo max. (height 33-40mm) 1) No electrical discontinuity of 1s or more 4. Vibration 2) No damage, crack, or loose part 1) Contact resistance change: 20mo or less 5. Cyclic Temperature 2) Insulation resistance: 100Mo min. and Humidity 3) No damage, crack or loose part 6. Durability 1) Contact resistance change: 20mo or less (Mating/Un-mating) 2) No damage, crack or loose part
Note1: Refer to IT3 derating curves on test report TR636E-20041 for power application. Note2: The value of contact resistance includes 2 contact points and the bulk resistance.
sMaterial Information
qReceptacle
Component Housing Locator Contact Solder Ball Tray Pick Up Cap Pick Up Tape Material LCP LCP Copper Alloy Tin-Lead (SnPb) Tin (Pb-Free) Polystyrene Stainless steel Paper (Nomex) Finish & Remarks Black , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 m) over Nickel (1.5 m) Mounting Area : Gold (0.03 m) over Nickel (1.5 m) Other : Nickel (1.5 m) Sn(63)-Pb(37) Sn(96.5)-Ag(3)-Cu(0.5) Black 300pos 100pos and 200pos
qInterposer
Component Guide (Mounting Side) Guide (Detachable/Mating Side) Blade Contact Ground Shield Tray Material PBT LCP PBT LCP Copper Alloy Copper Alloy Polypropylene Finish & Remarks Black , UL 94V-0 Gray , UL 94V-0 Gray , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 m) over Nickel (1.5 m) Other : Nickel (1.5 m)
----------
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sOrdering Information
qReceptacle
IT 3 ** - *** S - BGA ** (**)
1 2 3 4 5 6 7
qInterposer
IT 3 ** - *** P - ** H ** (**)
1 2 3 4 8 6 9 1 Series name : IT3 2 Receptacle Type D : Mating Receptacle D* : Mating Receptacle ( Customized ) M : Mounting Receptacle M* : Mounting Receptacle ( Coustomized ) Interposer Type Blank: Standard ** : Customized 3 Contact Positions : 100, 180*, 200, 300 *180 pos. is 2 columns depopulated version for higher voltage proof. 4 Connector type S : Receptacle P : Interposer 5 BGA : Ball Grid Array 6 Package Specification Blank : Standard ** : Customized 7 Material and Plating Specification of Receptacle (37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) Contact Area : Au(0.76m)+Ni(1.5m) (57) : Eutectic Solder Sn(63)-Pb(37) Contact Area : Au(0.76m)+Ni(1.5m) 8 Stacking Height (mm) 17, 20, 22, 25, 26, 28, 30, 32, 38, 40 9 Plating Specification of Interposer (03) : Contact Area : Au(0.76m)+Ni(1.5m)
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sSignal Integrity
qPin assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the figures below. In the following data, one victim pair and eight aggressor pairs are included.
7 8 9 16 17 18
4
5
6
13
14
15
1
2
3
10
11
12
Mating receptacle side
Signal Ground Victim pair
Mounting receptacle side
Aggressor pair
qImpedance profile at 60ps rise time (20-80%)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are designed with higher impedance to offset the via's low impedance.
115 115 115
110 Z (Ohm) Z (Ohm)
110 Z (Ohm) S11 95 0 200 400 600 Time (ps) 800 1000
110
105
105
105
100 S11 95 0 200 400 600 Time (ps) 800 1000
100
100 S11 95 0 200 400 600 Time (ps) 800 1000
17mm Height
25mm Height
32mm Height
qDifferential propagation delay
Stacking Height (mm) Delay (ps) 17 101.05 25 146.69 32 188.48
4
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
qDifferential Insertion Loss
The differential insertion loss is less than -2dB up to 12GHz.
17mm Height
25mm Height
32mm Height
qDifferential Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
17mm Height
25mm Height
32mm Height
qDifferential Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as critical because TX and RX can be grouped into separate wafers.
17mm Height
25mm Height
32mm Height
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
qDifferential Far-End Crosstalk (FEXT)
Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk can be achieved by skipping pins.
17mm Height
25mm Height
32mm Height
qInsertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT
The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap specification up to 12GHz.
17mm Height
25mm Height
32mm Height
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sReceptacle
A
Shown: 200 position mating receptacle, IT3M-200S-BGA
Contact Positions 100 (100 signals/90 grounds)
180 (180 signals/162 grounds)
200 (200 signals/180 grounds)
300 (300 signals/270 grounds)
Type Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle
Solder Ball Material Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder
Part Number IT3D-100S-BGA(37) IT3D-100S-BGA(57) IT3M-100S-BGA(37) IT3M-100S-BGA(57) IT3D2-180S-BGA(37) IT3D2-180S-BGA(57) IT3M2-180S-BGA(37) IT3M2-180S-BGA(57) IT3D-200S-BGA(37) IT3D-200S-BGA(57) IT3M-200S-BGA(37) IT3M-200S-BGA(57) IT3D-300S-BGA(37) IT3D-300S-BGA(57) IT3M-200S-BGA(37) IT3M-200S-BGA(57)
CL No. 636-0013-1-37 636-0013-1-57 636-0014-4-37 636-0014-4-57 636-0011-6-37 636-0011-6-57 636-0012-9-37 636-0012-9-57 636-0003-8-37 636-0003-8-57 636-0004-0-37 636-0004-0-57 636-0007-9-37 636-0007-9-57 636-0008-1-37 636-0008-1-57
6.0
*
Unit: mm
21.0
38.5
56.0
19.2
A
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sInterposer
A0.5
Mounting Side
1.40.3 (Contact wipe)
IT3D*-300S-BGA(**) Daughter card Spacer height : D0.127
Mated connector height : C0.25
Spacer IT3**-300P-25H(**) IT3M*-300S-BGA(**)
Spacer Mother board
Mounting Side
Mating Cross Section(FREE)
Mating condition with spacers
Mating condition without spacers
0.90.3 Contact wipe
Mating Side
*
Height (mm) 17 20 22
Part Number IT3-200P-17H(03) IT3-300P-17H(03) IT3-100P-20H(03) IT3-200P-20H(03) IT3-300P-20H(03) IT3-200P-22H(03) IT3-300P-22H(03) IT3-100P-25H(03) IT3M2-180P-25H(03) IT3-200P-25H(03) IT3-300P-25H(03) IT3-100P-26H(03) IT3-200P-26H(03) IT3-300P-26H(03)
CL No. 636-0100-4-03 636-0130-5-03 636-0223-4-03 636-0224-7-03 636-0225-0-03 636-0209-3-03 636-0210-2-03 636-0150-2-03 636-0157-1-03 636-0155-6-03 636-0160-6-03 636-0165-0-03 636-0110-8-03 636-0135-9-03
A 41.5 59.0 24.0 41.5 59.0 41.5 59.0 24.0 41.5 41.5 59.0 24.0 41.5 59.0
B
C
D
Height (mm) 28
Part Number IT3-100P-28H(03) IT3M2-180P-28H(03) IT3-200P-28H(03) IT3-300P-28H(03) IT3-200P-30H(03) IT3-300P-30H(03) IT3-200P-32H(03) IT3-300P-32H(03) IT3-100P-38H(03) IT3-200P-38H(03) IT3-300P-38H(03) IT3-100P-40H(03) IT3-200P-40H(03) IT3-300P-40H(03)
CL No. 636-0170-0-03 636-0107-3-03 636-0105-8-03 636-0140-9-03 636-0180-3-03 636-0185-7-03 636-0115-1-03 636-0145-2-03 636-0200-9-03 636-0195-0-03 636-0190-7-03 636-0230-0-03 636-0227-5-03 636-0175-3-03
A 24.0 41.5 41.5 59.0 41.5 59.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0
B
(1.0 with spacers)
Unit: mm
C
D
15.8 16.6 17.0 18.8 19.6 20.0 30 20.8 21.6 22.0 32 23.8 24.6 25.0 38
26.8 27.6 28.0
28.8 29.6 30.0 30.8 31.6 32.0 36.8 37.6 38.0
25
26
24.8 25.6 26.0
40
38.8 39.6 40.0
8
B0.5
Mating Side
210.5
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sPCB footprint (mounting foot pattern)
27.2 Minimum clearance for all devices
*
No.n Signal Ground
Column No.1
B D F H K M P T V
Row A C E G J L N R U W
0.875 1.75 0.875 A B Minimum clearance for all devices C Minimum clearance for sensitive devices Signal Pad Ground Pad
Mounting Receptacle - IT3M
No.n Signal Ground
V T P M K H F D B
Row W U R N L J G E C A
0.875 1.75 0.875 A B Minimum clearance for all devices C Minimum clearance for sensitive devices Signal Pad Ground Pad
Mating Receptacle - IT3D
Unit: mm
Dimension (mm) A B C
100 15.75 28.10 30.10
180 / 200 33.25 45.60 47.50
300 50.75 63.10 65.10
27.2 Minimum clearance for all devices
Column No.1
29.2 Minimum clearance for sensitive devices
0.75
1.5
13.5
29.2 Minimum clearance for sensitive devices
0.75
1.5
13.5
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sSpacers
Spacers are required to support the PWB's and protect the BGA solder joints.
Stacking Height
Spacers
Suggested spacer style is shown below:
Spacer, male-male, M3 thread
The recommended spacer height corresponds to the interposer stacking height as shown in the chart below:
Stacking Height 17 mm 20 mm 22 mm 25 mm 26 mm 28 mm 30 mm 32 mm 38 mm 40 mm
Recommended Spacer Height 17 +/-0.127 mm 20 +/-0.127 mm 22 +/-0.127 mm 25 +/-0.127 mm 26 +/-0.127 mm 28 +/-0.127 mm 30 +/-0.127 mm 32 +/-0.127 mm 38 +/-0.127 mm 40 +/-0.127 mm
1050mm
1050mm
Two spacers located diagonally are minimally required. Some applications may require 4 spacers. Spacers should be located 10 - 50 mm from the corners of the receptacles to prevent excessive mechanical loading on the interconnections. If assembly will be subjected to vibration, spacers should be located to prevent resonance, and additional spacers may be required.
Recommended Spacer Location
O3.5 Non plated through hole
10
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sInterposer installation
Position interposer directly over mounting receptacle, aligning the polarity chamfers. If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap onto interposer and push straight down to engage the locking latches:
Manual Installation
*Installation caps are available upon request for manual operation Press firmly on installation cap only, not on wafers or interposer body
Locking Latch
Always support PWB from underside to prevent flexing
sDaughter card installation
After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align the spacer holes in the daughter card with the threads on the spacers.
The spacers help align the mating receptacle with the interposer. If positioned correctly, the mating receptacle will slip down into the interposer. Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer threads. Tighten nuts to specified torque.
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sDaughter card removal
To remove a daughter card, first remove the nuts from the reinforcing spacers, then lift the daughter card straight off the interposers, as shown right.
sInterposer removal Interposer Removal
1) Hold the Interposer Assembly on the walls without locking latches 2) Gently rotate one side of the Interposer Assembly laterally 10 maximum
Locking Latch
10MAX
Caution: do not rotate more than 10 degrees
3) While gently rotating, pull up on other side of the Interposer Assembly
4) The Interposer Assembly is removed, and the Mounting Receptacle is ready to accept another Interposer Assembly.
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sAssembly reflow soldering profile
Parameters Preheat Ramp Rate Soak Time Soak Temperature Peak Reflow Temperature Time Above Liquidus (TAL) Cooling Rate Maximum Package Body Temperature (T) Maximum Delta T between Body and PWB at Liquidus Package Body Exposure Limit at Maximum Temperature Eutectic (SnPb) 2 - 3c/sec 0 - 120 sec 140 - 180c 205 - 225c 30 - 90 sec >6c/sec 240c 10c 5 sec Pb-Free 2 - 3c/sec 0 - 120 sec 160 - 215c 230 - 250c 45 - 120 sec >6c/sec 260c 10c 5 sec Comment Other components may limit ramp rate to 2c/sec Soak requirements determined by board design, oven capability, and paste activation requirements Caution - "oversoaking" may exhaust flux and affect soldering Cooler peak temperatures may require longer TAL's Shorter TAL's may require higher peak temperatures Faster cooling rates produce finer grain structures and smoother joint appearances Open body design allows for low delta T between package and solder joint Standard practice is easy to achieve with open body design Adjust profile if maximum exposure limit is approached or exceeded
Reflow Profile
225 205 183
MaxPeak Temp Min Peak Temp Melting Point
250
Reflow
Soak
230 217
140
Min Soak Temp
nal) (optio
160
21
Time, typically 3 to 7 minutes total
21
Different solder pastes have different thermal performance characteristics. Consult with paste manufacturer for optimum profile settings. Check thermal exposure limits of PWB laminate if processing with Pb-free solder.
SnAgCu Temperatures ( C)
240
Max Body Temp
260
SnPb Temperatures( C)
Pr eh ea t
ol Co
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sMating self alignment
*
Unit: mm
+/-0.8
+/-0.6
X-direction
Y-direction
sMating tolerance
Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to 0.3mm tolerance in the X-axis and up to 0.2mm in the Y-axis.
+/-0.3
+/-0.2
X-direction
Y-direction
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sPackaging information
Please order per box with its Minimum Order Quantity (MOQ) of connectors contained. The number for each configuration is shown below.
qReceptacles
IT 3** - ***S - BGA(57)...SnPb / Au0.76m IT 3** - ***S - BGA(37)...Pb-Free / Au0.76m
(1) (2) (1) M D M* D* (2)
Unit: pcs
100S 120 120
-------------------
180S
-------------------
200S 72 72
-------------------
300S 48 48
-------------------
72 72
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Dry package and deoxidizer Box
Cushion materials
Three trays + One empty tray as lid
Bundle
15
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sPackaging information
qInterposers
IT 3 - ***P - **H(03)...Au0.76m
(3) (4)
Unit: pcs
(3) (4) 17H 20H 22H 25H 26H 28H 30H 32H 38H 40H
100P
----------
180P
----------------------------
200P 80 80 80 80 80 40 40 40 40 40
300P 60 60 60 60 60 30 30 30 30 30
100
----------
100 100 50
-------------------
80
----------
40
-------------------------------------
50 50
This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes)
Box
Cushion materials
One or two trays (depending on height) +One empty tray as lid
Bundle
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IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sTray information
X3 31 31 31 31 31 31 31 31 31 18 32.8 18.75 135.90.5 Tape (3.8) 3150.5 Chamfer (Connector Column1) Y3
JEDEC Tray for IT3M 100 Position Receptacles
Chamfer (Connector Column1) X3 51.7 51.7 51.7 51.7 51.7 28.25 32.8 18.75 135.90.5 Tape (3.8) 3150.5 Y3
JEDEC Tray for IT3M 200 Position Receptacles
X3 77.6 77.6 77.6 41.1
Chamfer (Connector Column1) Y3 32.8 18.75
135.90.5
(3.8)
3150.5
JEDEC Tray for IT3M 300 Position Receptacles
32.8 Cap
32.8
32.8
32.8
32.8
32.8
17
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
sTray information (con't)
X3 31 31 31 31 31 31 31 31 31 18 32.8 18.75 135.90.5 (3.8) 3150.5 Tape Chamfer (Connector Column1) Y3
JEDEC Tray for IT3D 100 Position Receptacles
X3 51.7 51.7 51.7 51.7 51.7 28.25
Chamfer (Connector Column1) Y3 18.75
135.90.5
Tape (3.8) 3150.5
JEDEC Tray for IT3D 200 Position Receptacles
X3 77.6 77.6 77.6 41.1
Chamfer (Connector Column1) Y3 32.8 18.75
135.90.5
(3.8)
3150.5
Cap
JEDEC Tray for IT3D 300 Position Receptacles
18
32.8
32.8
32.8
32.8
32.8
32.8
32.8
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
NOTES :
19
IT3 SeriesqHigh-Speed(10+Gbps) BGA Mezzanine Connectors
USA: HIROSE ELECTRIC (U.S.A.), INC. Headquarters 2688 Westhills Court, Simi Valley, CA 93065-6235 Phone : 1-805-522-7958 Fax : 1-805-522-3217 http://www.hiroseusa.com
USA: HIROSE ELECTRIC (U.S.A.), INC. North California Office 20400 Stevens Creek Blvd., Ste 250, Cupertino, CA 95014 Phone : 1-408-253-9640 Fax : 1-408-253-9641 http://www.hiroseusa.com
USA: HIROSE ELECTRIC (U.S.A.), INC. Dallas Office 1701 N. Greenville Ave. Ste 817, Richardson, TX 75081 Phone : 1-469-330-9200 Fax : 1-469-330-9205 http://www.hiroseusa.com USA: HIROSE ELECTRIC (U.S.A.), INC. Detroit Office (Automotive) 37650 Professional Center Drive, Suite 120A, Livonia, MI 48154 Phone : 1-734-542-9963 Fax : 1-734-542-9964 http://www.hiroseusa.com FINLAND: HIROSE ELECTRIC EUROPE B.V. FINLAND OFFICE Teknobulevardi 3-5 01530 VANTAA Phone : 358-46-712-2178 Fax : 358-46-712-2179 http://www.hiroseeurope.com
USA: USA: HIROSE ELECTRIC (U.S.A.), INC. New York Office HIROSE ELECTRIC (U.S.A.), INC. Chicago Office 2777 Finley Road, Suite 19 Downers Grove, 510 Broadhollow Road, Suite 305, Melville, NY 11747 IL 60515 Phone : 1-516-249-5259 Phone : 1-630-916-1455 http://www.hiroseusa.com Fax : 1-630-916-1451 http://www.hiroseusa.com GERMANY: HIROSE ELECTRIC GmbH Herzog-Carl-Strasse 4 D-73760 Ostfildern (Scharnhauser Park) Phone : 49-711-4560-02-1 Fax : 49-711-4560-02-299 http://www.hirose.de THE NETHERLANDS: HIROSE ELECTRIC EUROPE B.V. Hogehillweg #8 1101 CC Amsterdam Z-O Phone : 31-20-6557490 Fax : 31-20-6557469 http://www.hiroseeurope.com
CHINA: UNITED KINGDOM: HIROSE ELECTRIC UK LTD. HIROSE ELECTRIC CO., LTD. BEIJING REPRESENTATIVE OFFICE First Floor, St Andrews House, Caldecotte Lake A1205, Ocean International Center, Building 56# East 4th Business Park, Milton Keynes MK7 8LE Ring Middle Road, Chao Yang District, Beijing, 100025 Phone : 44-1908-369060 Phone : 86-10-5165-9332 Fax : 44-1908-369078 Fax : 86-10-5908-1381 http://www.hirose.co.uk http://www.hirose-china.com.cn CHINA: HIROSE ELECTRIC CO., LTD. SHENZHEN OFFICE Room 1902-05, Office Tower Shun Hing Square, Di Wang Commercial Centre 5002, ShenNanDong Road, ShenZhen City, Guangdong Province, 518008 Phone : 86-755-8207-0851 Fax : 86-755-8207-0873 http://www.hirose-china.com.cn SINGAPORE: HIROSE ELECTRIC CO., LTD. Singapore Branch 10 Anson Road #26-16 International Plaza 079903 Phone : 65-6324-6113 Fax : 65-6324-6123 http://www.hirose-singapore.com.sg HONG KONG: HIROSE ELECTRIC HONGKONG TRADING CO., LTD. Unit 1102 A&B, Energy Plaza, 92 Granville Road, Tsim Sha Tsui East, Kowloon Phone : 852-2803-5338 Fax : 852-2591-6560 http://www.hirose-hongkong.com.hk KOREA: HIROSE KOREA CO., LTD. 1261-10, Jeoungwhang-Dong, Shihung-City, Kyunggi-Do 429-450 Phone : 82-31-496-7000,7124 Fax : 82-31-496-7100 http://www.hirose.co.kr
CHINA: HIROSE ELECTRIC (SHANGHAI) CO., LTD. 1501-02, Cross Tower Building, 318 Fuzhou Road, Huang Pu District, Shanghai 200001 Phone : 86-21-6391-3355 Fax : 86-21-6391-3335 http://www.hirose-china.com.cn TAIWAN: HIROSE ELECTRIC TAIWAN CO., LTD. No.28 Lane 247 Sec. 2, Yen Ping N, Rd. Taipei Phone : 886-2-2557-7351,7352 Fax : 886-2-2552-9851 http://www.hirose-taiwan.com.tw
(R)
5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-5300, FAX: 81-3-3495-5230 http://www.hirose.com http://www.hirose-connectors.com
20
The contents of this catalog are current as of date of 02/2010. Contents are subject to change without notice for the purpose of improvements.

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