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FEATURES AND SPECIFICATIONS New Micro-USB interconnect solutions set standard for sleeker mobile devices USB Implementers Forum, Inc. (USB-IF) has finalized the specification of the Micro-USB technology in early January 2007. The development of this new connector technology has given the opportunity for portable device and mobile phone makers to further reduce their real estate in their applications. The Micro-USB will replace most of the Mini-USB plugs and receptacles that are currently being used. The specification of the Micro-USB supports the current USB On-The-Go (OTG) supplement. This allows communication between portable devices without going through a host. Being much smaller than the Mini-USB, the Micro-USB is the choice of interconnect solution of mobile phone makers such as Nokia and Motorola for their new phone designs. Molex has developed the Micro-USB `B' receptacle in standard and mid-mount version. The design comes with a lead-in feature for blind mating. The mid-mount version features a unique laser-welded shield design, ensuring mechanical seam strength and rigidity of the connector body, which helps prevent damage to the plug or receptacle as the result of any perpendicular or horizontal (wrenching) stress. Both connectors are specified for up to 10,000 insertion cycles. To ensure maximum receptacle to PCB retention, wide side tabs are employed. The beveled `B'-style mating profile design prevents mis-mating with `A'-type plug. As a member of the USB Implementer Forum, Molex's ensure a high level of application connectivity and reliability. Features and Benefits * * * * * * * * * Wider side solder tabs provide improved solder retention Stainless steel shell (0.3mm thick) provides high mating durability & strength Lead-in features provide blind mate Fold-down tabs provide high housing retention Latching windows with angular tabs prevent accidental unmating of plug Beveled profile `B' style to lock out `A'-type plug Unique laser-welded shield design strengthen wrenching strength during use Pick & place area (3mm diameter) enhances assembly process Rear shield for EMI protection (for standard mount)
0.65mm (.025") Pitch Micro-USB 47346 Standard `B' receptacle 47491 Mid Mount `B' receptacle
SPECIIFICATIONS Reference Information Packaging: Embossed Tape and Reel UL File No.: CSA File No.: Mates With: Designed In: mm Electrical Voltage: 100V AC Current: 1A Contact Resistance: 40 milliohm max Dielectric Withstanding Voltage: 100V AC Insulation Resistance: 100 Megohms min Mechanical Mating Force: 35N (3.57kgf)max Unmating Force: 10N (1.02kgf) ~ 20N(2.04kgf) Terminal / housing retention force: 4.0N (0.41kgf)min Durability: 10,000 cycles Physical Housing: Liquid Crystal Polymer, UL 94V-0 Contact: Copper Alloy Shell: Stainless Steel (0.3mm thickness) Plating: Contact Area -- 0.13m Gold (Au) over 0.76m Pd/Ni Solder Tail Area -- Gold (Au)flash Underplating -- 1.27 m (50 *") Nickel (Ni) min Coplanarity = 0.08mm max Operating Temperature: -20C to +85C
MARKETS AND APPLICATIONS Markets and Applications * * Mobile Phones Portable devices
- - - MP3 players Portable digital video players Digital Still Cameras
0.65mm (.025") Pitch Micro-USB 47346 Standard `B' receptacle 47491 Mid Mount `B' receptacle
ORDERING INFORMATION
Description Micro-USB `B' receptacle, standard mount Micro-USB `B' receptacle, mid mount
Order No. 47346 -0001 47491 -0001
Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX amerinfo@molex.com
Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com
Asia Pacific South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com
European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com
Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550
Visit our Web site at http://www.molex.com
Order No. SNG-073 (c)2007, Molex

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